BAS16VV SURFACE MOUNT SWITCHING DIODE ARRAY Features Mechanical Data • • • • • • • • • • • Fast Switching Speed Low Forward Voltage: Maximum of 0.715V at 1mA Fast Reverse Recovery: Maximum of 4ns Low Capacitance: Maximum of 1.5pF Low Leakage Current Ultra-Small Surface Mount Package Thermally Efficient Copper Alloy leadframe for High Power Dissipation Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) • • • Case: SOT563 Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Matte Tin Finish annealed over Copper Alloy leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Weight: 0.003 grams (approximate) SOT563 Top View Bottom View Top View Ordering Information (Note 4) Part Number BAS16V V-7 Notes: Case SOT563 Packaging 3000/Tape & Reel 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For Packaging Details, go to our website at http://www.diodes.com. Marking Information KJP Date Code Key Year Code Month Code 2012 Z Jan 1 YM 2013 A Feb 2 BAS16VV Document number: DS35791 Rev. 3 - 2 Mar 3 KJP = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Z = 2012) M = Month (ex: 9 = September) 2014 B Apr 4 May 5 2015 C Jun 6 1 of 4 www.diodes.com 2016 D Jul 7 Aug 8 2017 E Sep 9 Oct O 2018 F Nov N Dec D June 2012 © Diodes Incorporated BAS16VV Maximum Ratings (@TA = 25°C unless otherwise specified.) Characteristic Non-Repetitive Peak Reverse Voltage Symbol VRM VRRM VRWM VR VR(RMS) IFM Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Note 5) Non-Repetitive Peak Forward Surge Current @ t = 1.0μs @ t = 1.0ms @ t = 1.0s IFSM Value 100 Unit V 100 V 71 200 4.0 1.0 0.5 V mA Value 350 357 -55 to +150 Unit mW °C/W °C A Thermal Characteristics Characteristic Power Dissipation (Note 5) Thermal Resistance Junction to Ambient Air (Note 5) Operating and Storage Temperature Range Symbol PD RθJA TJ, TSTG Electrical Characteristics (@TA = 25°C unless otherwise specified.) Characteristic Reverse Breakdown Voltage (Note 6) Symbol V(BR)R Leakage Current (Note 6) IR Total Capacitance CT Min 100 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ Reverse Recovery Time trr ⎯ Forward Voltage Notes: VF Max ⎯ 0.715 0.855 1.0 1.25 0.5 50 30 30 1.5 Unit V 4.0 ns V μA μA μA nA pF Test Condition IR = 100μA IF = 1.0mA IF = 10mA IF = 50mA IF = 150mA VR = 80V VR = 80V, TJ = 150°C VR = 25V, TJ = 150°C VR = 25V VR = 0, f = 1.0MHz IF = IR = 10mA, Irr = 0.1 x IR, RL = 100Ω 5. Device mounted on FR-4 PCB, on minimum recommended, 2oz copper pad layout. 6. Short duration pulse test used to minimize self-heating effect. PD, POWER DISSIPATION (mW) 300 IF, INSTANTANEOUS FORWARD CURRENT (A) 350 Note 5 250 200 150 100 50 RθJA = 357°C/W 0 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (° C) 150 Fig. 1 Power Derating Curve, Total Package BAS16VV Document number: DS35791 Rev. 3 - 2 2 of 4 www.diodes.com 1 0.1 0.01 0.001 0 0.4 0.8 1.2 1.6 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics, Per Element June 2012 © Diodes Incorporated 1.0 100,000 10,000 CT, TOTAL CAPACITANCE (pF) IR, INSTANTANEOUS REVERSE CURRENT (nA) BAS16VV 1,000 100 10 1 0.8 0.6 0.4 0.2 0 0.1 0 10 100 VR, DC REVERSE VOLTAGE (V) Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element 60 80 100 20 40 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics, Per Element 1 Package Outline Dimensions A B C D G M K SOT563 Dim Min Max Typ A 0.15 0.30 0.20 B 1.10 1.25 1.20 C 1.55 1.70 1.60 D 0.50 G 0.90 1.10 1.00 H 1.50 1.70 1.60 K 0.55 0.60 0.60 L 0.10 0.30 0.20 M 0.10 0.18 0.11 All Dimensions in mm H L Suggested Pad Layout C2 Z C2 C1 G Y Dimensions Value (in mm) Z 2.2 G 1.2 X 0.375 Y 0.5 C1 1.7 C2 0.5 X BAS16VV Document number: DS35791 Rev. 3 - 2 3 of 4 www.diodes.com June 2012 © Diodes Incorporated BAS16VV IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2012, Diodes Incorporated www.diodes.com BAS16VV Document number: DS35791 Rev. 3 - 2 4 of 4 www.diodes.com June 2012 © Diodes Incorporated