2 Pad Metal Package, 4.7 mm x 13.3 mm Product Features: HC49USM Series Applications: Low Cost SMD Package Low ESR Compatible with Leadfree Processing Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 System Clock 13.3 Max. 4.73 Frequency 3.2 MHz to 100.000 MHz 11.4 0.2 0.1 H Max. See Part Number Guide ESR (Equivalent Series Resistance) 3.2 MHz – 3.49 MHz 3.5 MHz – 3.99 MHz 4.0 MHz – 4.99 MHz 5.0 MHz – 5.99 MHz 6.0 MHz – 6.99 MHz 7.0 MHz – 8.9 MHz 9.0 MHz – 12.9 MHz 13 MHz – 19.9 MHz 20 MHz – 36 MHz rd 27 MHz – 100 MHz (3 O.T.) 300 : Max. 200 : Max. 150 : Max. 120 : Max. 100 : Max. 80 : Max. 60 : Max. 40 : Max. 30 : Max. 100 : Max. Shunt Capacitance (C0) 7 pF Max. Frequency Tolerance @ 25q C r30 ppm Standard (see Part Number Guide for more options) Frequency Stability over Temperature r50 ppm Standard (see Part Number Guide for more options) Crystal Cut AT Cut Standard Load Capacitance 18 pF Standard (see Part Number Guide for more options) Drive Level 1 mW Max. Aging r5 ppm Max. / Year Standard 3.9 Nom. 0.5 Min. Insulator 1.6 Recommended Pad Layout 0q C to +70q C Standard (see Part Number Guide for more options) Operating Storage Dimension Units: mm -40q C to +85q C Standard Part Number Guide Package HC49USM (4.5 mm H) HC49USM2 (3.5 mm H) HC49USM3 - Sample Part Number: HC49USM – FB1F18 - 20.000 Tolerance (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range B = ±50 ppm B = ±50 ppm 0 = 0°C to +50°C F = Fundamental F = ±30 ppm F = ±30 ppm 1 = 0°C to +70°C 3 = 3rd overtone G = ±25 ppm G = ±25 ppm 2 = -10°C to +60°C H = ±20 ppm H = ±20 ppm 3 = -20°C to +70°C I = ±15 ppm I = ±15 ppm 5 = -40°C to +85°C J = ±10 ppm J = ±10 ppm 9 = -10°C to +50°C Mode (overtone) Load Capacitance (pF) 18 pF Standard or Specify [email protected]• www.ilsiamerica.com • www.ilsiamerica.com ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] 04/09 0.2 5.5 Temperature (3.1 mm H) 0.8 Specifications subject to change without notice Page 1 Frequency - 20.000 MHz 2 Pad Metal Package, 4.7 mm x 13.3 mm HC49USM Series Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = N/A Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 24 +/-.3 12 +/-.2 11.5 +/-.2 25 +/-1.5 80/100 330 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Frequency, Date Code [email protected]• www.ilsiamerica.com • www.ilsiamerica.com ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] 04/09 Specifications subject to change without notice Page 2