MA4DP918-1277 HMICTM Integrated Passive Diplexer GSM/DCS or AMPS/PCS Applications 3 mm square MLP Plastic Package 3mm MLP Plastic Package Features n n n n n n n V 1.00 TM HMIC Integrated Passive Circuit Low Insertion Loss, High Rejection Diplexer Suface Mountable in Microwave Circuits, No Wirebonds Required Rugged HMICTM Construction with Polyamide Encapsulation Reliable, Multilayer Metalization No External 50 Ω Matching Required Low Cost Miniature Plastic MLP Package Description The MA4DP918-1277 HMICTM Integrated Passive Diplexer is fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process. HMIC circuits consist of multilayer conductors on a glass dielectric, which acts as the low dispersion, low loss microstrip transmission medium. The glass allows HMIC devices to have excellent Q characteristics in a low profile, reliable device. Conductors are printed with state-of-the-art semiconductor photolithography processes and encapsulated in rugged silicon nitride and BCB polyamide. The circuit is composed of plated inductors and metal-insulator-metal (MIM) capacitors employing a silicon nitride dielectric layer. The high performance 3 mm MLP package allows for surface mount placement with no additional circuit matching required. Applications The MA4DP918-1277 HMICTM Integrated Passive Diplexer is recommended for use in wireless dual band GSM/DCS or AMPS/PCS applications. The diplexer has low insertion loss in the pass bands and high rejection in the stop bands. All ports are matched to 50 ohms. Absolute Maximum Ratings1 @ TA = +25 °C (Unless otherwise specified) Parameter Value Operating Temperature -65 °C to +125 °C Storage Temperature -65 °C to +150 °C RF C.W. Incident Power 3 Watts C.W. 1. Exceeding any of these values may result in permanent damage PIN Configuration PIN Function PIN Function 1 GND 9 NC 2 NC 10 RF 1800 3 RF 900 11 NC 4 NC 12 GND 5 NC 13 NC 6 NC 14 ANT 7 NC 15 NC 8 NC 16 NC Paddle GND Ordering Information Part Number Package MA4DP918-1277 Bulk MA4DP918-1277T Tape and Reel HMICTM Integrated Passive Diplexer for GSM/DCS or AMPS/PCS Applications MA4DP918-1277 V 1.00 Electrical Specifications @ 25 °C ANT - RF 900 (AMPS / GSM) ANT - RF 1800 (PCS / DCS) Freq (MHz) 825 880 960 Freq (MHz) 1710 1880 1990 IL (dB) typ 0.55 0.63 0.88 IL (dB) typ 0.75 0.80 0.91 Freq (MHz) 1650 1760 1920 Freq (MHz) 825 880 960 34 28 20 Rej (dB) typ 35 44 33 2475 2640 2880 15 15 16 2H Rej (dB) typ Freq (MHz) 3H Rej (dB) typ 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n North America: Tel. (800) 366-2266 n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 HMICTM Integrated Passive Diplexer for GSM/DCS or AMPS/PCS Applications MA4DP918-1277 V 1.00 Package Dimensions 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n North America: Tel. (800) 366-2266 n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300