HD74HC365 Hex Bus Drivers (with 3-state outputs) REJ03D0615–0200 (Previous ADE-205-494) Rev.2.00 Jan 31, 2006 Features • • • • • • High Speed Operation: tpd (A to Y) = 9 ns typ (CL = 50 pF) High Output Current: Fanout of 15 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C) Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74HC365P DILP-16 pin PRDP0016AE-B (DP-16FV) P — HD74HC365FPEL SOP-16 pin (JEITA) PRSP0016DH-B (FP-16DAV) FP EL (2,000 pcs/reel) HD74HC365RPEL SOP-16 pin (JEDEC) PRSP0016DG-A (FP-16DNV) RP EL (2,500 pcs/reel) Note: Please consult the sales office for the above package availability. Function Table G1 H X L L Inputs G2 X H L L Notes: 1. H; High level, L; Low level, X; Irrelevant, Z; High impedance Rev.2.00 Jan 31, 2006 page 1 of 6 A X X L H Output Y Z Z L H HD74HC365 Pin Arrangement G1 1 16 VCC 1A 2 15 G2 1Y 3 14 6A 2A 4 13 6Y 2Y 5 12 5A 3A 6 11 5Y 3Y 7 10 4A GND 8 9 4Y (Top view) Absolute Maximum Ratings Item Supply voltage range Input / Output voltage Input / Output diode current Output current VCC, GND current Power dissipation Storage temperature Symbol VCC VIN, VOUT IIK, IOK IOUT ICC or IGND PT Tstg Ratings –0.5 to 7.0 –0.5 to VCC +0.5 ±20 ±35 ±75 500 –65 to +150 Unit V V mA mA mA mW °C Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. Recommended Operating Conditions Item Supply voltage Input / Output voltage Operating temperature Input rise / fall time*1 Ratings 2 to 6 0 to VCC –40 to 85 0 to 1000 0 to 500 0 to 400 Notes: 1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics. Rev.2.00 Jan 31, 2006 page 2 of 6 Symbol VCC VIN, VOUT Ta tr, tf Unit V V °C ns Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V HD74HC365 Electrical Characteristics Item Input voltage Symbol VCC (V) VIH VIL Output voltage VOH VOL Off-state output current Input current IOZ Quiescent supply current ICC Iin 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 6.0 Ta = 25°C Min Typ Max 1.5 — — 3.15 — — 4.2 — — — — 0.5 — — 1.35 — — 1.8 1.9 2.0 — 4.4 4.5 — 5.9 6.0 — 4.18 — — 5.68 — — — 0.0 0.1 — 0.0 0.1 — 0.0 0.1 — — 0.26 — — 0.26 — — ±0.5 — — — — ±0.1 4.0 Ta = –40 to+85°C Unit Test Conditions Min Max 1.5 — V 3.15 — 4.2 — — 0.5 V — 1.35 — 1.8 1.9 — V Vin = VIH or VIL IOH = –20 µA 4.4 — 5.9 — 4.13 — IOH = –6 mA 5.63 — IOH = –7.8 mA — 0.1 V Vin = VIH or VIL IOL = 20 µA — 0.1 — 0.1 — 0.33 IOH = 6 mA — 0.33 IOH = 7.8 mA — ±5.0 µA Vin = VIH or VIL, Vout = VCC or GND — ±1.0 µA Vin = VCC or GND — 40 µA Vin = VCC or GND, Iout = 0 µA Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Item Symbol VCC (V) Min Ta = 25°C Typ Max Propagation delay time tPLH tPHL 2.0 4.5 6.0 — — — — 9 — 120 24 20 Output enable time tZH tZL 2.0 4.5 6.0 — — — — 13 — Output disable time tHZ tLZ 2.0 4.5 6.0 — — — Output rise/fall time tTLH tTHL 2.0 4.5 6.0 Input capacitance Cin — Rev.2.00 Jan 31, 2006 page 3 of 6 Ta = –40 to +85°C Unit Min Max ns — 150 — — 30 26 220 44 37 — — — 275 55 47 ns — 15 — 220 44 37 — — — 275 55 47 ns — — — — 4 — 60 12 10 — — — 75 15 13 ns — 5 10 — 10 pF Test Conditions HD74HC365 Test Circuit VCC VCC Output G1, G2 1 kΩ See Function Table Input Pulse Generator Zout = 50 Ω 1Y to 6Y OPEN S1 GND CL = 50 pF 1A to 6A VCC TEST t PLH / t PHL S1 OPEN t ZH/ t HZ t ZL / t LZ GND VCC Note : 1. CL includes probe and jig capacitance. Waveforms • Waveform – 1 tf tr 90 % 50 % Input A VCC 90 % 50 % 10 % 10 % 90 % Output Y VOH 90 % 50 % 10 % 50 % 10 % t TLH • Waveform – 2 Input G 0V t PHL t PLH VOL t THL tf tr 90 % 50 % VCC 90 % 50 % 10 % 10 % t ZL GND t LZ VOH Waveform - A 50 % t ZH Waveform - B 50 % 10 % VOL t HZ 90 % VOH VOL Notes : 1. Input waveform : PRR ≤ 1 MHz, duty cycle 50%, tr ≤ 6 ns, tf ≤ 6 ns 2. Waveform– A is for an output with internal conditions such that the output is low except when disabled by the output control. 3. Waveform– B is for an output with internal conditions such that the output is high except when disabled by the output control. 4. The output are measured one at a time with one transition per measurement. Rev.2.00 Jan 31, 2006 page 4 of 6 HD74HC365 Package Dimensions JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B MASS[Typ.] 1.05g Previous Code DP-16FV D 9 E 16 1 8 b3 0.89 Z A1 A Reference Symbol L e Nom θ c e1 D 19.2 E 6.3 JEITA Package Code P-SOP16-5.5x10.06-1.27 RENESAS Code PRSP0016DH-B *1 Previous Code FP-16DAV 7.4 A1 0.51 b p 0.40 b 3 0.48 0.56 1.30 c 0.19 θ 0° e 2.29 0.25 0.31 2.54 2.79 15° 1.12 L 2.54 MASS[Typ.] 0.24g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. D F 16 20.32 5.06 Z ( Ni/Pd/Au plating ) Max 7.62 1 A bp e Dimension in Millimeters Min 9 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 Z *3 bp Nom D 10.06 E 5.50 Max 10.5 A2 8 e Dimension in Millimeters Min x A1 M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 A L1 2.20 bp b1 c A c A1 θ y L Detail F 1 θ 0° HE 7.50 e 1.27 x 0.12 y 0.15 0.80 Z L L Rev.2.00 Jan 31, 2006 page 5 of 6 8° 0.50 1 0.70 1.15 0.90 HD74HC365 JEITA Package Code P-SOP16-3.95x9.9-1.27 RENESAS Code PRSP0016DG-A *1 Previous Code FP-16DNV MASS[Typ.] 0.15g D NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 16 9 c *2 Index mark HE E bp Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) Dimension in Millimeters Min Nom Max D 9.90 10.30 E 3.95 A2 8 1 Z e *3 bp x A1 0.10 0.14 0.25 0.34 0.40 0.46 0.15 0.20 0.25 6.10 6.20 1.75 A M L1 bp b1 c A c A1 θ L y Detail F 1 θ 0° HE 5.80 1.27 e x 0.25 y 0.15 0.635 Z 0.40 L L Rev.2.00 Jan 31, 2006 page 6 of 6 8° 1 0.60 1.08 1.27 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. 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