BZT52B15LP SURFACE MOUNT PRECISION ZENER DIODE Features Mechanical Data Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes Tight Tolerance on Zener Breakdown Voltage (±2%) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Terminal Connections: Cathode Bar (See Marking Information) Terminals: Finish – NiPdAu Over Copper Leadframe. Solderable per MIL-STD-202, Method 208 e4 Weight: 0.001 grams (approximate) Case: X1-DFN1006-2 Case Material: Molded Plastic, "Green" Molding Compound. NEW PRODUCT UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 X1-DFN1006-2 Bottom View Ordering Information (Note 4) Part Number BZT52B15LP-7B Notes: Case X1-DFN1006-2 Packaging 10,000/Tape & Reel 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html. Marking Information 6L BZT52B15LP Document number: DS36252 Rev. 1 - 2 6L= Product Type Marking Code: 1 of 4 www.diodes.com April 2013 © Diodes Incorporated BZT52B15LP Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Forward Voltage Symbol Value Unit VF 0.9 V Symbol Value Unit @ IF = 10mA Characteristic Power Dissipation (Note 5) TA = +25°C PD 250 mW Thermal Resistance, Junction to Ambient Air (Note 5) TA = +25°C RθJA 500 C/W TJ, TSTG -65 to +150 C Operating and Storage Temperature Range Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Type Number Marking Code VZ @ IZT BZT52B15LP IZT ZZT @ IZT ZZK @ IZK 15 14.70 15.30 5 15 200 @ VR Maximum Temperature Test Capacitance Coefficient Current (Note 7) @ IZTC IZTC mV/°C CT IZK IR mA µA V Min Max mA pF 1 0.05 10.5 9.2 13.0 5 100 5. Device mounted on FR-4 PCB with minimum recommended pad layout which can be found on our website at http://www.diodes.com. 6. Short duration pulse test used to minimize self-heating effect. 7. f = 1MHz, VR = 0V, TA = +25°C. 300 Note 5 250 200 150 100 50 0 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) Figure 1 Power Derating Curve BZT52B15LP Document number: DS36252 Rev. 1 - 2 150 IF, INSTANTANEOUS FORWARD CURRENT(mA) Notes: 6L Maximum Reverse Current (Note 6) Maximum Zener Impedance f = 1kHz Zener Voltage Range (Note 6) Nom (V) Min (V) Max (V) mA PD, POWER DISSIPATION (mW) NEW PRODUCT Thermal Characteristics 1000 TA = 150°C 100 TA = 125°C 10 TA = 85°C TA = 25°C 1 TA = -55°C 0.1 200 400 600 800 1000 1200 1400 1600 VF, INSTANTANEOUS FORWARD VOLTAGE(mV) Figure 2 Typical Forward Characteristics 2 of 4 www.diodes.com April 2013 © Diodes Incorporated BZT52B15LP IZ, ZENER CURRENT (mA) NEW PRODUCT 100 10 1 0.1 0.01 12 13 14 15 16 17 18 VZ, ZENER VOLTAGE (V) Figure 3 Typical Zener Breakdown Characteristics Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. A X1-DFN1006-2 Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.03 b 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e 0.40 L 0.20 0.30 0.25 R 0.05 0.15 0.10 All Dimensions in mm A1 D R E L b e Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. 1 X X Y Dimensions C G X X1 Y G Value (in mm) 0.70 0.30 0.40 1.10 0.70 C BZT52B15LP Document number: DS36252 Rev. 1 - 2 3 of 4 www.diodes.com April 2013 © Diodes Incorporated BZT52B15LP IMPORTANT NOTICE NEW PRODUCT DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2013, Diodes Incorporated www.diodes.com BZT52B15LP Document number: DS36252 Rev. 1 - 2 4 of 4 www.diodes.com April 2013 © Diodes Incorporated