POWER MANAGEMENT EL Lamp Drivers: Die Specifications IMP525 Single Cell Battery Powered Electroluminescent Lamp Driver IMP527 Single Cell Battery Powered EL Lamp Driver, 180VPP Drive IMP528 High-Voltage EL Lamp Driver, 220VPP Drive IMP560 Power Efficient EL Lamp Driver IMP803 High-Voltage EL Lamp Driver http://www.ds-imp.com.cn IMP525 - Die Specif ications IMP525 Single Cell Battery Powered EL Lamp Driver General Information Pad Description Die Thickness: 25 mils (625 microns) Bond Wire Size: 1.0 mil (25 microns) Back Side Metal: None Back Side Potential: Ground 3 Die Attach Method: Conductive Adhesive Pad Number Name Function 1 2 RSW-OSC Switch-mode oscillator frequency setting pad. CS Boost converter storage capacitor pad. 4 LX Inductor pad. 5 GND 6 VB EL lamp drive. VA EL lamp drive. Bond Pad Metal: Aluminum, 1% Silicon, 1/2% Copper Bond Pad Size: 100 microns per side 7 1.35mm x 1.54mm 8 Die Size: 4 3 RSW-OSC 2 9 1 8 DIS VDD REL-OSC 1.54mm (0, 0) 5 6 7 VB VA 1.35mm DIS Disable pad. DIS = HIGH disables chip. * See Ordering Information table IMP525 GND Ground pad. REL-OSC EL lamp oscillator frequency setting pad. 9* LX CS Positive voltage supply. VDD Pad Location1 Pad Number X (microns) Y (microns) 1 1153 1092 2 476 1226 3 314 1226 4 143 1216 5 111 460 6 397 112 7 1104 112 8 1153 958 9 1153 1226 Notes 1. To bonding pad center Ordering Information Description Part Number Pad Number IMP525/D 9 IMP525/D1 9 Disable Pad Active Disable Pad Not Active 525 Die_t01 © Daily Silver IMP Electroluminescent Lamp Driver 1 IMP527 - Die Specif ications IMP527 Single Cell Battery Powered EL Lamp Driver, 180VPP Drive General Information Pad Description Die Thickness: 25 mils (625 microns) Bond Wire Size: 1.0 mil (25 microns) Back Side Metal: None Back Side Potential: Ground 3 Die Attach Method: Conductive Adhesive Pad Number Name Function 1 2 RSW-OSC Switch-mode oscillator frequency setting pad. CS Boost converter storage capacitor pad. 4 LX Inductor pad. 5 GND 6 VB EL lamp drive. VA EL lamp drive. Bond Pad Metal: Aluminum, 1% Silicon, 1/2% Copper Bond Pad Size: 100 microns per side 7 1.35mm x 1.54mm 8 Die Size: Positive voltage supply. VDD Ground pad. REL-OSC EL lamp oscillator frequency setting pad. 9* DIS Disable pad. DIS = HIGH disables chip. * See Ordering Information table RSW-OSC LX CS 4 3 2 9 1 8 Pad Location1 DIS VDD REL-OSC IMP527 1.54mm GND (0, 0) Pad Number X (microns) Y (microns) 1 1153 1092 2 476 1226 3 314 1226 143 1216 5 6 7 4 VB VA 5 111 460 6 397 112 7 1104 112 8 1153 958 9 1153 1226 1.35mm Notes 1. To bonding pad center Ordering Information Part Number Disable Pad Number IMP527/D 9 IMP527/D1 9 Description Disable Pad Active Disable Pad Not Active 527 Die_t01 2 © Daily Silver IMP www.ds-imp.com.cn IMP528 - Die Specif ications IMP528 High-Voltage EL Lamp Driver, 220VPP Drive General Information Pad Description Die Thickness: 25 mils (625 microns) Bond Wire Size: 1.0 mil (25 microns) Back Side Metal: None Back Side Potential: Ground 3 Die Attach Method: Conductive Adhesive Pad Number Name Function 1 Positive voltage supply. VDD 2 RSW-OSC Switch-mode oscillator frequency setting pad. CS Boost converter storage capacitor pad. 4 LX Inductor pad. 5 GND 6 VB EL lamp drive. EL lamp drive. Ground pad. Bond Pad Metal: Aluminum, 1% Silicon, 1/2% Copper Bond Pad Size: 100 microns per side 7 VA 1.38mm x 1.82mm 8 REL-OSC 9 GND Ground pad. 10* DIS Disable pad. DIS = HIGH disables chip. Die Size: DIS VDD 1 8 REL-OSC 10 RSW-OSC 2 7 VA IMP528 LX 4 9 GND (0, 0) 1.38mm 6 VB 5 GND * See Ordering Information table Pad Location1 1.82mm CS 3 EL lamp oscillator frequency setting pad. Pad Number X (microns) 1 152 1480 2 152 1253.5 3 152 387.75 4 152 122.5 5 1198.5 140 6 1215 395 7 1215 1208.5 8 1234 1508.5 9 998 122.5 10 382 1553.5 Y (microns) Notes 1. To bonding pad center Ordering Information Part Number Disable Pad Number IMP528/D 10 IMP528/D1 10 Description Disable Pad Active Disable Pad Not Active 528 Die_t01 © Daily Silver IMP Electroluminescent Lamp Driver 3 IMP560 - Die Specif ications IMP560 Power Efficient EL Lamp Driver General Information Pad Description Die Thickness: 25 mils (625 microns) Bond Wire Size: 1.0 mil (25 microns) Back Side Metal: None Back Side Potential: Ground 3 Die Attach Method: Conductive Adhesive Pad Number Name Function 1 2 Positive voltage supply. VDD RSW-OSC Switch-mode oscillator frequency setting pad. CS Boost converter storage capacitor pad. 4 LX Inductor pad. 5 GND 6 VB EL lamp drive. EL lamp drive. Ground pad. Bond Pad Metal: Aluminum, 1% Silicon, 1/2% Copper Bond Pad Size: 100 microns per side 7 VA 1.38mm x 1.82mm 8 REL-OSC 9 GND Ground pad. 10* DIS Disable pad. DIS = HIGH disables chip. Die Size: DIS VDD 1 8 REL-OSC 10 RSW-OSC 2 7 Pad Location1 1.82mm CS 3 LX 4 * See Ordering Information table VA IMP560 9 6 VB 5 GND Pad Number X (microns) 1 152 1480 2 152 1253.5 3 152 387.75 4 152 122.5 5 1198.5 140 6 1215 395 7 1215 1208.5 8 1234 1508.5 9 998 122.5 10 382 1553.5 GND (0, 0) EL lamp oscillator frequency setting pad. 1.38mm Y (microns) Notes 1. To bonding pad center Ordering Information Description Part Number Pa d Number IMP560/D 10 IMP560/D1 10 Disable Pad Active Disable Pad Not Active 560 Die_t01 4 © Daily Silver IMP www.ds-imp.com.cn IMP803 - Die Specif ications IMP803 High-Voltage EL Lamp Driver General Information Pad Description Die Thickness: 25 mils (625 microns) Bond Wire Size: 1.0 mil (25 microns) Back Side Metal: None Back Side Potential: Ground 3 Die Attach Method: Conductive Adhesive Pad Number Name Function 1 Positive voltage supply. VDD 2 RSW-OSC Switch-mode oscillator frequency setting pad. CS Boost converter storage capacitor pad. 4 LX Inductor pad. 5 GND 6 VB EL lamp drive. EL lamp drive. Ground pad. Bond Pad Metal: Aluminum, 1% Silicon, 1/2% Copper Bond Pad Size: 100 microns per side 7 VA 1.38mm x 1.82mm 8 REL-OSC 9 GND Ground pad. 10* DIS Disable pad. DIS = HIGH disables chip. Die Size: DIS VDD 1 8 REL-OSC 10 RSW-OSC 2 7 VA IMP803 LX 4 9 GND (0, 0) 1.38mm 6 VB 5 GND * See Ordering Information table Pad Location1 1.82mm CS 3 EL lamp oscillator frequency setting pad. Pad Number X (microns) 1 152 1480 2 152 1253.5 3 152 387.75 4 152 122.5 5 1198.5 140 6 1215 395 7 1215 1208.5 8 1234 1508.5 9 998 122.5 10 382 1553.5 Y (microns) Notes 1. To bonding pad center Ordering Information Description Part Number Pad Number IMP803SX 10 IMP803/D1 10 Disable Pad Active Disable Pad Not Active 803 Die_t01 © Daily Silver IMP Electroluminescent Lamp Driver 5