HD74LS37 Quadruple 2-input Positive NAND Buffers REJ03D0406–0200 Rev.2.00 Feb.18.2005 Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS37P DILP-14 pin PRDP0014AB-B (DP-14AV) P — HD74LS37FPEL SOP-14 pin (JEITA) PRSP0014DF-B (FP-14DAV) FP EL (2,000 pcs/reel) Note: Please consult the sales office for the above package availability. Pin Arrangement 1A 1 14 VCC 1B 2 13 4B 1Y 3 12 4A 2A 4 11 4Y 2B 5 10 3B 2Y 6 9 3A GND 7 8 3Y (Top view) Rev.2.00, Feb.18.2005, page 1 of 4 HD74LS37 Circuit Schematic (1/4) VCC 17k 3k 75 Inputs A B 4k Output Y 750 1.5k GND Absolute Maximum Ratings Item Symbol Ratings Supply voltage VCC 7 Input voltage VIN 7 Power dissipation PT 400 Storage temperature Tstg –65 to +150 Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Unit V V mW °C Recommended Operating Conditions Item Supply voltage Output current Operating temperature Rev.2.00, Feb.18.2005, page 2 of 4 Symbol VCC IOH IOL Topr Min 4.75 — — –20 Typ 5.00 — — 25 Max 5.25 –1.2 24 75 Unit V mA mA °C HD74LS37 Electrical Characteristics (Ta = –20 to +75 °C) Item typ.* — — — — — — — — max. — 0.8 — 0.5 0.4 20 –0.4 0.1 Unit V V V II min. 2.0 — 2.7 — — — — — µA mA mA VCC = 4.75 V, VIL = 0.8 V, IOH = –1.2 mA IOL = 24 mA VCC = 4.75 V, VIH = 2 V IOL = 12 mA VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V Short-circuit output current IOS –30 — –130 mA VCC = 5.25 V Supply current ICCH ICCL — — — 0.9 6 — 2.0 12 –1.5 mA mA V VCC = 5.25 V VCC = 5.25 V VCC = 4.75 V, IIN = –18 mA Input voltage Output voltage Input current Symbol VIH VIL VOH VOL IIH IIL Input clamp voltage VIK Note: * VCC = 5 V, Ta = 25°C V Condition Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Propagation delay time Symbol tPLH tPHL min. — — typ. 12 12 max. 24 24 Unit ns ns Condition CL = 45 pF, RL = 667 Ω Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D00050100)". Rev.2.00, Feb.18.2005, page 3 of 4 HD74LS37 Package Dimensions JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B MASS[Typ.] 0.97g Previous Code DP-14AV D 8 E 14 1 7 b3 Z A1 A Reference Symbol Nom e1 7.62 D 19.2 E 6.3 L A θ bp e Dimension in Millimeters Min e1 A1 0.51 bp 0.40 JEITA Package Code P-SOP14-5.5x10.06-1.27 RENESAS Code PRSP0014DF-B *1 Previous Code FP-14DAV D 0.48 0.56 c 0.19 θ 0° e 2.29 0.25 0.31 2.54 2.79 15° 2.39 L 2.54 MASS[Typ.] 0.23g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 14 7.4 1.30 Z ( Ni/Pd/Au plating ) 20.32 5.06 b3 c Max 8 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 Z *3 Nom Max D 10.06 10.5 E 5.50 A2 7 e A1 bp Dimension in Millimeters Min x M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 A L1 2.20 bp b1 c A c A1 θ y L Detail F 1 θ 0° HE 7.50 e 1.27 x 0.12 y 0.15 1.42 Z L L Rev.2.00, Feb.18.2005, page 4 of 4 8° 0.50 1 0.70 1.15 0.90 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. 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