TSOP752.., TSOP754.. Datasheet

TSOP752.., TSOP754..
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Vishay Semiconductors
IR Receiver Modules for Remote Control Systems
FEATURES
• Very low supply current
• Photo detector and preamplifier in one package
• Internal filter for PCM frequency
• Supply voltage: 2.5 V to 5.5 V
• Improved immunity against ambient light
4
• Capable of side or top view
3
2
• Two lenses for high sensitivity and wide
receiving angle
1
• Insensitive to supply voltage ripple and noise
• Narrow optical filter to reduce interference from plasma
TV emissions
20953
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
MECHANICAL DATA
Pinning:
DESCRIPTION
1, 4 = GND, 2 = VS, 3 = OUT
The TSOP75... series are miniaturized SMD IR receiver
modules for infrared remote control systems. Two PIN
diodes and a preamplifier are assembled on a leadframe, the
epoxy package contains an IR filter.
ORDERING CODE
Taping:
The demodulated output signal can be directly connected to
a microprocessor for decoding.
TSOP75...TT - top view taped
TSOP75...TR - side view taped
The TSOP752.. and TSOP754.. are optimized to suppress
almost all spurious pulses from energy saving lamps like
CFLs. The AGC4 used in the TSOP754.. may suppress
some data signals. The TSOP752.. is a legacy product for all
common IR remote control data formats. Between these
two receiver types, the TSOP754.. is preferred. Customers
should initially try the TSOP754.. in their design.
These components have not been qualified according to
automotive specifications.
PARTS TABLE
LEGACY, FOR
LONG BURST REMOTE CONTROLS (AGC2)
RECOMMENDED FOR
LONG BURST CODES (AGC4) (1)
30 kHz
TSOP75230
TSOP75430
33 kHz
TSOP75233
TSOP75433
36 kHz
TSOP75236
TSOP75436 (2)(3)(4)
38 kHz
TSOP75238
TSOP75438 (5)(6)
40 kHz
TSOP75240
TSOP75440
56 kHz
TSOP75256
TSOP75456 (7)(8)
AGC
Carrier
frequency
Package
Heimdall
Pinning
1, 4 = GND, 2 = VS, 3 = OUT
Dimensions (mm)
6.8 W x 3.0 H x 3.2 D
Mounting
SMD
Application
Best remote control code
Remote control
(2)
RC-5
(3)
RC-6
(4)
Panasonic
(5)
NEC
(6)
Sharp
(7)
r-step
(8)
Thomson RCA
Note
(1) We advise try AGC4 first if the burst length is unknown
Rev. 1.3, 27-Feb-15
1
Document Number: 82494
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BLOCK DIAGRAM
APPLICATION CIRCUIT
17170_5
2
VS
IR receiver
VS
3
Input
Band
pass
AGC
OUT
Demodulator
VO
GND
GND
Control circuit
µC
OUT
1, 4
PIN
+ VS
C1
Circuit
30 k Ω
R1
Transmitter
with
TSALxxxx
GND
R1 and C1 are recommended for protection against EOS.
Components should be in the range of 33 Ω < R1 < 1 kΩ,
C1 > 0.1 µF.
20445-1
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply voltage
Supply current
Output voltage
Output current
Junction temperature
Storage temperature range
Operating temperature range
Power consumption
TEST CONDITION
SYMBOL
VS
IS
VO
IO
Tj
Tstg
Tamb
Ptot
Tamb ≤ 85 °C
VALUE
-0.3 to +6.0
3
-0.3 to (VS + 0.3)
5
100
-25 to +85
-25 to +85
10
UNIT
V
mA
V
mA
°C
°C
°C
mW
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Supply voltage
TEST CONDITION
Ev = 0, VS = 3.3 V
Ev = 40 klx, sunlight
Ev = 0, test signal see fig. 1,
IR diode TSAL6200, IF = 200 mA
IOSL = 0.5 mA, Ee = 0.7 mW/m2, test signal see fig. 1
Pulse width tolerance:
tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1
tpi - 5/fo < tpo < tpi + 6/fo, test signal see fig. 1
Angle of half transmission distance
Supply current
Transmission distance
Output voltage low
Minimum irradiance
Maximum irradiance
Directivity
SYMBOL
VS
ISD
ISH
MIN.
2.5
0.27
TYP.
0.35
0.45
d
MAX.
5.5
0.45
UNIT
V
mA
mA
100
mV
0.25
mW/m2
45
m
VOSL
0.12
Ee min.
Ee max.
ϕ1/2
W/m2
deg
30
± 50
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Ee
Optical Test Signal
1.0
(IR diode TSAL6200, IF = 0.4 A, 30 pulses, f = f0, t = 10 ms)
Output Pulse Width
tpo - Output Pulse Width (ms)
0.9
t
tpi *
* tpi
VO
T
10/f0 is recommended for optimal function
Output Signal
1)
VOH
2)
16110
7/f0 < td < 15/f0
tpi - 5/f0 < tpo < tpi + 6/f0
0.8
Input Burst Length
0.7
0.6
0.5
0.4
0.3
λ = 950 nm,
Optical Test Signal, Fig.1
0.2
0.1
0
0.1
VOL
td
1)
tpo
2)
20752
t
Fig. 1 - Output Active Low
Rev. 1.3, 27-Feb-15
1
10
102
103
104
105
Ee - Irradiance (mW/m2)
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
2
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Ee min. - Threshold Irradiance (mW/m2)
Ee
Vishay Semiconductors
Optical Test Signal
600 µs
t
600 µs
t = 60 ms
94 8134
Output Signal, (see fig. 4)
VO
VOH
VOL
t off
t on
4
Correlation with Ambient Light Sources:
2
3.5 10 W/m = 1.4 kLx (Std. illum. A, T = 2855 K)
10 W/m2 = 8.2 kLx (Daylight, T = 5900 K)
3
Wavelength of Ambient
Illumination: λ = 950 nm
2.5
2
1.5
1
0.5
0
0.01
t
20757
Ton, Toff - Output Pulse Width (ms)
0.8
Ton
0.7
0.6
0.5
Toff
0.4
0.3
0.2
λ = 950 nm,
Optical Test Signal, Fig. 3
0.1
0
0.1
1
10
100
1000
10 000
Ee - Irradiance (mW/m2)
20759
1
10
100
Fig. 6 - Sensitivity in Bright Ambient
Ee min. - Threshold Irradiance (mW/m2)
Fig. 3 - Output Function
0.1
Ee - Ambient DC Irradiance (W/m2)
3.0
2.5
f = f0
f = 30 kHz
f = 10 kHz
f = 100 Hz
2.0
1.5
1.0
0.5
0
1
10
100
1000
ΔVS RMS - AC Voltage on DC Supply Voltage (mV)
Fig. 4 - Output Pulse Diagram
Fig. 7 - Sensitivity vs. Supply Voltage Disturbances
1.2
1
Max. Envelope Duty Cycle
E e min./Ee - Rel. Responsivity
0.9
1.0
0.8
0.6
0.4
f = f0 ± 5 %
Δ f(3 dB) = f0/10
0.2
0.8
0.7
0.6
0.5
TSOP752..
0.4
0.3
TSOP754..
0.2
0.1
0.0
f = 38 kHz, Ee = 2 mW/m²
0
0.7
16925
0.9
1.1
0
1.3
20955-1
f/f0 - Relative Frequency
Fig. 5 - Frequency Dependence of Responsivity
Rev. 1.3, 27-Feb-15
20
40
60
80
100
120
Burst Length (number of cycles/burst)
Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length
3
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Ee min. - Threshold Irradiance (mW/m2)
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Vishay Semiconductors
0°
0.30
20°
30°
0.25
40°
0.20
1.0
0.15
0.10
0.9
50°
0.8
60°
70°
0.05
80°
0
-30
-10
10
30
50
70
0.6
90
Tamb - Ambient Temperature (°C)
0.4
0.2
0
drel - Relative Transmission Distance
21428
Fig. 9 - Sensitivity vs. Ambient Temperature
Fig. 12 - Vertical Directivity
0.30
1.0
0.9
Ee min. - Sensitivity (mW/m2)
S (λ) rel - Relative Spectral Sensitivity
10°
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.25
0.20
0.15
0.10
0.05
0.00
0
750
800
850
900
950 1000 1050 1100 1150
1
λ- Wavelength (nm)
21425
Fig. 10 - Relative Spectral Sensitivity vs. Wavelength
0°
10°
2
3
4
5
VS - Supply Voltage (V)
20°
Fig. 13 - Sensitivity vs. Supply Voltage
30°
40°
1.0
0.9
50°
0.8
60°
70°
80°
0.6
21427
0.4
0.2
0
drel - Relative Transmission Distance
Fig. 11 - Horizontal Directivity
Rev. 1.3, 27-Feb-15
4
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SUITABLE DATA FORMAT
IR Signal
This series is designed to suppress spurious output pulses
due to noise or disturbance signals. The devices can
distinguish data signals from noise due to differences in
frequency, burst length, and envelope duty cycle. The data
signal should be close to the device’s band-pass center
frequency (e.g. 38 kHz) and fulfill the conditions in the table
below.
When a data signal is applied to the product in the
presence of a disturbance, the sensitivity of the receiver is
automatically reduced by the AGC to insure that no spurious
pulses are present at the receiver’s output.
Some examples which are suppressed are:
0
• DC light (e.g. from tungsten bulbs sunlight)
5
• Continuous signals at any frequency
10
15
20
Time (ms)
16920
Fig. 14 - IR Disturbance from Fluorescent Lamp
with Low Modulation
IR Signal
• Strongly or weakly modulated patterns from fluorescent
lamps with electronic ballasts (see fig. 14 or fig. 15)
0
5
10
15
20
Time (ms)
16921
Fig. 15 - IR Disturbance from Fluorescent Lamp
with High Modulation
TSOP752..
TSOP754..
Minimum burst length
10 cycles/burst
10 cycles/burst
After each burst of length
a minimum gap time is required of
10 to 70 cycles
≥ 10 cycles
10 to 35 cycles
≥ 10 cycles
For bursts greater than
a minimum gap time in the data stream is needed of
70 cycles
> 4 x burst length
35 cycles
> 10 x burst length
Maximum number of continuous short bursts/second
1800
1500
yes
preferred
RC5/RC6 code
yes
preferred
Thomson 56 kHz code
yes
preferred
Sharp code
yes
preferred
Most common disturbance
patterns are suppressed
Even extreme disturbance
patterns are suppressed
NEC code
Suppression of interference from fluorescent lamps
Notes
• For data formats with short bursts please see the datasheet for TSOP753.., TSOP755..
• Best choice of AGC for some popular IR-codes:
- TSOP75436: RC-5, RC-6, Panasonic
- TSOP75438: NEC, Sharp, r-map
- TSOP75456: r-step, Thomson RCA
• For Sony 12, 15, and 20 bit IR-codes please see the datasheet of TSOP75S40F
Rev. 1.3, 27-Feb-15
5
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PACKAGE DIMENSIONS in millimeters
6.8
6.6 ± 0.1
3.2
(3.4)
Mold residue
Mold residue
2.5
(1.8)
1.2 ± 0.2
3
0.8
2.2
(0.635)
(1)
1.27
(3 x)
0.5 ± 0.1
(4 x)
technical drawings
according to DIN
specifications
3 x 1.27 = 3.81
Marking area
2.2
Not indicated tolerances ± 0.15
(1.65)
Tool separation line
(2.2)
Proposed pad layout
from component side
(for reference only)
3 x 1.27 = 3.81
1.27
Pick and place area
1.8
(R1.3)
Drawing-No.: 6.550-5297.01-4
Issue: 4; 13.09.11
0.8
22608
ASSEMBLY INSTRUCTIONS
Reflow Soldering
Manual Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handle products only after the temperature has cooled off
• Finish soldering within 3 s
• Handling after reflow should be done only after the work
surface has been cooled off
Rev. 1.3, 27-Feb-15
6
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VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
300
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
T (°C)
200
max. 20 s
150
max. 100 s
max. 120 s
100
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
50
0
0
50
100
150
t (s)
19800
200
250
300
max. 2 cycles allowed
TAPING VERSION TSOP..TR DIMENSIONS in millimeters
3.3
0.3
4°
7.1
16
7.5
1.75
2.8
4°
1.34 ref.
Ø 1.5
Direction of feed
8
2
Ø 1.5 min
4
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5337.01-4
Issue: 1; 16.10.08
21577
Rev. 1.3, 27-Feb-15
7
Document Number: 82494
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TAPING VERSION TSOP..TT DIMENSIONS in millimeters
3.35
0.3
4°
7.1
16
7.5
3.3
4°
1.75
Ø 1.5
4
8
Direction of feed
2
Ø 1.5 min.
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5338.01-4
Issue: 3; 09.06.09
21578
Rev. 1.3, 27-Feb-15
8
Document Number: 82494
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REEL DIMENSIONS in millimeters
16734
LEADER AND TRAILER DIMENSIONS in millimeters
Trailer
no devices
Leader
devices
no devices
End
Start
min. 200
min. 400
96 11818
COVER TAPE PEEL STRENGTH
LABEL
According to DIN EN 60286-3
Standard bar code labels for finished goods
0.1 N to 1.3 N
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
300 ± 10 mm/min.
165° to 180° peel angle
Rev. 1.3, 27-Feb-15
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VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING
ABBREVIATION
LENGTH
Item-description
-
18
Item-number
INO
8
Selection-code
SEL
3
BATCH
10
Data-code
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
LOT-/serial-number
Mixed code indicator
Origin
Long bar code top
MIXED CODE
-
xxxxxxx+
Company logo
Type
Length
Item-number
N
8
Plant-code
N
2
Sequence-number
X
3
Quantity
N
8
Total length
-
21
Short bar code bottom
Type
Length
Selection-code
X
3
Data-code
N
3
Batch-number
X
10
Filter
-
1
Total length
-
17
DRY PACKING
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
Aluminum bag
Label
An EIA JEDEC® standard J-STD-020 level 4 label is included
on all dry bags.
Reel
LEVEL
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
15973
FINAL PACKING
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
RECOMMENDED METHOD OF STORAGE
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
22522
• Storage temperature 10 °C to 30 °C
EIA JEDEC standard J-STD-020 level 4 label is included
on all dry bags
• Storage humidity ≤ 60 % RH max.
Rev. 1.3, 27-Feb-15
4
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
10
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VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
22178
Rev. 1.3, 27-Feb-15
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
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product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000