PACKAGE OUTLINE DIMENSIONS(AP02002) SUGGESTED PAD LAYOUT(AP02001) (Based on IPC-7351A) Table of Contents X4‐DFN0402‐2/SWP ................................................................................................................................................................ 10 X2‐DFN0603‐2 ......................................................................................................................................................................... 11 X3‐DFN0603‐2 ......................................................................................................................................................................... 12 X2‐DFN0606‐3 ......................................................................................................................................................................... 13 X2‐DFN0806‐3 ......................................................................................................................................................................... 14 X2‐DFN0808‐4 ......................................................................................................................................................................... 15 X2‐DFN0910‐6 ......................................................................................................................................................................... 16 U‐DFN1006‐2/SWP ................................................................................................................................................................. 17 X1‐DFN1006‐2 ......................................................................................................................................................................... 18 X2‐DFN1006‐2 ......................................................................................................................................................................... 19 X1‐DFN1006‐3 ......................................................................................................................................................................... 20 X2‐DFN1006‐3 ......................................................................................................................................................................... 21 X2‐DFN1010‐3 ......................................................................................................................................................................... 22 X2‐DFN1010‐4 ......................................................................................................................................................................... 23 X1‐DFN1010‐6 (TYPE B) ........................................................................................................................................................... 24 X2‐DFN1010‐6 ......................................................................................................................................................................... 25 X2‐DFN1010‐6 (TYPE C) ........................................................................................................................................................... 26 W‐DFN1114‐3 ......................................................................................................................................................................... 27 X2‐DFN1210‐6 ......................................................................................................................................................................... 28 X2‐DFN1210‐8 ......................................................................................................................................................................... 29 X1‐DFN1212‐3 ......................................................................................................................................................................... 30 X1‐DFN1212‐3(TYPE B) ............................................................................................................................................................ 31 X2‐DFN1212‐6 ......................................................................................................................................................................... 32 U‐DFN1212‐3 (TYPE C) ............................................................................................................................................................ 33 X1‐DFN1216‐4 ......................................................................................................................................................................... 34 X2‐DFN1310‐6 ......................................................................................................................................................................... 35 X2‐DFN1409‐6 ......................................................................................................................................................................... 36 X2‐DFN1410‐6 ......................................................................................................................................................................... 37 X1‐DFN1411‐3 ......................................................................................................................................................................... 38 U‐DFN1510‐6 .......................................................................................................................................................................... 39 U‐DFN1610‐6 .......................................................................................................................................................................... 40 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 1 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated X1‐DFN1612‐6 ......................................................................................................................................................................... 41 X2‐DFN1612‐8 ......................................................................................................................................................................... 42 U‐DFN1616‐6 .......................................................................................................................................................................... 43 U‐DFN1616‐6 (TYPE E) ............................................................................................................................................................. 44 X1‐DFN1616‐6 (TYPE E) ........................................................................................................................................................... 45 U‐DFN1616‐6 (TYPE F) ............................................................................................................................................................. 46 U‐DFN1616‐8 .......................................................................................................................................................................... 47 X2‐DFN2015‐3 ......................................................................................................................................................................... 48 X2‐DFN2015‐6 ......................................................................................................................................................................... 49 X2‐DFN2015‐8 ......................................................................................................................................................................... 50 U‐DFN2018‐6 .......................................................................................................................................................................... 51 X2‐DFN2018‐8 ......................................................................................................................................................................... 52 U‐DFN2020‐2 (TYPE B) ............................................................................................................................................................ 53 U‐DFN2020‐3 .......................................................................................................................................................................... 55 U‐DFN2020‐3 (TYPE B) ............................................................................................................................................................ 56 V‐DFN2020‐3 .......................................................................................................................................................................... 57 U‐DFN2020‐6 .......................................................................................................................................................................... 58 U‐DFN2020‐6/SWP ................................................................................................................................................................. 59 U‐DFN2020‐6 (TYPE B) ............................................................................................................................................................ 60 U‐DFN2020‐6 (TYPE C) ............................................................................................................................................................ 61 U‐DFN2020‐6 (TYPE E) ............................................................................................................................................................. 62 U‐DFN2020‐6 (TYPE F) ............................................................................................................................................................. 63 X2‐DFN2020‐6 ......................................................................................................................................................................... 65 U‐DFN2020‐8 .......................................................................................................................................................................... 66 W‐DFN2020‐6 (TYPE US) ......................................................................................................................................................... 67 W‐DFN2020‐8 (TYPE C) ........................................................................................................................................................... 68 U‐DFN2030‐6 (TYPE B) ............................................................................................................................................................ 69 U‐DFN2030‐6 (TYPE C) ............................................................................................................................................................ 70 U‐DFN2030‐8 .......................................................................................................................................................................... 71 X1‐DFN2030‐8 ......................................................................................................................................................................... 72 U‐DFN2510‐10 ........................................................................................................................................................................ 73 U‐DFN2535‐6 .......................................................................................................................................................................... 74 U‐DFN2535‐6(TYPE B) ............................................................................................................................................................. 75 V‐DFN2050‐4 .......................................................................................................................................................................... 76 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 2 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated U‐DFN2116‐8 .......................................................................................................................................................................... 77 U‐DFN2523‐6 .......................................................................................................................................................................... 78 U‐DFN2626‐10 ........................................................................................................................................................................ 79 U‐DFN3016‐12 ........................................................................................................................................................................ 80 X2‐DFN3020‐6 ......................................................................................................................................................................... 81 V‐DFN3020‐8 .......................................................................................................................................................................... 82 W‐DFN3020‐8 (TYPE B) ........................................................................................................................................................... 83 W‐DFN3020‐8 (TYPE K) ........................................................................................................................................................... 84 V‐DFN3020‐8 (TYPE N) ........................................................................................................................................................... 85 U‐DFN3020‐10 ........................................................................................................................................................................ 86 V‐DFN3020‐10 ......................................................................................................................................................................... 87 V‐DFN3020‐14 ......................................................................................................................................................................... 88 U‐DFN3030‐4 .......................................................................................................................................................................... 89 U‐DFN3030‐6 .......................................................................................................................................................................... 90 V‐DFN3030‐6 .......................................................................................................................................................................... 91 U‐DFN3030‐8 .......................................................................................................................................................................... 92 U‐DFN3030‐8 (TYPE D) ............................................................................................................................................................ 93 U‐DFN3030‐8 (TYPE E) ............................................................................................................................................................. 94 V‐DFN3030‐8 .......................................................................................................................................................................... 95 V‐DFN3030‐8 TYPE H ............................................................................................................................................................... 96 V‐DFN3030‐8 TYPE J ................................................................................................................................................................ 97 V‐DFN3030‐8 TYPE K ............................................................................................................................................................... 98 V‐DFN3030‐8 TYPE M .............................................................................................................................................................. 99 U‐DFN3030‐10 ...................................................................................................................................................................... 100 U‐DFN3030‐12 ...................................................................................................................................................................... 101 W‐DFN3030‐12 ..................................................................................................................................................................... 102 U‐DFN3030‐14 ...................................................................................................................................................................... 103 W‐DFN3030‐16 (TYPE US) ..................................................................................................................................................... 104 U‐QFN3030‐16 (TYPE B) ........................................................................................................................................................ 105 U‐QFN3030‐20 ...................................................................................................................................................................... 106 U‐DFN3216‐14 ...................................................................................................................................................................... 107 DFN322 ................................................................................................................................................................................. 108 X1‐DFN3313‐8 ....................................................................................................................................................................... 109 V‐DFN3535‐14 ....................................................................................................................................................................... 110 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 3 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated U‐DFN4030‐12 ...................................................................................................................................................................... 111 U‐DFN4030‐12 (TYPE B) ........................................................................................................................................................ 112 U‐DFN4030‐12 (TYPE C)......................................................................................................................................................... 113 U‐DFN4030‐12 (TYPE D) ........................................................................................................................................................ 114 V‐DFN4030‐14 ....................................................................................................................................................................... 115 W‐DFN4030‐14 ..................................................................................................................................................................... 116 U‐DFN4040‐8 ........................................................................................................................................................................ 117 W‐DFN5020‐6 ....................................................................................................................................................................... 118 V‐DFN5045‐12 ....................................................................................................................................................................... 119 V‐DFN5045‐12 (TYPE B) ......................................................................................................................................................... 120 V‐DFN5060‐4 ........................................................................................................................................................................ 121 U‐DFN6040‐12 ...................................................................................................................................................................... 122 V‐DFN6040‐22 ....................................................................................................................................................................... 123 D‐FLAT .................................................................................................................................................................................. 124 DF‐S ...................................................................................................................................................................................... 125 U‐FLGA1515‐9 ....................................................................................................................................................................... 126 W‐FLGA2520‐17 .................................................................................................................................................................... 127 MINIDIP ................................................................................................................................................................................ 128 MINIMELF ............................................................................................................................................................................. 129 MELF ..................................................................................................................................................................................... 130 MSB ...................................................................................................................................................................................... 131 MSOP‐8 ................................................................................................................................................................................ 132 MSOP‐8EP ............................................................................................................................................................................. 133 MSOP‐10 ............................................................................................................................................................................... 134 POWERDI®5 ........................................................................................................................................................................... 135 POWERDI®123 ....................................................................................................................................................................... 136 POWERDI®123(TYPE B) .......................................................................................................................................................... 137 POWERDI®323 ....................................................................................................................................................................... 138 POWERDI®3333‐8 .................................................................................................................................................................. 139 POWERDI®3333‐8(TYPE B) ..................................................................................................................................................... 140 POWERDI®5060‐8 .................................................................................................................................................................. 141 POWERDI®5060‐8 (TYPE B) ................................................................................................................................................... 142 POWERDI5060‐8 (TYPE C) ..................................................................................................................................................... 143 POWERDI®5SP ....................................................................................................................................................................... 144 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 4 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated POWERDI®5SP (TYPE B) ......................................................................................................................................................... 145 W‐QFN3020‐12 ..................................................................................................................................................................... 146 U‐QFN4040‐16 (TYPE C) ........................................................................................................................................................ 147 U‐QFN4040‐20 ...................................................................................................................................................................... 148 V‐QFN4525‐20 ...................................................................................................................................................................... 149 QSOP‐16 ............................................................................................................................................................................... 150 QSOP‐20 ............................................................................................................................................................................... 151 SM‐8 ..................................................................................................................................................................................... 152 SMA ...................................................................................................................................................................................... 153 SMAF .................................................................................................................................................................................... 154 SMB ...................................................................................................................................................................................... 155 SMC ...................................................................................................................................................................................... 156 SO‐8 ...................................................................................................................................................................................... 157 SO‐8EP .................................................................................................................................................................................. 158 SO‐8EP .................................................................................................................................................................................. 159 SO‐14 .................................................................................................................................................................................... 160 SO‐16 .................................................................................................................................................................................... 161 SO‐20 .................................................................................................................................................................................... 162 SO‐24 (TYPE TH) .................................................................................................................................................................... 163 SOD123 ................................................................................................................................................................................. 164 SOD123F ............................................................................................................................................................................... 165 SOD323 ................................................................................................................................................................................. 166 SOD323F ............................................................................................................................................................................... 167 SOD523 ................................................................................................................................................................................. 168 SOD923 (0.2MM LEAD WIDTH) ............................................................................................................................................. 169 SOD923 (0.3MM LEAD WIDTH) ............................................................................................................................................. 170 SOT143 ................................................................................................................................................................................. 171 SOT223 ................................................................................................................................................................................. 172 SOT25 ................................................................................................................................................................................... 173 SOT353 ................................................................................................................................................................................. 174 SC74R / SOT26 ...................................................................................................................................................................... 175 SOT363 ................................................................................................................................................................................. 176 SC59 ...................................................................................................................................................................................... 177 SOT523 ................................................................................................................................................................................. 178 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 5 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated SOT323 ................................................................................................................................................................................. 179 SOT23 ................................................................................................................................................................................... 180 SOT23F ................................................................................................................................................................................. 181 SOT543 ................................................................................................................................................................................. 182 SOT553 ................................................................................................................................................................................. 183 SOT563 ................................................................................................................................................................................. 184 SOT666 ................................................................................................................................................................................. 185 SOT953 ................................................................................................................................................................................. 186 SOT963 ................................................................................................................................................................................. 187 SOT89 ................................................................................................................................................................................... 188 SOT89‐5 ................................................................................................................................................................................ 189 TO220AC (TYPE A4) ............................................................................................................................................................... 191 TO220AC (TYPE BR) ............................................................................................................................................................... 192 TO220AC (TYPE E) ................................................................................................................................................................. 193 TO252 (DPAK) ....................................................................................................................................................................... 194 TO252 TYPE B (DPAK)............................................................................................................................................................ 196 TO252 (DPAK) (TYPE BR) ....................................................................................................................................................... 197 TO252 TYPE C (DPAK) ............................................................................................................................................................ 198 TO252 (DPAK) (TYPE TH) ....................................................................................................................................................... 199 TO252‐4 ................................................................................................................................................................................ 200 TO252‐5 ................................................................................................................................................................................ 201 TO263AB (D2PAK) ................................................................................................................................................................. 202 TO263AB TYPE B (D2PAK) ...................................................................................................................................................... 203 TO263AB (D2PAK)(TYPE BR) .................................................................................................................................................. 204 TO263AB TYPE C (D2PAK) ...................................................................................................................................................... 205 TO263AB (D2PAK) (TYPE TH) ................................................................................................................................................. 206 TO263‐5 ................................................................................................................................................................................ 207 T‐MINIDIP ............................................................................................................................................................................. 208 TSSOP‐8 ................................................................................................................................................................................ 209 TSSOP‐14 .............................................................................................................................................................................. 210 TSSOP‐16 .............................................................................................................................................................................. 211 TSSOP‐16EP .......................................................................................................................................................................... 212 TSSOP‐20 .............................................................................................................................................................................. 213 TSSOP‐20EP .......................................................................................................................................................................... 214 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 6 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated TSOT25 ................................................................................................................................................................................. 215 TSOT25F ................................................................................................................................................................................ 216 TSOT26 ................................................................................................................................................................................. 217 TSOT26F ................................................................................................................................................................................ 218 X4‐WLB0402‐2/SWP ............................................................................................................................................................. 219 X2‐WLB0505‐3 ...................................................................................................................................................................... 220 X2‐WLB0603‐2 ...................................................................................................................................................................... 221 X3‐WLB0603‐2 ...................................................................................................................................................................... 222 X4‐WLB0603‐2 ...................................................................................................................................................................... 223 X3‐WLB0603‐3 ...................................................................................................................................................................... 224 U‐WLB0808‐4 ........................................................................................................................................................................ 225 W‐WLB0808‐4 ....................................................................................................................................................................... 226 X1‐WLB0808‐4 ...................................................................................................................................................................... 227 X2‐WLB1006‐2 ...................................................................................................................................................................... 228 X3‐WLB1006‐2 ...................................................................................................................................................................... 229 X3‐WLB1006‐2(TYPE B) ......................................................................................................................................................... 230 U‐WLB1010‐4 ........................................................................................................................................................................ 231 U‐WLB1010‐4 (TYPE B) .......................................................................................................................................................... 232 X2‐WLB1406‐2 ...................................................................................................................................................................... 233 X3‐WLB1406‐2 ...................................................................................................................................................................... 234 X3‐WLB1408‐2 ...................................................................................................................................................................... 235 U‐WLB1510‐6 ........................................................................................................................................................................ 236 U‐WLB1515‐9 ........................................................................................................................................................................ 237 X3‐WLB1608‐2 ...................................................................................................................................................................... 238 X2‐WLB1608‐3 ...................................................................................................................................................................... 239 U‐WLB1818‐4 ........................................................................................................................................................................ 240 X1‐WLB1818‐4 ...................................................................................................................................................................... 241 X2‐WLB2010‐2 ...................................................................................................................................................................... 242 X2‐WLB2718‐6 ...................................................................................................................................................................... 243 X4‐WLCUP0505‐3 .................................................................................................................................................................. 244 X2‐WLCUP2010‐2 .................................................................................................................................................................. 245 X4‐WLCUS0603‐2 .................................................................................................................................................................. 246 X3‐WLCUS0603‐3 .................................................................................................................................................................. 247 X4‐WLCUS1006‐2 .................................................................................................................................................................. 248 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 7 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated X4‐WLCUS1406‐2 .................................................................................................................................................................. 249 X4‐WLCUS1408‐2 .................................................................................................................................................................. 250 A‐405 .................................................................................................................................................................................... 251 DO‐35 ................................................................................................................................................................................... 252 DO‐41 PLASTIC ...................................................................................................................................................................... 253 DO‐41 GLASS ......................................................................................................................................................................... 254 DO‐15 ................................................................................................................................................................................... 255 DO‐201 ................................................................................................................................................................................. 256 DO‐201AD ............................................................................................................................................................................. 257 R‐6 ........................................................................................................................................................................................ 258 T‐1 ........................................................................................................................................................................................ 259 DF‐M ..................................................................................................................................................................................... 260 E‐LINE ................................................................................................................................................................................... 261 GBJ ....................................................................................................................................................................................... 262 GBPC ..................................................................................................................................................................................... 263 GBPC‐W ................................................................................................................................................................................ 264 GBU ...................................................................................................................................................................................... 265 ITO220AB .............................................................................................................................................................................. 266 ITO220AB .............................................................................................................................................................................. 267 ITO220AB (TO220F‐3) ........................................................................................................................................................... 268 ITO220S ................................................................................................................................................................................ 269 ITO220AC‐S ........................................................................................................................................................................... 270 KBJ ........................................................................................................................................................................................ 271 KBP ....................................................................................................................................................................................... 272 MB ........................................................................................................................................................................................ 273 MB‐W ................................................................................................................................................................................... 274 PBPC‐3 / PBPC‐6 ................................................................................................................................................................... 275 PBPC‐8 .................................................................................................................................................................................. 276 PBU ....................................................................................................................................................................................... 277 PDIP‐8 ................................................................................................................................................................................... 278 PDIP‐14 ................................................................................................................................................................................. 279 SIP‐3 (AMMO PACK) ............................................................................................................................................................. 280 SIP‐3 (BULK PACK) ................................................................................................................................................................. 281 SIP‐4 ..................................................................................................................................................................................... 282 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 8 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated SIP‐5 ..................................................................................................................................................................................... 283 TO126 ................................................................................................................................................................................... 284 TO220‐3 ................................................................................................................................................................................ 285 TO220‐5 ................................................................................................................................................................................ 286 TO220‐5(R) ........................................................................................................................................................................... 287 TO220AB ............................................................................................................................................................................... 288 TO220AB(TYPE C) .................................................................................................................................................................. 289 TO220AC ............................................................................................................................................................................... 290 TO220AC (13.7MM MIN LEAD LENGTH) .............................................................................................................................. 291 TO247 ................................................................................................................................................................................... 292 TO251 ................................................................................................................................................................................... 293 TO262 ................................................................................................................................................................................... 294 TO3P ..................................................................................................................................................................................... 295 TO92 ..................................................................................................................................................................................... 296 TO92 (TYPE B) ....................................................................................................................................................................... 297 TO92 (TYPE C) ....................................................................................................................................................................... 298 TO92L ................................................................................................................................................................................... 299 TO92S (TYPE A ...................................................................................................................................................................... 300 TO92S (TYPE B) ..................................................................................................................................................................... 301 TO94 ..................................................................................................................................................................................... 302 WOG ..................................................................................................................................................................................... 303 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 9 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated SURFACE MOUNT PACKAGES Package Outline Dimensions X4-DFN0402-2/SWP 2 A 1 A A e n a l P g n i t a e S X4-DFN0402-2/SWP D Dim Min Max Typ A 0.150 0.200 0.175 A1 0.00 0.020 0.010 A2 0.010 0.040 0.025 b 0.110 0.170 0.140 D 0.375 0.425 0.400 E 0.175 0.225 0.200 e 0.260 L 0.080 0.100 0.090 z 0.010 0.040 0.025 All Dimensions in mm e D I y t i r a l o P b E z L Suggested Pad Layout X4-DFN0402-2/SWP 1 X Dimensions Y G X X1 Y G X Value (in mm) 0.110 0.200 0.510 0.200 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 10 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN0603-2 A e n a l P g n i t a e S D e x 2 b E ︵ ︶ X2-DFN0603-2 Dim Min Max Typ A 0.27 0.35 0.30 A1 0.00 0.03 0.02 b 0.19 0.29 0.24 D 0.595 0.645 0.62 E 0.295 0.345 0.32 e 0.355 L3 0.14 0.24 0.19 All Dimensions in mm x 2 3 L ︵ ︶ Suggested Pad Layout X2-DFN0603-2 1 X Dimensions Y X X1 Y Value (in mm) 0.230 0.610 0.300 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 11 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X3-DFN0603-2 A A1 D e E b (2X) X3-DFN0603-2 Dim Min Max Typ A 0.27 0.35 0.30 A1 0.00 0.03 0.02 b 0.19 0.29 0.24 D 0.595 0.645 0.62 E 0.295 0.345 0.32 e 0.355 L 0.14 0.24 0.19 All Dimensions in mm L (2x) Suggested Pad Layout 1 X X3-DFN0603-2 X Dimensions Y C X X1 Y Value (in mm) 0.380 0.230 0.610 0.300 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 12 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN0606-3 1 A A X2-DFN0606-3 Dim Min Max Typ A 0.36 0.42 0.39 A1 0 0.05 0.02 b 0.10 0.20 0.15 D 0.57 0.67 0.62 D2 0.155 BSC D3 0.185 BSC E 0.57 0.67 0.62 E2 0.40 0.60 0.50 e 0.35 BSC k 0.16 REF L 0.09 0.21 0.15 L2 0.11 0.31 0.21 All Dimensions in mm Seating Plane D 2 D 3 D 2 / e E 2 E e k x 2 b 2 L ︵ ︶ x 2 L ︵ ︶ Suggested Pad Layout X2-DFN0606-3 Dimensions C X X1 X2 Y Y1 Value (in mm) 0.350 0.280 0.350 0.760 0.200 0.600 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 13 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN0806-3 A1 A3 A Seating Plane D e L (2x) b (2x) K E E1 Pin#1 R0.075 X2-DFN0806-3 Dim Min Max Typ A 0.375 0.40 0.39 A1 0 0.05 0.02 A3 0.10 b 0.10 0.20 0.15 D 0.55 0.65 0.60 D1 0.35 0.45 0.40 E 0.75 0.85 0.80 E1 0.20 0.30 0.25 e 0.35 K 0.20 L 0.20 0.30 0.25 All Dimensions in mm D1 Suggested Pad Layout X2-DFN0806-3 X1 Dimensions Y1 C X X1 X2 Y Y1 Y2 Y2 X Y Value (in mm) 0.350 0.200 0.450 0.550 0.375 0.475 1.000 C X2 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 14 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN0808-4 3 A 1 A A e n a l P g n i t a e S D I 1 # n i P D e Dim A A1 A3 b D D2 E E2 e k L L1 z P Y T 5 0 . 0 R k E 1 L 2 D 2 E L X2-DFN0808-4 Min Max Typ 0.25 0.35 0.30 0 0.04 0.02 0.13 0.17 0.27 0.22 0.75 0.85 0.80 0.15 0.35 0.25 0.75 0.85 0.80 0.15 0.35 0.25 0.48 0.20 0.17 0.27 0.22 0.02 0.12 0.07 0.05 All Dimensions in mm b Z Suggested Pad Layout 3 X C X2-DFN0808-4 2 Y 3 Y 2 X 1 Y Y 1 X Dimensions C X X1 X2 X3 Y Y1 Y2 Y3 Value 0.480 0.320 0.300 0.106 0.800 0.320 0.300 0.106 0.900 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 15 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN0910-6 1 A A Seating Plane D 1 Z e Z K 1 K E 1 L L b (Pin #1 ID) C0.5X45° X2-DFN0910-6 Dim Min Max Typ A 0.35 0.30 A1 0 0.03 0.02 b 0.10 0.20 0.15 D 0.85 0.95 0.90 E 0.95 1.05 1.00 e 0.30 K 0.20 K1 0.25 L 0.25 0.35 0.30 L1 0.30 0.40 0.35 Z 0.075 Z1 0.075 All Dimensions in mm Suggested Pad Layout X2-DFN0910-6 X1 Dimensions Y1 G1 Y2 G Y G G1 G2 X X1 Y Y1 Y2 Value (in mm) 0.100 0.050 0.150 0.150 0.750 0.525 0.475 1.150 Pin1 G2 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 16 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN1006-2/SWP c 1 A A h e n a l P g n i t a e S D D I 1 # n i P x 2 b E ︵ ︶ U-DFN1006-2/SWP Dim Min Max Typ A 0.47 0.53 0.50 A1 0.0 0.05 0.03 b 0.45 0.55 0.50 c 0.55 REF D 0.95 1.05 1.00 E 0.55 0.65 0.60 h 0.17 REF k 0.37 REF L 0.25 0.35 0.30 All Dimensions in mm x 2 L k ︵ ︶ Suggested Pad Layout U- DFN1006-2/SWP 1 X x 2 X ︵ ︶ Y Dimensions X X1 Y Value (in mm) 0.45 1.20 0.60 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 17 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X1-DFN1006-2 A X1-DFN1006-2 Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.03 b 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e 0.40 L 0.20 0.30 0.25 R 0.05 0.15 0.10 All Dimensions in mm A1 D R E b e L Suggested Pad Layout X1-DFN1006-2 1 X X Dimensions Y C G X X1 Y G Value (in mm) 0.70 0.30 0.40 1.10 0.70 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 18 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN1006-2 A A1 D R E b L X2-DFN1006-2 Dim Min Max Typ A 0.34 0.4 0.37 A1 0 0.05 0.03 b 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e 0.40 L 0.20 0.30 0.25 R 0.05 0.15 0.10 All Dimensions in mm e Suggested Pad Layout X2-DFN1006-2 1 X X Dimensions Y C G X X1 Y G Value (in mm) 0.70 0.30 0.40 1.10 0.70 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 19 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X1-DFN1006-3 1 A A e n a l P g n i t a e S D I 1 # b D n i P e 2 b E X1-DFN1006-3 Dim Min Max Typ A 0.47 0.53 0.50 A1 0.00 0.05 0.03 b 0.10 0.20 0.15 b2 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e 0.35 L1 0.20 0.30 0.25 L2 0.20 0.30 0.25 L3 0.40 z 0.02 0.08 0.05 All Dimensions in mm 1 L 3 L 2 L z Suggested Pad Layout X1-DFN1006-3 C Y 1 Y 2 G 1 G X 1 X Dimensions C G1 G2 X X1 Y Y1 Value (in mm) 0.70 0.30 0.20 0.40 1.10 0.25 0.70 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 20 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN1006-3 1 A A e n a l P g n i t a e S X 2 1 b D I 1 # n D i P ︵ ︶ e E 2 b X2-DFN1006-3 Dim Min Max Typ A 0.40 A1 0 0.05 0.03 b1 0.10 0.20 0.15 b2 0.45 0.55 0.50 D 0.95 1.05 1.00 E 0.55 0.65 0.60 e 0.35 L1 0.20 0.30 0.25 L2 0.20 0.30 0.25 L3 0.40 All Dimensions in mm 1 L 2 L 3 L Z Suggested Pad Layout X2-DFN1006-3 C Dimensions X1 X Z G1 G2 X X1 Y C G2 G1 Y Value (in mm) 1.1 0.3 0.2 0.7 0.25 0.4 0.7 Z ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 21 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions A 1 A 3 A X2-DFN1010-3 Seating Plane D 2 E (Pin #1 ID) E K 2 D L b e X2-DFN1010-3 Dim Min Max Typ A 0.40 0.39 A1 0.00 0.05 0.02 A3 0.13 b 0.18 0.28 0.23 D 0.95 1.05 1.00 D2 0.70 0.90 0.80 E 0.95 1.05 1.00 E2 0.36 0.56 0.46 e 0.50 K 0.20 L 0.195 0.295 0.245 All Dimensions in mm Suggested Pad Layout X X2-DFN1010-3 2 Y 1 Y 1 X X G X2-DFN1010-3 Dimensions Value C 0.500 G 0.150 X 0.330 X1 0.900 Y 0.445 Y1 0.505 Y2 0.200 All Dimensions in mm Y C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 22 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN1010-4 3 A 1 A A e n a l P g n i t a e S D e ︶ x 3 8 1 . 0 C ︵ 5 2 . 0 C 1 L E 2 L 2 D 2 E L X2-DFN1010-4 Dim Min Max Typ A 0.40 0.39 A1 0.00 0.05 0.02 A3 0.13 b 0.20 0.30 0.25 D 0.95 1.05 1.00 D2 0.38 0.58 0.48 E 0.95 1.05 1.00 E2 0.38 0.58 0.48 e 0.65 L 0.20 0.30 0.25 L1 0.27 0.37 0.32 L2 0.02 0.12 0.07 Z 0.050 All Dimensions in mm b Z Suggested Pad Layout 2 X C X2-DFN1010-4 2 Y Dimensions 1 Y 3 Y 4 Y 1 X Y C X X1 X2 Y Y1 Y2 Y3 Y4 Value (in mm) 0.650 0.250 0.480 0.900 0.400 0.470 0.220 0.480 1.300 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 23 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X1-DFN1010-6 (Type B) 1 A A e n a l P g n i t a e S D X1-DFN1010-6 (Type B) Dim Min Max Typ A - 0.50 0.39 A1 0.04 b 0.12 0.20 0.15 D 0.95 1.050 1.00 E 0.95 1.050 1.00 e 0.35 BSC e1 0.55 BSC L3 0.27 0.30 0.30 L3a 0.32 0.40 0.35 All Dimensions in mm x 5 3 L e a 3 L ︵ ︶ 1 e E D I 1 # n i P ︵ ︶ b Suggested Pad Layout X1-DFN1010-6 (Type B) 1 X x 4 Y C ︵ ︶ Dimensions 2 Y 3 Y 1 G 1 Y G X 1 n i P C G G1 X X1 Y Y1 Y2 Y3 Value (in mm) 0.350 0.150 0.150 0.200 0.900 0.500 0.525 0.475 1.150 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 24 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN1010-6 A1 A A3 D (Pin #1 ID) e b1 E K L(6x) X2-DFN1010-6 Dim Min Max Typ A –– 0.40 0.39 A1 0.00 0.05 0.02 A3 –– –– 0.13 b 0.14 0.20 0.17 b1 0.05 0.15 0.10 D 0.95 1.05 1.00 E 0.95 1.05 1.00 e –– –– 0.35 L 0.35 0.45 0.40 K 0.15 –– –– Z –– –– 0.065 All Dimensions in mm b(6x) Z(4x) Suggested Pad Layout X1 C Y(6x) Y1 1 G(4x) Dimensions Value (in mm) C 0.350 G 0.150 X 0.200 X1 0.900 Y 0.550 Y1 1.250 X(6x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 25 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN1010-6 (Type C) 1 A A e n a l P g n i t a e S x 5 3 L D ︵ e a 3 L ︶ 1 e E D I 1 # n i P ︵ X2-DFN1010-6 (Type C) Dim Min Max Typ A - 0.35 - A1 0.04 b 0.12 0.20 0.15 D 0.95 1.050 1.00 E 0.95 1.050 1.00 e 0.35 BSC e1 0.55 BSC L3 0.27 0.30 0.30 L3a 0.32 0.40 0.35 All Dimensions in mm ︶ b Suggested Pad Layout X2-DFN1010-6 (Type C) 1 X x 4 Y C ︵ ︶ Dimensions 2 Y 3 Y 1 G 1 Y G 1 n i P X C G G1 X X1 Y Y1 Y2 Y3 Value (in mm) 0.350 0.150 0.150 0.200 0.900 0.500 0.525 0.475 1.150 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 26 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions W-DFN1114-3 1 A 3 A A e n a l P g n i t a e S L D e x 2 b 5 6 2 . 0 D I 1 # n i P ︵ ︶ ︵ ︶ E 1 E W-DFN1114-3 Dim Min Max Typ A 0.77 0.83 0.80 A1 0 0.05 0.02 A3 0.152 b 0.25 0.35 0.30 D 1.05 1.15 1.10 D1 0.70 0.80 0.75 e 0.55 E 1.35 1.45 1.40 E1 0.66 0.76 0.71 L 0.20 0.30 0.25 All Dimensions in mm 0 5 1 . 0 R 1 D Suggested Pad Layout W-DFN1114-3 1 Y 1 X 2 Y X Y Dimensions C X X1 X2 Y Y1 Y2 Value(in mm) 0.550 0.400 0.750 0.950 0.450 0.710 1.375 2 C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 27 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN1210-6 3 A 1 A A e n a l P g n i t a e S D X2-DFN1210-6 Dim Min Max Typ A 0.40 A1 0.00 0.05 0.03 A3 0.13 b 0.15 0.25 0.20 D 1.15 1.275 1.20 E 0.95 1.075 1.00 e 0.40 L 0.325 0.425 0.375 z 0.100 All Dimensions in mm D I 1 n i P E L z e b Suggested Pad Layout X2-DFN1210-6 1 X C 1 G Dimensions G 1 Y Y C G G1 X X1 Y Y1 Value (in mm) 0.400 0.230 0.180 0.220 1.020 0.420 1.070 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 28 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN1210-8 1 A A X2-DFN1210-8 Dim Min Max Typ A 0.35 0.30 A1 0 0.03 0.02 b 0.10 0.20 0.15 D 1.15 1.25 1.20 E 0.95 1.05 1.00 e 0.30 K 0.25 K1 0.20 L 0.25 0.35 0.30 L1 0.30 0.40 0.35 Z 0.050 0.100 0.075 Z1 0.050 0.100 0.075 All Dimensions in mm Seating Plane D X 4 Z e (Pin #1 ID) C0.5X45° ︵ ︶ X 4 1 Z 1 L ︵ ︶ K 1 K E b x 7 L ︵ ︶ Suggested Pad Layout X2-DFN1210-8 1 X Dimensions G 2 Y Y C G X X1 Y Y1 Value (in mm) 0.300 0.150 0.150 1.050 0.500 1.150 X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 29 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions A X1-DFN1212-3 3 A 1 A e n a l P g n i t a e S D e x 2 1 b ︵ ︶ E X1-DFN1212-3 Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.02 A3 0.13 b 0.27 0.37 0.32 b1 0.17 0.27 0.22 D 1.15 1.25 1.20 E 1.15 1.25 1.20 e 0.80 L 0.25 0.35 0.30 All Dimensions in mm x 3 L b ︵ ︶ Suggested Pad Layout X1-DFN1212-3 X Dimensions Value (in mm) C 0.80 X 0.42 X1 0.32 Y 0.50 Y1 0.50 Y2 1.50 Y X1 (2x) Y2 Y1 (2x) C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 30 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X1-DFN1212-3(Type B) A A1 X1-DFN1212-3 Type B Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.02 A3 0.13 b 0.27 0.37 0.32 b1 0.17 0.27 0.22 D 1.15 1.25 1.20 D2 0.70 0.90 0.80 E 1.15 1.25 1.20 E2 0.10 0.30 0.20 e 0.80 L 0.25 0.35 0.30 All Dimensions in mm A3 D e b1(2x) E2 E D2 L(3x) b Suggested Pad Layout X1-DFN1212-3 (Type B) X Dimensions Value (in mm) C 0.80 X 0.42 X1 0.32 X2 0.90 Y 0.50 Y1 0.50 Y2 0.20 Y3 1.50 Y X2 Y3 Y2 X1(2x) Y1 (2x) C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 31 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN1212-6 3 A 1 A A e n a l P g n i t a e S X2-DFN1212-6 D Dim Min Max Typ A - 0.40 0.39 A1 0.00 0.05 0.020 A3 0.13 b 0.13 0.23 0.18 D 1.15 1.25 1.20 D2 0.89 0.99 0.94 E 1.15 1.25 1.20 E2 0.25 0.35 0.30 e 0.40 k 0.15 0.25 0.20 L 0.15 0.25 0.20 z 0.11 z1 0.05 All Dimensions in mm 1 z 2 D 5 1 . 0 C D I 1 n i P k 2 E E L b z e Suggested Pad Layout X2-DFN1212-6 2 X C Dimensions G 1 X 1 Y 2 Y Y C G X X1 X2 Y Y1 Y2 Value (in mm) 0.400 0.150 0.250 0.940 1.050 0.400 0.300 1.400 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 32 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN1212-3 (Type C) 3 A 1 A A U-DFN1212-3 Type C Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.02 A3 0.13 b 0.27 0.37 0.32 b1 0.17 0.27 0.22 D 1.15 1.25 1.20 D2 0.75 0.95 0.85 e 0.80 E 1.15 1.25 1.20 E2 0.40 0.60 0.50 L 0.25 0.35 0.30 L1 0.65 0.75 0.70 All Dimensions in mm e n a l P g n i t a e S D e L 1 b E 2 E 2 D 1 L b Suggested Pad Layout U-DFN1212-3 (Type C) 2 X 1 X 1 Y Dimensions 2 Y X G Y C C G X X1 X2 Y Y1 Y2 Value (in mm) 0.800 0.200 0.320 0.520 1.050 0.450 0.250 0.850 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 33 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions A X1-DFN1216-4 3 A 1 A e n a l P g n i t a e S De X1-DFN1216-4 Dim Min Max Typ A 0.47 0.53 0.50 A1 0.00 0.05 0.02 A3 --0.13 b 0.15 0.25 0.20 D 1.15 1.25 1.20 D2 0.75 0.95 0.85 E 1.55 1.65 1.60 E2 0.55 0.75 0.65 e 0.65 L 0.20 0.30 0.25 Z 0.175 All Dimensions in mm D I 1 # n i P ︶ ° 5 4 x 2 . 0 ' C ︵ 2 E E L 2 D b Z Suggested Pad Layout 1 XC X1-DFN1216-4 1 Y 2 Y Y X1-DFN1216-4 Value Dimensions (in mm) C 0.65 X 0.25 X1 0.90 Y 0.50 Y1 0.70 Y2 2.00 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 34 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN1310-6 3 A 1 A A X2-DFN1310-6 Dim Min Max Typ A 0.40 A1 0 0.05 0.02 A3 0.13 b 0.10 0.20 0.15 D 1.25 1.38 1.30 d 0.25 D2 0.30 0.50 0.40 E 0.95 1.075 1.00 e 0.35 E2 0.30 0.50 0.40 f 0.10 L 0.20 0.30 0.25 Z 0.05 All Dimensions in mm e n a l P g n i t a e S D 2 D f f b z 0 5 1 . 0 R 2 E E D I 1 # n i P ︵ ︶ d L z d f e f Suggested Pad Layout X2-DFN1310-6 G2 X2 Dimensions G1 G2 G3 X1 X2 Y1 Y2 a b Y2 G1 b Y1 G3 a X1 X2- DFN1310-6 0.16 0.17 0.15 0.52 0.20 0.52 0.375 0.09 0.06 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 35 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN1409-6 3 A 1 A A e n a l P g n i t a e S D X2-DFN1409-6 Dim Min Max Typ A 0.40 0.39 A1 0 0.05 0.02 A3 0.13 Ø 0.20 0.30 0.25 D 1.35 1.45 1.40 E 0.85 0.95 0.90 e1 0.50 e2 0.50 Z1 0.075 Z2 0.075 All Dimensions in mm x 6 2 Ø e 1 e ︵ ︶ D I 1 # n i P ︵ ︶ E x 4 2 Z x 4 1 Z ︵ ︶ ︵ ︶ Suggested Pad Layout X2-DFN1409-6 C x 6 D ︵ ︶ Dimensions Y 1 C 1 G 1 n i P G X C C1 D G G1 X Y Value (in mm) 1.000 0.500 0.300 0.200 0.200 0.400 0.150 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 36 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN1410-6 A1 A3 X2-DFN1410-6 Dim Min Max Typ A –– 0.40 0.39 A1 0.00 0.05 0.02 A3 –– –– 0.13 b 0.15 0.25 0.20 D 1.35 1.45 1.40 E 0.95 1.05 1.00 e –– –– 0.50 L 0.25 0.35 0.30 Z –– –– 0.10 Z1 0.045 0.105 0.075 All Dimensions in mm A Seating Plane D (Pin #1 ID) e L(6x) E Z1(4x) Z(4x) b(6x) Suggested Pad Layout 1 X X2-DFN1410-6 C Y Dimensions 1 Y C G X X1 Y Y1 Value (in mm) 0.500 0.250 0.250 1.250 0.525 1.250 X G 1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 37 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X1-DFN1411-3 A X1-DFN1411-3 Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.02 b 0.25 0.35 0.30 D 1.35 1.475 1.40 D2 0.65 0.85 0.75 E 1.05 1.175 1.10 E2 0.65 0.85 0.75 e 0.55 L 0.225 0.325 0.275 L1 0.20 All Dimensions in mm A1 D b E E2 e D2 L1 L Suggested Pad Layout X1-DFN1411-3 C X2 X1 G2 X Y G1 Dimensions Z G1 G2 X X1 X2 Y C Value (in mm) 1.38 0.15 0.15 0.95 0.75 0.40 0.75 0.76 Z ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 38 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN1510-6 1 A A e n a l P g n i t a e S 3 A D E L Z U-DFN1510-6 Dim Min Max Typ A 0.545 0.605 0.575 A1 0.05 0.03 A3 0.13 b 0.20 0.30 0.25 D 1.40 1.525 1.45 E 0.95 1.075 1.00 e 0.50 L 0.325 0.425 0.375 Z 0.100 All Dimensions in mm b e Suggested Pad Layout U-DFN1510-6 C X Dimensions 1 Y Y C X X1 Y Y1 Value (in mm) 0.500 0.350 1.350 0.575 1.300 1 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 39 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN1610-6 3 A 1 A U-DFN1610-6 A e n a l P g n i t a e S Dim Min Max Typ D e 5 2 1 . 0 R 5 7 0 . 0 R E A 0.545 0.605 0.575 A1 0.00 0.05 0.03 A3 - - 0.13 b 0.15 0.25 0.20 b2 0.35 0.45 0.40 D 1.550 1.675 1.600 E 0.950 1.075 1.000 L e L 2 b Z z 0.50 BSC 0.325 0.425 - - 0.375 0.150 b All Dimensions in mm Suggested Pad Layout U-DFN1610-6 2 X C Dimensions 1 Y Y C X X1 X2 Y Y1 Value (in mm) 0.500 0.250 0.450 1.350 0.625 1.400 1 X X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 40 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X1-DFN1612-6 3 A 1 A A X1-DFN1612-6 Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.02 A3 0.13 b 0.15 0.25 0.20 D 1.55 1.675 1.60 d 0.25 D2 0.40 0.60 0.50 E 1.15 1.28 1.20 e 0.40 E2 0.45 0.65 0.55 f 0.15 L 0.20 0.30 0.25 Z 0.10 All Dimensions in mm e n a l P g n i t a e S D 2 D f f b z 0 5 1 . 0 R 2 E E D I 1 # n i P ︵ ︶ d L z d f e f Suggested Pad Layout X1-DFN1612-6 G2 X2 Dimensions G1 G2 G3 X1 X2 Y1 Y2 a b Y2 G1 b Y1 G3 a X1 X1-DFN1612-6 0.15 0.175 0.15 0.60 0.25 0.65 0.45 0.10 0.15 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 41 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN1612-8 1 A A e n a l P g n i t a e S X2-DFN1612-8 D Dim Min Max Typ A –– 0.40 0.39 A1 0.00 0.05 0.02 b 0.13 0.23 0.18 D 1.55 1.65 1.60 D2 1.25 1.35 1.30 E 1.15 1.25 1.20 E2 0.25 0.35 0.30 e –– –– 0.40 L 0.15 0.25 0.20 z –– –– 0.11 z1 –– –– 0.05 All Dimensions in mm 2 D L 2 E E 5 1 . 0 C z b e 1 z Suggested Pad Layout X2-DFN1612-8 2 X C Dimensions 1 Y 1 X 2 Y Y C X X1 X2 Y Y1 Y2 Value (in mm) 0.400 0.230 1.300 1.430 0.400 0.300 1.400 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 42 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN1616-6 A A3 A1 U-DFN1616-6 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.13 b 0.20 0.30 0.25 D 1.55 1.675 1.60 D2 1.10 1.30 1.20 E 1.55 1.675 1.60 e 0.50 E2 0.30 0.50 0.40 L 0.275 0.375 0.325 All Dimensions in mm D e E E2 L b D2 Suggested Pad Layout U-DFN1616-6 Y C Dimensions Value (in mm) Z 1.3 G 0.175 X1 0.50 X2 0.525 Y 0.30 C 0.50 X2 G X1 Z ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 43 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN1616-6 (Type E) A1 A3 A D D2 b1 E E2 L1 L(2X) e Z(4X) X1-DFN1616-6 Type E Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.02 A3 — — 0.13 b 0.20 0.30 0.25 b1 0.10 0.30 0.20 D 1.55 1.65 1.60 D2 0.57 0.77 0.67 E 1.55 1.65 1.60 E2 1.30 1.50 1.40 e — — 0.50 L 0.25 0.35 0.30 L1 0.52 0.72 0.62 Z — — 0.175 All Dimensions in mm b(6X) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 44 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X1-DFN1616-6 (Type E) A3 A1 A D D2 b1 E E2 L1 L(2X) e Z(4X) b(6X) X1-DFN1616-6 Type E Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.02 A3 — — 0.13 b 0.20 0.30 0.25 b1 0.10 0.30 0.20 D 1.55 1.65 1.60 D2 0.57 0.77 0.67 E 1.55 1.65 1.60 E2 1.30 1.50 1.40 e — — 0.50 L 0.25 0.35 0.30 L1 0.52 0.72 0.62 Z — — 0.175 All Dimensions in mm Suggested Pad Layout X1-DFN1616-6 (Type E) X3 Y (2x) Dimensions C X X1 X2 X3 Y Y1 Y2 Y1 Y2 X2 X1 X (6x) Value (in mm) 0.500 0.300 0.200 0.720 0.400 0.475 0.620 1.900 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 45 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN1616-6 (Type F) 3 A 1 A A e n a l P g n i t a e S 1 D D X 2 2 D ︵ ︶ D I 1 # n i P x 2 2 E 0 0 1 . 0 R E ︵ ︶ K L e b x 4 Z ︵ ︶ U-DFN1616-6 Type F Dim Min Max Typ A 0.45 0.55 0.50 A1 0 0.05 0.02 A3 — — 0.127 b 0.20 0.30 0.25 D 1.55 1.65 1.60 D1 1.14 1.34 1.24 D2 0.38 0.58 0.48 E 1.55 1.65 1.60 E2 0.54 0.74 0.64 e — — 0.50 K — — 0.23 L 0.15 0.35 0.25 Z — — 0.175 All Dimensions in mm Suggested Pad Layout 2 1 X G U-DFN1616-6 (Type F) 1 X 2 Y G 1 Y Y Dimensions C G G1 X X1 X2 Y Y1 Y Value(in mm) 0.500 0.150 0.180 0.320 0.580 1.320 0.450 0.700 1.900 C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 46 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN1616-8 A A3 A1 D e L E2 E D2 U-DFN1616-8 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.13 b 0.15 0.25 0.20 D 1.55 1.675 1.60 D2 0.35 0.55 0.45 E 1.55 1.675 1.60 e 0.40 E2 0.90 1.10 1.00 L 0.25 0.35 0.30 All Dimensions in mm e b Suggested Pad Layout U-DFN1616-8 X2 a G2 Dimensions Value (in mm) G1 0.15 G2 0.20 X1 0.65 X2 0.25 Y1 1.25 Y2 0.50 C 0.40 a 0.10 Y2 Y1 G1 X1 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 47 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN2015-3 A3 A SEATING PLANE A1 D z L e E2 E D2 X2-DFN2015-3 Dim Min Max Typ A - 0.40 - A1 0 0.05 0.02 A3 0.13 b 0.20 0.30 0.25 D 1.45 1.575 1.5 D2 1.00 1.20 1.10 e 0.50 E 1.95 2.075 2.00 E2 0.70 0.90 0.80 L 0.25 0.35 0.30 z 0.125 All Dimensions in mm b Suggested Pad Layout X2-DFN2015-3 X 1 Y X2-DFN2015-3 Value (in mm) C 1.000 G 0.150 X 0.310 X1 1.300 Y 0.500 Y1 0.650 Y2 1.000 Dimensions 2 Y 1 X x 2 Y G ︵ ︶ C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 48 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions 3 A 1 A X2-DFN2015-6 A X2-DFN2015-6 Dim Min Max Typ A 0.375 0.40 0.390 A1 0 0.05 0.02 A3 0.13 b 0.20 0.30 0.25 D 1.45 1.575 1.50 D2 1.00 1.20 1.10 e 0.50 E 1.95 2.075 2.00 E2 0.70 0.90 0.80 L 0.25 0.35 0.30 Z 0.125 Z1 0.075 All Dimensions in mm e n a l P g n i t a e S L D z 0 0 2 . 0 R D I 1 # n i P ︵ ︶ 2 E E 2 D 1 z b e Suggested Pad Layout X2-DFN2015-6 2 X C X Y X2-DFN2015-6 Value (in mm) C 0.500 X 0.350 X1 1.150 X2 1.350 Y 0.500 Y1 0.850 Y2 2.150 Dimensions 2 Y 1 Y 1 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 49 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN2015-8 A A3 A1 SIDE VIEW D D1 L E1 E D3 D2 E2 e Z E3 b BOTTOM VIEW X2-DFN2015-8 Dim Min Max Typ D 1.95 2.05 2.00 E 1.45 1.55 1.50 D1 0.23 0.43 0.33 E1 0.55 0.75 0.65 D2 0.52 0.72 0.62 E2 0.38 0.58 0.48 D3 0.40 0.60 0.50 E3 0.35 0.55 0.45 A 0.40 0.39 A1 0 0.05 0.02 A3 0.127 b 0.20 0.30 0.25 L 0.25 0.35 0.30 e 0.65 Z 0.225 All Dimensions in mm Suggested Pad Layout X2-DFN2015-8 C X1 (4x) X Y1 (4x) Y Y2 G (4x) X2 G1 X3 R Y3 Y X Dimensions Value (in mm) C 0.650 G 0.150 G1 0.150 X 0.410 X1 0.350 X2 0.795 X3 0.700 Y 0.825 Y1 0.500 Y2 0.480 Y3 0.500 R R0.125 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 50 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2018-6 A3 A U-DFN2018-6 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.13 b 0.15 0.25 0.20 D 1.750 1.875 1.80 D2 1.30 1.50 1.40 e 0.50 E 1.95 2.075 2.00 E2 0.90 1.10 1.00 L 0.20 0.30 0.25 z 0.30 All Dimensions in mm SEATING PLANE A1 Pin#1 ID D D2 L E2 E z b e Suggested Pad Layout U-DFN2018-6 X C Y Dimensions C G X X1 Y Y1 Y1 G Value (in mm) 0.50 0.20 0.25 1.60 0.35 1.20 X1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 51 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN2018-8 F G H SIDE VIEW B D C L3 D L1 L4 A E D L5 L6 L2 N D K D M BOTTOM VIEW X2-DFN2018-8 Dim Min Max Typ A 1.95 2.08 2.00 B 1.75 1.88 1.80 C 0.25 0.35 0.30 D 0.20 E 0.30 F 0.26 G 0.36 0.40 0.39 H 0 0.05 0.02 K 0.15 0.25 0.20 L1 0.40 0.60 0.50 L2 0.90 1.10 1.00 L3 0.50 0.70 0.60 L4 0.30 0.50 0.40 L5 0.25 0.45 0.35 L6 0.20 0.40 0.30 M 0.40 N 0.30 All Dimensions in mm TOP VIEW Suggested Pad Layout X2-DFN2018-8 X C Dimensions C G1 G2 G3 G4 X X1 X2 X3 Y Y1 Y2 Y3 Y Y3 G3 X3 X2 G4 Y2 G1 Y1 X1 G2 Value (in mm) 0.40 0.10 0.20 0.10 0.20 0.25 0.60 0.50 0.35 0.50 0.40 1.00 0.30 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 52 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2020-2 (Type B) A 1 A e n a l P g n i t a e S 1 Z 2 D D 2 E k E L U-DFN2020-2 (Type B) Dim Min Max Typ A 0.47 0.53 0.50 A1 0.00 0.05 0.02 b 1.55 1.65 1.60 D 1.95 2.05 2.00 D2 1.50 1.70 1.60 E 1.95 2.05 2.00 E2 1.22 1.42 1.32 k 0.25 BSC L 0.23 0.33 0.28 Z 0.20 BSC Z1 0.075 BSC All Dimensions in mm b Z U-DFN2020-2 (Type B) A 1 A e n a l P g n i t a e S 1 Z 2 D D 2 E k E L U-DFN2020-2 (Type B) Dim Min Max Typ A 0.47 0.53 0.50 A1 0.00 0.05 0.02 b 1.55 1.65 1.60 D 1.95 2.05 2.00 D2 1.50 1.70 1.60 E 1.95 2.05 2.00 E2 1.22 1.42 1.32 k 0.25 BSC L 0.23 0.33 0.28 Z 0.20 BSC Z1 0.075 BSC All Dimensions in mm b Z Suggested Pad Layout ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 53 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated U-DFN2020-2 (Type B) X Y Dimensions 2 Y G 1 Y G X X1 Y Y1 Y2 Value (in mm) 0.150 1.700 1.700 0.480 1.520 2.150 1 X U-DFN2020-2 (Type B) X Y Dimensions 2 Y G 1 Y G X X1 Y Y1 Y2 Value (in mm) 0.150 1.700 1.700 0.480 1.520 2.150 1 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 54 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2020-3 3 A 1 A A e n a l P g n i t a e S L D 2 D 3 E 0 0 D 2 I . 0 1 R # n i P 2 E E U-DFN2020-3 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.152 b 0.20 0.30 0.25 D 1.950 2.075 2.00 D2 1.10 1.30 1.20 D3 0.325 REF e 0.50 E 1.950 2.075 2.00 E2 0.80 1.00 0.90 E3 0.138 REF L 0.35 0.45 0.40 All Dimensions in mm 3 D L b e Suggested Pad Layout U-DFN2020-3 3 X 1 X 1 Y 0 0 2 . 0 R 0 5 0 . 0 R Dimensions 5 2 2 . 0 R 2 X 4 Y 0 0 2 . 0 R 2 Y G 3 Y Y C G X X1 X2 X3 Y Y1 Y2 Y3 Y4 Value (in mm) 1.000 0.150 0.350 0.450 1.400 1.724 0.600 0.450 1.100 0.450 2.300 X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 55 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2020-3 (Type B) 3 A 1 A A e n a l P g n i t a e S D e e Z L 4 D 2 D 2 E E 4 E U-DFN2020-3 (Type B) Dim Min Max Typ A 0.57 0.63 0.60 A1 0.00 0.05 0.02 A3 –– –– 0.152 b 0.20 0.30 0.25 D 1.950 2.075 2.00 D2 1.22 1.42 1.32 D4 0.56 0.76 0.66 E 1.950 2.075 2.00 E2 0.79 0.99 0.89 E4 0.48 0.68 0.58 e –– –– 0.65 L 0.25 0.35 0.30 Z –– –– 0.225 All Dimensions in mm b Suggested Pad Layout U-DFN2020-3 (Type B) X 1 Y Dimensions 1 X 2 Y G Y C G X X1 X2 Y Y1 Y2 Value (in mm) 1.300 0.240 0.350 1.520 1.700 0.500 0.470 1.090 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 56 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Suggested Pad Layout V-DFN2020-3 C C X (3x) Dimensions Y (2x) G Y4 Y3 Y1 Y2 X1 C G X X1 Y Y1 Y2 Y3 Y4 Value (in mm) 0.65 0.20 0.35 1.52 0.55 0.98 0.47 0.63 2.20 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 57 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2020-6 1 A 3 A A e n a l P g n i t a e S 2 D D 2 / 2 D 0 0 1 . 0 R 2 / 2 E D I 1 # n i P 2 E E U-DFN2020-6 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.03 A3 0.15 b 0.20 0.30 0.25 D 1.95 2.075 2.00 D2 1.45 1.65 1.55 e 0.65 E 1.95 2.075 2.00 E2 0.76 0.96 0.86 L 0.30 0.40 0.35 All Dimensions in mm L b e Suggested Pad Layout U-DFN2020-6 C X G Y Dimensions 1 Y G C G X X1 Y Y1 Value (in mm) 0.65 0.15 0.37 1.67 0.45 0.90 X 1 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 58 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2020-6/SWP 3 A 1 A A e n a l P g n i t a e S A D U-DFN2020-6/SWP Dim Min Max Typ A 0.59 0.65 0.62 A1 0 0.05 0.03 A3 0.19 b 0.28 0.38 0.33 D 1.95 2.05 2.00 D2 0.87 1.07 0.97 D2a 0.205 0.305 0.255 E 1.95 2.05 2.00 E2 1.42 1.62 1.52 E2a 0.69 0.79 0.74 e 0.65 BSC L 0.28 0.38 0.33 k 0.450 BSC k1 0.225 BSC Z 0.20 All Dimensions in mm 2 D Detail A k a 2 D 1 k a 2 E 2 E E x 2 L ︵ ︶ e b z Suggested Pad Layout U-DFN2020-6/SWP 1 X 1 Y 1 G Dimensions 3 Y 2 Y Y G C G G1 X X1 Y Y1 Y2 Y3 Value (in mm) 0.650 0.125 0.350 0.400 1.700 0.365 0.515 0.825 2.330 X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 59 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2020-6 (Type B) A A3 SEATING PLANE A1 D Pin#1 ID D2 z d E E2 f f L e b U-DFN2020-6 Type B Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.13 b 0.20 0.30 0.25 D 1.95 2.075 2.00 d 0.45 D2 0.50 0.70 0.60 e 0.65 E 1.95 2.075 2.00 E2 0.90 1.10 1.00 f 0.15 L 0.25 0.35 0.30 z 0.225 All Dimensions in mm Suggested Pad Layout U-DFN2020-6 (Type B) C Y Dimensions G X2 Z G G1 X1 X2 Y Y1 C G1 X1 G Y1 Z Value (in mm) 1.67 0.20 0.40 1.0 0.45 0.37 0.70 0.65 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 60 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2020-6 (Type C) A1 A A3 Seating Plane D D2 Pin #1 ID E E2 Z(4x) L U-DFN2020-6 Type C Dim Min Max Typ A 0.57 0.63 0.60 A1 0.00 0.05 0.02 A3 –– –– 0.15 b 0.25 0.35 0.30 D 1.95 2.075 2.00 D2 1.55 1.75 1.65 E 1.95 2.075 2.00 E2 0.86 1.06 0.96 e –– –– 0.65 L 0.25 0.35 0.30 Z –– –– 0.20 All Dimensions in mm b e Suggested Pad Layout U-DFN2020-6 (Type C) X2 X1 Y Y2 Y1 X Dimensions C X X1 X2 Y Y1 Y2 Value (in mm) 0.650 0.350 1.650 1.700 0.525 1.010 2.400 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 61 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2020-6 (Type E) 3 A 1 A A D 1 K 1 b 2 D X 2 L 1 L 2 E E ︵ ︶ 2 K ︵ X 6 b ︶ e X 4 Z ︵ ︶ U-DFN2020-6 Type E Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.03 A3 0.15 b 0.25 0.35 0.30 b1 0.185 0.285 0.235 D 1.95 2.05 2.00 D2 0.85 1.05 0.95 E 1.95 2.05 2.00 E2 1.40 1.60 1.50 e 0.65 L 0.25 0.35 0.30 L1 0.82 0.92 0.87 K1 0.305 K2 0.225 Z 0.20 All Dimensions in mm Suggested Pad Layout U-DFN2020-6 (Type E) Dimensions 1 Y 2 X 2 Y 3 Y C X X1 X2 Y Y1 Y2 Y3 1 X ︵ x 2 Y ︶ C x 6 X ︵ Value (in mm) 0.650 0.400 0.285 1.050 0.500 0.920 1.600 2.300 ︶ ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 62 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2020-6 (Type F) A 3 A 1 A e n a l P g n i t a e S D 3 D 3 E 2 D 2 E E L 2 e 1 Z b e X 4 Z ︵ U-DFN2020-6 (Type F) Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.03 A3 0.15 b 0.25 0.35 0.30 D 1.95 2.05 2.00 D2 0.85 1.05 0.95 D3 0.33 0.43 0.38 e 0.65 BSC e2 0.863 BSC E 1.95 2.05 2.00 E2 1.05 1.25 1.15 E3 0.65 0.75 0.70 L 0.225 0.325 0.275 Z 0.20 BSC Z1 0.110 BSC All Dimensions in mm ︶ U-DFN2020-6 (Type F) A 3 A 1 A e n a l P g n i t a e S D 3 D 3 E 2 D 2 E E L 2 e 1 Z b e X 4 Z ︵ U-DFN2020-6 (Type F) Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.03 A3 0.15 b 0.25 0.35 0.30 D 1.95 2.05 2.00 D2 0.85 1.05 0.95 D3 0.33 0.43 0.38 e 0.65 BSC e2 0.863 BSC E 1.95 2.05 2.00 E2 1.05 1.25 1.15 E3 0.65 0.75 0.70 L 0.225 0.325 0.275 Z 0.20 BSC Z1 0.110 BSC All Dimensions in mm ︶ Suggested Pad Layout ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 63 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated U-DFN2020-6 (Type F) 3 X Y X C Dimensions 4 Y 1 Y 2 Y 3 Y 1 X 1 n i P C X X1 X2 X3 Y Y1 Y2 Y3 Y4 Value (in mm) 0.650 0.400 0.480 0.950 1.700 0.425 0.800 1.150 1.450 2.300 2 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 64 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN2020-6 3 A 1 A A D e L 2 D 2 E E 1 L X 6 b e X 3 Z ︵ ︶ X2-DFN2020-6 Dim Min Max Typ A 0.40 A1 0 0.05 0.03 A3 0.13 b 0.25 0.35 0.30 D 1.95 2.05 2.00 D2 0.85 1.05 0.95 E 1.95 2.05 2.00 E2 1.40 1.60 1.50 e 0.65 L 0.25 0.35 0.30 L1 1.35 1.45 1.40 Z 0.20 All Dimensions in mm ︵ ︶ Suggested Pad Layout X2-DFN2020-6 X2 X1 Y C X X1 X2 Y Y1 Y2 Y3 Y3 Y2 Y1 X (6x) Dimensions Value (in mm) 0.650 0.400 1.050 1.700 0.500 1.600 1.600 2.300 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 65 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Suggested Pad Layout U-DFN2020-8 3 A 1 A A e n a l P g n i t a e S U-DFN2020-8 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.152 b 0.20 0.30 0.25 D 1.95 2.05 2.00 D2 0.54 0.74 0.64 e 0.500 BSC E 1.95 2.05 2.00 E2 0.86 1.06 0.96 K 0.23 K1 0.32 L 0.24 0.34 0.29 Z 0.125 All Dimensions in mm D 2 D D I 1 # n i P K 1 K 0 5 1 . 0 R 2 E E L b e Z Suggested Pad Layout U-DFN2020-8 3 X C X G Y Dimensions 1 X C G X X1 X2 Y Y1 Y1 1 Y 2 Y Value (in mm) 0.500 0.150 0.350 0.700 1.660 0.490 1.020 2.300 2 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 66 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions W-DFN2020-6 (Type US) A1 A A3 Seating Plane D D2 Pin #1 ID E E2 W-DFN2020-6 (Type US) Dim Min Max Typ A 0.70 0.80 0.75 A1 0.00 0.05 -A3 0.20 REF b 0.25 0.35 0.30 D 1.95 2.075 2.00 D2 1.35 1.60 1.50 E 1.95 2.075 2.00 E2 0.65 0.90 0.80 e 0.65 BSC L 0.25 0.45 0.35 All Dimensions in mm L b e Suggested Pad Layout W-DFN2020-6 (Type US) X1 X2 Y Dimensions C X X1 X2 Y Y1 Y2 Y2 Y1 Value (in mm) 0.650 0.350 1.650 1.550 0.545 0.850 2.350 X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 67 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions W-DFN2020-8 (Type C) 1 A A e n a l P g n i t a e S 3 A D 2 * D 2 / 2 D K D I 1 # n i P 2 / 2 E 2 E 0 0 2 . 0 R E L W-DFN2020-8 Type C Dim Min Max Typ A 0.770 0.830 0.800 A1 0 0.05 0.02 A3 0.152 b 0.20 0.30 0.25 D 1.950 2.075 2.000 D2 1.50 1.70 1.60 E 1.950 2.075 2.000 E2 0.80 1.00 0.90 e 0.50 K 0.125 L 0.240 0.340 0.290 All Dimensions in mm b e Suggested Pad Layout W-DFN2020-8 Y 2 G X 1 Y 2 Y 1 G Dimensions Value (in mm) C 0.500 G 0.200 G1 0.210 X 0.300 X1 1.600 X2 1.750 Y 0.490 Y1 0.900 Y2 2.300 1 X C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 68 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions 3 A 1 A U-DFN2030-6 (Type B) A e n a l P g n i t a e S D e D I 1 # n i P ︵ ︶ 2 E E L 2 D b x 4 Z U-DFN2030-6 Type B Dim Min Max Typ A 0.55 0.65 0.60 A1 0 0.05 0.02 A3 0.15 b 0.25 0.35 0.30 D 1.95 2.05 2.00 D2 1.40 1.60 1.50 E 2.95 3.05 3.00 E2 1.74 1.94 1.84 e 0.65 L 0.28 0.38 0.33 Z 0.20 All Dimensions in mm ︵ ︶ Suggested Pad Layout U-DFN2030-6 (Type B) 2 X Y G Dimensions 1 X C G X X1 X2 Y Y1 Y2 1 Y 2 Y Value (in mm) 0.650 0.150 0.400 1.600 1.700 0.530 1.940 3.300 X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 69 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2030-6 (Type C) 3 A 1 A A e n a l P g n i t a e S D L e 1 1 e 0 5D 1I . 1 0 n R i P 2 E E 2 D z Dim A A1 A3 b b2 D D2 E E2 e e1 L z U-DFN2030-6 (Type C) Min Max Typ 0.50 0.60 -0.00 0.05 0.02 --0.127 0.25 0.35 0.30 0.60 0.70 0.65 1.90 2.10 2.00 1.60 1.80 1.70 2.90 3.10 3.00 1.60 1.80 1.70 --0.60 --0.775 0.25 0.35 0.30 0.0500 Ref All Dimensions in mm b 2 b Suggested Pad Layout U-DFN2030-6 (Type C) 1 G X 1 X Y Dimensions G 1 Y 2 X C C1 G G1 X X1 X2 Y Y1 Value (in mm) 0.600 0.775 0.200 0.200 0.400 0.750 1.800 0.500 1.800 C 1 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 70 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2030-8 A 3 A 1 A e n a l P g n i t a e S D L e D I 1 # n i P ︵ ︶ 2 D 2 E ° 5 4 * 5 2 . 0 ' C E b Z U-DFN2030-8 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 D 1.95 2.05 2.00 D2 1.40 1.60 1.50 e 0.50 E 2.95 3.05 3.00 E2 1.50 1.70 1.60 L 0.35 0.45 0.40 Z 0.125 All Dimensions in mm Suggested Pad Layout U-DFN2030-8 2 X Y C Dimensions 1 Y 2 Y C G X X1 X2 Y Y1 Y2 1 X G Value (in mm) 0.500 0.250 0.350 1.500 1.850 0.600 1.600 3.300 X 1 n i P ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 71 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X1-DFN2030-8 1 A A Seating Plane X 4 1 Z ︵ X 4 Z D e (Pin #1 ID) C0.5X45° ︵ ︶ ︶ 1 L K 1 K E x 7 L X1-DFN2030-8 Dim Min Max Typ A 0.470 0.530 0.50 A1 0 0.05 0.02 b 0.20 0.30 0.25 D 1.95 2.05 2.00 E 2.95 3.05 3.00 e 0.50 K 2.00 K1 1.90 L 0.35 0.45 0.40 L1 0.45 0.55 0.50 Z 0.125 Z1 0.100 All Dimensions in mm ︵ ︶ b Suggested Pad Layout X1-DFN2030-8 1 X 1 Y Dimensions G 2 Y C G X X1 Y Y1 Y2 Y Value (in mm) 0.500 1.900 0.350 1.850 0.500 0.700 3.100 X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 72 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2510-10 3 A 1 A A e n a l P g n i t a e S 1 D b 5 7 0 . 0 R E L Z U-DFN2510-10 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.03 A3 0.13 b 0.15 0.25 0.20 b1 035 0.45 0.40 D 2.450 2.575 2.500 e 0.50 E 0.950 1.075 1.000 L 0.325 0.425 0.375 Z 0.150 All Dimensions in mm 5 2 1 . 0 R b e Suggested Pad Layout U-DFN2510-10 2 X X 1 X Y 1 Y Dimensions 3 Y C X X1 X2 Y Y1 Y2 Y3 2 Y C Value (in mm) 0.500 0.250 0.450 2.250 0.625 0.575 0.700 1.400 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 73 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2535-6 A 3 A 1 A e n a l P g n i t a e S D L e D I 1 # n i P ︵ ︶ 1 0 5 1 . 0 R 2 E E 2 D U-DFN2535-6 Dim Min Max Typ A 0.50 0.60 -A1 0.00 0.05 0.02 A3 0.127 b 0.25 0.35 0.30 D 2.45 2.55 2.50 D2 1.87 2.07 1.97 E 3.45 3.55 3.50 E2 1.20 1.40 1.30 e 0.65 L 0.33 0.43 0.38 Z 0.45 All Dimensions in mm b Z Suggested Pad Layout U-DFN2535-6 X G Dimensions 1 Y C G X X1 Y Y1 1 X Value (in mm) 0.650 0.620 0.400 2.070 0.610 1.400 Y C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 74 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2535-6(Type B) 3 A A e n a l P g n i t a e S D 1 A e ︶ D I 01 5# 1n . 0 i R P ︵ 6 X L 1 e ︵ ︶ 2 E E 2 D b z U-DFN2535-6 (Type B) Dim Min Max Typ A 0.50 0.60 A1 0.00 0.05 0.02 A3 0.127 b 0.25 0.35 0.30 b2 1.05 1.15 1.10 D 2.45 2.55 2.50 D2 2.01 2.21 2.11 E 3.45 3.55 3.50 E2 2.20 2.40 2.30 e 0.55 e1 0.95 L 0.25 0.35 0.30 z 0.15 All Dimensions in mm 2 b Suggested Pad Layout U-DFN2535-6 (Type B) X 1 X 2 X Dimensions 1 Y C C1 X X1 X2 Y Y1 Y Value (in mm) 0.550 0.950 0.400 1.200 2.210 0.500 2.400 C 1 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 75 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN2050-4 1 A 3 A A e n a l P g n i t a e S D e D I 1 # n i P V-DFN2050-4 Dim Min Max Typ A 0.75 0.85 0.80 A1 0 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 b1 0.70 0.80 0.75 D 1.90 2.10 2.00 D2 1.40 1.60 1.50 E 4.90 5.10 5.00 E2 3.46 3.66 3.56 e 0.50 BSC L 0.35 0.65 0.50 Z 0.375 All Dimensions in mm 2 D 2 E E L b Z 1 b Suggested Pad Layout V-DFN2050-4 X 1 X G Y C Dimensions 1 Y C G X X1 X2 X3 Y Y1 Y2 2 Y 2 X Value (in mm) 0.500 0.150 0.350 0.850 1.540 0.175 0.700 3.600 5.300 3 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 76 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2116-8 3 A 1 A A U-DFN2116-8 e n a l P g n i t a e S D 2 D 2 / 2 D ° 5 D4 I x 12 #. 0 n' i C P ︵ ︶ 0 0 1 . 0 R 2 / 2 E 2 E E 0 0 6 . 0 ︶ L ︵ Dim Min Max Typ A 0.545 0.605 0.575 A1 0.000 0.050 0.020 A3 - - 0.130 b 0.200 0.300 0.250 D 2.050 2.175 2.100 D2 1.600 1.800 1.700 E 1.550 1.675 1.600 E2 0.300 0.500 0.400 e - - 0.500 L 0.275 0.375 0.325 Z - - 0.175 b e All Dimensions in mm Z Suggested Pad Layout U-DFN2116-8 2 X C Y Dimensions 1 Y 2 Y 1 X C X X1 X2 Y Y1 Y2 Value (in mm) 0.500 0.300 1.750 1.800 0.600 0.450 2.050 1 n i P X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 77 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2523-6 A A3 A1 D e L (3x) Pin #1 ID R0.150 E E1 D1 L1 (2x) U-DFN2523-6 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.152 b 0.25 0.35 0.30 D 2.45 2.55 2.50 D1 1.55 1.65 1.60 e 0.65 E 2.25 2.35 2.30 E1 1.18 1.28 1.23 L 0.30 0.40 0.35 L1 0.30 0.40 0.35 All Dimensions in mm b (6x) Suggested Pad Layout U-DFN2523-6 X1 Y1 Dimensions Value (in mm) C 0.650 X 0.400 X1 1.700 Y 0.650 Y1 0.450 Y2 1.830 Y3 2.700 Y2 Y3 Y C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 78 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN2626-10 A A3 A1 Seating Plane D D2 U-DFN2626-10 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.03 A3 0.15 b 0.20 0.30 0.25 D 2.55 2.675 2.60 D2 2.05 2.25 2.15 E 2.55 2.675 2.60 E2 1.16 1.36 1.26 e 0.50 BSC L 0.30 0.40 0.35 All Dimensions in mm C'0.2x45° (Pin #1 ID) D2/2 E E2/2 E2 0 .10 R0 L e b Suggested Pad Layout U-DFN2626-10 X2 Y Dimensions C X X1 X2 Y Y1 Y2 X1 Y2 Y1 Pin1 Value (in mm) 0.500 0.300 2.250 2.300 0.600 1.360 3.000 C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 79 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN3016-12 A A3 A1 D E E2 D2 L (12x) U-DFN3016-12 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.13 b 0.20 0.30 0.25 D 2.95 3.075 3.00 D2 2.10 2.30 2.20 e 0.50 E 1.55 1.675 1.60 E2 0.30 0.50 0.40 L 0.28 0.38 0.33 All Dimensions in mm b (12x) e Suggested Pad Layout U-DFN3016-12 X1 Y (12x) Dimensions X2 C Y1 Y2 C X X1 X2 Y Y1 Y2 Value (in mm) 0.500 0.300 2.800 2.250 0.600 0.450 2.050 X (12x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 80 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-DFN3020-6 A A1 A3 D e Pin #1 ID D1 E E1 L Z X2-DFN3020-6 Dim Min Max Typ A - 0.40 A1 0 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 D 1.95 2.075 2.00 D1 0.942 1.142 1.042 e 0.50 E 2.95 3.075 3.00 E1 1.124 1.324 1.224 L 0.50 0.60 0.55 Z 0.375 All Dimensions in mm b ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 81 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions A V-DFN3020-8 3 A 1 A e n a l P g n i t a e S D e D I 1 # n i P ︵ ︶ E L V-DFN3020-8 Dim Min Max Typ A 0.77 0.83 0.80 A1 0 0.05 0.02 A3 0.203 b 0.25 0.35 0.30 D 2.95 3.05 3.00 e 0.65 E 1.95 2.05 2.00 L 0.30 0.40 0.35 Z 0.375 All Dimensions in mm b Z Suggested Pad Layout V-DFN3020-8 1 X Y X G 1 Y Dimensions C G X X1 Y Y1 Value (in mm) 0.650 1.000 0.400 2.350 0.650 2.300 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 82 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions W-DFN3020-8 (Type B) A W-DFN3020-8 Type B Dim Min Max Typ A 0.77 0.83 0.80 A1 0 0.05 0.02 A3 0.15 b 0.25 0.35 0.30 D 2.95 3.075 3.00 D2 0.82 1.02 0.92 D4 1.01 1.21 1.11 e 0.65 E 1.95 2.075 2.00 E2 0.43 0.63 0.53 L 0.25 0.35 0.30 Z 0.375 All Dimensions in mm A3 A1 Seating Plane D D4 D4 (Pin #1 ID) E E2 E2 D2 D2 L e e e b Z Suggested Pad Layout W-DFN3020-8 (Type B) C X Y1 G1 G Y2 Y X1 Dimensions Value (in mm) C 0.650 G 0.285 G1 0.090 X 0.400 X1 1.120 Y 0.730 Y1 0.500 Y2 0.365 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 83 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions W-DFN3020-8 (Type K) A A3 A1 D e D3 L1 L2 E E3 E1 E2 D2 D1 E4 (2x) L (4x) Dim Min A 0.77 A1 0.00 A3 b 0.25 D 2.95 D1 1.025 D2 1.05 D3 0.375 D4 0.40 E 1.95 D4 (2x) W-DFN3020-8 Type K Max Typ Dim Min Max Typ E1 0.83 0.80 0.56 0.76 0.66 E2 0.05 0.02 0.26 0.46 0.36 E3 0.605 0.805 0.705 0.15 E4 0.275 0.475 0.375 0.35 0.30 L 3.05 3.00 0.425 0.525 0.475 1.225 1.125 L1 0.30 0.40 0.35 L2 1.25 1.15 0.60 0.70 0.65 Z 0.575 0.475 0.375 e 0.60 0.50 0.65 2.05 2.00 All Dimensions in mm b Z (4x) Suggested Pad Layout W-DFN3020-8 (Type K) Dimensions Value (in mm) C 0.650 X 0.600 X1 0.400 X2 0.825 X3 0.675 X4 1.250 X5 2.750 Y 0.675 Y1 0.550 Y2 0.850 Y3 0.755 Y4 1.455 Y5 1.000 Y6 0.650 Y7 1.455 Y8 2.300 X5 X (2x) C Y (4x) X4 Y8 Y7 Y6 Y5 X3 Y4 Y3 X2 Y2 X1 (6x) Y1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 84 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN3020-8 (Type N) 3 A 1 A A e n a l P g n i t a e S D e D I 1 # n i P ︵ ︶ L K 2 D 1 L E 2 E b x 4 Z V-DFN3020-8 (Type N) Dim Min Max Typ A 0.77 0.83 0.80 A1 0 0.05 0.02 A3 0.203 b 0.24 0.34 0.29 D 2.95 3.05 3.00 D2 0.84 1.04 0.94 e 0.65 E 1.95 2.05 2.00 E2 0.70 0.90 0.80 L 0.27 0.37 0.32 L1 0.15 0.25 0.20 K 0.68 Z 0.38 All Dimensions in mm ︵ ︶ Suggested Pad Layout V-DFN3020-8 (Type N) 2 X Y X C Dimensions G 1 X 3 Y 1 Y 2 Y C G X X1 X2 Y Y1 Y2 Y3 Value (in mm) 0.650 0.580 0.390 1.040 2.340 0.520 0.900 0.300 2.300 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 85 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN3020-10 3 A 1 A A e n a l P g n i t a e S U-DFN3020-10 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.15 0.25 0.20 D 2.95 3.05 3.00 D1 0.25 0.45 0.35 E 1.95 2.05 2.00 E1 0.90 1.10 1.00 e 0.60 e1 0.65 e2 0.50 0.70 0.60 L 0.25 0.35 0.30 Z 0.15 All Dimensions in mm D e ° 5 4 X 2 . 0 ' C x 3 1 D D I 1 # n i P ︵ ︶ ︵ ︶ x 3 1 E E x 0 1 L ︵ ︶ 2 e ︵ ︶ 1 e x 0 1 b x 4 Z ︵ ︶ ︵ ︶ Suggested Pad Layout U-DFN3020-10 2 X Dimensions Y 1 G C G G1 X X1 X2 Y Y1 Y2 1 Y 2 Y G 1 X X C Value (in mm) 0.650 0.150 0.600 0.300 0.350 2.800 0.500 1.000 2.300 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 86 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN3020-10 3 A 1 A A e n a l P g n i t a e S D e a L c L 2 E 0D 5 I 1 . 1 0 # Rn i P ︵ 2 E 2 E ︶ a 2 D 2 D 2 E a L a 2 E c 2 D d 2 D E b 2 D 2 E e 2 D b L x 6 L ︵ ︶ x 0 1 b x 4 Z ︵ ︶ ︵ ︶ V-DFN3020-10 Dim Min Max Typ A 0.75 0.85 0.80 A1 0 0.05 0.02 A3 0.15 b 0.15 0.25 0.20 D 2.95 3.075 3.00 D2 1.000 D2a 0.400 D2b 0.500 D2c 0.850 D2d 0.320 D2e 0.400 E 1.95 2.075 2.00 E2 0.200 E2a 0.450 e 0.60 L 0.25 0.35 0.30 La 0.460 Lb 0.550 Lc 0.548 Z 0.175 0.225 0.20 All Dimensions in mm Suggested Pad Layout V-DFN3020-10 Dimensions ︵ x 0 1 X x 6 Y ︵ ︶ ︶ 2 Y 1 Y G 5 Y 4 Y 3 G 2 X 1 X 1 G 3 Y 5 X 3 X 6 Y 1 1 Y 6 X 9 Y 8 Y 4 X 2 G 0 1 Y 7 Y C C G, G2, G3 G1 X X1 X2 X3 X4 X5 X6 Y Y1 Y2 Y3 Y4, Y5, Y6 Y7 Y8, Y9 Y10 Y11 Value (in mm) 0.600 0.150 0.240 0.300 0.950 0.500 0.600 1.100 0.500 0.420 0.500 0.650 0.560 0.550 0.300 0.650 0.300 0.560 2.300 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 87 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN3020-14 3 A 1 A A e n a l P g n i t a e S D e D I 1 # n i P ︶ 2 D ︵ 0 0 2 . 0 R 1 E E L b Z V-DFN3020-14 Dim Min Max Typ A 0.77 0.83 0.80 A1 0 0.05 0.02 A3 0.15 b 0.15 0.25 0.20 D 2.95 3.05 3.00 D2 2.40 2.60 2.50 E 1.95 2.05 2.00 E1 0.80 1.00 0.90 e 0.40 L 0.30 0.40 0.35 Z 0.20 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 88 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN3030-4 A3 A A1 U-DFN3030-4 Dim Min Max Typ Dim Min A E1 0.615 0.57 0.63 0.60 A1 E2 0 0.05 0.02 1.78 A3 E3 0.715 0.15 B H 0.35 0.45 0.40 0.05 D I 2.90 3.10 3.00 0.20 D1 1.075 1.275 1.175 J 0.185 D2 0.925 1.125 1.025 K 0.065 D3 1.075 1.275 1.175 L 0.30 E M 2.90 3.10 3.00 0.05 e Z 1.30 All Dimensions in mm Side View D e H D3 E3 E K I E2 D2 J D1 E1 M L Z Max 0.815 1.98 0.915 0.15 0.30 0.285 0.165 0.60 0.15 - Typ 0.715 1.88 0.815 0.10 0.25 0.235 0.115 0.45 0.10 0.65 b Bottom View Suggested Pad Layout U-DFN3030-4 C Y3 (2x) G6 G4 Y2 Dimensions C G1 G2 G3 G4 G5 G6 G7 G8 R X X1 X2 X3 Y Y1 Y2 Y3 G1 X3 G3 R Y G2 G5 Y1 X2 X1 G7 G8 X (4x) Value (in mm) 1.300 0.100 0.150 0.830 0.115 0.135 0.170 0.500 0.500 0.150 0.500 1.375 1.225 1.175 1.980 1.015 0.715 0.650 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 89 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN3030-6 3 A 1 A A e n a l P g n i t a e S U-DFN3030-6 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.35 0.45 0.40 D 2.95 3.05 3.00 D2 2.25 2.45 2.35 E 2.95 3.05 3.00 E2 1.48 1.68 1.58 e 0.95 L 0.35 0.45 0.40 Z 0.35 All Dimensions in mm 2 D D D I 1 # n i P ︵ ︶ 5 3 . 0 * 5 3 . 0 ° 5 4 ︵ ︶ L E 2 E e b x 4 Z ︵ ︶ Suggested Pad Layout U-DFN3030-6 21 XX C Dimensions 2 Y 1 Y C X X1 X2 Y Y1 Y2 9 0 4 . 0 C Y Value (in mm) 0.950 0.500 2.400 2.550 0.600 1.780 3.300 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 90 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN3030-6 1 A 3 A D A e n a l P g n i t a e S V-DFN3030-6 Dim Min Max Typ A 0.80 0.90 0.85 A1 0 0.05 A3 0.203 b 0.30 0.40 0.35 D 2.95 3.05 3.00 D2 1.95 2.05 2.00 E 2.95 3.05 3.00 E2 1.15 1.25 1.20 e 0.95 e1 1.90 L 0.45 0.55 0.50 All Dimensions in mm e L 2 D 2 E E ° 5 4 X 0 0 3 . 0 Dr I e 1f #m a nh i P C 1 b e Suggested Pad Layout V-DFN3030-6 Y Dimensions 1 X 1 Y 2 Y C X X1 Y Y1 Y2 9 2 3 . 0 C Value (in mm) 0.950 0.450 2.100 0.630 1.300 3.160 X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 91 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN3030-8 3 A 1 A A e n a l P g n i t a e S 2 DD 2 E E L 0 0 2 . 0 R D I 1 # n i P b ︶ e ︵ U-DFN3030-8 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.29 0.39 0.34 D 2.90 3.10 3.00 D2 2.19 2.39 2.29 e 0.65 E 2.90 3.10 3.00 E2 1.64 1.84 1.74 L 0.30 0.60 0.45 All Dimensions in mm Suggested Pad Layout U-DFN3030-8 Z Dimensions Value (in mm) Z 2.59 G 0.11 X1 2.49 X2 0.65 Y 0.39 C 0.65 X1 X2 G Y C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 92 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions A U-DFN3030-8 (Type D) 3 A 1 A e n a l P g n i t a e S D 3 D 2 e / D 3 E 4 E 4 D 5 E 1 D 7 E 1 E E 2 E 2 D 6 E 2 / E L Dim A A1 A3 b D D1 D2 D3 D4 D5 e Min 0.570 0 0.290 2.950 2.175 0.980 0.105 - 5 D U-DFN3030-8 Type D Max Typ Dim Min E 2.950 0.630 0.600 E1 1.800 0.050 0.020 E2 0.290 0.150 E3 0.175 0.390 0.340 E4 3.075 3.000 E5 2.375 2.275 E6 1.180 1.080 E7 0.305 0.205 L 0.925 0.300 Z 1.330 0.650 All Dimensions in mm Max 3.075 2.000 0.490 0.375 0.40 - Typ 3.000 1.900 0.390 0.275 0.550 0.815 0.150 0.135 0.350 0.355 Z X 8 b ︵ ︶ ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 93 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN3030-8 (Type E) A A3 U-DFN3030-8 Type E Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 D 2.95 3.05 3.00 D2 2.15 2.35 2.25 E 2.95 3.05 3.00 e 0.65 E2 1.40 1.60 1.50 L 0.30 0.60 0.45 Z 0.40 All Dimensions in mm A1 D D2 L (x8) E E2 Z (x4) e b (x8) Suggested Pad Layout U-DFN3030-8 (Type E) X (x8) C Y (x8) Y1 Y2 Dimensions C C1 X Y Y1 Y2 Value (in mm) 0.65 2.35 0.30 0.65 1.60 2.75 C1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 94 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN3030-8 3 A 1 A A e n a l P g n i t a e S D V-DFN3030-8 Dim Min Max Typ A 0.75 0.85 0.80 A1 0.00 0.05 0.02 A3 0.203 b 0.25 0.35 0.30 D 2.95 3.05 3.00 E 2.95 3.05 3.00 e 0.65 L 0.55 0.65 0.60 Z 0.375 All Dimensions in mm e L 10 #1 . n0 i P C E b X 4 Z ︵ ︶ Suggested Pad Layout V-DFN3030-8 C Dimensions 1 Y X C X Y Y1 Value (in mm) 0.650 0.400 0.850 3.400 Y 1 n i P ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 95 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN3030-8 Type H 3 A 1 A A e n a l P g n i t a e S D 1 Z e K 1 K E 2 D 2 E L V-DFN3030-8 (Type H) Dim Min Max Typ A 0.75 0.85 0.80 A1 0 0.05 0.02 A3 0.203 BSC b 0.27 0.37 0.32 D 2.95 3.05 3.00 D2 2.50 2.70 2.60 e 0.65 BSC E 2.95 3.05 3.00 E2 0.59 0.79 0.69 L 0.30 0.40 0.35 K 0.28 BSC K1 0.36 BSC Z 0.365 BSC Z1 0.24 BSC All Dimensions in mm x 8 b Z ︵ ︶ Suggested Pad Layout V-DFN3030-8 Type H 3 X C G 2 X 1 Y 1 G 2 Y 1 Y Y Dimensions Value (in mm) C 0.650 G 0.180 G1 0.260 X 0.420 X1 1.920 X2 2.700 X3 2.495 Y 0.550 Y1 0.790 Y2 3.300 1 X X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 96 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN3030-8 Type J 3 A 1 A A e n a l P g n i t a e S D e 2 / D D I # 1 N I P a 2 D L k 2 E E a 2 E 2 D 2 / E V-DFN3030-8 (Type J) Dim Min Max Typ A 0.77 0.83 0.80 A1 0.00 0.05 0.02 A3 0.203 BSC b 0.20 0.30 0.25 D 2.95 3.050 3.00 D2 0.90 1.10 1.00 D2a 0.90 1.10 1.00 E 2.95 3.050 3.00 E2 1.72 1.92 1.82 E2a 1.72 1.92 1.82 e 0.65BSC L 0.27 0.38 0.33 La 0.15 0.25 0.20 k 0.35 TYP z 0.40 BSC All Dimensions in mm a L b z Suggested Pad Layout V-DFN3030-8 Type J 1 Y Dimensions 1 G 4 Y 3 Y 5 Y 1 X 2 Y G X 2 X Y C 3 X C G G1 X X1 X2 X3 X4 Y Y1 Y2 Y3 Y4 Y5 Value (in mm) 0.650 0.250 0.550 0.350 1.100 1.100 1.225 2.375 0.530 0.300 1.920 1.920 1.650 3.300 4 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 97 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN3030-8 Type K 3 A 1 A A e n a l P g n i t a e S D 2 / D e 2 E k 2 D E a 2 E a 2 D 2 / E L V-DFN3030-8 (Type K) Dim Min Max Typ A 0.77 0.83 0.80 A1 0 0.05 0.02 A3 0.20BSC b 0.35 0.45 0.40 D 2.95 3.050 3.00 D2 2.30 2.50 2.40 D2a 2.30 2.50 2.40 E 2.95 3.050 3.00 E2 0.42 0.62 0.52 E2a 0.89 0.109 0.99 e 0.65BSC k 0.35 L 0.30 0.40 0.35 z 0.325BSC All Dimensions in mm b Z Suggested Pad Layout V-DFN3030-8 Type K 1 X C X Y Dimensions 4 Y 5 Y 1 Y 6 Y 3 Y 2 Y C G G1 X X1 Y Y1 Y2 Y3 Y4 Y5 Y6 Value (in mm) 0.650 0.195 0.200 0.450 2.550 0.450 1.044 0.566 0.389 0.089 1.150 3.200 G 1 G ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 98 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN3030-8 Type M 3 A 1 A A e n a l P g n i t a e S D 2 / D k 1 k 2 E 2 D a 2 E E a 2 D 2 / E L V-DFN3030-8 (Type M) Dim Min Max Typ A 0.75 0.85 0.80 A1 0.00 0.05 0.02 A3 0.203 BSC b 0.27 0.37 0.32 D 2.95 3.05 3.00 D2 2.50 2.70 2.60 D2a 2.50 2.70 2.60 e 0.65 BSC E 2.95 3.05 3.00 E2 0.59 0.79 0.69 E2a 0.59 0.79 0.69 L 0.30 0.40 0.35 k 0.180 0.280 0.230 k1 0.205 0.305 0.255 z 0.365 BSC All Dimensions in mm e b z Suggested Pad Layout V-DFN3030-8 Type M 3 X 2 X X 1 X Y 1 Y G 3 Y 2 Y 2 G 1 G 1 C C Dimensions Value (in mm) C 0.650 C1 0.688 G 0.260 G1 0.180 G2 0.325 X 0.370 X1 0.470 X2 0.545 X3 2.700 X4 2.470 Y 0.550 Y1 0.790 Y2 0.790 Y3 3.300 4 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 99 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN3030-10 A3 A U-DFN3030-10 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 D 2.90 3.10 3.00 D2 2.30 2.50 2.40 e 0.50 E 2.90 3.10 3.00 E2 1.50 1.70 1.60 L 0.25 0.55 0.40 z 0.375 All Dimensions in mm SEATING PLANE A1 D D2 Pin#1 ID E E2 L z b e Suggested Pad Layout U-DFN3030-10 Y C X1 G X G Dimensions Value (in mm) Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.30 C 0.50 Z ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 100 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions A U-DFN3030-12 3 A e n a l P g n i t a e S 1 A 2 D D 0 0 3 . 0 R D I 1 # n i P ︵ ︶ 2 E E U-DFN3030-12 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.18 0.28 0.23 D 2.90 3.10 3.00 D2 2.30 2.50 2.40 e 0.45 E 2.90 3.10 3.00 E2 1.50 1.70 1.60 L 0.25 0.55 0.40 All Dimensions in mm L b e Suggested Pad Layout U-DFN3030-12 C G 1 Y G 1 X Dimensions Value (in mm) C 0.45 G 0.15 X 0.28 X1 2.60 Y 0.60 Y1 1.80 Y X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 101 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions W-DFN3030-12 3 A A e n a l P g n i t a e S 1 A 2 D D D I 1 # n i P 2 E E W-DFN3030-12 Dim Min Max Typ A 0.70 0.80 -A1 0 0.05 -A3 0.175 0.250 -b 0.150 0.250 -D 2.950 3.050 -D2 2.30 2.65 -e 0.45 E 2.950 3.050 -E2 1.40 1.75 -L 0.35 0.45 -All Dimensions in mm L b e Suggested Pad Layout W-DFN3030-12 C G 1 Y G 1 X Dimensions Value (in mm) C 0.45 G 0.15 X 0.28 X1 2.60 Y 0.60 Y1 1.80 Y X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 102 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN3030-14 A1 A A3 DFN3030-14 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.15 0.25 0.20 D 2.95 3.05 3.00 D2 2.20 2.40 2.30 E 2.95 3.05 3.00 E2 1.60 1.80 1.70 e 0.40 L 0.30 0.40 0.35 Z 0.20 All Dimensions in mm D e (Pin #1 ID) E2 E D2 L(14x) b (14x) Z(4x) Suggested Pad Layout U-DFN3030-14 X2 Y (14x) Dimensions C X X1 X2 Y Y1 Y2 X1 Y2 Y1 Value (in mm) 0.400 0.250 2.350 2.650 0.600 1.750 3.400 Pin1 C X (14x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 103 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions D W-DFN3030-16 (Type US) k r a DM Ir 1e #s a nL i P E ︵ ︶ 3 A A e n a l P g n i t a e S 1 A 2 D 2 / e 2 / E 2 E W-DFN3030-16 (Type US) Dim Min Max Typ A 0.70 0.80 0.75 A1 0 0.05 0.02 A3 0.20 REF b 0.18 0.30 0.25 D 2.90 3.10 3.00 D2 1.55 1.80 1.70 e 0.50 BSC E 2.90 3.10 3.00 E2 1.55 1.80 1.70 L 0.30 0.50 0.40 All Dimensions in mm L b e 2 / D Suggested Pad Layout W-DFN3030-16 (Type US) 3 X 1 X 1 Y 2 Y Dimensions Value (in mm) C 0.500 X 0.350 X1 0.570 X2 1.800 X3 3.300 Y 0.570 Y1 1.800 Y2 3.300 2 X Y X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 104 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-QFN3030-16 (Type B) A3 A1 A U-QFN3030-16 Type B Dim Min Max Typ A 0.55 0.65 0.60 A1 0 0.05 0.02 A3 0.15 b 0.18 0.28 0.23 D 2.95 3.05 3.00 D2 1.40 1.60 1.50 E 2.95 3.05 3.00 E2 1.40 1.60 1.50 e 0.50 L 0.35 0.45 0.40 Z 0.625 All Dimensions in mm Side View D e (Pin #1 ID) E 0.450 00 R0.2 E2 D2 L (16x) Z (8x) b (16x) Bottom View Suggested Pad Layout U-QFN3030-16(Type B) C G G1 Dimensions C G G1 X X1 Y Y1 Y1 X1 Value (in mm) 0.500 0.150 0.150 0.350 1.800 0.600 1.800 Y (16x) X (16x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 105 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-QFN3030-20 3 A 1 A A e n a l P g n i t a e S D 2 D U-QFN3030-20 Dim Min Max Typ A 0.57 0.63 0.60 A1 0.00 0.05 0.02 A3 0.15 b 0.16 0.26 0.21 D 2.95 3.05 3.00 D2 1.70 1.90 1.80 E 2.95 3.05 3.00 E2 1.70 1.90 1.80 e 0.40 L 0.30 0.40 0.35 z 0.595 All Dimensions in mm e D I 1 # n i P ︶ e 2 E E ° 5 4 X 2 . 0 ' C ︵ L b z Suggested Pad Layout U-QFN3030-20 C X Y 1 Y Dimensions Value (in mm) C 0.400 X 0.250 X1 1.900 X2 3.300 Y 0.550 Y1 1.900 Y2 3.300 2 Y 1 X 2 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 106 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN3216-14 3 A 1 A A U-DFN3216-14 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.127 b 0.15 0.25 0.20 D 3.15 3.275 3.20 D2 2.70 2.90 2.80 E 1.55 1.675 1.60 E2 0.45 0.65 0.55 e 0.40 L 0.275 0.375 0.325 Z 0.25 0.35 0.30 All Dimensions in mm e n a l P g n i t a e S 2 D D ° D5 I 4 1x #2 . n0 i P C ︵ ︶ 2 / 2 E 2 E E L Z e b Suggested Pad Layout U-DFN3216-14 2 X Y C Dimensions 2 Y 1 Y X 1 n i P C X X1 X2 Y Y1 Y2 Value (in mm) 0.400 0.250 2.850 2.650 0.525 0.550 1.900 1 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 107 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions DFN322 e D e b (3x) DFN322 Dim Min Max Typ A 0.800 1.00 0.850 A 0.050 A3 0.153 0.253 0.203 b 0.180 0.300 0.230 D 1.900 2.100 2.000 D2 1.220 1.420 1.320 e 0.650 E 1.900 2.100 2.000 E2 0.780 0.990 0.880 E4 0.480 0.680 0.580 L 0.300 0.500 0.400 All Dimensions in mm L (3x) E E4 E2 D2 A A1 A3 Suggested Pad Layout DFN322 C C X (3x) Dimensions C G X X1 Y Y1 Y2 Y3 Y4 Y (2x) G Y4 Y3 Y1 Y2 X1 Value (in mm) 0.65 0.20 0.35 1.52 0.55 0.98 0.47 0.63 2.20 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 108 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X1-DFN3313-8 A 3 A 1 A e n a l P g n i t a e S D 1 x 6 L ︵ ︶ e E 8 1 e x 2 a L ︵ ︶ b X1-DFN3313-8 Dim Min Max Typ A 0.37 0.48 0.42 A1 0 0.05 0.02 A3 0.13 b 0.20 0.30 0.25 D 3.25 3.38 3.30 E 1.25 1.38 1.30 e 0.50 BSC e1 1.25 BSC L 0.30 0.43 0.38 La 0.57 0.70 0.65 All Dimensions in mm Suggested Pad Layout X1-DFN3313-8 A 3 A 1 A e n a l P g n i t a e S D 1 x 6 L ︵ ︶ e E 8 ︶ 1 e x 2 a L ︵ b X1-DFN3313-8 Dim Min Max Typ A 0.37 0.48 0.42 A1 0 0.05 0.02 A3 0.13 b 0.20 0.30 0.25 D 3.25 3.38 3.30 E 1.25 1.38 1.30 e 0.50 BSC e1 1.25 BSC L 0.30 0.43 0.38 La 0.57 0.70 0.65 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 109 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN3535-14 1 A 3 A A e n a l P g n i t a e S D e D I 1 # n i P ︶ 1 e 2 E E ︵ 2 D V-DFN3535-14 Dim Min Max Typ A 0.75 0.85 0.80 A1 0.00 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 D 3.45 3.55 3.50 D2 1.90 2.10 2.00 E 3.45 3.55 3.50 E2 1.90 2.10 2.00 e 0.50 e1 1.50 L 0.35 0.45 0.40 Z 0.625 All Dimensions in mm L b Z Suggested Pad Layout V-DFN3535-14 3 X C 1 G Dimensions 1 X 2 X 1 Y 1 C 2 Y 3 Y G Y C C1 G G1 X X1 X2 X3 Y Y1 Y2 Y3 Value (in mm) 0.500 1.500 0.250 0.250 0.350 0.600 2.100 2.350 0.600 0.350 2.100 3.800 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 110 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN4030-12 A1 A A3 U-DFN4030-12 Dim Min Max Typ A 0.55 0.65 0.60 A1 0 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 D 3.95 4.05 4.00 D2 3.20 3.40 3.30 e 0.50 E 2.95 3.05 3.00 E2 1.60 1.80 1.70 L 0.30 0.40 0.35 Z 0.625 All Dimensions in mm D e E E2 D2 L (12x) Z (4x) b (12x) Suggested Pad Layout U-DFN4030-12 X2 Y (12x) Dimensions X1 Y1 Y2 Pin1 C C X X1 X2 Y Y1 Y2 Value (in mm) 0.500 0.300 2.800 3.350 0.600 1.750 3.400 X (12x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 111 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN4030-12 (Type B) A A3 A1 D e L1 (6x) E5 D1 (2x) E2 E Dim A A1 A3 B D D1 D2 D3 D4 E D4 (4x) E1 E3 D2 (2x) D3 L2 E4 Z (4x) L (5x) Min 0.55 0.00 0.20 3.95 1.52 0.96 0.70 0.65 2.95 U-DFN4030-12 Type B Max Typ Dim Min e 0.65 0.60 0.05 0.02 E1 1.51 0.15 E2 0.35 0.30 0.25 E3 0.74 4.05 4.00 E4 0.30 1.72 1.62 E5 0.15 L 0.45 1.16 1.06 0.90 0.80 L1 0.30 0.85 0.75 L2 0.72 Z 3.05 3.00 All Dimensions in mm Max 1.71 0.55 0.94 0.50 0.35 0.55 0.40 0.82 - Typ 0.50 1.61 0.45 0.84 0.40 0.25 0.50 0.35 0.77 0.625 b (12x) Suggested Pad Layout U-DFN4030-12 (Type B) Dimensions X (12X) C Y Y2 Y1 X1(2x) X2 Y6 Y7 Y5 (2x) X3 (2x) Y3 1 X4 Y4 X5 C X X1 X2 X3 X4 X5 Y Y1 Y2 Y3 Y4 Y5 Y6 Y7 Value (in mm) 0.500 0.350 1.160 0.900 1.720 0.850 3.700 0.700 0.870 0.500 0.550 0.350 1.710 0.940 3.300 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 112 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN4030-12 (Type C) 3 A A 1 A D x 2 1 b e ︵ ︶ 1 n i P L 1 K 2 E 2 D 0 5 1 . 0 R 4 E 1 D 1 E E 3 D 4 D 1 L 3 E Dim A A1 A3 B D D1 D2 D3 D4 E Min 0.57 0 0.20 3.95 0.74 1.00 1.00 0.84 2.95 U-DFN4030-12 Type C Max Typ Dim Min 0.63 0.60 E1 1.60 0.05 0.02 E2 0.88 0.015 E3 0.29 0.30 0.25 E4 1.60 e 4.05 4.00 L 0.30 0.94 0.84 L1 0.05 1.20 1.10 1.20 1.10 K1 1.04 0.94 K2 Z 3.05 3.00 All Dimensions in mm Max 1.80 1.08 0.49 1.80 0.40 0.15 Typ 1.70 0.98 0.39 1.70 0.50 0.35 0.10 0.30 0.33 0.23 2 K Z Suggested Pad Layout U-DFN4030-12 (Type C) X5 Dimensions G Y6 X1 Y X2 Y2 X3 Y4 Y5 Y3 X4 Y1 (6x) 1 C X (12x) C G X X1 X2 X3 X4 X5 Y Y1 Y2 Y3 Y4 Y5 Y6 Value (in mm) 0.500 0.225 0.300 0.800 0.890 0.990 1.150 3.590 0.600 0.600 0.440 1.030 1.750 3.400 0.275 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 113 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN4030-12 (Type D) 3 A 1 A A e n a l P g n i t a e S U-DFN4030-12 Type D Dim Min Max Typ A 0.55 0.65 0.60 A1 0 0.05 0.02 A3 0.15 b 0.23 0.33 0.28 D 3.95 4.05 4.00 D2 3.46 3.66 3.56 E 2.95 3.05 3.00 E2 1.043 1.243 1.143 e 0.65 L 0.40 0.50 0.45 Z 0.235 All Dimensions in mm D e D I 1 # n i P ︵ ︶ 2 D 2 E E L b Z Suggested Pad Layout U-DFN4030-12 (Type D) 2 X Y C Dimensions 2 Y 1 Y 1 X C X X1 X2 Y Y1 Y2 Value (in mm) 0.650 0.330 3.610 3.580 0.700 1.193 3.400 X C 1 n i P ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 114 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN4030-14 L D 2 D V-DFN4030-14 Dim Min Max Typ A 0.80 0.90 0.85 A1 0 0.05 0.02 A3 0.203 b 0.20 0.30 0.25 D 3.95 4.05 4.00 D2 3.15 3.25 3.20 E 2.95 3.05 3.00 E2 1.65 1.75 1.70 e 0.50 L 0.35 0.45 0.40 All Dimensions in mm 2 E E b e G TN I OK DR A 1M NY I P B ° 5 D4 I X 10 #0 N3 . I 0 P R E F M A H C 3 A 1 A A Suggested Pad Layout V-DFN4030-14 1 X G Y Dimensions 2 Y 1 Y G C G X X1 Y Y1 Y2 Value (in mm) 0.50 0.20 0.30 3.30 0.55 1.80 3.30 X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 115 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions W-DFN4030-14 L D 2 D W-DFN4030-14 Dim Min Max Typ A 0.70 0.80 0.75 A1 0 0.05 0.02 A3 0.203 b 0.20 0.30 0.25 D 3.95 4.05 4.00 D2 3.15 3.25 3.20 E 2.95 3.05 3.00 E2 1.65 1.75 1.70 e 0.50 L 0.35 0.45 0.40 All Dimensions in mm 2 E E b e G TN I OK R DA 1M NY I P B ° 5 D4 IX 10 #0 3 N. I0 P R E F M A H C 3 A 1 A A Suggested Pad Layout W-DFN4030-14 1 X G Y Dimensions 2 Y 1 Y G C G X X1 Y Y1 Y2 Value (in mm) 0.50 0.20 0.30 3.30 0.55 1.80 3.30 X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 116 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions 3 A 1 A U-DFN4040-8 A e n a l P g n i t a e S D U-DFN4040-8 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 D 3.95 4.05 4.00 D1 2.05 2.25 2.15 D2 0.90 1.10 1.00 E 3.95 4.05 4.00 E1 1.00 1.20 1.10 E2 2.50 2.70 2.60 e 0.80 L 0.35 0.45 0.40 Z 0.675 All Dimensions in mm e D I 1 # n i P ︵ ︶ 2 E E 2 D b Z Suggested Pad Layout U-DFN4040-8 C X 1 Y 1 X 9 7 2 . 0 C Dimensions 2 Y 2 X 3 X 4 Y 3 Y 1 Y 2 Y 3 X 1 X C X X1 X2 X3 X4 X5 Y Y1 Y2 Y3 Y4 Value (in mm) 0.800 0.350 1.150 1.100 2.250 2.750 3.650 0.600 2.700 1.200 2.700 4.300 4 5 X X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 117 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions W-DFN5020-6 A A3 A1 W-DFN5020-6 Dim Min Max Typ A 0.75 0.85 0.80 A1 0 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 D 1.90 2.10 2.00 D2 1.40 1.60 1.50 e 0.50 E 4.90 5.10 5.00 E2 2.80 3.00 2.90 L 0.35 0.65 0.50 Z 0.375 All Dimensions in mm D e D2 Pin 1 ID E E2 L Z b Suggested Pad Layout W-DFN5020-6 Y X C X1 Dimensions G C G X X1 X2 Y Y2 Y3 Y2 Y3 X2 Value (in mm) 0.50 0.35 0.35 0.90 1.80 0.70 1.60 3.20 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 118 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN5045-12 A3 A1 A Seating Plane D D2(4x) k1 E2(4x) k E L V-DFN5045-12 Dim Min Max Typ A 0.75 0.85 0.80 A1 0.00 0.05 0.02 A3 0.203 b 0.25 0.35 0.30 D 4.95 5.05 5.00 D2 1.80 2.00 1.90 E 4.45 4.55 4.50 E2 0.90 1.10 1.00 e 0.80 k 0.50 k1 0.50 k2 0.50 L 0.45 0.55 0.50 z 0.35 All Dimensions in mm k2 z b e Suggested Pad Layout V-DFN5045-12 2 X C x 4 1 X ︵ ︶ x 4 1 Y ︵ ︶ 3 Y 2 Y Dimensions C X X1 X2 Y Y1 Y2 Y3 Value (in mm) 0.800 0.400 2.100 4.500 0.700 1.200 2.700 4.800 Y X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 119 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN5045-12 (Type B) A3 A1 A Seating Plane D D2(2x) D2a E2(2x) E k1 E2a k2 L k b V-DFN5045-12 (Type B) Dim Min Max Typ A 0.75 0.85 0.80 A1 0.00 0.05 0.02 A3 0.203 b 0.25 0.35 0.30 D 4.95 5.05 5.00 D2 2.00 2.20 2.10 D2a 1.60 1.80 1.70 E 4.45 4.55 4.50 E2 0.90 1.10 1.00 E2a 2.40 2.60 2.50 e 0.80 k 0.50 k1 0.50 k2 0.50 L 0.45 0.55 0.50 z 0.35 All Dimensions in mm e z Suggested Pad Layout V-DFN5045-12 (Type B) 3 X C 1 G 2 G 1 Y 1 X 2 X 2 Y 3 Y G Y Dimensions C G G1 G2 X X1 X2 X3 Y Y1 Y2 Y3 Value (in mm) 0.800 0.40 0.40 0.40 0.40 2.20 1.80 4.40 0.700 1.100 2.600 4.800 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 120 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN5060-4 1 A 3 A A e n a l P g n i t a e S 1 L D e 1 L D I 1 # n i P E W-DFN5060-4 Dim Min Max Typ A 0.75 0.85 0.80 A1 0 0.05 0.02 A3 0.203 b 0.65 0.75 0.70 D 4.95 5.05 5.00 e 4.00 E 5.95 6.05 6.00 L 0.65 0.75 0.70 L1 0.05 0.15 0.10 All Dimensions in mm b 4 Suggested Pad Layout V-DFN5060-4 Z C Dimensions C X Y Y1 Z Y1 X (4x) Value (in mm) 4.00 0.75 0.95 6.20 4.75 Y (4x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 121 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-DFN6040-12 A1 A3 A Seating Plane D e D2 D1 E E2 E1 L b Z U-DFN6040-12 Dim Min Max Typ A 0.55 0.65 0.60 A1 0 0.05 0.02 A3 0.15 b 0.35 0.45 0.40 D 5.95 6.05 6.00 D1 1.95 2.15 2.05 D2 2.35 2.55 2.45 e 1.00 E 3.95 4.05 4.00 E1 2.10 2.30 2.20 E2 1.80 2.00 1.90 L 0.35 0.45 0.40 Z 0.30 All Dimensions in mm Suggested Pad Layout U-DFN6040-12 3 X Y C G Dimensions 3 Y 2 Y 2 X 1 X 1 G 1 Y 1 n i P X C G G1 X X1 X2 X3 Y Y1 Y2 Y3 Value (in mm) 0.500 0.650 0.350 0.250 1.075 1.275 2.750 0.400 1.150 1.000 2.300 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 122 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-DFN6040-22 1 A 3 A A e n a l P g n i t a e S D V-DFN6040-22 Dim Min Max Typ A 0.75 0.85 0.80 A1 0.00 0.05 0.02 A3 0.203 BSC b 0.20 0.30 0.25 D 5.95 6.05 6.00 D2 3.82 4.02 3.92 D2a 1.10 1.30 1.20 E 3.95 4.05 4.00 E2 2.44 2.64 2.54 e 0.50 BSC L 0.35 0.45 0.40 Z 0.375 All Dimensions in mm e L 2 D 2 E E a 2 D . D . I 1 #3 . N0 I C P b Z Suggested Pad Layout V-DFN6040-22 3 X 2 X 1 X 1 G Dimensions G 2 Y 1 Y Y C G G1 X X1 X2 X3 Y Y1 Y2 Value (in mm) 0.500 0.280 0.200 0.350 1.330 4.050 5.660 0.650 0.270 4.400 C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 123 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions D-FLAT k L E H E b D D-FLAT Dim Min Max A 0.90 1.10 b 1.25 1.65 c 0.10 0.40 D 2.25 2.95 E 3.95 4.60 k 2.80 HE 5.00 5.60 L 0.50 1.30 All Dimensions in mm A c Suggested Pad Layout D-FLAT 1 X X Dimensions Y G C C G X X1 Y Value (in mm) 4.65 2.80 1.85 6.50 1.70 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 124 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions DF-S L G A B D DF-S Dim Min Max A 7.40 7.90 B 6.20 6.50 C 0.22 0.30 D 0.076 0.33 E - 10.40 G 1.02 1.53 H 8.13 8.51 J 2.40 2.60 K 5.00 5.20 L 1.00 1.20 All Dimensions in mm E C H J K Suggested Pad Layout DF-S X Dimensions DF-S Z 10.26 X 1.2 Y 1.52 C 5.2 Z Y C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 125 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-FLGA1515-9 3 A 1 A A e n a l P g n i t a e S D e U-FLGA1515-9 Dim Min Max Typ A 0.55 0.65 0.60 A1 0 0.05 0.02 A3 0.13 BSC b 0.20 0.30 0.25 D 1.45 1.55 1.50 E 1.45 1.55 1.50 e 0.50 BSC Z 0.125 BSC All Dimensions in mm 1 . 0 R E ︶ e D I 1 # n i P ︵ Z . Q S b Suggested Pad Layout U-FLGA1515-9 1 X X Y G Dimensions 1 Y 2 Y C G G1 X X1 X2 Y Y1 Y2 1 G C Value (in mm) 0.587 0.150 0.150 0.525 0.350 1.700 0.525 0.350 1.700 2 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 126 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions 3 A W-FLGA2520-17 1 A e n a l P g n i t a e S e E A D I 1 # n i P D I 1 # n i P L D a L W-FLGA2520-17 Dim Min Max A 0.700 0.800 A1 0 0.050 A3 0.0203REF b 0.200 0.300 D 2.420 2.580 E 1.950 2.050 e 0.500TYP L 0.320 0.480 La 0.424 0.576 All Dimensions in mm b Suggested Pad Layout W-FLGA2520-17 3 2 X X Dimensions Y x 8 3 Y x 9 2 Y 1 X ︵ ︶ x 9 1 Y ︵ ︶ ︵ ︶ ︶ C x 8 X ︵ C X X1 X2 X3 Y Y1 Y2 Y3 Value (in mm) 0.500 0.350 0.600 1.850 2.320 0.600 0.350 1.350 2.800 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 127 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions MiniDIP L G A B D MiniDIP Dim Min Max A 5.43 5.75 B 3.6 4.0 C 0.15 0.35 D 0.05 0.20 E 7.0 G 0.70 1.10 H 4.5 4.9 J 2.3 2.7 K 2.3 2.7 L 0.50 0.80 All Dimensions in mm E C H J K Suggested Pad Layout MiniDIP X Dimensions DF-S MiniDIP Z 10.26 6.91 X 1.2 0.60 Y 1.52 0.76 C 5.2 2.67 Z Y C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 128 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions MiniMELF A B C MiniMELF Dim Min Max A 3.30 3.70 B 1.30 1.60 C 0.28 0.50 All Dimensions in mm Suggested Pad Layout MiniMELF 1 X X Dimensions Y G C G X X1 Y C Value (in mm) MiniMELF 3.50 2.10 1.30 4.70 1.70 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 129 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions MELF A MELF Dim Min Max A 4.80 5.20 B 2.40 2.60 C 0.55 Typ All Dimensions in mm B C Suggested Pad Layout MELF 1 X X Dimensions Y C G X X1 Y G Value (in mm) MELF 4.80 3.30 1.50 6.30 2.70 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 130 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions e n a l P g n i t a e S D MSB 4 1 A A x y ° 0 1 ° 7 3 E 1 # n i P E 1 E MSB Dim Min Max Typ A 1.10 1.20 1.30 A1 0.00 0.02 0.05 A4 0.05 0.08 A5 0.03 0.05 0.08 b 0.55 0.60 0.70 c 0.12 0.15 0.18 D 4.40 4.50 4.60 E 4.90 5.00 5.10 E1 5.60 5.70 5.80 E3 2.95 3.00 3.05 e 3.45 3.50 3.55 L 0.65 0.70 0.75 x 0.60 0.65 0.70 y 0.60 0.65 0.70 All Dimensions in mm 5 A c e A b L Suggested Pad Layout MSB C Dimensions 1 Y Y C X Y Y1 Value (in mm) 3.55 0.90 1.05 6.10 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 131 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions MSOP-8 D 5 2 . 0 4X 10 ° e n a l P e g u a G E x e n a l P g n i t a e S y L C l i a t e D 4X10° a 3 E b 1 3 A A 2 A C l c i a t e D e e S 1 A 1 E e MSOP-8 Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm Suggested Pad Layout MSOP-8 C X Y Dimensions 1 Y C X Y Y1 Value (in mm) 0.650 0.450 1.350 5.300 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 132 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions MSOP-8EP D 1 D MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm 4X 10 ° x 5 2 . 0 2 E E e n a l P e g u a G e n a l P g n i t a e S y a L 10° 3 E C l i a t e D b X 8 e 1 4X c 3 A 1 A 2 A A 1 E D C l i a t e D e e S Suggested Pad Layout MSOP8-EP C X Y G Dimensions 1 Y 2 Y C G X X1 Y Y1 Y2 1 X Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 133 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions MSOP-10 D 4X10 ° E Dim a A A1 A b c D e E E1 L 0.25 X Seating Plane 4X1 0° L a Gauge Plane Y 1 e b (10X) E3 A2 A MSOP-10 Min Max 8° 0 1.10 0.05 0.15 0.75 0.95 0.17 0.27 0.08 0.23 2.95 3.05 4.80 5.00 2.95 3.05 0.40 0.80 Typ 4° 0.10 0.86 0.20 0.15 3.00 0.50 4.90 3.00 0.60 All Dimensions in mm A3 D A1 E1 c Suggested Pad Layout MSOP-10 X Dimensions X Y C1 C2 C1 C2 Value (in mm) 0.30 1.4 4.4 0.50 Y ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 134 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ® 1 E POWERDI 5 1 A 2 / 1 E e D 2 b 1 b X 2 ° 1 ± ° 0 1 ® A 2 / E E ° 1 ± ° 5 2 A ° 1 ± ° 0 1 ° 1 ± ° 5 2 E 1 L 1 L W 2 D POWERDI 5 Dim Min Max Typ A 1.05 1.15 1.10 A2 0.33 0.43 0.381 b1 0.80 0.99 0.89 b2 1.70 1.88 1.78 D 3.90 4.05 3.966 D2 3.054 E 6.40 6.60 6.504 e 1.84 E1 5.30 5.45 5.37 E2 3.549 L 0.75 0.95 0.85 L1 0.50 0.65 0.57 W 1.10 1.41 1.255 All Dimensions in mm L L Suggested Pad Layout ® POWERDI 5 X Dimensions C G X X1 Y Y1 Y X1 (2x) Value (in mm) 1.840 0.852 3.360 1.390 4.860 1.400 G Y1 (2x) C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 135 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ® POWERDI 123 D ® 1 E POWERDI 123 Min Max Typ 0.93 1.00 0.98 0.15 0.25 0.20 0.85 1.25 1.00 1.025 1.125 1.10 1.63 1.93 1.78 3.50 3.90 3.70 2.60 3.00 2.80 0.40 0.50 0.45 1.25 1.40 1.35 0.125 0.275 0.20 All Dimensions in mm 3 A Dim A A3 b b2 D E E1 L L1 L3 A X 2 L ︶ 1 L ︵ 2 b b 3 L 3 L E Suggested Pad Layout ® POWERDI 123 2 X Dimensions 1 Y Y 1 X G X G X X1 X2 Y Y1 Value (in mm) 0.65 1.05 2.40 4.10 1.50 1.50 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 136 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ® POWERDI 123(Type B) ® C POWERDI 123 Type B Dim Min Max Typ A 3.50 3.90 3.70 B 2.60 3.00 2.80 C 1.63 1.93 1.78 D 0.93 1.00 0.98 E 0.85 1.25 1.00 H 0.15 0.25 0.20 L 0.50 0.80 0.65 All Dimensions in mm E B H D L E A Suggested Pad Layout ® POWERDI 123 (Type B) X Dimensions Y G X X1 Y G Value (in mm) 2.000 1.050 4.100 1.500 X1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 137 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ® POWERDI 323 C ® POWERDI 323 Dim Min Max Typ A 2.40 2.60 2.50 B 1.85 1.95 1.90 C 1.20 1.30 1.25 D 0.60 0.70 0.65 E 0.78 0.98 0.88 E1 0.50 0.70 0.60 E2 0.60 1.00 0.80 H 0.08 0.18 0.13 L 0.20 0.40 0.30 L1 1.40 L3 0.20 L4 0.40 0.80 0.60 All Dimensions in mm B D H L L E E2 E1 L4 L1 L1 L3 A Suggested Pad Layout ® POWERDI 323 X1 G X2 Dimensions Y2 G X1 X2 Y1 Y2 Y1 ® POWERDI 123 1.0 2.2 0.9 1.4 1.4 ® POWERDI 323 0.5 2.0 0.8 0.8 1.1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 138 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ® POWERDI 3333-8 ® POWERDI 3333-8 Dim Min Max Typ D 3.25 3.35 3.30 E 3.2 3.35 3.30 D2 2.22 2.32 2.27 E2 1.56 1.66 1.61 A 0.75 0.85 0.80 A1 0 0.05 0.02 A3 0.203 b 0.27 0.37 0.32 b2 0.20 L 0.35 0.45 0.40 L1 0.39 e 0.65 Z 0.515 All Dimensions in mm A A3 A1 D D2 L (4x) 1 Pin 1 ID 4 b2 (4x) E E2 8 5 Z (4x) e L1 (3x) b (8x) Suggested Pad Layout ® POWERDI 3333-8 X G 8 Y2 Dimensions C G G1 Y Y1 Y2 Y3 X X2 5 G1 Y1 Y 1 4 Y3 X2 Value (in mm) 0.650 0.230 0.420 3.700 2.250 1.850 0.700 2.370 0.420 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 139 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ® POWERDI 3333-8(Type B) ® POWERDI 3333-8 Type B Dim Min Max Typ A 0.75 0.85 0.80 A1 0 0.05 0.02 A3 0.203 b 0.27 0.37 0.32 b2 0.20 D 3.25 3.35 3.30 D1 2.55 2.66 2.61 D2 1.74 1.84 1.79 e 0.65 E 3.25 3.35 3.30 E1 1.14 1.24 1.19 E2 0.61 0.71 0.66 K1 0.41 K2 0.38 L 0.35 0.45 0.40 L1 0.25 Z 0.515 All Dimensions in mm A A3 A1 D D1 L (5x) K1 E E1 b2 (4x) K2 D2 E2 L1 (2x) Z (4x) e b (8x) Suggested Pad Layout ® POWERDI 3333-8 (Type B) X1 G Dimensions C G X X1 X2 X3 X4 Y Y1 Y2 Y3 Y4 Y5 Y6 X2 (3x) Y1 Y2 X3 Y3 Y4 Y6 X4 Y5 Y (5x) X (5x) Value (in mm) 0.650 0.230 0.420 2.370 0.420 1.890 2.710 0.700 0.400 1.160 1.850 0.405 1.295 3.700 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 140 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ® POWERDI 5060-8 ® A l i a t e D 1 D D X 4 0 ︵ ︶ 1 A c E 1 E e ︶ 2 / e X 8 b ︵ X 4 1 0 1 ︵ ︶ 1 X 4 2 b L K 3 D ︵ ︶ X 4 M 3 b 2 D 2 E 3 E A ︵ ︶ 1 M A l i a t e D 1 L G POWERDI 5060-8 Dim Min Max Typ A 0.90 1.10 1.00 A1 0.00 0.05 b 0.33 0.51 0.41 b2 0.200 0.350 0.273 b3 0.40 0.80 0.60 c 0.230 0.330 0.277 D 5.15 BSC D1 4.70 5.10 4.90 D2 3.70 4.10 3.90 D3 3.90 4.30 4.10 E 6.15 BSC E1 5.60 6.00 5.80 E2 3.28 3.68 3.48 E3 3.99 4.39 4.19 e 1.27 BSC G 0.51 0.71 0.61 K 0.51 L 0.51 0.71 0.61 L1 0.100 0.200 0.175 M 3.235 4.035 3.635 M1 1.00 1.40 1.21 Θ 10º 12º 11º Θ1 6º 8º 7º All Dimensions in mm Suggested Pad Layout ® 4 X POWERDI 5060-8 2 Y 3 X 1 Y 3 Y 2 X 1 X 4 Y 5 Y 7 Y 1 G C 6 Y x 4 Y G X ︵ ︶ Dimensions C G G1 X X1 X2 X3 X4 Y Y1 Y2 Y3 Y4 Y5 Y6 Y7 Value (in mm) 1.270 0.660 0.820 0.610 4.100 0.755 4.420 5.610 1.270 0.600 1.020 0.295 1.825 3.810 0.180 6.610 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 141 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions POWERDI®5060-8 (Type B) ® X 8 b ︵ ︶ 2 / e K 1 D D POWERDI 5060-8 TYPE B Dim Min Max Typ A 0.90 1.10 1.00 A1 0.00 0.05 –– b 0.33 0.51 0.41 b2 0.20 0.40 0.273 c 0.230 0.330 0.273 D 5.15 BSC D1 4.70 5.10 4.90 D2 3.50 4.40 3.90 E 6.15 BSC E1 5.60 6.00 5.80 E2 2.25 2.65 2.45 E3 0.595 0.995 0.795 e 1.27 BSC G 0.51 0.71 0.61 K 0.51 –– –– K1 0.51 –– –– L 0.51 0.71 0.61 L1 0.05 0.20 0.175 M 3.235 4.035 3.635 M1 1.00 1.40 1.21 θ1 10° 12° 11° θ2 6° 8° 7° All Dimensions in mm X 4 2 b L 2 D ︵ ︶ 2 E E 1 E 0 0 4 . 1 3 E M 1 K 0 0 9 . 1 1 M 1 L e G 0 3 0 . 0 ± 7 0 . 0 h t p e D 0 0 0 . 1 Ø X 1 A c A A L I A T E D X Suggested Pad Layout ® POWERDI 5060-8 (Type B) 1 X 1 Y 3 Y 2 Y Dimensions C X X1 Y Y1 Y2 Y3 Y4 Y5 Y6 6 Y 5 Y 4 Y x 5 Y Value (in mm) 1.270 0.610 4.420 0.910 0.910 0.895 2.130 0.585 2.550 6.550 ︵ ︶ X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 142 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions PowerDI5060-8 (Type C) D 1 D x 4 0 ︵ ︶ E 1 E 1 A c x e n a l P g n i t a e S y e 1 x 4 1 0 0 3 0 . 0 ± 7 0 . 0 h t p e D 0 0 0 . 1 Ø ︵ ︶ A L I A T E D x 8 1 b ︵ ︶ 2 / e x 8 1 b ︵ ︶ x 2 2 b L k 3 D ︵ ︶ A 1 k 4 L A L I A T E D 2 D M 2 D 2 E 1 L a L PowerDI5060-8 (Type C) Dim Min Max Typ A 0.90 1.10 1.00 A1 0 0.05 0.02 b 0.33 0.51 0.41 b1 0.300 0.366 0.333 b2 0.20 0.35 0.25 c 0.23 0.33 0.277 D 5.15 BSC D1 4.85 4.95 4.90 D2 1.40 1.60 1.50 D3 3.98 E 6.15 BSC E1 5.75 5.85 5.80 E2 3.56 3.76 3.66 e 1.27BSC k 1.27 k1 0.56 L 0.51 0.71 0.61 La 0.51 0.71 0.61 L1 0.05 0.20 0.175 L4 0.125 M 3.50 3.71 3.605 x 1.400 y 1.900 θ 10° 12° 11° θ1 6° 8° 7° All Dimensions in mm Suggested Pad Layout 8 4 X PowerDI5060-8 (Type C) Dimensions 1 Y 2 X 3 X 2 Y 3 Y 1 G 1 X x 4 Y ︵ ︶ 1 G C G G1 X X1 X2 X3 X4 Y Y1 Y2 Y3 Value (in mm) 1.270 0.660 0.820 0.610 3.910 1.650 1.650 4.420 1.270 1.020 3.810 6.610 C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 143 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ® POWERDI 5SP ® E E/2 b 2x R1 K 4x J 4x M 4x c R3 N 8x D R2 E1 TOP VIEW ? A Cutting Burr Side H1 ' ?1 8x cut faces are not tin plated E2 R L 2x D2 L1 W POWERDI 5SP Dim Min Max Typ A 0.75 b 4.30 4.50 4.40 c 0.155 0.195 D 5.70 5.90 5.80 D2 4.40 E 23.6 24.0 23.8 E1 5.70 5.90 5.80 E2 2.74 H1 0.19 0.21 0.20 J 0.20 K 0.30 L 9.00 L1 2.50 M 0.30 N 0 0.20 R 0.40 R1 0.15 R2 0.25 R3 0.40 W 1.66 2.06 θ 8º 12º θ1 3º 7º All Dimensions in mm BOTTOM VIEW Suggested Pad Layout X G Y Dimensions Value (in mm) G X Y 8.101 8.100 5.100 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 144 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ® POWERDI 5SP (Type B) E1/2 ® E/2 J 4x M 4x N 8x K 4x R2 E1 TOP VIEW A H1 Cutting Burr Side ø ø1 8x cut faces are not tin plated V Groove Inner Line E2 R L 2x D2 W R1 c R3 D b 2x E L1 BOTTOM VIEW POWERDI 5SP Type B Dim Min Max Typ A 0.75 b 4.30 4.50 4.40 c 0.155 0.191 D 5.70 5.90 5.80 D2 4.40 E 20.8 21.2 21.0 E1 5.70 5.90 5.80 E2 2.90 H1 0.19 0.21 0.20 J 0.20 K 0.30 L 7.60 L1 2.50 M 0.30 N 0 0.20 R 0.40 R1 0.15 R2 0.25 R3 0.40 W 1.63 1.97 1.80 Ø 8º 12º Ø1 3º 7º All Dimensions in mm Suggested Pad Layout X G Y Dimensions Value (in mm) G X Y 8.101 8.100 5.100 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 145 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions 1 L L E W-QFN3020-12 D I 1 # N I P 2 L b e D 1 e 1 b b 3 A A A -QFN3020-12 Dim Min Max Typ A 0.700 0.800 - A1 0 0.05 A3 0.203REF b 0.200 0.300 b1 0.350 0.450 D 1.900 2.100 2.000 E 2.900 3.100 3.000 e 0.500 e1 0.575 L 0.350 0.450 L1 0.450 0.550 L2 0.750 0.850 All Dimensions in mm Suggested Pad Layout W-QFN3020-12 X 1 X Dimensions Y C 2 Y 4 Y 1 C 3 Y 1 Y 2 3 X X C G X X1 X2 X3 Y Y1 Y2 Y3 Y4 Value (in mm) 0.500 0.575 0.650 0.750 0.350 2.400 0.300 0.450 0.900 1.050 3.400 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 146 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-QFN4040-16 (Type C) A1 A3 U-QFN4040-16 Type C Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.25 0.35 0.30 D 3.95 4.05 4.00 D2 1.04 1.24 1.14 E 3.95 4.05 4.00 E2 1.01 1.21 1.11 e 0.65 K 0.30 K1 0.32 K2 0.38 L 0.35 0.45 0.40 All Dimensions in mm A D Pin #1 ID C 0.2 K1 1 K E2(4x) E e K2 D2(4x) L b K Suggested Pad Layout U-QFN4040-16 (Type C) C X (8x) Y (4x) Y1 (8x) Dimensions Y5 Y2 Y3 X1 X2 (8x) Y4 (4x) 1 C X X1 X2 X3 X4 Y Y1 Y2 Y3 Y4 Y5 Value (in mm) 0.650 0.400 2.075 0.550 2.075 4.400 0.650 0.400 1.225 2.075 0.550 4.400 X3 X4 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 147 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-QFN4040-20 A1 A3 A Seating Plane D (Pin #1 ID) e E2 E D2 L U-QFN4040-20 Dim Min Max Typ A 0.55 0.65 0.60 A1 0 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 D 3.95 4.05 4.00 D2 2.40 2.60 2.50 E 3.95 4.05 4.00 E2 2.40 2.60 2.50 e 0.50 BSC L 0.35 0.45 0.40 Z 0.875 All Dimensions in mm b Z (8x) Suggested Pad Layout U-QFN4040-20 X3 X1 Dimensions C X X1 X2 X3 Y Y1 Y2 Y3 Y1 Y2 Y3 X2 Y X 1 Value (in mm) 0.500 0.350 0.600 2.500 4.300 0.600 0.350 2.500 4.300 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 148 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions V-QFN4525-20 3 A 1 A A e n a l P g n i t a e S D D I 1 # n i P ︵ ︶ e 1 Z E 2 E 2 D L V-QFN4525-20 Dim Min Max Typ A 0.75 0.85 0.80 A1 0.00 0.05 0.02 A3 0.15 b 0.18 0.30 0.23 D 4.45 4.55 4.50 D2 2.85 3.15 3.00 E 2.45 2.55 2.50 E2 0.85 1.15 1.00 e 0.50BSC L 0.30 0.50 0.40 Z 0.385 Z1 0.885 All Dimensions in mm b Z Suggested Pad Layout V-QFN4525-20 4 X 3 X Dimensions 1 X 2 X 3 Y 1 Y 2 Y Y C X X1 X2 X3 X4 Y Y1 Y2 Y3 Value (in mm) 0.500 0.330 0.600 3.200 3.830 4.800 0.600 1.200 0.830 2.800 C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 149 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions D QSOP-16 D Z 2 / E Dim A A1 A2 b c D E E1 e h L L1 L2 R R1 ZD θ θ1 θ2 2 / 1 E ' A ' L I A T E D E E S E h 1 E h 1 N I P c b e x 4 2 ︵ ︶ 1 R R 2 A E N A L P G N I T A E S L 2 L x 4 A ︵ E N A L P E G U A G ︶ 1 L 1 A QSOP-16 Min Max Typ 1.55 1.73 0.10 0.25 1.40 1.50 0.20 0.30 0.18 0.25 4.80 5.00 5.79 6.20 3.81 3.99 0.635 BSC 0.254 0.508 0.41 1.27 1.03 REF 0.254 BSC 0.0762 0.0762 0.23 REF 0° 8° 5° 15° 0° All Dimensions in mm Suggested Pad Layout 1 X QSOP-16 Y Dimensions Y C X X1 Y Y1 C Value (in mm) 0.635 0.350 4.795 1.450 6.400 1 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 150 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions D QSOP-20 D Z QSOP-20 Dim Min Max Typ A 1.55 1.73 A1 0.10 0.25 A2 1.40 1.50 b 0.20 0.30 c 0.18 0.25 D 8.56 8.74 E 5.79 6.20 E1 3.81 3.99 e 0.635 BSC h 0.254 0.508 L 0.41 1.27 L1 1.03 REF L2 0.254 BSC R 0.0762 R1 0.0762 ZD 1.47 REF θ 0° 8° θ1 5° 15° θ2 0° All Dimensions in mm 2 / E 2 / 1 E ' A ' L I A T E D E E S h E 1 E h 1 N I P b c e x 4 1 2 ︵ ︶ A 2 A 1 R R E N A L P E G U A G E N A L P G N I T A E S 2 L L x 4 1 1 A 1 L ︵ ︶ Suggested Pad Layout 1 X QSOP-20 Y Dimensions 1 Y C X X1 Y Y1 C Value (in mm) 0.635 0.350 6.065 1.450 6.400 1 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 151 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SM-8 1 A A e n a l P g n i t a e S 1 D e L ø 1 E E 1 ø c SM-8 Dim Min Max Typ A -- 1.70 1.60 A1 0.02 0.10 0.04 b 0.70 0.90 0.80 c 0.24 0.32 0.28 D 6.30 6.70 6.60 e 1.53 REF e1 4.59 REF E 6.70 7.30 7.00 E1 3.30 3.70 3.50 L 0.75 1.00 0.90 Ø --45° Ø1 -15° -Ø2 --10° All Dimensions in mm 2 ø e b Suggested Pad Layout SM-8 Y 1 Y 1 C Dimensions C C1 X Y Y1 Value (in mm) 1.52 4.60 0.95 2.80 6.80 C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 152 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SMA B C A SMA D Dim Min Max A 2.29 2.92 B 4.00 4.60 C 1.27 1.63 D 0.15 0.31 E 4.80 5.59 G 0.05 0.20 H 0.76 1.52 J 1.96 2.40 All Dimensions in mm J G H E Suggested Pad Layout SMA 1 X X Dimensions Y C G X X1 Y G Value (in mm) 4.00 1.50 2.50 6.50 1.70 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 153 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SMAF L E HE b D SMAF Dim Min Max A 0.90 1.10 b 1.25 1.65 c 0.10 0.40 D 2.25 2.95 E 3.95 4.60 HE 4.80 5.60 L 0.50 1.50 All Dimensions in mm c A Suggested Pad Layout SMAF 1 X X Y G C Dimensions Value (in mm) C G X X1 Y 4.00 1.50 2.50 6.50 1.70 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 154 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SMB B A SMB Dim Min Max A 3.30 3.94 B 4.06 4.57 C 1.96 2.21 D 0.15 0.31 E 5.00 5.59 G 0.05 0.20 H 0.76 1.52 J 2.00 2.50 All Dimensions in mm C D J G H E Suggested Pad Layout SMB 1 X X Y G C Dimensions Value (in mm) C G X X1 Y 4.30 1.80 2.50 6.80 2.30 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 155 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SMC B A SMC Dim Min Max A 5.59 6.22 B 6.60 7.11 C 2.75 3.18 D 0.15 0.31 E 7.75 8.13 G 0.10 0.20 H 0.76 1.52 J 2.00 2.50 All Dimensions in mm C D J G H E Suggested Pad Layout SMC 1 X X Dimensions Y G C G X X1 Y C Value (in mm) 6.90 4.40 2.50 9.40 3.30 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 156 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions 0.254 SO-8 E1 E Gauge Plane Seating Plane A1 L Detail ‘A’ 7°~9° h 45° Detail ‘A’ A2 A A3 b e D SO-8 Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0 8 All Dimensions in mm Suggested Pad Layout SO-8 X Dimensions Value (in mm) X 0.60 Y 1.55 C1 5.4 C2 1.27 C1 C2 Y ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 157 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SO-8EP F D A P D E S O P X E SO-8EP Dim Min Max Typ A 1.40 1.50 1.45 A1 0.00 0.13 b 0.30 0.50 0.40 C 0.15 0.25 0.20 D 4.85 4.95 4.90 E 3.80 3.90 3.85 E0 3.85 3.95 3.90 E1 5.90 6.10 6.00 e 1.27 F 2.75 3.35 3.05 H 2.11 2.71 2.41 L 0.62 0.82 0.72 N 0.35 Q 0.60 0.70 0.65 All Dimensions in mm 1 E H 1 b E Q N e d i s l l A ° 9 ︵ ° 7 ︶ C ° 5 4 ° 3 ± ° 4 L 1 A Gauge Plane Seating Plane 0 E e 1 . 0 R A D Suggested Pad Layout 2 X SO-8EP Dimensions 2 Y 1 Y C X X1 X2 Y Y1 Y2 1 X Y Value (in mm) 1.270 0.802 3.502 4.612 1.505 2.613 6.500 X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 158 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SO-8EP Detail ‘A’ 7°~ 9° E1 E 45° h A3 0.254 A2 A b e A1 D Detail ‘A’ L Gauge Plane Seating Plane Exposed Pad F P3 P1 SO-8EP Min Max Dim Min Max e 1.75 1.27 Typ F1 0.10 0.20 0.685 Typ F2 1.30 1.50 0.713 Typ G 0.15 0.25 0.20 Typ h 0.3 0.5 0.35 L 1.7 Typ 0.62 0.82 P1 0.9 Typ 2.05 Typ P2 4.85 4.95 1.15 Typ P3 5.90 6.10 2.15 Typ 3.85 3.95 0 8 All Dimensions in mm P2 G C1 Dim A A1 A2 A3 b C1 C2 D E E1 C2 C1 F2 Bottom View Suggested Pad Layout 2 X SO-8EP Dimensions 2 Y 1 Y C X X1 X2 Y Y1 Y2 1 X Y Value (in mm) 1.270 0.802 3.502 4.612 1.505 2.613 6.500 X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 159 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SO-14 E H SO-14 Dim Min Max A 1.47 1.73 A1 0.10 0.25 A2 1.45 Typ B 0.33 0.51 D 8.53 8.74 E 3.80 3.99 e 1.27 Typ H 5.80 6.20 L 0.38 1.27 0 8 All Dimensions in mm Gauge Plane L Detail “A” D 7° (4 x) A2 A e B A1 Detail “A” Suggested Pad Layout SO-14 X C1 C2 Dimensions Value (in mm) X 0.60 Y 1.50 C1 5.4 C2 1.27 Y ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 160 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SO-16 SO-16 Dim Min Max A 1.40 1.75 A1 0.1 0.25 A2 1.30 1.50 B 0.33 0.51 C 0.19 0.25 D 9.80 10.00 E 3.80 4.00 e 1.27 Typ H 5.80 6.20 L 0.38 1.27 0 8 All Dimensions in mm H E Gauge Plane L Detail ‘A’ D A A2 e B A1 C Detail ‘A’ Suggested Pad Layout 1 X SO-16 Dimensions 1 Y Y 1 n i P C X X1 Y Y1 Value (in mm) 1.270 0.670 9.560 1.450 6.400 C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 161 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SO-20 D R Ø 1 R 1 L Ø1 Ø2 E 1 E x e d n I L c 1 A 3 A Ø3 A 2 A e n a l P g n i t a e S e b Ø4 Dim A A1 A2 A3 b c D E E1 e L L1 R/R1 SO-20 Max Typ 2.65 2.52 0.30 0.20 2.55 2.35 1.10 1.00 0.49 0.32 12.80 12.70 10.60 10.20 7.60 7.50 1.27 BSC 0.50 1.27 0.80 1.35 REF 0.07 0 8 10 14 12 6 10 8 9 14 11.5 6 10 8 All Dimensions in mm Min 2.35 0.10 2.05 0.90 0.35 0.23 12.60 10.00 7.40 Suggested Pad Layout SO-20 Y Dimensions G 1 Y C G X Y Y1 Value (in mm) 1.27 8.00 0.60 1.50 11.00 C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 162 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SO-24 (Type TH) 3 A A D e n a l P g n i t a e S 2 A ' A ' L I A T E D 1 A h h c 5 2 . 0 0 L ' A ' L I A T E D 1 e b 1 L SO-24 (Type TH) Dim Min Max Typ A 2.36 2.64 2.54 A1 0.10 0.30 0.20 A2 2.26 2.35 2.30 A3 0.97 1.07 1.02 b 0.39 0.48 c 0.25 0.31 D 15.20 15.60 15.40 e 1.27BSC E 10.10 10.50 10.30 E1 7.40 7.60 7.50 h 0.25 0.75 L 0.70 1.00 L1 1.40 BSC θ 0° 8° All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 163 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOD123 C H SOD123 Dim Min Max A 0.55 Typ B 1.40 1.70 C 3.55 3.85 H 2.55 2.85 J 0.00 0.10 K 1.00 1.35 L 0.25 0.40 M 0.10 0.15 0 8° All Dimensions in mm A B K M L Suggested Pad Layout 1 X SOD123 X Y G Dimensions Value(in mm) G 2.250 X 0.900 X1 4.050 Y 0.950 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 164 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOD123F 2 L E D b SOD123F Dim Min Max Typ A 0.81 1.15 b 0.80 1.35 c 0.05 0.30 D 1.70 1.90 1.80 E 2.60 2.80 2.70 He 3.30 3.70 3.50 L2 0.35 0.85 All Dimensions in mm e H A c Suggested Pad Layout C SOD123F Y Dimensions Value (in mm) C 2.86 G 1.52 X 1.34 X1 4.20 Y 1.80 1 G X X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 165 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOD323 C H A B K M J SOD323 Dim Min Max A 0.25 0.35 B 1.20 1.40 C 2.30 2.70 H 1.60 1.80 J .00 0.10 K 1.0 1.1 L 0.20 0.40 M 0.10 0.15 0° 8° All Dimensions in mm L Suggested Pad Layout 1 X SOD323 X Y G Dimensions Value (in mm) G 1.520 X 0.590 X1 2.700 Y 0.450 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 166 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOD323F c D 2 1 He L2 (2x) E L1 b (2x) b (2x) 1 A SOD323F Dim Min Max Typ A 0.60 0.75 - b 0.25 0.35 c 0.05 0.26 D 1.15 1.35 1.25 E 1.60 1.80 1.70 He 2.30 2.70 2.50 L1 0.30 0.50 0.40 L2 0.41 0.61 0.51 α1 7° α2 3° β1 7° β2 3° All Dimensions in mm 2 Suggested Pad Layout 1 X SOD323F X Y G Dimensions Value (in mm) G 1.280 X 0.710 X1 2.700 Y 0.403 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 167 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOD523 L C SOD523 Dim Min Max A 0.25 0.35 B 0.70 0.90 C 1.50 1.70 H 1.10 1.30 K 0.55 0.65 L 0.10 0.30 M 0.10 0.12 All Dimensions in mm H M A K B Suggested Pad Layout 1 X SOD523 X Y G Dimensions Value (in mm) G 0.80 X 0.60 X1 2.00 Y 0.70 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 168 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOD923 (0.2mm Lead Width) 2 L x 2 b E ︵ ︶ D SOD923 (0.2mm Lead Width) Dim Min Max Typ A 0.34 0.40 0.37 b 0.15 0.25 0.20 c 0.070 0.170 0.120 D 0.55 0.65 0.60 E 0.75 0.85 0.80 He 0.95 1.05 1.00 L 0.05 0.15 0.10 L2 0.190 REF a1 0° 8° 7° a2 2° 4° 3° All Dimensions in mm e H A A 1 a 2 a L c Suggested Pad Layout X X SOD923 (0.2mm Lead Width) Y Dimensions C C X Y Value (in mm) 0.900 0.300 0.400 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 169 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions 2 L x 2 b E SOD923 (0.3mm Lead Width) ︵ ︶ D SOD923 (0.3mm Lead Width) Dim Min Max Typ A 0.34 0.40 0.37 b 0.25 0.35 0.30 c 0.05 0.15 0.10 D 0.55 0.65 0.60 E 0.75 0.85 0.80 He 0.95 1.05 1.00 L 0.05 0.15 0.10 L2 0.190 REF a1 0° 8° 7° a2 2° 4° 3° All Dimensions in mm e H A A 1 a 2 a c Suggested Pad Layout X X SOD923 (0.3mm Lead Width) Y Dimensions C C X Y Value (in mm) 0.900 0.400 0.600 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 170 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT143 F 1 A G 5 2 . 0 M B C E N A L P E G U A G a E N A L P G N I T A E S L 2 DA H K J SOT143 Dim Min Max Typ A1 0.37 0.51 0.400 A2 0.77 0.93 0.800 B 1.20 1.40 1.30 C 2.28 2.48 2.38 D 1.58 1.83 1.72 F 0.45 0.60 0.49 G 1.78 2.03 1.92 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.89 1.00 L 0.46 0.60 0.50 M 0.085 0.18 0.11 a 0° 8° All Dimensions in mm Suggested Pad Layout SOT143 X2 X Dimensions Z G X X1 X2 Y C Y Z C G X1 Value (in mm) 2.70 1.30 2.50 1.0 0.60 0.70 2.0 X2 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 171 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT223 D Q b1 C E Gauge Plane 0.25 Seating Plane e1 L b 0° -1 0° e A1 7° 7° A E1 SOT223 Dim Min Max Typ A 1.55 1.65 1.60 A1 0.010 0.15 0.05 b 0.60 0.80 0.70 b1 2.90 3.10 3.00 C 0.20 0.30 0.25 D 6.45 6.55 6.50 E 3.45 3.55 3.50 E1 6.90 7.10 7.00 e 4.60 e1 2.30 L 0.85 1.05 0.95 Q 0.84 0.94 0.89 All Dimensions in mm Suggested Pad Layout SOT223 1 X 1 Y 2 Y 1 C Dimensions Value (in mm) C 2.30 C1 6.40 X 1.20 X1 3.30 Y 1.60 Y1 1.60 C2 8.00 Y C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 172 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT25 A SOT25 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D 0.95 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 N 0.70 0.80 0.75 0° 8° - All Dimensions in mm B C H K M N J L D Suggested Pad Layout SOT25 C2 Z C2 Dimensions Z G X Y C1 C2 C1 G Y X SOT25 3.20 1.60 0.55 0.80 2.40 0.95 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 173 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT353 A SOT353 Min Max Typ 0.10 0.30 0.25 1.15 1.35 1.30 2.00 2.20 2.10 0.65 Typ 0.40 0.45 0.425 1.80 2.20 2.15 0 0.10 0.05 0.90 1.00 1.00 0.25 0.40 0.30 0.10 0.22 0.11 0° 8° All Dimensions in mm Dim A B C D F H J K L M B C H K M N J L D Suggested Pad Layout SOT353 C2 Z C2 Dimensions Z G X Y C1 C2 C1 G Y SOT353 2.5 1.3 0.42 0.6 1.9 0.65 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 174 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SC74R / SOT26 A SC74R / SOT26 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D 0.95 F H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 0° 8° - All Dimensions in mm B C H K M J D F L Suggested Pad Layout SC74R / SOT26 C2 Z C2 Dimensions Z G X Y C1 C2 C1 G Y SC74R / SOT26 3.20 1.60 0.55 0.80 2.40 0.95 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 175 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT363 A SOT363 Dim Min Max Typ A 0.10 0.30 0.25 B 1.15 1.35 1.30 C 2.00 2.20 2.10 D 0.65 Typ F 0.40 0.45 0.425 H 1.80 2.20 2.15 J 0 0.10 0.05 K 0.90 1.00 1.00 L 0.25 0.40 0.30 M 0.10 0.22 0.11 0° 8° All Dimensions in mm B C H K M J D F L Suggested Pad Layout SOT363 C2 Z C2 C1 G Y Dimensions Z G X Y C1 C2 SOT363 2.5 1.3 0.42 0.6 1.9 0.65 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 176 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SC59 A SC59 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D 0.95 G 1.90 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 N 0.70 0.80 0.75 0° 8° All Dimensions in mm B C G H K M N J L D Suggested Pad Layout SC59 Y Z Dimensions Z X Y C E C X SC59 3.4 0.8 1.0 2.4 1.35 E ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 177 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT523 A SOT523 Dim Min Max Typ A 0.15 0.30 0.22 B 0.75 0.85 0.80 C 1.45 1.75 1.60 D 0.50 G 0.90 1.10 1.00 H 1.50 1.70 1.60 J 0.00 0.10 0.05 K 0.60 0.80 0.75 L 0.10 0.30 0.22 M 0.10 0.20 0.12 N 0.45 0.65 0.50 0° 8° - All Dimensions in mm B C G H K M N J L D Suggested Pad Layout SOT523 Y Z Dimensions Z X Y C E C X SOT523 1.8 0.4 0.51 1.3 0.7 E ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 178 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT323 H K a M L D J A B C SOT323 Dim Min Max Typ A 0.25 0.40 0.30 B 1.15 1.35 1.30 C 2.00 2.20 2.10 D 0.650 BSC F 0.375 0.475 0.425 G 1.20 1.40 1.30 H 1.80 2.20 2.15 J 0.00 0.10 0.05 K 0.90 1.00 0.95 L 0.25 0.40 0.30 M 0.10 0.18 0.11 a 8°C All Dimensions in mm G Suggested Pad Layout SOT323 Y Z Dimensions Z X Y C E C X SOT323 2.8 0.7 0.9 1.9 1.0 E ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 179 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT23 ° 7 l l A H E N A L 5 P2 E. G0 U A G J K 1 K a M A 1 L L B C D G F SOT23 Dim Min Max Typ A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.890 1.00 0.975 K1 0.903 1.10 1.025 L 0.45 0.61 0.55 L1 0.25 0.55 0.40 M 0.085 0.150 0.110 a 8° All Dimensions in mm Suggested Pad Layout SOT23 Y Z C X Dimensions Z X Y C E Value (in mm) 2.9 0.8 0.9 2.0 1.35 E ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 180 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions g ne i t n a a el SP D c SOT23F b 1 L E 1 E 1 e e A L R k SOT23F Dim Min Max Typ A 0.80 1.00 0.90 b 0.35 0.45 0.40 c 0.06 0.16 0.11 D 2.80 3.00 2.90 e 0.95 e1 1.90 E 2.30 2.50 2.40 E1 1.50 1.70 1.60 k 1.10 1.26 1.18 L 0.48 0.68 0.58 L1 0.39 0.41 0.40 R 0.05 0.15 0.10 All Dimensions in mm Suggested Pad Layout C X SOT23F 1 Y Y Dimensions Value (in mm) C 0.95 X 0.80 Y 1.110 Y1 3.000 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 181 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT543 D e1 SOT543 Dim Min Max Typ A 0.55 0.60 0.60 b 0.15 0.30 0.20 c 0.10 0.18 0.15 D 1.50 1.70 1.60 E 1.55 1.70 1.60 E1 1.10 1.25 1.20 e 0.50 BSC e1 1.00 BSC L 0.10 0.30 0.20 L1 0.06 0.10 0.08 a 6° 8° 7° All Dimensions in mm E/2 E1/2 E1 E e L c b L1 R0.1 MAX. TYP. a 7° A TYP. Suggested Pad Layout C SOT543 2 Y Dimensions Y C X Y Y1 Y2 Value (in mm) 0.500 0.300 0.670 0.550 1.940 X 1 Y ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 182 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT553 D e1 e E1/2 E/2 E1 E L (5x) b (5x) F R0.1 MAX. TYP. c a 7° A SOT553 Dim Min Max Typ A 0.55 0.62 0.60 b 0.15 0.30 0.20 c 0.10 0.18 0.15 D 1.50 1.70 1.60 E 1.55 1.70 1.60 E1 1.10 1.25 1.20 e 0.50 BSC e1 1.00 BSC F 0.00 0.10 –– L 0.10 0.30 0.20 a 6° 8° 7° All Dimensions in mm TYP. Suggested Pad Layout SOT553 C2 Z C2 Dimensions Z G X Y C1 C2 C1 G Y SOT553 2.2 1.2 0.375 0.5 1.7 0.5 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 183 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT563 A B C D G M K SOT563 Dim Min Max Typ A 0.15 0.30 0.20 B 1.10 1.25 1.20 C 1.55 1.70 1.60 D 0.50 G 0.90 1.10 1.00 H 1.50 1.70 1.60 K 0.55 0.60 0.60 L 0.10 0.30 0.20 M 0.10 0.18 0.11 All Dimensions in mm H L Suggested Pad Layout SOT563 C2 Z C2 Dimensions Z G X Y C1 C2 C1 G SOT563 2.2 1.2 0.375 0.5 1.7 0.5 Y X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 184 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT666 A SOT666 Dim Min Max Typ A 0.15 0.30 0.20 B 1.10 1.25 1.20 C 1.55 1.70 1.60 D - 0.50 G 0.90 1.10 1.00 H 1.50 1.70 1.60 K 0.55 0.60 0.60 L 0.10 0.30 0.20 M 0.10 0.18 0.15 All Dimensions in mm B C D G M K H L Suggested Pad Layout SOT666 C Y (6x) Dimensions Value (in mm) C 0.50 G 0.80 X 0.35 Y 0.50 G X (6x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 185 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT953 D e1 L E E1 e b (5 places) c A SOT953 Dim Min Max Typ A 0.40 0.50 0.45 A1 0 0.05 - b 0.10 0.20 0.15 c 0.12 0.18 0.15 D 0.95 1.05 1.00 E 0.95 1.05 1.00 E1 0.75 0.85 0.80 e 0.35 e1 0.70 L 0.05 0.15 0.10 All Dimensions in mm A1 Suggested Pad Layout SOT953 C C Dimensions C X Y Y1 Y1 Y (5X) Value (in mm) 0.350 0.200 0.200 1.100 X (5X) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 186 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT963 D e1 L E E1 e b (6 places) c A SOT963 Dim Min Max Typ A 0.40 0.50 0.45 A1 0 0.05 c 0.120 0.180 0.150 D 0.95 1.05 1.00 E 0.95 1.05 1.00 E1 0.75 0.85 0.80 L 0.05 0.15 0.10 b 0.10 0.20 0.15 e 0.35 Typ e1 0.70 Typ All Dimensions in mm A1 Suggested Pad Layout SOT963 C C Dimensions C X Y Y1 Y1 Y (6X) Value (in mm) 0.350 0.200 0.200 1.100 X (6X) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 187 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions c 0 0 2 . 0 R 1 D SOT89 E H SOT89 Dim Min Max Typ A 1.40 1.60 1.50 B 0.50 0.62 0.56 B1 0.42 0.54 0.48 c 0.35 0.43 0.38 D 4.40 4.60 4.50 D1 1.62 1.83 1.733 D2 1.61 1.81 1.71 E 2.40 2.60 2.50 E2 2.05 2.35 2.20 e 1.50 H 3.95 4.25 4.10 H1 2.63 2.93 2.78 L 0.90 1.20 1.05 L1 0.327 0.527 0.427 z 0.20 0.40 0.30 All Dimensions in mm L 1 B B e 2 D X 4 ° 8 ︵ 2 E 1 H ︶ A 1 L z D Suggested Pad Layout 2 X SOT89 3 Y Dimensions 1 Y G X 4 Y 2 Y Y 1 X C G X X1 X2 Y Y1 Y2 Y3 Y4 Value (in mm) 1.500 0.244 0.580 0.760 1.933 1.730 3.030 1.500 0.770 4.530 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 188 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SOT89-5 C 1 D 0 0 2 . 0 R L E H SOT89-5 Dim Min Max Typ A 1.40 1.60 1.50 B 0.50 0.62 0.56 B1 0.44 0.54 0.48 C 0.35 0.43 0.38 D 4.40 4.60 4.50 D1 1.62 1.83 1.733 E 2.40 2.60 2.50 e 1.50 H 3.95 4.25 4.10 L 0.65 0.95 0.80 All Dimensions in mm L B 1 B e x 4 ° 8 ︵ ︶ A D Suggested Pad Layout SOT89-5 C 1 C Dimensions 2 X C C1 X X1 X2 X3 Y Y1 Y2 Y3 3 Y 1 Y 2 Y 1 X Y X Value (in mm) 1.500 1.050 0.680 0.760 1.930 3.680 1.200 1.200 4.250 4.500 3 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 189 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO220AB A a 2 E 1 A P Ø Q 1 H 2 E 1 P Ø 01 D 1 Q 1 D 01 1 L 2 A 2 b L c b e 1 e x 2 2 0︵ ︶ TO220AB Dim Min Max Typ A 4.40 4.70 4.57 A1 1.22 1.33 1.27 A2 2.59 2.79 2.69 b 0.77 0.90 0.813 b2 1.20 1.36 1.27 c 0.340 0.470 0.381 D 14.70 15.30 15.00 D1 8.60 8.80 8.70 e 2.54 BSC e1 5.08 BSC E 10.00 10.20 10.10 E2 10.06 10.26 10.16 E2a 10.10 10.35 10.25 H1 6.10 6.50 6.30 L 13.20 13.50 13.40 L1 4.00 3.75 Q 2.60 2.90 2.743 Q1 2.50 REF ØP 3.76 3.88 3.84 ØP1 1.40 1.60 1.50 θ1 5° 9° 7° θ2 1° 5° 3° All Dimensions in mm E ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 190 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline TO220AC (Type A4) A 1 A E P Q a 1 H 1 D 2 L 0 5 . 1 O 2 A 1 L 2 b L b e c 1 e TO220AC (Type A4) Dim Min Max Typ A 4.470 4.670 A1 1.170 1.370 A2 2.520 2.820 b 0.710 0.910 0.813 b2 1.170 1.370 1.270 c 0.279 0.483 D1 8.763 9.017 8.890 E 10.010 10.310 e 2.54BSC e1 4.980 5.180 H1a 12.294 12.548 12.446 L 13.700 14.100 L1 4.04 4.19 4.11 L2 1.60 Q 2.642 2.946 2.743 ØP 3.790 3.890 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 191 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline TO220AC (Type BR) A 1 A E 1 H P TO220AC (Type BR) Dim Min Max Typ A 4.30 4.70 4.50 A1 1.20 1.40 1.30 A2 2.20 2.60 2.40 b 0.70 0.90 0.80 b2 1.27 c 0.40 0.60 0.50 D1 9.00 9.40 9.20 E 9.80 10.20 10.00 e 4.88 5.28 5.08 H1 6.30 6.70 6.50 H1a 10.90 11.30 11.10 H1b 15.70 16.10 15.90 L 12.60 13.60 13.10 L1 9.60 10.60 10.10 P 3.56 3.64 3.60 All Dimensions in mm ° 3 a 1 H 1 D b 1 H ° 3 ° 3 2 A 2 b L 1 L c b e ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 192 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline TO220AC (Type E) A E 1 A 1 H P Q D 2 L 1 L 2 b L c b 2 A 1 e TO220AC (Type E) Dim Min Typ Max A 4.40 4.82 A1 1.1 1.40 A2 2.05 2.92 b 0.72 1.00 b2 1.16 1.45 c 0.36 0.68 D 14.70 - 15.87 e1 5.08 E 9.80 - 10.26 H1 5.80 6.40 L 12.70 - 13.96 L1 3.56 4.50 L2 1.30 P 3.70 3.90 Q 2.54 3.30 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 193 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions E TO252 (DPAK) A 3 b c ° 1 ± ° 7 3 L 4 L H 2 A D x 3 b e ︵ ︶ x 2 2 b ︵ ︶ 8 0 5 . 0 e n a l P e g u a G e n a l P g n i t a e S 1 D 1 E 1 A L a F E R 4 7 . 2 TO252 (DPAK) Dim Min Max Typ A 2.19 2.39 2.29 A1 0.00 0.13 0.08 A2 0.97 1.17 1.07 b 0.64 0.88 0.783 b2 0.76 1.14 0.95 b3 5.21 5.46 5.33 c 0.45 0.58 0.531 D 6.00 6.20 6.10 D1 5.21 e 2.286 E 6.45 6.70 6.58 E1 4.32 H 9.40 10.41 9.91 L 1.40 1.78 1.59 L3 0.88 1.27 1.08 L4 0.64 1.02 0.83 a 0° 10° All Dimensions in mm Suggested Pad Layout 1 X TO252 (DPAK) 1 Y 2 Y Dimensions C X X1 Y Y1 Y2 C Value (in mm) 4.572 1.060 5.632 2.600 5.700 10.700 Y X TO252 (DPAK) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 194 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated 1 X 1 Y 2 Y Dimensions C X X1 Y Y1 Y2 C Value (in mm) 4.572 1.060 5.632 2.600 5.700 10.700 Y X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 195 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions E TO252 Type B (DPAK) A 3 b 3 L c ° 2 ± ° 7 4 A D 5 L H 2 A 0 0 2 . 1 Ø 4 L ° 2 ± ° 7 ° 2 ± ° 7 x 3 b e ︵ ︶ 2 L e n a l P e g u a G e n a l P g n i t a e S 1 D 1 E 1 A L a F E R 0 9 . 2 TO252 (DPAK) (Type B) Dim Min Max Typ A 2.20 2.38 2.30 A1 0.00 0.10 A2 0.97 1.17 1.07 A4 0.10 REF b 0.72 0.85 0.78 b3 5.23 5.45 5.33 c 0.47 0.58 0.53 D 6.00 6.20 6.10 D1 5.30 REF e 2.286 BSC E 6.50 6.70 6.60 E1 4.70 4.92 4.83 H 9.90 10.10 10.30 L 1.40 1.70 1.60 L2 0.51 BSC L3 0.90 1.25 L4 0.60 1.00 0.80 L5 1.70 1.90 1.80 a 0° 8° All Dimensions in mm Suggested Pad Layout TO252 Type B (DPAK) 1 X 1 Y 2 Y C Dimensions C X X1 Y Y1 Y2 Value (in mm) 4.572 1.060 5.632 2.600 5.700 10.700 Y X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 196 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions E TO252 (DPAK) (Type BR) A 3 b c 3 L D H 4 L L x 3 b e x 2 2 b 1 A ︵ ︶ ︵ ︶ 1 D 1 E TO252 (DPAK) (Type BR) Dim Min Max Typ A 2.20 2.40 A1 0.00 0.10 b 0.50 0.70 b3 5.20 5.40 c 0.45 0.55 D 5.95 6.25 D1 5.10 5.50 E 6.45 6.70 E1 4.71 4.91 e 2.24 2.34 H 9.45 9.95 L 1.25 1.75 L3 0.95 1.25 L4 0.60 0.90 All Dimensions in mm Suggested Pad Layout 1 X TO252 (DPAK) 1 Y 2 Y Dimensions C X X1 Y Y1 Y2 C Value (in mm) 4.572 1.060 5.632 2.600 5.700 10.700 Y X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 197 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions E TO252 Type C (DPAK) A 3 b c 3 L D H 4 L L x 3 b e x 2 2 b 1 A ︵ ︶ ︵ ︶ 1 D 1 E TO252 (DPAK) (Type C) Dim Min Max Typ A 2.20 2.40 A1 0.00 0.10 b 0.50 0.70 b3 5.20 5.40 c 0.45 0.55 D 5.95 6.25 D1 5.10 5.50 E 6.45 6.70 E1 4.71 4.91 e 2.24 2.34 H 9.45 9.95 L 1.25 1.75 L3 0.95 1.25 L4 0.60 0.90 All Dimensions in mm Suggested Pad Layout TO252 Type C (DPAK) 1 X 1 Y 2 Y C Dimensions C X X1 Y Y1 Y2 Value (in mm) 4.572 1.060 5.632 2.600 5.700 10.700 Y X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 198 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions E TO252 (DPAK) (Type TH) A 3 b 3 L c ° 2 ± ° 7 4 A D 5 L H 2 A 0 0 2 . 1 Ø 4 L ° 2 ± ° 7 ° 2 ± ° 7 x 3 b e ︵ ︶ 2 L e n a l P e g u a G e n a l P g n i t a e S 1 D 1 E 1 A L a F E R 0 9 . 2 TO252 (DPAK) (Type TH) Dim Min Max Typ A 2.20 2.38 2.30 A1 0.00 0.10 A2 0.97 1.17 1.07 A4 0.10 REF b 0.72 0.85 0.78 b3 5.23 5.45 5.33 c 0.47 0.58 0.53 D 6.00 6.20 6.10 D1 5.30 REF e 2.286 BSC E 6.50 6.70 6.60 E1 4.70 4.92 4.83 H 9.90 10.10 10.30 L 1.40 1.70 1.60 L2 0.51 BSC L3 0.90 1.25 L4 0.60 1.00 0.80 L5 1.70 1.90 1.80 a 0° 8° All Dimensions in mm Suggested Pad Layout 1 X TO252 (DPAK) 1 Y 2 Y Dimensions C X X1 Y Y1 Y2 C Value (in mm) 4.572 1.060 5.632 2.600 5.700 10.700 Y X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 199 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO252-4 E A b3 c2 L3 A2 D E1 H L4 A1 L 4X b2 e 5X b a TO252-4 Dim Min Max Typ A 2.19 2.39 2.29 A1 0.00 0.13 0.08 A2 0.97 1.17 1.07 b 0.51 0.71 0.583 b2 0.61 0.79 0.70 b3 5.21 5.46 5.33 c2 0.45 0.58 0.531 D 6.00 6.20 6.10 D1 5.21 e 1.27 E 6.45 6.70 6.58 E1 4.32 H 9.40 10.41 9.91 L 1.40 1.78 1.59 L3 0.88 1.27 1.08 L4 0.64 1.02 0.83 a 0° 10° All Dimensions in mm Suggested Pad Layout TO252-4 1 X 1 Y Dimensions 2 Y C C1 X X1 Y Y1 Y2 Y3 3 Y 1 C Y Value (in mm) 1.27 2.54 1.00 5.73 2.00 6.17 1.64 2.66 C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 200 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions E TO252-5 A 3 b ° 1 ± ° 7 2 c 3 L D H 2 A b e 2 b 1 D 1 E 1 A 8 0 5 . 0 a E N A L P E G U A G E N A L P G N I T A E S L F E R 4 7 . 2 TO252-5 Dim Min Max Typ A 2.19 2.39 2.29 A1 0.00 0.13 0.08 A2 0.97 1.17 1.07 b 0.51 0.71 0.583 b2 0.61 0.79 0.70 b3 5.21 5.46 5.33 c2 0.45 0.58 0.531 D 6.00 6.20 6.10 D1 5.21 e 1.27 E 6.45 6.70 6.58 E1 4.32 H 9.40 10.41 9.91 L 1.40 1.78 1.59 L3 0.88 1.27 1.08 a 0° 10° All Dimensions in mm Suggested Pad Layout TO252-5 1 X 1 Y Dimensions 2 Y C X X1 Y Y1 Y2 Y3 3 Y Y Value (in mm) 1.27 1.00 5.73 2.00 6.17 1.64 2.66 C X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 201 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO263AB (D2PAK) A E 2 c 1 L TO263AB (D2PAK) Dim Min Max Typ A 4.07 4.82 A1 0.00 0.25 b 0.51 0.99 b2 1.15 1.77 c 0.356 0.73 c2 1.143 1.65 D 8.39 9.65 D1 6.55 6.95 e 2.54 TYP E 9.66 10.66 E1 6.23 8.23 H 14.61 15.87 L 1.78 2.79 L1 1.67 L2 1.77 L3 0.254 a 0° 8° All Dimensions in mm ° 1 ± ° 7 D H 2 L e c B l i a t e D e e S b 2 b 3 1 D 1 E L e n a l P e g u a G g ne i t n a a el SP a 1 A L B l i a t e D Suggested Pad Layout TO263AB (D2PAK) 1 X 1 Y 2 Y X Dimensions C X X1 Y Y1 Y2 Value (in mm) 5.08 1.10 10.41 3.50 7.01 15.99 Y C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 202 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions 2 TO263AB Type B (D PAK) 2 c E A TO263AB (D2PAK) (Type B) Dim Min Max Typ A 4.40 4.70 4.57 A1 0.00 0.20 0.10 A2 2.59 2.79 2.69 b 0.77 0.90 0.813 b2 1.20 1.36 1.27 c 0.356 0.47 0.381 c2 1.22 1.32 1.27 D 8.60 8.80 8.70 D1 6.60 7.80 7.60 D1a 5.33 6.53 6.33 D1b 4.54 5.74 5.54 e 2.54 BSC E 10.00 10.20 10.10 E1 6.67 7.87 7.67 E1a 4.94 6.14 5.94 E1b 7.06 8.26 8.06 H 14.70 15.50 15.10 L 2.00 2.60 2.30 L1 1.17 1.40 1.27 L2 1.45 1.70 1.55 L3 0.25 BSC L4 2.50 REF θ 0° 8° 5° θ1 5° 9° 7° θ2 1° 5° 3° All Dimensions in mm 1 L 1 0 4 L 2 A D 0 5 . 1 Ø H 2 0 1 0 2 L e c B l i a t e D e e S b 2 b a 1 E 1 E 3 a 1 D b 1 D 1 D L e n a l P e g u a G 1 A L b 1 E g ne i t n aa el SP 0 B l i a t e D Suggested Pad Layout 2 TO263 Type B (D PAK) 1 X Y Dimensions 2 Y C X X1 Y Y1 Y2 X 1 Y Value (in mm) 5.08 1.10 10.41 3.50 7.01 15.99 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 203 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions E A TO263AB (D2PAK)(Type BR) 2 c 1 L D H 2 L L e c b 2 b 1 D 1 E TO263AB (D2PAK) Type BR Dim Min Max Typ A 4.30 4.70 b 0.70 0.90 b2 1.15 1.35 c 0.40 0.60 c2 1.20 1.40 D 9.00 9.40 D1 7.96 8.36 E 9.80 10.20 E1 7.85 8.05 e 2.34 2.74 H 15.00 15.87 L 2.24 2.84 L1 1.00 1.40 L2 1.20 1.60 All Dimensions in mm Suggested Pad Layout 1 X TO263AB (D2PAK) Y Dimensions C X X1 Y Y1 Y2 Value (in mm) 5.08 1.10 10.41 3.50 7.01 15.99 2 Y X 1 Y C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 204 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions 2 A E TO263AB Type C (D PAK) 2 c 1 L D TO263AB (D2PAK) Type C Dim Min Max Typ A 4.30 4.70 b 0.70 0.90 b2 1.15 1.35 c 0.40 0.60 c2 1.20 1.40 D 9.00 9.40 D1 7.96 8.36 E 9.80 10.20 E1 7.85 8.05 e 2.34 2.74 H 15.00 15.87 L 2.24 2.84 L1 1.00 1.40 L2 1.20 1.60 All Dimensions in mm H 2 L L e c b 2 b 1 D 1 E Suggested Pad Layout 2 TO263AB Type C (D PAK) 1 X Y Dimensions 2 Y C X X1 Y Y1 Y2 X 1 Y Value (in mm) 5.08 1.10 10.41 3.50 7.01 15.99 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 205 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO263AB (D2PAK) (Type TH) A 2 c E 1 L 1 0 4 L 2 A D 0 5 . 1 Ø H 2 0 1 0 2 L e c B l i a t e D e e S b 2 b a 1 E 1 E 3 a 1 D b 1 D 1 D L e n a l P e g u a G 1 A L b 1 E g ne i t n a a el SP 0 B l i a t e D TO263AB (D2PAK) (Type TH) Dim Min Max Typ A 4.40 4.70 4.57 A1 0.00 0.20 0.10 A2 2.59 2.79 2.69 b 0.77 0.90 0.813 b2 1.20 1.36 1.27 c 0.356 0.47 0.381 c2 1.22 1.32 1.27 D 8.60 8.80 8.70 D1 6.60 7.80 7.60 D1a 5.33 6.53 6.33 D1b 4.54 5.74 5.54 e 2.54 BSC E 10.00 10.20 10.10 E1 6.67 7.87 7.67 E1a 4.94 6.14 5.94 E1b 7.06 8.26 8.06 H 14.70 15.50 15.10 L 2.00 2.60 2.30 L1 1.17 1.40 1.27 L2 1.45 1.70 1.55 L3 0.25 BSC L4 2.50 REF θ 0° 8° 5° θ1 5° 9° 7° θ2 1° 5° 3° All Dimensions in mm Suggested Pad Layout 1 X TO263AB (D2PAK) Y Dimensions C X X1 Y Y1 Y2 Value (in mm) 5.08 1.10 10.41 3.50 7.01 15.99 2 Y X 1 Y C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 206 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO263-5 A E TO263-5 Dim Min Max A 4.07 4.85 A1 1.14 1.40 b 0.66 1.02 c 0.36 0.64 D 8.65 9.65 E 9.78 10.54 e 1.57 1.85 L 14.61 15.88 L1 2.29 2.79 L2 - 2.92 All Dimensions in mm A1 L2 D L L1 b e c Suggested Pad Layout TO263-5 X Dimensions Y1 X X1 Y Y1 Y2 C Y Y2 Value (in mm) 10.9 1.05 15.7 9.1 2.5 1.7 X1 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 207 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions b T-MiniDIP 1 E E L 1 L c 1 D e D T-MiniDIP Dim Min Max A 1.15 1.27 b 0.60 0.70 c 0.15 0.25 D 4.90 5.10 D1 3.20 3.50 E 5.30 5.50 E1 6.00 6.40 e 3.90 4.10 L 0.25 0.80 L1 0.25 0.55 All Dimensions in mm A Suggested Pad Layout T-MiniDIP X 1 C Dimensions C C1 X Y Value(in mm) 4.00 5.60 0.750 0.450 Y C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 208 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TSSOP-8 D TSSOP-8 Dim Min Max Typ a 0.09 A 1.20 A1 0.05 0.15 A2 0.825 1.025 0.925 b 0.19 0.30 c 0.09 0.20 D 2.90 3.10 3.025 e 0.65 E 6.40 E1 4.30 4.50 4.425 L 0.45 0.75 0.60 All Dimensions in mm See Detail C E E1 e c b Gauge plane a A2 A L D A1 Detail C Suggested Pad Layout TSSOP-8 Y X C3 C1 C2 G Dimensions Value (in mm) X 0.45 Y 1.78 C1 7.72 C2 0.65 C3 4.16 G 0.20 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 209 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions 0.25 TSSOP-14 B Gauge Plane Seating Plane L F1 a2 Pin# 1 Indent F Detail ‘A’ G K A a1 D C TSSOP-14 Dim Min Max a1 7° (4X) a2 8° 0 A 4.9 5.10 B 4.30 4.50 C - 1.2 D 0.8 1.05 F 1.00 Typ F1 0.45 0.75 G 0.65 Typ K 0.19 0.30 L 6.40 Typ All Dimensions in mm Detail ‘A’ Suggested Pad Layout TSSOP-14 X C1 C2 Dimensions Value (in mm) X 0.45 Y 1.45 C1 5.9 C2 0.65 Y ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 210 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TSSOP-16 2 / E ' A ' L I A T E D E E S 1 E Y E X 1 N I P b e x) 2 L C A EE GN UA AL GP 1 R R D 2 A Ø0.760Depth0.050±0.02 L E N A L P G N I T A E S 1 L 1 A ' A ' L I A T E D TSSOP-16 Dim Min Max Typ A 1.08 A1 0.05 0.15 A2 0.80 0.93 b 0.19 0.30 c 0.09 0.20 D 4.90 5.10 E 6.40 BSC E1 4.30 4.50 e 0.65 BSC L 0.45 0.75 L1 1.00 REF L2 0.25 BSC R / R1 0.09 X 1.350 Y 1.050 θ 0° 8° θ1 5° 15° θ2 0° All Dimensions in mm Suggested Pad Layout TSSOP-16 X1 Dimensions C X X1 Y Y1 Y1 Y Value (in mm) 0.650 0.350 4.900 1.400 6.800 1 X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 211 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TSSOP-16EP X D e TSSOP-16EP Dim Min Max Typ A 1.20 A1 0.025 0.100 A2 0.80 1.05 0.90 b 0.19 0.30 c 0.09 0.20 D 4.90 5.10 5.00 E 6.20 6.60 6.40 E1 4.30 4.50 4.40 e 0.65 BSC L 0.45 0.75 0.60 L1 1.0 REF L2 0.65 BSC X 2.997 Y 2.997 θ1 0° 8° All Dimensions in mm Y E 1 E K 1R A NM I P D I 2 A e n a l 5P 2e . 0 g u a G A e n a l P g n i t a e S L L I A T E D 1 A b 1 L Suggested Pad Layout TSSOP-16EP X2 Y Y3 Y1 X1 X Dimensions C X X1 X2 Y Y1 Y2 Y3 Y2 Value (in mm) 0.650 0.450 3.290 5.000 1.450 3.290 4.450 7.350 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 212 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TSSOP-20 TSSOP-20 Dim Min Max Typ A 1.20 A1 0.05 0.15 A2 0.80 1.05 b 0.19 0.30 c 0.09 0.20 D 6.40 6.60 6.50 E 6.20 6.60 6.40 E1 4.30 4.50 4.40 e 0.65 BSC L 0.45 0.75 0.60 L1 1.0 REF θ1 0° 8° θ2 10° 14° 12° θ3 10° 14° 12° All Dimensions in mm D E1 E PIN 1 ID MARK 0.25 Gauge Plane e A2 b A Seating Plane L L1 A1 DETAIL Suggested Pad Layout TSSOP-20 X C Dimensions Y1 Y2 Y C X X1 Y Y1 Y2 Value (in mm) 0.650 0.420 6.270 1.780 4.160 7.720 X1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 213 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TSSOP-20EP X D Y E 1 E TSSOP-20EP Dim Min Max Typ A 1.20 A1 0.025 0.100 A2 0.80 1.05 0.90 b 0.19 0.30 c 0.09 0.20 D 6.40 6.60 6.50 E 6.20 6.60 6.40 E1 4.30 4.50 4.40 L 0.45 0.75 0.60 L1 1.0 REF L2 0.65 BSC X 4.191 Y 2.997 θ1 0° 8° All Dimensions in mm K 1R NA IM P D I e e n a l 5P 2e . 0 g u a G A 2 A e n a l P g n i t a e S L L I A T E D 1 L 1 A b Suggested Pad Layout TSSOP-20EP X (20x) C Dimensions Y1 Y2 Y3 X1 Y (20x) C X X1 X2 Y Y1 Y2 Y3 Value (in mm) 0.650 0.420 4.490 6.270 1.780 3.290 4.160 7.720 X2 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 214 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TSOT25 x 4 1 0 1 De ︵ ︶ 2 / 1 E 2 / E c E 1 E e n a l P e g u a G e n a l P g n i t a e S 0 2 L L x 4 1 0 b e ︵ ︶ 2 A 1 A A e n a l P g n i t a e S TSOT25 Dim Min Max Typ A - 1.00 A1 0.01 0.10 A2 0.84 0.90 b 0.30 0.45 c 0.12 0.20 D 2.90 E 2.80 E1 1.60 e 0.95 BSC e1 1.90 BSC L 0.30 0.50 L2 0.25 BSC θ 0° 8° 4° θ1 4° 12° All Dimensions in mm TSOT25 (Type A2) Dim Min Max Typ A - 1.10 A1 0.01 0.10 A2 0.70 1.00 b 0.30 0.50 c 0.12 REF D 2.70 3.10 E 2.60 3.00 E1 1.40 1.80 e 0.95 REF e1 1.90 REF L 0.45 REF L2 0.25 REF θ 0° 8° 4° All Dimensions in mm Suggested Pad Layout TSOT25 C 1 Y Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199 Y X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 215 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TSOT25F D TSOT25F Dim E 1 E A C W E I V E E S c e b 0 x 4 C W E I V 1 e ︵ ︶ Min Max Typ 0.700 0.775 0.750 b 0.350 0.500 - c 0.100 0.200 - D 2.800 3.100 2.900 E 3.700 3.900 3.800 E1 1.500 1.700 1.600 e - - 0.950 e1 - - 1.900 θ 4° 12° 10° A All Dimensions in mm x 4 0 ︵ ︶ Suggested Pad Layout TSOT25F 1 C Y X Dimensions 1 Y C C1 X X1 Y Y1 C Value (in mm) 0.950 1.900 0.700 2.600 1.000 4.220 1 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 216 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TSOT26 TSOT26 Dim Min Max Typ A - 1.00 A1 0.01 0.10 A2 0.84 0.90 D 2.90 E 2.80 E1 1.60 b 0.30 0.45 c 0.12 0.20 e 0.95 e1 1.90 L 0.30 0.50 L2 .25 θ 0° 8° 4° θ1 4° 12° All Dimensions in mm D e1 E E1 L2 c 4x1 e L 6x b A A2 A1 Suggested Pad Layout TSOT26 C C Dimensions C X Y Y1 Y1 Y (6x) Value (in mm) 0.950 0.700 1.000 3.199 X (6x) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 217 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TSOT26F D TSOT26F Dim E 1 E A C W E I V E E S c e b 0 x 4 C W E I V 1 e ︵ ︶ Min Max Typ 0.700 0.775 0.750 b 0.350 0.500 - c 0.100 0.200 - D 2.800 3.100 2.900 E 3.700 3.900 3.800 E1 1.500 1.700 1.600 e - - 0.950 e1 - - 1.900 θ 4° 12° 10° A All Dimensions in mm x 4 0 ︵ ︶ Suggested Pad Layout TSOT26F X C Y Dimensions 1 Y C X X1 Y Y1 Value (in mm) 0.950 0.700 2.600 1.000 4.220 1 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 218 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X4-WLB0402-2/SWP 2 A 1 A A e n a l P g n i t a e S X4-WLB0402-2/SWP D Dim Min Max Typ A 0.150 0.200 0.175 A1 0.00 0.020 0.010 A2 0.010 0.040 0.025 b 0.110 0.170 0.140 D 0.375 0.425 0.400 E 0.175 0.225 0.200 e 0.260 L 0.080 0.100 0.090 z 0.010 0.040 0.025 All Dimensions in mm e D I y t i r a l o P b E z L Suggested Pad Layout X4-WLB0402-2/SWP 1 X Dimensions Y G X X1 Y G X Value (in mm) 0.110 0.200 0.510 0.200 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 219 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-WLB0505-3 D A1 A X2-WLB0505-3 Dim Min Max Typ A 0.35 0.40 A1 0.00 0.01 b 0.12 0.18 0.15 D 0.50 E 0.50 K 0.16 L 0.43 0.49 0.46 L1 0.07 0.13 0.10 L2 0.17 0.23 0.20 All Dimensions in mm E L1 SEATING PLANE K L L2 b b K Suggested Pad Layout X2-WLB0505-3 X1 Y Dimensions X X1 Y Y1 Y2 Y2 Y1 X Value (in mm) 0.17 0.50 0.22 0.12 0.50 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 220 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions D X2-WLB0603-2 e E L X2-WLB0603-2 Dim Min Max Typ A 0.26 0.34 0.30 A1 0 0.02 0.01 b 0.20 0.28 0.24 D 0.28 0.32 0.30 E 0.58 0.62 0.60 e 0.42 0.34 0.38 L 0.11 0.15 0.13 All Dimensions in mm b D I 1 # n i P A 1 A e n a l P g n i t a e S Suggested Pad Layout X2-WLB0603-2 1 Y Dimensions Y X Y Y1 Value (in mm) 0.300 0.210 0.610 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 221 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X3-WLB0603-2 1 A A X3-WLB0603-2 e n a l P g n i t a e S Dim A D k A1 b Min Max 0.250 0.300 0.00 0.01 0.220 0.290 Typ 0.275 0.241 D 0.575 0.625 0.600 E 0.275 0.325 0.300 E b k L - - 0.120 0.190 0.256 0.144 All Dimensions in mm L L Suggested Pad Layout X3-WLB0603-2 1 X G Dimensions Y G X Y X1 Value (in mm) 0.206 0.194 0.291 0.594 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 222 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X4-WLB0603-2 1 A A e n a l P g n i t a e S D e x 2 b E ︵ ︶ X4-WLB0603-2 Dim Min Max Typ A --0.20 A1 0.006 0.01 0.008 b 0.19 0.29 0.24 D 0.595 0.645 0.62 E 0.295 0.345 0.320 e 0.355 L3 0.14 0.24 0.19 All Dimensions in mm x 2 3 L ︵ ︶ Suggested Pad Layout X4-WLB0603-2 1 X Dimensions Y X X1 Y Value (in mm) 0.230 0.610 0.300 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 223 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X3-WLB0603-3 D b L (3x) E e e1 b1 A X3-WLB0603-3 Dim Min Max Typ A 0.24 0.30 A1 0.00 0.01 b 0.23 0.29 0.26 b1 0.075 0.135 0.105 D 0.30 E 0.60 e 0.40 e1 0.155 L 0.13 0.19 0.16 All Dimensions in mm A1 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 224 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions D U-WLB0808-4 e D I 1 # N I P e E U-WLB0808-4 Dim Min Max Typ A 0.511 REF A2 0.336 0.366 0.351 A3 0.15 0.17 0.16 b 0.205 0.225 0.215 D 0.795 0.825 0.81 E 0.795 0.825 0.81 e — — 0.40 All Dimensions in mm 4 X b Ø ︵ ︶ 2 A A 3 A E N A L P G N I T A E S Suggested Pad Layout X 4 D Ø U-WLB0808-4 C Dimensions C D Value (in mm) 0.40 0.172 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 225 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions W-WLB0808-4 e D 1 # n i P W-WLB0808-4 x 4 b Ø E e ︵ ︶ Min Max Typ A 0.550 0.660 0.605 A1 0.180 0.220 0.200 A2 0.355 0.405 0.380 A3 0.020 0.030 0.025 b 0.240 0.280 0.260 b1 0.235 0.245 0.240 D 0.790 0.850 0.820 E 0.790 0.850 0.820 M B U , x 4 1 b Ø Dim ︵ ︶ g n i t a o C e d i s k c a B 3 A ︵ ︶ 2 A A e 0.400 BSC 1 A All Dimensions in mm e n a l P g n i t a e S Suggested Pad Layout W-WLB0808-4 x 4 D Ø ︵ ︶ C Dimensions C D Value (in mm) 0.400 0.220 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 226 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X1-WLB0808-4 x 4 b Ø e E ︵ ︶ 1 n i P D X1-WLB0808-4 Dim Min Max Typ A 0.3320 0.4180 0.3750 A1 0.1350 0.1650 0.1500 A2 0.1750 0.2250 0.2000 A3 0.0220 0.0280 0.0250 b 0.1971 0.2409 0.2190 D 0.7900 0.8100 0.8000 E 0.7900 0.8100 0.8000 e 0.400 BSC All Dimensions in mm e g n i t a o C e d i s k c a B 3 A ︵ ︶ A 2 A 1 A e n a l P g n i t a e S Suggested Pad Layout x 4 D Ø X1-WLB0808-4 ︵ ︶ C Dimensions C D Value (in mm) 0.4000 0.2190 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 227 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-WLB1006-2 1 A A e n a l P g n i t a e S X2-WLB1006-2 Dim Min Max Typ A 0.27 0.35 0.30 A1 00 0.03 0.02 b 0.459 0.559 0.509 D 0.95 1.05 1.000 E 0.55 0.65 0.600 e 0.578 L1 0.194 0.294 0.244 L2 0.369 0.469 0.419 Z1 0.016 0.076 0.046 Z2 0.016 0.076 0.046 All Dimensions in mm D 2 Z e x 2 b E ︵ ︶ 1 Z 2 L 1 L Suggested Pad Layout X2-WLB1006-2 2 X Dimensions Y X X1 X2 Y Value (in mm) 0.332 0.507 0.989 0.579 1 X X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 228 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X3-WLB1006-2 1 A A e n a l P g n i t a e S D R x 2 b E ︵ ︶ a 3 L k 3 L X3-WLB1006-2 Dim Min Max Typ A 0.25 0.30 0.275 A1 0.00 0.01 b 0.450 0.550 0.500 D 0.95 1.05 1.000 E 0.55 0.65 0.600 k 0.288 L3 0.194 0.294 0.244 L3a 0.350 0.450 0.400 R 0.100 All Dimensions in mm Suggested Pad Layout X3-WLB1006-2 2 X Dimensions Y X X1 X2 Y Value (in mm) 0.332 0.507 0.989 0.579 1 X X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 229 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X3-WLB1006-2(Type B) 1 A A e n a l P g n i t a e S D b E a 3 L 3 L X3-WLB1006-2 (Type B) Dim Min Max Typ A 0.250 0.300 0.275 A1 0.00 0.015 b 0.459 0.559 0.509 D 0.95 1.050 1.000 E 0.55 0.65 0.600 L3 0.194 0.294 0.244 L3a 0.369 0.469 0.419 LD 0.909 All Dimensions in mm D L Suggested Pad Layout X3-WLB1006-2 (Type B) 2 X Dimensions Y X X1 X2 Y Value (in mm) 0.332 0.507 0.989 0.579 1 X X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 230 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-WLB1010-4 x 4 b 1 2 2 1 1 n i P ︵ ︶ A A e E B B D 3 A A 2 A 1 A U-WLB1010-4 Dim Min Max Typ A 0.4535 0.5565 0.5050 A1 0.2115 0.2585 0.2350 A2 0.2200 0.2700 0.2450 A3 0.0220 0.0280 0.0250 b 0.2880 0.3520 0.3200 D 1.0300 1.0500 1.0400 e 0.500 BSC E 1.0300 1.0500 1.0400 All Dimensions in mm Suggested Pad Layout U-WLB1010-4 x 4 X ︵ ︶ C Dimensions C X Value (in mm) 0.500 0.3200 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 231 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-WLB1010-4 (Type B) x 4 b 1 2 2 1 1 n i P ︵ ︶ A A e E B B D 3 A A 2 A 1 A U-WLB1010-4 (Type B) Dim Min Max Typ A 0.4535 0.5565 0.5050 A1 0.2115 0.2585 0.2350 A2 0.2200 0.2700 0.2450 A3 0.0220 0.0280 0.0250 b 0.2880 0.3520 0.3200 D 1.030 1.050 1.040 e 0.500 BSC E 1.030 1.050 1.040 All Dimensions in mm Suggested Pad Layout U-WLB1010-4 (Type B) x 4 X ︵ ︶ C Dimensions C X Value (in mm) 0.500 0.3200 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 232 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-WLB1406-2 1 A A e n a l P g n i t a e S X2-WLB1406-2 Dim Min Max Typ A 0.27 0.35 0.30 A1 00 0.03 0.02 b 0.459 0.559 0.509 D 1.35 1.45 1.40 E 0.55 0.65 0.60 e 0.812 L1 0.194 0.294 0.244 L2 0.700 0.800 0.750 Z1 0.016 0.076 0.046 Z2 0.016 0.076 0.046 All Dimensions in mm 2 Z D e x 2 b E ︵ ︶ 1 Z 2 L 1 L Suggested Pad Layout X2-WLB1406-2 2 X Dimensions Y X X1 X2 Y Value (in mm) 0.334 0.840 1.386 0.589 1 X X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 233 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X3-WLB1406-2 1 A A e n a l P g n i t a e S D 0 0 1 = R b E 1 b 2 L k 1 L X3-WLB1406-2 Dim Min Max Typ A 0.250 0.300 0.275 A1 0.000 0.015 b 0.45 0.55 b1 0.45 0.55 D 1.37 1.43 1.40 E 0.57 0.63 0.60 k 0.30 L1 0.20 0.26 L2 0.70 0.80 All Dimensions in mm Suggested Pad Layout X3-WLB1406-2 2 X Dimensions Y 1 X X X X1 X2 Y Value (in mm) 0.304 0.840 1.352 0.580 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 234 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X3-WLB1408-2 1 A A e n a l P g n i t a e S D 2 Z e 0 e0 d1 o. h0 t R a C 1h #c no t i P N ︵ ︶ x 2 b E ︵ ︶ 1 Z 1 L L X3-WLB1408-2 Dim Min Max Typ A 0.25 0.30 0.275 A1 0.01 b 0.659 0.759 0.709 D 1.35 1.45 1.40 E 0.75 0.85 0.80 e 0.855 L 0.194 0.294 0.244 L1 0.615 0.715 0.665 Z1 0.16 0.076 0.046 Z2 0.16 0.076 0.046 All Dimensions in mm Anode Cathode Suggested Pad Layout 2 X X3-WLB1408-2 Dimensions Y X X1 X2 Y Value (in mm) 0.334 0.755 1.386 0.789 1 X X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 235 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-WLB1510-6 Øb (x6) D U-WLB1510-6 Dim Min Max Typ D 0.90 1.00 1.00 E 1.40 1.50 1.50 A 0.62 A2 0.38 b 0.27 0.37 0.32 e 0.50 All Dimensions in mm e E e e A2 A Seating Plane Suggested Pad Layout U-WLB1510-6 D Dimensions C1 C C1 D C Value (in mm) 0.50 1.00 0.25 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 236 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-WLB1515-9 D 6X-Ø b PIN ID e U-WLB1515-9 Dim Min Max Typ A 0.62 A2 0.36 0.36 A3 0.020 0.030 0.025 b 0.27 0.37 0.32 D 1.47 1.51 1.49 E 1.47 1.51 1.49 e 0.50 All Dimensions in mm E e e A3 A2 e A SEATING PLANE Suggested Pad Layout U-WLB1515-9 D C1 Dimensions Value (in mm) C C1 C2 D 0.50 1.00 1.00 0.25 C C C2 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 237 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X3-WLB1608-2 1 A A X3-WLB1608-2 e n a l P g n i t a e S Dim A Min Max Typ 0.250 0.300 0.275 D 0 1 . 0 = R E b 1 b A1 - 0.015 - b - - 0.600 b1 - - 0.600 D 1.57 1.63 1.60 E 0.77 0.83 0.80 K - - 0.282 L1 0.25 0.35 0.30 L2 0.90 1.00 0.95 2 L 1 L All Dimensions in mm K Suggested Pad Layout X3-WLB1608-2 2 X Dimensions Y X X1 X2 Y Value (in mm) 0.385 1.035 1.622 0.690 1 X X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 238 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-WLB1608-3 1 A A X2-WLB1608-3 e n a l P g n i t a e S Dim Min Max Typ A 0.310 2 / L ︵ X 2 1 Z D L A1 ︶ K 1 b E X 2 b ︵ ︶ 0.015 0.025 0.020 b 0.190 0.250 0.220 b1 0.570 0.630 0.600 D 1.570 1.630 1.600 E 0.770 0.830 0.800 L 1.384 1.484 1.434 L2 0.784 0.844 0.814 L3 0.280 0.340 0.310 2 L 3 L K 0.10 0.22 0.16 Z1 0.07 0.13 0.10 All Dimensions in mm Suggested Pad Layout X2-WLB1608-3 2 X Dimensions Y X X1 X2 Y3 Value (in mm) 0.410 0.914 1.534 0.700 1 X X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 239 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions U-WLB1818-4 e D D I N I P 1 2 B A U-WLB1818-4 Dim Min Max Typ A 0.62 A2 0.36 b 0.30 D 1.75 1.80 1.79 E 1.75 1.80 1.79 e 0.65 All Dimensions in mm e E A B b Ø X 6 1 A 2 A 1 2 A G NE I T N AA EL SP Suggested Pad Layout U-WLB1818-4 1 C x 4 D ︵ ︶ 2 A C Dimensions B C D Value (in mm) 0.65 0.30 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 240 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions e D b Ø x 4 X1-WLB1818-4 ︵ ︶ X1-WLB1818-4 B B Dim e E A A 1 # N I P 1 2 2 1 Max Typ 0.3420 0.4080 0.3750 A1 0.1350 0.1650 0.1500 A2 0.1850 0.2150 0.2000 A3 0.0220 0.0280 0.0250 g n i t a o C e d i s k c a B 3 A 2 A ︵ Min A ︶ A e n a l P g n i t a e S b 0.2700 0.3300 0.3000 D 1.7800 1.8000 1.7900 E 1.7800 1.8000 1.7900 e 0.650 BSC 1 A All Dimensions in mm Suggested Pad Layout X1-WLB1818-4 1 C x 4 D ︵ ︶ 2 A C Dimensions B C D Value (in mm) 0.65 0.30 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 241 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-WLB2010-2 1 A e n a l P g n i t a e S A D e d o h t a C k 0 0 1 . 0 R h c t o N X2-WLB2010-2 Dim Min Max Typ A 0.305 0.290 A1 0.02 0.011 b 0.48 D 1.950 2.050 2.000 E 0.950 1.050 1.000 k 0.972 L 0.932 All Dimensions in mm L E x 2 b ︵ ︶ Suggested Pad Layout X2-WLB2010-2 X Y 1 G X Dimensions G X X1 Y Value (in mm) 0.872 0.580 2.032 1.032 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 242 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions D I N I P 1 e D X2-WLB2718-6 2 C A e X2-WLB2718-6 Dim Min Max Typ A 0.40 0.35 A1 0.15 A2 0.20 b 0.25 0.35 0.30 D 1.75 1.80 1.79 E 2.65 2.70 2.69 e 0.65 All Dimensions in mm B E B A C 1 A 2 A 1 2 A G NE I T N AA EL SP Suggested Pad Layout X2-WLB2718-6 x 6 D ︵ ︶ 1 2 A C C C D C B Dimensions Value (in mm) 0.65 0.30 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 243 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions D X4-WLCUP0505-3 1 A E A X4-WLCUP0505-3 Dim Min Max Typ A 0.22 0.20 A1 0.006 0.001 0.008 b 0.12 0.18 0.15 D 0.54 E 0.54 K 0.20 L 0.47 0.53 0.50 L1 0.12 0.18 0.15 L2 0.12 0.18 0.15 All Dimensions in mm E N A L P G N I T A E S 1 L K L 2 L b b K Suggested Pad Layout X4-WLCUP0505-3 1 X Y Dimensions 1 Y X X1 Y Y1 Y Value (in mm) 0.17 0.54 0.17 0.54 X X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 244 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X2-WLCUP2010-2 1 A e n a l P g n i t a e S A D e d o h t a C k 0 0 1 . 0 R h c t o N X2-WLCUP2010-2 Dim Min Max Typ A 0.305 0.290 A1 0.02 0.011 b 0.48 D 1.950 2.050 2.000 E 0.950 1.050 1.000 k 0.972 L 0.932 All Dimensions in mm L E x 2 b ︵ ︶ Suggested Pad Layout X2-WLCUP2010-2 X Y Dimensions G X X1 Y 1 G X Value (in mm) 0.872 0.580 2.032 1.032 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 245 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X4-WLCUS0603-2 A1 A X4-WLCUS0603-2 Dim Min Max Typ A 0.20 A1 0.006 0.01 0.008 b 0.19 0.29 0.24 D 0.595 0.645 0.62 E 0.295 0.345 0.32 e 0.355 L 0.14 0.24 0.19 All Dimensions in mm D e E b (2X) L (2x) Suggested Pad Layout X4-WLCUS0603-2 1 X X Y Dimensions C X X1 Y Value (in mm) 0.380 0.230 0.610 0.300 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 246 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions b D X3-WLCUS0603-3 e d o h t a C X 3 L ︵ ︶ X3-WLCUS0603-3 e 1 e E e dt oo hD t a C e d o n A X 2 1 b ︵ ︶ Dim Min Max Typ A 0.24 0.30 A1 0.00 0.01 b 0.23 0.29 0.26 b1 0.075 0.135 0.105 D 0.290 0.300 0.295 E 0.590 0.600 0.595 A 1 A e n a l P g n i t a e S e 0.40 e1 0.155 L 0.13 0.19 0.16 All Dimensions in mm Suggested Pad Layout X3-WLCUS0603-3 Y 1 Y Dimensions X Y Y1 Y Value (in mm) 0.30 0.21 0.60 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 247 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions A 1 A X4-WLCUS1006-2 e n a l P g n i t a e S Z D e x 2 b R E ︵ ︶ X4-WLCUS1006-2 Dim Min Max Typ A 0.18 0.22 0.20 A1 0.006 0.01 0.008 b 0.48 0.58 0.53 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e 0.40 L 0.23 0.33 0.28 R 0.05 0.15 0.10 Z 0.02 0.08 0.05 All Dimensions in mm e dx o2 h t a CL e d o n A ︵ ︶ ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 248 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X4-WLCUS1406-2 1 A A e n a l P g n i t a e S D X4-WLCUS1406-2 Dim Min Max Typ A 0.17 0.25 0.20 A1 0.006 0.01 0.008 b 0.459 0.559 0.509 D 1.35 1.45 1.40 E 0.550 0.650 0.600 e 0.812 L1 0.194 0.294 0.244 L2 0.700 0.800 0.750 Z1 0.016 0.076 0.046 Z2 0.016 0.076 0.046 All Dimensions in mm 2 Z e e0 0 d1 o. h0 t a CR 1h #c no t i P N ︵ ︶ x 2 b E ︵ ︶ 1 Z e d o h t a C e d 2 o L n A 1 L Suggested Pad Layout X4-WLCUS1406-2 2 X Dimensions Y X X1 X2 Y Value (in mm) 0.334 0.840 1.386 0.589 1 X X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 249 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions X4-WLCUS1408-2 1 A A e n a l P g n i t a e S 2 Z D e e0 d0 o1 . h0 t a CR 1h #c no t i P N ︵ X4-WLCUS1408-2 Dim Min Max Typ A 0.17 0.25 0.20 A1 0.006 0.01 0.008 b 0.659 0.759 0.709 D 1.35 1.45 1.40 E 0.75 0.85 0.80 e 0.855 L1 0.194 0.294 0.244 L2 0.615 0.715 0.665 Z1 0.016 0.076 0.046 Z2 0.016 0.076 0.046 All Dimensions in mm ︶ x 2 b E ︵ ︶ 1 Z e d 2 o L n A 1 L e d o h t a C Suggested Pad Layout X4-WLCUS1408-2 Y Dimensions 1 X X X X1 X2 Y Value (in mm) 0.334 0.755 1.386 0.789 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 250 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated AXIAL / THROUGH-HOLE PACKAGES Package Outline Dimensions A-405 Dim A B C D A-405 Min 25.40 4.10 0.53 2.00 All Dimensions in mm Max 5.20 0.64 2.70 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 251 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions DO-35 Dim A B C D DO-35 Min 25.40 All Dimensions in mm Max - 4.00 0.60 2.00 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 252 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions DO-41 Plastic Dim A B C D DO-41 Plastic Min Max 25.40 - 4.06 5.21 0.71 0.864 2.00 2.72 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 253 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions DO-41 Glass Dim A B C D DO-41 Glass Min Max 25.40 - 4.70 0.863 2.71 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 254 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions DO-15 Dim A B C D DO-15 Min Max 25.40 - 5.50 7.62 0.686 0.889 2.60 3.60 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 255 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions DO-201 Dim A B C D DO-201 Min 25.40 8.50 0.96 4.80 All Dimensions in mm Max - 9.53 1.06 5.21 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 256 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions DO-201AD Dim A B C D DO-201AD Min 25.40 7.20 1.20 4.80 All Dimensions in mm Max - 9.50 1.30 5.30 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 257 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions R-6 Dim A B C D R-6 Min 25.40 8.60 1.20 8.60 All Dimensions in mm Max - 9.10 1.30 9.10 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 258 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions T-1 Dim A B C D T-1 Min 25.40 2.60 0.53 2.20 All Dimensions in mm Max - 3.20 0.64 2.60 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 259 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions DF-M C B A E H D J G L DF-M Dim Min Max A 7.40 7.90 B 6.20 6.50 C 0.22 0.30 D 1.27 2.03 E 7.60 8.90 G 3.81 4.69 H 8.13 8.51 J 2.40 3.40 K 5.00 5.20 L 0.46 0.58 All Dimensions in mm K ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 260 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions E-Line D A D EJECTION MARK E E F L1 L L* b SEATING PLANE e e2 e BULK e2 AMMO E-Line Dim Min Max Typ A 2.16 2.41 b 0.41 0.495 b1 0.41 0.495 D 4.37 4.77 E 3.61 4.01 e 1.27 e2 2.54 F 2.50 L 13.00 13.97 L1 2.50 3.50 All Dimensions in mm b1 R 1.14 (.045) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 261 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions GBJ GBJ Dim Min Max A 29.70 30.30 B 19.70 20.30 C 17.00 18.00 D 3.80 4.20 E 7.30 7.70 G 9.80 10.20 H 2.00 2.40 I 0.90 1.10 J 2.30 2.70 K 3.0 X 45 L 4.40 4.80 M 3.40 3.80 N 3.10 3.40 P 2.50 2.90 R 0.60 0.80 S 10.80 11.20 All Dimensions in mm L A K M B S _ J P D H N C R I G E E ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 262 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions GBPC H E F A C H (AC) (+) J GBPC Min Max 28.30 28.80 7.40 8.00 16.10 17.10 18.80 21.30 13.80 14.80 Hole for #10 screw H 5.08 5.59 J 17.60 18.60 F 6.30 6.50 All Dimensions in mm Dim A B C E G B C A (AC) (-) G ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 263 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions GBPC-W H GBPC-W Min Max 28.30 28.80 7.40 8.00 Hole for #10 screw H 5.08 5.59 J 17.60 18.60 K 10.90 11.90 L 0.97 1.07 M 31.80 All Dimensions in mm Dim A B B M L A H J (AC) ( +) J K (-) A (AC) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 264 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions GBU A B K M C L O - ~ ~ + D E F J N G P H GBU Dim Min Max A 21.8 22.3 B 3.5 4.1 C 7.4 7.9 D 1.65 2.16 E 2.25 2.75 F 1.95 2.35 G 1.02 1.27 H 4.83 5.33 J 17.5 18.0 K 3.2 X 45 L 18.3 18.8 M 3.30 3.56 N 0.46 0.56 O 1.90R P 0.76 1.0 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 265 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ITO220AB A 1 A P Ø ° 5 E ° 0 5 ° 5 3 B ° 5 Q ° 5 D B 1 L 1 D ° 5 ° 5 x 3 1 b 2 A L x 3 b e e c ° 5 ° 3 ITO220AB Dim Min Typ Max A 4.50 4.70 4.90 A1 3.04 3.24 3.44 A2 2.56 2.76 2.96 b 0.50 0.60 0.75 b1 1.10 1.20 1.35 c 0.50 0.60 0.70 D 15.67 15.87 16.07 D1 8.99 9.19 9.39 e 2.54 E 9.91 10.11 10.31 L 9.45 9.75 10.05 L1 15.80 16.00 16.20 P 2.98 3.18 3.38 Q 3.10 3.30 3.50 All Dimensions in mm ° 5 P Ø ° 5 ° 5 SECTION B-B ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 266 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ITO220AB A ØP E Q A1 D L1 D1 A2 b1 L e b ITO220AB Dim Min Max A 4.36 4.77 A1 2.54 3.10 A2 2.54 2.80 b 0.55 0.75 b1 1.20 1.50 c 0.38 0.68 D 14.50 15.50 D1 8.38 8.89 e 2.41 2.67 E 9.72 10.27 L 9.87 10.67 L1 15.8 17.00 P 3.08 3.39 Q 2.60 3.00 All Dimensions in mm c ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 267 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ITO220AB (TO220F-3) D 3 A X Y ITO220AB (TO220F-3) 1 Y E A ø 2 b 2 A 1 b Dim A A2 A3 b b1 b2 c D E e L Min 4.300 2.520 2.350 0.550 1.000 1.100 0.450 9.70 14.70 12.50 Max Typ 4.900 2.920 2.900 0.900 1.400 1.500 0.600 10.30 16.00 2.54 13.50 - 1 L L L1 2.790 4.500 X 6.90 7.10 Y 3.000 3.400 Y1 3.370 3.900 ø 3.000 3.550 All Dimensions in mm b e e c ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 268 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ITO220S A E Q A1 + 7 Ref H1 + ØP D Ø1.5 Dp 0.1 max D1 D2 1.7 Ref 5 Ref E1 5 Ref A2 L1 b2 L e 5 Ref b c e1 5 Ref ITO220S Dim Min Max Typ A 4.52 4.62 4.57 A1 1.17 1.39 A2 2.57 2.77 2.67 b 0.72 0.95 0.84 b2 1.15 1.34 1.26 c 0.356 0.61 D 14.22 16.51 15.00 D1 8.60 8.80 8.70 D2 13.68 14.08 e 2.49 2.59 2.54 e1 4.98 5.18 5.08 E 10.01 10.21 10.11 E1 6.86 8.89 H1 5.85 6.85 L 13.30 13.90 13.60 L1 4.00 P 3.54 4.08 Q 2.54 3.42 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 269 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions ITO220AC-S A E/2 A1 ØP Q 7° Re f E H1 D2 D E1 5° Re f D1 1.7 Ref L1 L 5°Ref A2 L2 Ø1.5 x Dp 0.1 max 3xb2 2xe 2xb c e1 ITO220AC-S Dim Min Max Typ A 4.52 4.62 4.57 A1 0.51 1.39 -A2 2.57 2.77 2.67 b 0.72 0.95 0.84 b2 1.15 1.34 1.26 c 0.356 0.61 -D 14.22 16.51 15.00 D1 8.60 8.80 8.70 D2 13.68 14.08 -e 2.49 2.59 2.54 e1 4.98 5.18 5.08 E 10.01 10.21 10.11 E1 6.86 8.89 -H1 5.85 6.85 -L 13.30 13.90 13.60 L1 -4.00 -L2 0.70 1.30 1.00 P 3.54 4.08 -Q 2.54 3.42 -All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 270 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions KBJ P N A O B H C _ K L J E D G R M KBJ Dim Min Max A 24.80 25.20 B 14.70 15.30 C 3.90 4.10 D 17.20 17.80 E 0.90 1.10 G 7.30 7.70 H 3.10 3.40 J 3.30 3.70 K 1.50 1.90 L 9.30 9.70 M 2.50 2.90 N 3.40 3.80 O 3.0 x 45 P 4.40 4.80 R 0.60 0.80 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 271 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions KBP KBP Dim Min Max A 14.25 14.75 B 10.20 10.60 C 1.80 2.20 D 14.25 14.73 E 3.56 4.06 G 0.76 0.86 H 1.17 1.42 J 2.8 X 45 K 0.80 1.10 L 3.35 3.65 M 3 Typ N 2 Typ P 0.30 0.64 All Dimensions in mm L A K J M _ + B N C H D G P E ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 272 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions MB H MB Min Max 28.40 28.70 10.97 11.23 15.50 17.60 22.86 25.40 13.30 15.30 Hole for #10 screw H 4.85 5.59 J 17.10 19.10 K 10.40 12.40 L 0.97 Typ 1.07 M 30.50 N 10.97 11.23 All Dimensions in mm Dim A B C E G B E A C H (AC) (+) J C A (AC) (-) G ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 273 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions MB-W H MB-W Min Max 28.40 28.70 10.97 11.23 15.50 17.60 22.86 25.40 13.30 15.30 Hole for #10 screw H 4.85 5.59 J 17.10 19.10 K 10.40 12.40 L 0.97 Typ 1.07 M 30.50 N 10.97 11.23 All Dimensions in mm Dim A B C E G N M L A H J (AC) (+) J K (-) A (AC) ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 274 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions PBPC-3 / PBPC-6 H + G PBPC-3 / PBPC-6 Dim Min Max A 14.73 15.75 B 5.84 6.86 C 19.00 - D 0.76 Typ E 1.70 3.20 Hole for #6 screw G 3.60 4.00 H 10.30 11.30 All Dimensions in mm AC A - AC E E D C B A ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 275 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions PBPC-8 H J + G PBPC-8 Dim Min Max A 18.54 19.56 B 6.35 7.60 C 22.20 - D 1.27 Typ E 5.33 7.37 G 3.60 4.00 H 12.70 Typ J 2.38 X 45 Typ All Dimensions in mm AC A - AC E E D C B A ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 276 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions PBU PBU Dim Min Max A 22.70 23.70 B 3.80 4.10 C 4.20 4.70 D 1.70 2.20 E 10.30 11.30 G 4.50 6.80 H 4.80 5.80 J 25.40 - K - 19.30 L 16.80 17.80 M 6.60 7.10 N 4.70 5.20 P 1.20 1.30 All Dimensions in mm A C M B D K L - E ~ ~ + N J G P H ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 277 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions PDIP-8 A PDIP-8 Dim Min Max A 9.02 9.53 B 6.15 6.35 C 3.10 3.50 D 0.36 0.56 F 1.40 1.65 G 2.54 typ. H 0.71 0.97 J 0.20 0.36 K 2.92 3.81 L 7.62 8.26 M - 15° N 0.38 (min) All Dimensions in mm B L G M C N K H J D F ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 278 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions PDIP-14 E c 2 A A 1 A L 2 E e B 1 B D 1 E PDIP-14 Dim Min Max A 3.710 4.310 A1 0.510 A2 3.200 3.600 B 0.380 0.570 B1 1.524 (BSC) c 0.204 0.360 D 18.800 19.200 E 6.200 6.600 E1 7.320 7.920 E2 8.400 9.000 e 2.540 (BSC) L 3.000 3.600 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 279 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SIP-3 (Ammo Pack) EF N D C A G a1 a2 B P SIP-3 (Ammo Pack) Dim Min Max A 3.9 4.3 a1 45 Typ a2 3 Typ B 2.8 3.2 C 1.40 1.60 D 0.35 0.41 E 0.43 0.48 F 0 0.2 G 2.4 2.9 N 0.63 0.84 P 1.55 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 280 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SIP-3 (Bulk Pack) L a1 J a2 B P N D C a3 A E F G H a4 SIP-3 (Bulk Pack) Dim Min Max A 3.9 4.3 a1 5 Typ a2 5 Typ a3 45 Typ a4 3 Typ B 2.8 3.2 C 1.40 1.60 D 0.33 0.432 E 0.40 0.508 F 0 0.2 G 1.24 1.30 H 2.51 2.57 J 0.35 0.43 L 14.0 15.0 N 0.63 0.84 P 1.55 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 281 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SIP-4 x 2 1 a L ︵ ︶ c A S x 2 2 a x 2 ° 5 4 x 3 . 0 ︵ ︶ ︵ ︶ 1 b 2 b E x 2 4 a x 2 3 a D J 1 e ︵ ︶ ︵ ︶ F 1 L SIP-4 Dim Min Max Typ A 1.45 1.65 1.55 b1 0.38 0.44 0.40 b2 0.48 c 0.35 0.45 0.40 D 5.12 5.32 5.22 e1 1.24 1.30 1.27 E 3.55 3.75 3.65 F 0.00 0.20 J 4.10 4.30 4.20 L 14.00 14.60 14.30 L1 1.32 1.52 1.42 S 0.63 0.83 0.73 a1 5° 3° a2 4° 7° 5° a3 4° 7° 5° a4 5° 3° All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 282 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions SIP-5 K C a1 E I a2 H L D 45° A B F 45° J SIP-5 Dim Min Max A 5.12 5.32 B 4.10 4.30 C 3.55 3.75 D 0.38 0.44 E 0.35 0.41 F 0.92 0.98 H 1.32 1.52 I 1.45 1.65 J 0.00 0.2 K 13.00 15.5 L 0.63 0.83 a1 3° 5° a2 5° 7° All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 283 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions A TO126 a 2 E 2 D 2 A D R1 TO126 h Y b 2 E E 2 b ø R 1 L b Dim A A2 b b2 c D D2 E E2a E2b e e1 Min 2.400 1.060 0.660 1.170 0.400 7.400 5.010 10.60 2.850 4.850 - Max 2.900 1.500 0.860 1.470 0.600 8.200 5.310 11.20 3.150 5.150 - Typ 2.280 4.560 L h 0.00 0.30 - L 14.50 15.90 - c e L1 1.700 2.100 R 1.840 R1 0.760 Y 3.600 3.900 Ø 3.100 3.550 All Dimensions in mm 1 e ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 284 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO220-3 A E Q F SEATING PLANE ØP D1 D L1 L b1 e b C J1 e1 TO220-3 Dim Min Max A 3.55 4.85 b 0.51 1.14 b1 1.14 1.78 C 0.31 1.14 D 14.20 16.50 D1 5.84 6.86 E 9.70 10.70 e 2.79 2.99 e1 4.83 5.33 F 0.51 1.40 J1 2.03 2.92 L 12.72 14.72 L1 3.66 6.35 P 3.53 4.09 Q 2.54 3.43 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 285 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO220-5 A E F SEATING PLANE ØP Q D1 D L1 L b1 b e C J1 e1 TO220-5 Dim Min Max A 3.55 4.85 b 0.51 1.14 b1 1.14 1.78 C 0.31 1.14 D 14.20 16.50 D1 5.84 6.86 E 9.78 10.54 e 1.6 1.8 e1 6.6 7.0 F 0.51 1.40 J1 2.03 2.92 L 12.72 14.72 L1 3.66 6.35 P 3.53 4.09 Q 2.54 3.43 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 286 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO220-5(R) A ØP E A1 Q H1 D D1 L1 H2 H3 A2 L e b c A3 A4 TO220-5(R) Dim Min Typ Max A 4.37 4.57 4.77 A1 1.12 1.27 1.40 A2 2.45 2.65 2.85 A3 4.10 4.40 4.70 A4 7.95 8.25 8.55 b 0.64 0.79 0.94 c 0.35 0.38 0.55 D 14.80 15.00 15.20 D1 8.50 8.70 8.90 e 1.70 E 9.96 10.16 10.36 H1 6.10 6.30 6.50 H2 21.32 22.12 22.92 H3 24.15 24.95 25.75 L 6.30 L1 13.10 13.50 13.90 P 3.64 3.84 4.04 Q 2.55 2.75 2.95 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 287 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO220AB A E 1 A P 2 Ø / E Q 1 H 1 H 2 D D 1 E 2 L 1 D 1 L 2 A 2 b L c b e 1 e TO220AB Dim Min Max Typ A 3.56 4.82 A1 0.51 1.39 A2 2.04 2.92 b 0.39 1.01 0.81 b2 1.15 1.77 1.24 c 0.356 0.61 D 14.22 16.51 D1 8.39 9.01 D2 11.45 12.87 e 2.54 e1 5.08 E 9.66 10.66 E1 6.86 8.89 H1 5.85 6.85 L 12.70 14.73 L1 6.35 L2 15.80 16.20 16.00 P 3.54 4.08 Q 2.54 3.42 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 288 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions 3 A 0 7 . 1 0 6 . D 0 TO220AB(Type C) 0 3 . 1 1 H Y ° 3 ø A E ° 3 ° 3 1 b 2 A L Dim A A2 A3 b b1 c D E e H1 L TO220AB Type C Min Max 0.700 0.900 0.400 0.600 9.800 10.20 9.00 9.40 6.30 6.70 12.60 13.60 Typ 4.500 2.400 1.300 1.270 2.54 - 1 L b L1 9.60 10.60 - Y - - 11.10 e Ø c e 3.560 3.640 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 289 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions A TO220AC E 1 A 1 H P Q D 2 L 1 L 2 b L c b 2 A 1 e TO220AC Dim Min Typ Max A 4.40 4.82 A1 1.1 1.40 A2 2.05 2.92 b 0.72 1.00 b2 1.16 1.45 c 0.36 0.68 D 14.70 15.87 e1 5.08 E 9.80 10.26 H1 5.80 6.40 L 12.70 13.96 L1 3.56 4.50 P 3.70 3.90 Q 2.54 3.30 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 290 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO220AC (13.7mm Min Lead Length) A 2 c D P Q TO220AC (13.7mm Min Lead Length) 1 E E 2 L 0 5 . 1 O 1 A 1 L 2 b L b Dim Min Max Typ A 4.470 4.670 A1 2.520 2.820 b 0.710 0.910 0.813 b2 1.170 1.370 1.270 c 0.279 0.483 c2 1.170 1.370 D 10.010 10.310 E 8.763 9.017 8.890 E1 12.294 12.548 12.446 e 2.54BSC e1 4.980 5.180 L 13.700 14.100 L1 4.04 4.19 4.11 L2 1.60 ØP 3.790 3.890 Q 2.642 2.946 2.743 All Dimensions in mm e c 1 e ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 291 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO247 A H B J S C K P Q L G D N E M M TO247 Dim Min Max A 1.9 2.1 B 4.85 5.15 C 20.3 21.75 D 19.60 20.1 E 2.2 2.6 G 0.51 0.76 H 15.45 16.25 J 1.93 2.18 K 2.9 3.2 L 3.78 4.38 M 5.2 5.7 N 1.0 1.4 P 1.8 2.2 Q 2.8 3.2 S 4.4 Typ All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 292 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO251 A D 2 n o i t p O 3 A 2 D 2 E TO251 ° 5 4 E 3 n o i t p O L b Dim A A2 A3 b c D D2 E E2 e e1 L Min 2.200 0.890 0.450 0.550 0.450 6.400 5.200 5.950 0.900 2.240 4.430 8.900 Max 2.400 1.150 0.550 0.740 0.570 6.750 5.400 6.250 1.250 2.340 4.730 9.500 c e All Dimensions in mm 2 A 1 e ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 293 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO262 L1 E A c2 TO262 Dim Min Max Typ A 4.06 4.83 4.57 A2 2.03 2.79 2.67 b 0.64 0.99 b2 1.14 1.40 1.24 c 0.356 0.74 c2 1.14 1.40 1.27 D 8.64 9.65 8.70 E 9.65 10.29 10.11 e 2.54 Typ L 12.70 14.73 13.60 L1 1.67 L2 - 4.00 All Dimensions in mm D L2 A2 L b2 c b e Suggested Pad Layout TO262 Z C E1 X2 X1 Y1 Y2 Dimensions Z X1 X2 Y1 Y2 C E1 Value (in mm) 16.9 1.1 10.8 3.5 11.4 9.5 2.5 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 294 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO3P A B H J S C K R P Q L G D N E M M TO-3P Dim Min Max A 1.88 2.08 B 4.68 5.36 C 20.63 22.38 D 18.5 21.5 E 2.10 2.40 G 0.51 0.76 H 15.38 16.25 J 1.90 2.70 K 2.90 3.65 L 3.78 4.50 M 5.20 5.70 N 0.89 1.53 P 1.82 2.46 Q 2.92 3.23 R 11.70 12.84 S 6.10 All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 295 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO92 A D K R A M N O I T C E J E K R A M N O I T C E J E E E 1 b 2 L 3 L 1 L L b 2 e c e 2 e e O M M A K L U B 1 D 2 A TO92 Dim Min Max Typ A 3.45 3.66 A2 1.22 1.37 b 0.38 c 0.38 D 4.27 4.78 D1 3.87 E 4.32 4.83 e 1.27 e2 2.40 2.90 L 12.98 15.00 L1 12.80 15.00 L2 0.80 L3 2.00 3.00 All Dimensions in mm h ø ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 296 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions A D TO92 (Type B) K R A M N O I T C E J E K R A M N O I T C E J E E E 1 b 2 L 3 L 1 L L b 2 e c e 2 e e O M M A K L U B 1 D TO92 Type B Dim Min Max Typ A 3.30 3.70 A2 1.00 1.40 b 0.38 0.55 b1 0.36 0.76 c 0.32 0.51 D 4.40 4.80 D1 3.430 E 4.30 4.70 e 1.27 e2 2.54 h 0.00 0.38 L 12.50 15.50 L1 12.50 14.50 L3 2.50 4.00 ø 1.60 All Dimensions in mm 2 A h ø ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 297 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions A D TO92 (Type C) K R A M N O I T C E J E K R A M N O I T C E J E E E 1 b 2 L 3 L 1 L L b 2 e c e 2 e e O M M A K L U B 1 D TO92 Type C Dim Min Max Typ A 3.30 3.70 A2 1.10 1.40 b 0.38 0.55 c 0.36 0.51 D 4.40 4.70 D1 3.430 E 4.30 4.70 e 1.27 e2 2.440 2.640 h 0.00 0.38 L 14.10 14.50 L1 12.50 14.50 L3 2.50 3.50 ø 1.60 All Dimensions in mm 2 A h ø ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 298 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions D TO92L k r a M n o i t c e j E O h k r a M n o i t c e j E c A E 1 A 1 b 1 D 1 L L b TO92L Dim Min Max A 3.70 4.10 A1 1.28 1.58 b 0.35 0.55 b1 0.60 0.80 c 0.35 0.45 D 4.70 5.10 D1 4.00 e1 2.30 2.70 E 7.80 8.20 L 10.10 10.70 L1 13.80 14.20 h 0.00 0.30 θ 1.60 All Dimensions in mm 1 e 1 e ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 299 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO92S (TYPE A) L c A 2 A E b e D 0 Dim A A2 b c D E e L L1 θ 1 L TO92S (TYPE A) Min Max Typ 1.480 1.680 0.710 0.810 0.440 0.380 4.000 4.200 3.080 3.280 1.270 13.500 14.500 2.200 2.400 44° 46° All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 300 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO92S (TYPE B) L c A 2 A E b 2 b e D 0 1 L Dim A A2 b b2 c D E e L L1 θ TO92S (TYPE B) Min Max Typ 1.420 1.620 0.750 0.360 0.480 0.380 0.550 0.360 0.510 3.850 4.150 2.900 3.310 1.270 14.000 15.500 1.600 44° 46° All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 301 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions TO94 L x 2 0 ︵ ︶ c b 2 b E 3 AA x 2 1 0 ︵ ︶ 1 e e D x 2 3 0 x 2 2 0 L ︵ ︶ ︵ ︶ TO94 Dim Min Max Typ A 1.46 1.66 1.56 A3 0.76 b 0.35 0.56 0.39 b2 0.46 c 0.36 0.51 0.38 D 5.12 5.32 5.22 E 3.55 3.75 3.65 e 1.27 e1 3.81 L 13.50 15.50 14.50 L1 1.42 S 0.63 0.83 0.73 θ 6° θ1 4° θ2 11° θ3 6° All Dimensions in mm ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 302 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated Package Outline Dimensions WOG A B WOG Dim Min Max A 8.84 9.86 B 4.00 4.60 C 27.90 - D 25.40 - E 0.71 0.81 G 4.60 5.60 All Dimensions in mm + D C E + G G ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. Rev. 84 303 of 303 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated