CUS08F30
Schottky Barrier Diode
Silicon Epitaxial
CUS08F30
1. Applications
•
High-Speed Switching
2. Features
(1)
Low forward voltage: VF(3) = 0.40 V (typ.)
(2)
General-purpose USC package, equivalent to SOD-323 and SC-76 packages.
3. Packaging and Internal Circuit
1: Cathode
2: Anode
USC
)
25
4. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25
Characteristics
Reverse voltage
Average rectified current
Non-repetitive peak forward surge current
Symbol
Note
Rating
Unit
VR
30
V
IO
(Note 1)
800
mA
IFSM
(Note 2)
5
A
Junction temperature
Tj
125
Storage temperature
Tstg
-55 to 125
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Mounted on a ceramic circuit board of 25 mm × 25 mm, Pad dimension of 2 mm × 2 mm.
Note 2: Measured with a 10 ms pulse.
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)
5. Electrical Characteristics (Unless otherwise specified, Ta = 25
25
Characteristics
Forward voltage
Reverse current
Total capacitance
Symbol
Note
VF(1)
Test Condition
Min
Typ.
Max
Unit
V
IF = 10 mA
0.22
VF(2)
IF = 100 mA
0.28
VF(3)
IF = 800 mA
0.40
0.45
IR(1)
VR = 30 V
50
µA
VR = 0 V, f = 1 MHz
170
pF
Ct
6. Marking
Fig. 6.1 Marking
Marking Code
Part Number
HQ
CUS08F30
7. Usage Considerations
•
Schottky barrier diodes (SBDs) have reverse leakage greater than other types of diodes. This makes SBDs
more susceptible to thermal runaway under high-temperature and high-voltage conditions. Thus, both
forward and reverse power losses of SBDs should be considered for thermal and safety design.
8. Land Pattern Dimensions for Reference Only
Fig. 8.1 Land Pattern Dimensions for Reference Only (Unit: mm)
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9. Characteristics Curves (Note)
Fig. 9.1 IF - VF
Fig. 9.2 IR - VR
Fig. 9.3 Ct - VR
Note:
The above characteristics curves are presented for reference only and not guaranteed by production test.
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Package Dimensions
Unit: mm
Weight: 4.5 mg (typ.)
Package Name(s)
Nickname: USC
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
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equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,
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• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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