MATERIAL DECLARATION SHEET Material Number CR0805 Product Line Chip Resistors Compliance Date 2010/10/29 RoHS Compliant YES No. 1 2 3 Construction Element(subpart) Ceramic Substrate Conductor Layer Resistive Element MSL Homogeneous Material Ceramic Conductor glass Resistor glass 1 Material weight [g] 0.00381944 0.00008224 0.00004328 4 5 Over Coating Marking Epoxy Epoxy 0.0000665 0.00000361 6 End Terminal Nickel Chromium 0.00000337 7 8 Ni Plating Sn Plating Nickel Matte Tin 0.00014111 0.00012589 Total weight Headquarters Riverside CA Homogeneous Material\ Substances Aluminum oxide Silicon dioxide Silver Bismuth trioxide Barium oxide Silicon dioxide Boron oxide Ruthenium dioxide Silver Palladium Lead oxide glass Epoxy Epoxy Nickel Chromium III Nickel Tin 1304-28-5 7631-86-9 1303-86-2 96% 4% 96% 1% 1% 1% 1% Material Mass % of total unit wt. 85.56% 3.57% 1.82% 0.025% 0.025% 0.025% 0.025% 12036-10-1 25% 0.25% 7440-22-4 7440-05-3 40% 15% 0.40% 0.15% 1317-36-8 20% 0.20% 29690-82-2 25068-38-6 7440-02-0 7440-47-3 100% 100% 80% 20% 1.55% 0.08% 0.06% 0.02% 1.55% 0.08% 7440-02-0 7440-31-5 100% 100% 3.29% 2.94% 3.29% 2.94% CASRN if applicable 1344-28-1 14808-60-7 7440-22-4 1304-76-3 Materials Mass % Subpart mass of total wt. (%) 89.13% 1.92% 1.01% 0.08% 0.00428544 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION This Document was updated on: 10.29.2010 Important remarks: 1. 2. It is the responsibility of the user to verify they are accessing the latest version. RoHS exemption – 5 – lead in glass of... electronic components... Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2