2 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm Product Features: Applications: Low Cost SMD Package Low Profile Package Compatible with Leadfree Processing Frequency ILCX09 Series 6.0 Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 3.5 8 MHz to 100 MHz 1.1 ESR (Equivalent Series Resistance) 8 MHz – 48.0 MHz rd 36 MHz – 100 MHz (3 O.T.) 60 : Max. 60 : Max. Shunt Capacitance (C0) 7 pF Max. Frequency Tolerance @ 25q C r30 ppm Standard (see Part Number Guide for more options) Frequency Stability over Temperature r50 ppm Standard (see Part Number Guide for more options) Crystal Cut AT Cut Load Capacitance 18 pF Standard (see Part Number Guide for more options) Drive Level 500 uW Max. 2.0 Connection Diagram Recommended Pad Layout Aging r5 ppm Max. / Year Standard 2.2 Temperature 2.4 Operating 0q C to +70q C Standard (see Part Number Guide for more options) Storage -40q C to +85q C Standard 4.8 Part Number Guide Package ILCX09 - Sample Part Number: Dimension Units: mm ILCX09 - FB1F18 - 20.000 Tolerance (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range Mode (overtone) B = ±50 ppm B = ±50 ppm 0 = 0°C to +50°C F = Fundamental F = ±30 ppm F = ±30 ppm 1 = 0°C to +70°C 3 = 3rd overtone G = ±25 ppm G = ±25 ppm 2 = -10°C to +60°C H = ±20 ppm H = ±20 ppm 3 = -20°C to +70°C I = ±15 ppm I = ±15 ppm** 5 = -40°C to +85°C J = ±10 ppm* J = ±10 ppm** 9 = -10°C to +50°C Load Capacitance (pF) 18 pF Standard Or Specify Frequency - 20.000 MHz * Not available at all frequencies. ** Not available for all temperature ranges. [email protected]• www.ilsiamerica.com • www.ilsiamerica.com ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] 06/09_A Specifications subject to change without notice Page 1 2 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm Pb Free Solder Reflow Profile: ILCX09 Series Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 16 +/-.3 8 +/-.2 7.5 +/-.2 17.5 +/-1 50 / 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Date Code (yww) Line 2: Frequency [email protected]• www.ilsiamerica.com • www.ilsiamerica.com ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] 06/09_A Specifications subject to change without notice Page 2