3.2 mm x 5.0 mm Ceramic Package SMD Oscillator, LVCMOS / LVPECL / LVDS Product Features Applications Small Surface Mount Package Fast Sample Delivery Frequencies to 1500 MHz Pb Free/ RoHS Compliant Leadfree Processing xDSL Broadcast video Wireless Base Stations Sonet /SDH WiMAX/WLAN Server and Storage ISM64 Series Ethernet/LAN/WAN Optical modules Clock and data recovery FPGA/ASIC Backplanes GPON Frequency LVCMOS LVPECL LVDS 10 MHz to 250 MHz 10 MHz to 1500 MHz 10 MHz to 1500 MHz Output Level LVCMOS LVPECL LVDS VOH=90% VDD min., VOL=10 % VDD max. VOH=VDD-1.03V max. (Nom. Load), VOL=VDD-1.6V max. (Nom. Load) VOD=(Diff. Output) 350mV Typ. Duty Cycle LVCMOS LVPECL LVDS 50% ±5% @ 50%VDD 50% ±5% @ 50%* 50% ±5% @ 50%* Rise / Fall Time LVCMOS LVPECL LVDS 3.0 ns max. (90%/10%)* 0.6 ns max. (80%/20%)* 0.6 ns max. (80%/20%)* Output Load LVCMOS LVPECL LVDS 15pF 50 to VDD - 2.0 VDC RL=100 /CL=10pF Frequency Stability See Table Below Supply Voltage 3.3 VDC ± 10%, 2.5VDC ± 5% Current LVCMOS = 45 mA max., LVPECL = 65 mA max. LVDS = 35 mA max. Phase Jitter (RMS) At 12kHz to 20 MHz 0.9 ps typical Operating Temp. Range See Table Below Storage -40 C to +100 C Recommended Pad Layout Bypass =0.01 uF Pin 1 2 3 4 5 6 Connection Enable/Disable or N.C. Enable/Disable or N.C Ground Output Output or N.C. VDD Dimension Units: mm Part Number Guide Package ISM64 Input Voltage Sample Part Number: Operating Temperature Stability (in ppm) ISM64–31A9H2–155.520 Output Enable / Disable Complimentary Ouput (Pin 5) ** 3 = 3.3V 1 = 0 C to +70 C F = 20 3 = LVCMOS H = Enable (Pin 1) 1 = N.C. 6 = 2.5V 3 = -20 C to +70 C A = 25 8 = LVDS K = Enable (Pin 2) 2 = Output 2 = -40 C to +85 C B = 50 9 = LVPECL Frequency -155.520 MHz NOTE: A 0.01 µF bypass capacitor is recommended between VDD (pin 6) and GND (pin 3) to minimize power supply noise. * Measured as percent of waveform. ** Available on LVDS and LVPECL ouput only. ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 11/08/13_E Page 1 of 3 3.2 mm x 5.0 mm Ceramic Package SMD Oscillator, LVCMOS / LVPECL / LVDS ISM64 Series Typical Application: Pb Free Solder Reflow Profile: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metallization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 16 +/-.3 8 +/-.2 7.5 +/-.2 17.5 +/-1 50 / 60 / 80 180 / 250 ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 11/08/13_E Page 2 of 3 3.2 mm x 5.0 mm Ceramic Package SMD Oscillator, LVCMOS / LVPECL / LVDS ISM64 Series Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code (YWW) Line 2: Frequency ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 11/08/13_E Page 3 of 3