BOURNS CR0805

MATERIAL DECLARATION SHEET
Material Number
CR0805
Product Line
Chip Resistors
Compliance Date
2010/10/29
RoHS Compliant
YES
No.
1
2
3
Construction
Element(subpart)
Ceramic Substrate
Conductor Layer
Resistive Element
MSL
Homogeneous
Material
Ceramic
Conductor glass
Resistor glass
1
Material
weight [g]
0.00381944
0.00008224
0.00004328
4
5
Over Coating
Marking
Epoxy
Epoxy
0.0000665
0.00000361
6
End Terminal
Nickel Chromium
0.00000337
7
8
Ni Plating
Sn Plating
Nickel
Matte Tin
0.00014111
0.00012589
Total weight
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Homogeneous
Material\
Substances
Aluminum oxide
Silicon dioxide
Silver
Bismuth trioxide
Barium oxide
Silicon dioxide
Boron oxide
Ruthenium
dioxide
Silver
Palladium
Lead oxide
glass
Epoxy
Epoxy
Nickel
Chromium III
Nickel
Tin
1304-28-5
7631-86-9
1303-86-2
96%
4%
96%
1%
1%
1%
1%
Material
Mass % of
total unit wt.
85.56%
3.57%
1.82%
0.025%
0.025%
0.025%
0.025%
12036-10-1
25%
0.25%
7440-22-4
7440-05-3
40%
15%
0.40%
0.15%
1317-36-8
20%
0.20%
29690-82-2
25068-38-6
7440-02-0
7440-47-3
100%
100%
80%
20%
1.55%
0.08%
0.06%
0.02%
1.55%
0.08%
7440-02-0
7440-31-5
100%
100%
3.29%
2.94%
3.29%
2.94%
CASRN
if applicable
1344-28-1
14808-60-7
7440-22-4
1304-76-3
Materials
Mass %
Subpart
mass of total
wt. (%)
89.13%
1.92%
1.01%
0.08%
0.00428544
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MATERIAL DECLARATION
This Document was updated on:
10.29.2010
Important remarks:
1.
2.
It is the responsibility of the user to verify they are accessing the latest version.
RoHS exemption – 5 – lead in glass of... electronic components...
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