VLMW51Q2R3 Datasheet

VLMW51Q2R3
www.vishay.com
Vishay Semiconductors
Power SMD LED PLCC-2 Plus
FEATURES
• High efficient InGaN technology
• Long life, due to silicone resin casting
• Compact package outline 3.5 mm x 3.5 mm x
1.2 mm
• Angle of half intensity  = ± 60°
• Luminous flux and color categorized per
packing unit
• Luminous flux
max./min. < 1.2
ratio
per
packing
unit
• ESD-withstand voltage: up to 2 kV (HBM)
according to JESD22-A114-B
• Preconditioning according to JEDEC level 2a
22038
• Compatible with IR-reflow soldering profiles according to
J-STD-020
DESCRIPTION
The VLMW51.. white LED in PLCC-2 plus package is an
advanced product in terms of high luminous flux and low
thermal resistance.
In combination with the small package outline (3.5 mm x
3.5 mm x 1.2 mm) the PLCC-2 plus is an ideal choice for
backlighting, signage, exterior and interior automotive
lighting as well as all general lighting applications.
• AEC-Q101 qualified
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Camera flash light
• Marker lights
PRODUCT GROUP AND PACKAGE DATA
• Interior and exterior automotive lighting
• Product group: LED
• Decorative lighting
• Package: SMD PLCC-2 plus
• Architectural lighting
• Product series: power
• All kinds of general lighting
• Angle of half intensity: ± 60°
• Backlighting (TFT LCD displays)
PARTS TABLE
PART
COLOR
LUMINOUS FLUX
(mlm)
MIN.
VLMW51Q2R3-GS08
White
TYP.
MAX.
at IF
(mA)
30 600 40 000 51 700 150
COORDINATE
(x, y)
MIN.
-
TYP. MAX.
0.33,
0.33
-
at IF
(mA)
150
FORWARD VOLTAGE
at IF
(V)
TECHNOLOGY
(mA)
MIN. TYP. MAX.
3
3.4
4.1
150
InGaN
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) 
VLMW51Q2R3
PARAMETER
TEST CONDITION
DC Forward current
Surge forward current
tp  10 μs
Power dissipation
SYMBOL
VALUE
UNIT
IF
180
mA
IFSM
350
mA
PV
738
mW
Junction temperature
Tjmax.
125
°C
Operating temperature range
Tamb
- 40 to + 100
°C
Storage temperature range
Tstg
- 40 to + 100
°C
RthJS
45
K/W
RthJA
125
K/W
Thermal resistance junction/solder point
Thermal resistance junction/ambient
Mounted on PC board total Cu area > 900 mm2
Note
• Not designed for reverse bias
Rev. 1.0, 16-May-13
Document Number: 84160
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMW51Q2R3
www.vishay.com
Vishay Semiconductors
OPTICAL AND ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
VLMW51P2Q3, WHITE
PARAMETER
TEST CONDITION
PART
SYMBOL
MIN.
TYP.
MAX.
Luminous flux
IF = 150 mA
VLMW51Q2R3
V
30.6
40
51.7
UNIT
lm
Luminous intensity
IF = 150 mA
VLMW51Q2R3
IV
-
13
-
cd
Chromaticity coordinate x, y
acc. to CIE 1931
IF = 150 mA
x
y
-
0.33
0.33
-
Angle of half intensity
IF = 150 mA

-
± 60
-
deg
Forward voltage
IF = 150 mA
VF
3
3.4
4.1
V
Temperature coefficient of VF
IF = 150 mA
TCVF
-
- 3.7
-
mV/K
Temperature coefficient of IV
IF = 150 mA
TCIV
-
- 0.25
-
%/K
Temperature coefficient of x
IF = 150 mA
TCx
-
- 0.00022
-
1/K
Temperature coefficient of y
IF = 150 mA
TCy
-
- 0.00016
-
1/K
Note
• Not designed for reverse bias
LUMINOUS FLUX CLASSIFICATION
GROUP
LUMINOUS FLUX (lm)
STANDARD
MIN.
MAX.
Q2
30.6
34.8
Q3
34.8
39.8
R2
39.8
45.2
R3
45.2
51.7
Note
• Luminous flux is tested at a current pulse duration of 25 ms and
an accuracy of ± 11 %.
The above type numbers represent the order groups which
include only a few brightness groups. Only one group will be
shipped on each reel (there will be no mixing of two groups on
each reel).
In order to ensure availability, single brightness groups will not
be orderable.
In a similar manner for colors where wavelength groups are
measured and binned, single wavelength groups will be shipped
on any one reel.
In order to ensure availability, single wavelength groups will not
be orderable.
CHROMATICITY COORDINATED GROUPS FOR WHITE PLCC-2 PLUS
YU
YL
XU
XL
WU
X
Y
X
Y
0.274
0.301
0.317
0.325
0.283
0.284
0.319
0.310
0.307
0.316
0.329
0.319
0.303
0.333
0.329
0.336
WL
0.283
0.284
0.329
0.354
0.290
0.270
0.329
0.336
0.310
0.299
0.345
0.350
0.307
0.316
0.347
0.368
0.303
0.333
0.329
0.336
0.307
0.316
0.329
0.319
0.317
0.325
0.343
0.331
0.315
0.343
0.345
0.350
0.307
0.316
0.347
0.368
0.310
0.299
0.345
0.350
0.319
0.310
0.361
0.365
0.317
0.325
0.364
0.383
0.315
0.343
0.345
0.350
0.317
0.325
0.343
0.331
0.329
0.336
0.357
0.343
0.329
0.354
0.361
0.365
VU
VL
UU
UL
Note
• Chromaticity coordinate groups are tested at a current pulse direction of 25 ms and a tolerance of ± 0.01.
Rev. 1.0, 16-May-13
Document Number: 84160
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMW51Q2R3
www.vishay.com
Vishay Semiconductors
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
RthJA = 90 K/W
160
140
120
RthJA = 125 K/W
100
80
60
40
20
80
60
40
20
0
0
0
20
40
60
80
100
400
120
Tamb - Ambient Temperature (°C)
22039
500
Fig. 1 - Forward Current vs. Ambient Temperature
600
0°
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
IF - Forward Current (mA)
20°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
80°
50 100 150 200 250 300 350 400
22040
10°
30°
IV rel - Relative Luminous Intensity
Relative Luminous Flux
(normalized at 150 mA)
1.8
800
Fig. 4 - Relative Intensity vs. Wavelength
2.0
0.6
0.4
0.2
0
95 10319
Fig. 2 - Relative Luminous Intensity vs. Forward Current
Fig. 5 - Relative Luminous Intensity vs. Angular Displacement
0.39
500
4500 K
0.37
5000 K
UU
400
5650 K
0.35
y-Coordinates
IF - Forward Current (mA)
700
λ - Wavelength (nm)
16196_1
ϕ - Angular Displacement
IF - Forward Current (mA)
180
100
IV rel - Relative Luminous Intensity
200
300
200
100
VU
6300 K
WU
7000 K
0.33
XU
UL
VL
WL
0.31
XL
10 000 K
YU
0.29
YL
0.27
0
2
22041
2.5
3
3.5
4
4.5
VF - Forward Voltage (V)
Fig. 3 - Forward Current vs. Forward Voltage
Rev. 1.0, 16-May-13
0.25
0.26
22042
0.28
0.3
0.32
0.34
0.36
0.38
x-Coordinates
Fig. 6 - White Grouping SMD
Document Number: 84160
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMW51Q2R3
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Vishay Semiconductors
Ø 180
Ø 62.5 - 2.5
REEL DIMENSIONS in millimeters
Ø 13 ± 0.2
12.4 + 2
Label area with depression
(Measured at outer edge)
18.4
(max., Measured at hub)
technical drawings
according to DIN
specifications
Not indicated tolerances ± 0.5
GS08 = 1000 pcs
Material: black static dissipative
Drawing-No.: 9.800-5104.01-4
Issue: 2; 19.03.10
22067
Rev. 1.0, 16-May-13
Document Number: 84160
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMW51Q2R3
www.vishay.com
Vishay Semiconductors
TAPING AND ORIENTATION DIMENSIONS in millimeters
Reels come in quantity of 1000 units.
3.75 ± 0.1
2.2 ± 0.1
3.75 ± 0.1
Package marking
+ 0.3
12 - 0.1
2 ± 0.05
5.5 ± 0.05
4 ± 0.1
1.75 ± 0.1
Ø 1.5 + 0.1
0.279 ± 0.02
Ø 1.5 + 0.25
8 ± 0.1
200 mm min. for Ø 180 reel
Trailer
480 mm min. for Ø 180 reel
Component
Leader
User feed direction
Drawing-No.: 9.700-5348.01-4
Issue: 1; 01.03.10
technical drawings
according to DIN
specifications
22066
Rev. 1.0, 16-May-13
Document Number: 84160
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMW51Q2R3
www.vishay.com
Vishay Semiconductors
RECOMMENDED PAD DESIGN DIMENSIONS in millimeters
2.6
0.05
Package mark
A
3.7 ± 0.2
Ø 2.6
1.5
3.1
3.5 ± 0.2
C
0.5
0.7
3.5 ± 0.2
1.2 ± 0.2
Recommended solder pad
Additional area covered by solder resist
for improved heat dissipation.
technical drawings
according to DIN
specifications
0.5
4.5
3.4
9.4
1.4
2.8
10
Drawing-No.: 6.541-5082.01-4
Issue: 2; 23.07.10
22065
Rev. 1.0, 16-May-13
Document Number: 84160
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMW51Q2R3
www.vishay.com
Vishay Semiconductors
SOLDERING PROFILE
FINAL PACKING
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
IR Reflow Soldering Profile for lead (Pb)-free soldering
Preconditioning acc. to JEDEC Level 2a
300
max. 260 °C
245 °C
255
255°C°C
240 °C
217 °C
250
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
T [°C]
200
max. 30 s
150
max. 100 s
max. 120 s
RECOMMENDED METHOD OF STORAGE
100
• Storage temperature 10 °C to 30 °C
max. Ramp Down 6 °C/s
max. Ramp Up 3 °C/s
50
• Storage humidity  60 % RH max.
0
0
50
100
150
250
200
300
t [s]
19470-3
max. 2 cycles allowed
Fig. 7 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020)
BAR CODE PRODUCT LABEL (example)
106
A
H
After more than 672 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen)
or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 100 °C + 5 °C not suitable for reel or tubes
An EIA JEDEC standard JESD22-A112 level 2a label is
included on all dry bags.
37
L E V E L
CAUTION
This bag contains
MOISTURE –SENSITIVE DEVICES
B
C
D
E
F
G
19795
2a
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
A) Type of component
B) Manufacturing plant
C) SEL - selection code (bin):
e.g.: V1 = code for luminous intensity group
5L = code for chrom. coordinate group
D) Date code year/week
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
a) Mounted within 672 hours at factory condition of < 30°C/60%RH or
b) Stored at <10% RH.
3. Devices require baking before mounting if:
a)
Humidity Indicator Card is >10% when read at 23°C + 5°C or
b)
2a or 2b is not met.
F) Batch no.
4. If baking is required, devices may be baked for:
192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
or
o
96 hours at 60±5 Cand <5%RH
or
For all device containers
24 hours at 100±5°C
Not suitable for reels or tubes
G) Total quantity
Bag Seal Date: ______________________________
(If blank, see bar code label)
E) Day code (e. g. 1: Monday)
H) Company code
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
19786
Example of JESD22-A112 level 2a label
DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
Aluminum bag
Label
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electro-static
sensitive devices warning labels are on the packaging.
Reel
15973
Rev. 1.0, 16-May-13
Document Number: 84160
7
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
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Revision: 02-Oct-12
1
Document Number: 91000