2 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm Product Features: Applications: Low Cost SMD Package Low ESR Compatible with Leadfree Processing Frequency ILCX03 Series 5.0 Fibre Channel Server & Storage Sonet /SDH 802.11 / Wifi T1/E1, T3/E3 3.2 10 MHz to 100 MHz 1.3 Max. 1.3 ESR (Equivalent Series Resistance) 10.0 MHz – 13.9 MHz 14.0 MHz – 19.9 MHz 20.0 MHz – 39.9 MHz 40.0 MHz – 66.0 MHz rd 30.0 MHz – 100.0 MHz (3 O.T.) 100 : Max. 80 : Max. 60 : Max. 40 : Max. 100 : Max. Shunt Capacitance (C0) 7 pF Max. 2.00 Connection Diagram Frequency Stability over Temperature r30 ppm Standard (see Part Number Guide for more options) r50 ppm Standard (see Part Number Guide for more options) Crystal Cut AT Cut Load Capacitance 18 pF Standard (see Part Number Guide for more options) Drive Level 500 uW Max. Aging r5 ppm Max. / Year Standard Frequency Tolerance @ 25q C Recommended pad layout 1.5 Temperature 2.4 Operating 0q C to +70q C Standard (see Part Number Guide for more options) Storage -40q C to +85q C Standard Part Number Guide Package ILCX03 - Sample Part Number: 3.5 Dimension Units: mm ILCX03 - FB1F18 - 20.000 Stability (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range Mode (overtone) B = ±50 ppm B = ±50 ppm 0 = 0°C to +50°C F = Fundamental F = ±30 ppm F = ±30 ppm 1 = 0°C to +70°C 3 = 3rd overtone G = ±25 ppm G = ±25 ppm 2 = -10°C to +60°C H = ±20 ppm H = ±20 ppm 3 = -20°C to +70°C I = ±15 ppm I = ±15 ppm** 5 = -40°C to +85°C J = ±10 ppm* J = ±10 ppm** 9 = -10°C to +50°C Load Capacitance (pF) 18 pF Standard. Or Specify Frequency - 20.000 MHz * Not available at all frequencies. ** Not available for all temperature ranges. [email protected]• www.ilsiamerica.com • www.ilsiamerica.com ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] 02/09 Specifications subject to change without notice Page 1 2 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm ILCX03 Series Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 12 +/-.3 8 +/-.2 5.5 +/-.2 13.5 +/-1 or 12 +/-3 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI, Date Code (yww) Line 2: Frequency [email protected]• www.ilsiamerica.com • www.ilsiamerica.com ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] 02/09 Specifications subject to change without notice Page 2