Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0206 C-7 – CONNECTORIZED HERMETIC MODULE PACKAGE OUTLINES C-7 Package Outline Drawing NOTES: 1. MATERIAL: ALUMINUM 6061-T6 2. FINISH a. COVER & END PLATES, CHEMICAL FILM PER MIL-C-5541, CLASS 3 b. BASE, TIN 3. RF CONNECTORS, SMA STYLE 4. DIMENSIONS ARE INCHES (MM) 5. TOLERANCES .X±.1 (2.54mm) .XX±.02 (0.50mm) 6. BASE MUST BE GROUNDED AND MOUNTED TO HEAT SINK CAPABLE OF DISSIPATING 100W (50 °C) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com B - 85