EL Lamp Drivers: Die Specifications

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MANAGEMENT
EL Lamp Drivers: Die Specifications
IMP525
Single Cell Battery Powered Electroluminescent Lamp Driver
IMP527
Single Cell Battery Powered EL Lamp Driver, 180VPP Drive
IMP528
High-Voltage EL Lamp Driver, 220VPP Drive
IMP560
Power Efficient EL Lamp Driver
IMP803
High-Voltage EL Lamp Driver
http://www.ds-imp.com.cn
IMP525 - Die Specif ications
IMP525
Single Cell Battery Powered EL Lamp Driver
General Information
Pad Description
Die Thickness:
25 mils (625 microns)
Bond Wire Size:
1.0 mil (25 microns)
Back Side Metal:
None
Back Side Potential:
Ground
3
Die Attach Method:
Conductive Adhesive
Pad
Number Name Function
1
2
RSW-OSC Switch-mode oscillator frequency setting pad.
CS
Boost converter storage capacitor pad.
4
LX
Inductor pad.
5
GND
6
VB
EL lamp drive.
VA
EL lamp drive.
Bond Pad Metal:
Aluminum, 1% Silicon, 1/2% Copper
Bond Pad Size:
100 microns per side
7
1.35mm x 1.54mm
8
Die Size:
4
3
RSW-OSC
2
9
1
8
DIS
VDD
REL-OSC
1.54mm
(0, 0)
5
6
7
VB
VA
1.35mm
DIS
Disable pad. DIS = HIGH disables chip.
* See Ordering Information table
IMP525
GND
Ground pad.
REL-OSC EL lamp oscillator frequency setting pad.
9*
LX CS
Positive voltage supply.
VDD
Pad Location1
Pad
Number
X (microns)
Y (microns)
1
1153
1092
2
476
1226
3
314
1226
4
143
1216
5
111
460
6
397
112
7
1104
112
8
1153
958
9
1153
1226
Notes 1. To bonding pad center
Ordering Information
Description
Part
Number
Pad
Number
IMP525/D
9
IMP525/D1
9
Disable Pad
Active
Disable Pad
Not Active
525 Die_t01
© Daily Silver IMP
Electroluminescent Lamp Driver
1
IMP527 - Die Specif ications
IMP527
Single Cell Battery Powered EL Lamp Driver, 180VPP Drive
General Information
Pad Description
Die Thickness:
25 mils (625 microns)
Bond Wire Size:
1.0 mil (25 microns)
Back Side Metal:
None
Back Side Potential:
Ground
3
Die Attach Method:
Conductive Adhesive
Pad
Number Name Function
1
2
RSW-OSC Switch-mode oscillator frequency setting pad.
CS
Boost converter storage capacitor pad.
4
LX
Inductor pad.
5
GND
6
VB
EL lamp drive.
VA
EL lamp drive.
Bond Pad Metal:
Aluminum, 1% Silicon, 1/2% Copper
Bond Pad Size:
100 microns per side
7
1.35mm x 1.54mm
8
Die Size:
Positive voltage supply.
VDD
Ground pad.
REL-OSC EL lamp oscillator frequency setting pad.
9*
DIS
Disable pad. DIS = HIGH disables chip.
* See Ordering Information table
RSW-OSC
LX CS
4
3
2
9
1
8
Pad Location1
DIS
VDD
REL-OSC
IMP527
1.54mm
GND
(0, 0)
Pad
Number
X (microns)
Y (microns)
1
1153
1092
2
476
1226
3
314
1226
143
1216
5
6
7
4
VB
VA
5
111
460
6
397
112
7
1104
112
8
1153
958
9
1153
1226
1.35mm
Notes 1. To bonding pad center
Ordering Information
Part
Number
Disable
Pad
Number
IMP527/D
9
IMP527/D1
9
Description
Disable Pad
Active
Disable Pad
Not Active
527 Die_t01
2
© Daily Silver IMP
www.ds-imp.com.cn
IMP528 - Die Specif ications
IMP528
High-Voltage EL Lamp Driver, 220VPP Drive
General Information
Pad Description
Die Thickness:
25 mils (625 microns)
Bond Wire Size:
1.0 mil (25 microns)
Back Side Metal:
None
Back Side Potential:
Ground
3
Die Attach Method:
Conductive Adhesive
Pad
Number Name Function
1
Positive voltage supply.
VDD
2
RSW-OSC Switch-mode oscillator frequency setting pad.
CS
Boost converter storage capacitor pad.
4
LX
Inductor pad.
5
GND
6
VB
EL lamp drive.
EL lamp drive.
Ground pad.
Bond Pad Metal:
Aluminum, 1% Silicon, 1/2% Copper
Bond Pad Size:
100 microns per side
7
VA
1.38mm x 1.82mm
8
REL-OSC
9
GND
Ground pad.
10*
DIS
Disable pad. DIS = HIGH disables chip.
Die Size:
DIS
VDD 1
8 REL-OSC
10
RSW-OSC 2
7
VA
IMP528
LX 4
9
GND
(0, 0)
1.38mm
6
VB
5
GND
* See Ordering Information table
Pad Location1
1.82mm
CS 3
EL lamp oscillator frequency setting pad.
Pad
Number
X (microns)
1
152
1480
2
152
1253.5
3
152
387.75
4
152
122.5
5
1198.5
140
6
1215
395
7
1215
1208.5
8
1234
1508.5
9
998
122.5
10
382
1553.5
Y (microns)
Notes 1. To bonding pad center
Ordering Information
Part
Number
Disable
Pad
Number
IMP528/D
10
IMP528/D1
10
Description
Disable Pad
Active
Disable Pad
Not Active
528 Die_t01
© Daily Silver IMP
Electroluminescent Lamp Driver
3
IMP560 - Die Specif ications
IMP560
Power Efficient EL Lamp Driver
General Information
Pad Description
Die Thickness:
25 mils (625 microns)
Bond Wire Size:
1.0 mil (25 microns)
Back Side Metal:
None
Back Side Potential:
Ground
3
Die Attach Method:
Conductive Adhesive
Pad
Number Name Function
1
2
Positive voltage supply.
VDD
RSW-OSC Switch-mode oscillator frequency setting pad.
CS
Boost converter storage capacitor pad.
4
LX
Inductor pad.
5
GND
6
VB
EL lamp drive.
EL lamp drive.
Ground pad.
Bond Pad Metal:
Aluminum, 1% Silicon, 1/2% Copper
Bond Pad Size:
100 microns per side
7
VA
1.38mm x 1.82mm
8
REL-OSC
9
GND
Ground pad.
10*
DIS
Disable pad. DIS = HIGH disables chip.
Die Size:
DIS
VDD 1
8 REL-OSC
10
RSW-OSC 2
7
Pad Location1
1.82mm
CS 3
LX 4
* See Ordering Information table
VA
IMP560
9
6
VB
5
GND
Pad
Number
X (microns)
1
152
1480
2
152
1253.5
3
152
387.75
4
152
122.5
5
1198.5
140
6
1215
395
7
1215
1208.5
8
1234
1508.5
9
998
122.5
10
382
1553.5
GND
(0, 0)
EL lamp oscillator frequency setting pad.
1.38mm
Y (microns)
Notes 1. To bonding pad center
Ordering Information
Description
Part
Number
Pa d
Number
IMP560/D
10
IMP560/D1
10
Disable Pad
Active
Disable Pad
Not Active
560 Die_t01
4
© Daily Silver IMP
www.ds-imp.com.cn
IMP803 - Die Specif ications
IMP803
High-Voltage EL Lamp Driver
General Information
Pad Description
Die Thickness:
25 mils (625 microns)
Bond Wire Size:
1.0 mil (25 microns)
Back Side Metal:
None
Back Side Potential:
Ground
3
Die Attach Method:
Conductive Adhesive
Pad
Number Name Function
1
Positive voltage supply.
VDD
2
RSW-OSC Switch-mode oscillator frequency setting pad.
CS
Boost converter storage capacitor pad.
4
LX
Inductor pad.
5
GND
6
VB
EL lamp drive.
EL lamp drive.
Ground pad.
Bond Pad Metal:
Aluminum, 1% Silicon, 1/2% Copper
Bond Pad Size:
100 microns per side
7
VA
1.38mm x 1.82mm
8
REL-OSC
9
GND
Ground pad.
10*
DIS
Disable pad. DIS = HIGH disables chip.
Die Size:
DIS
VDD 1
8 REL-OSC
10
RSW-OSC 2
7
VA
IMP803
LX 4
9
GND
(0, 0)
1.38mm
6
VB
5
GND
* See Ordering Information table
Pad Location1
1.82mm
CS 3
EL lamp oscillator frequency setting pad.
Pad
Number
X (microns)
1
152
1480
2
152
1253.5
3
152
387.75
4
152
122.5
5
1198.5
140
6
1215
395
7
1215
1208.5
8
1234
1508.5
9
998
122.5
10
382
1553.5
Y (microns)
Notes 1. To bonding pad center
Ordering Information
Description
Part
Number
Pad
Number
IMP803SX
10
IMP803/D1
10
Disable Pad
Active
Disable Pad
Not Active
803 Die_t01
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Electroluminescent Lamp Driver
5