VSMF970011X01 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, 890 nm FEATURES • Package type: surface mount • Package form: PLCC-2 • Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75 • Peak wavelength: λp = 890 nm • High reliability • High radiant power • High radiant intensity • Angle of half sensitivity: ϕ = ± 60° 948553 • Low forward voltage • Suitable for high pulse current operation • Floor life: 168 h, MSL 3, according to J-STD-020 • Lead (Pb)-free reflow soldering • AEC-Q101 qualified DESCRIPTION VSMF970011X01 is a high speed infrared emitting diode in GaAlAs double hetero (DH) technology in a miniature PLCC-2 package. • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Automotive sensors • Rain sensor • Infrared high speed remote control and free air data transmission systems PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (deg) λp (nm) tr (ns) 9 ± 60 890 50 VSMF970011X01 Note • Test condition see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMF970011X01-GS08 Tape and reel MOQ: 7500 pcs, 1500 pcs/reel PLCC-2 VSMF970011X01-GS18 Tape and reel MOQ: 8000 pcs, 8000 pcs/reel PLCC-2 Note • MOQ: minimum order quantity ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER SYMBOL VALUE Reverse voltage VR 5 V Forward current IF 100 mA IFSM 200 mA PV 170 mW Surge forward current TEST CONDITION tp = 100 μs Power dissipation Junction temperature Operating temperature range Storage temperature range Soldering temperature Thermal resistance junction / ambient Rev. 1.0, 16-Feb-15 Acc. fig. 8, J-STD-020 UNIT Tj 110 °C Tamb -40 to +105 °C Tstg -40 to +110 °C Tsd 260 °C RthJA 250 K/W Document Number: 84237 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMF970011X01 www.vishay.com Vishay Semiconductors 100 180 IF - Forward Current (mA) PV - Power Dissipation (mW) 200 160 140 120 100 80 RthJA = 250 K/W 60 40 80 60 40 RthJA = 250 K/W 20 20 0 0 0 20 40 60 80 0 100 20 40 60 80 100 Tamb - Ambient Temperature (°C) Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL TYP. MAX. UNIT IF = 100 mA, tp = 20 ms VF 1.6 1.9 V IF = 200 mA, tp = 100 μs VF 1.9 2.5 V IF = 100 mA TKVF -1.1 VR = 5 V IR VR = 0 V, f = 1 MHz, E = 0 Cj Radiant intensity IF = 100 mA, tp = 20 ms Ie Radiant power IF = 100 mA, tp = 20 ms φe 30 mW IF = 100 mA TKφe -0.46 %/K ϕ ± 60 deg IF = 100 mA λp 890 nm Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Temperature coefficient of φe Angle of half intensity Peak wavelength MIN. mV/K 10 5 μA 160 pF 9 mW/sr Spectral bandwidth IF = 100 mA Δλ½ 40 nm Temperature coefficient of λp IF = 100 mA TKλp 0.33 nm/K Rise time IF = 100 mA tr 50 ns Fall time IF = 100 mA tf 50 ns BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) VF, rel - Relative Forward Voltage (%) IF - Forward Current (mA) 1000 tp = 20 ms 100 10 1.2 1.4 1.6 1.8 2.0 VF - Forward Voltage (V) Fig. 3 - Forward Current vs. Forward Voltage Rev. 1.0, 16-Feb-15 115 IF = 100 mA tp = 20 ms 110 105 100 95 90 -50 -25 0 25 50 75 100 125 Tamb - Ambient Temperature (°C) Fig. 4 - Relative Forward Voltage vs. Ambient Temperature Document Number: 84237 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMF970011X01 www.vishay.com Vishay Semiconductors Ie, rel - Relative Radiant Intensity (%) tp = 20 ms 10 1 10 100 1000 100 90 IF = 100 mA 80 70 60 50 40 30 20 10 0 750 800 850 900 Fig. 5 - Radiant Intensity vs. Forward Current 0° Ie, rel - Relative Radiant Intensity 140 IF = 100 mA tp = 20 ms 120 110 100 90 80 70 60 50 -50 -25 0 25 50 75 100 125 Tamb - Ambient Temperature (°C) Fig. 6 - Relative Radiant Intensity vs. Ambient Temperature Rev. 1.0, 16-Feb-15 1050 Fig. 7 - Relative Radiant Intensity vs. Wavelength 10° 150 130 1000 λ - Wavelength (nm) IF - Forward Current (mA) Ie, rel - Relative Radiant Intensity (%) 950 20° 30° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 80° 0.6 0.4 0.2 ϕ - Angular Displacement Ie - Radiant Intensity (mW/sr) 100 0 λ - Wavelength (nm) Fig. 8 - Relative Radiant Intensity vs. Angular Displacement Document Number: 84237 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMF970011X01 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 0.9 1.75±0.1 3.5±0.2 0.8 A C Technical drawings according to DIN specifications 2.2 2.8±0.15 Pin identification Dimensions in mm Ø2.4 Drawing-No.: 6.541-5067.02-4 Issue: 5; 23.09.13 +0.15 3 Mounting Pad Layout 4 2.6 (2.8) 1.2 Area covered with solderresist 1.6 (1.9) 4 Dimensions: Reflow and vapor phase (wave soldering) DRYPACK REFLOW SOLDER PROFILE 300 255 °C 240 °C 217 °C 250 Temperature (°C) max. 260 °C 245 °C FLOOR LIFE 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp down 6 °C/s 50 max. ramp up 3 °C/s 0 0 19841 50 100 150 200 250 300 Time (s) Fig. 9 - Lead (Pb)-free Reflow Solder Profile according to J-STD-020 Rev. 1.0, 16-Feb-15 Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 3, according to J-STD-020. DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. Document Number: 84237 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMF970011X01 www.vishay.com Vishay Semiconductors TAPE AND REEL PLCC-2 components are packed in antistatic blister tape (DIN IEC (CO) 564) for automatic component insertion. Cavities of blister tape are covered with adhesive tape. The tape leader is at least 160 mm and is followed by a carrier tape leader with at least 40 empty compartements. The tape leader may include the carrier tape as long as the cover tape is not connected to the carrier tape. The least component is followed by a carrier tape trailer with a least 75 empty compartements and sealed with cover tape. Adhesive tape 10.0 9.0 120° 4.5 3.5 Blister tape 2.5 1.5 Component cavity 94 8670 Fig. 10 - Blister Tape 3.5 3.1 Identification Label: Vishay type group tape code production code quantity 13.00 12.75 63.5 60.5 14.4 max. 180 178 94 8665 2.2 2.0 Fig. 13 - Dimensions of Reel-GS08 5.75 5.25 3.6 3.4 4.0 3.6 4.5 3.5 1.85 1.65 1.6 1.4 4.1 3.9 4.1 3.9 10.4 8.4 120° 8.3 7.7 2.5 1.5 0.25 2.05 1.95 94 8668 Fig. 11 - Tape Dimensions in mm for PLCC-2 MISSING DEVICES A maximum of 0.5 % of the total number of components per reel may be missing, exclusively missing components at the beginning and at the end of the reel. A maximum of three consecutive components may be missing, provided this gap is followed by six consecutive components. De-reeling direction 94 8158 Identification Label: Vishay type group tape code production code quantity 13.00 12.75 62.5 60.0 321 329 14.4 max. 18857 Fig. 14 - Dimensions of Reel-GS18 COVER TAPE REMOVAL FORCE The removal force lies between 0.1 N and 1.0 N at a removal speed of 5 mm/s. In order to prevent components from popping out of the blisters, the cover tape must be pulled off at an angle of 180° with regard to the feed direction. > 160 mm Tape leader 40 empty compartments min. 75 empty compartments Carrier leader Carrier trailer Fig. 12 - Beginning and End of Reel Rev. 1.0, 16-Feb-15 Document Number: 84237 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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