LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1W Power Light LED LGFLB-321E-60 DATA SHEET DOC. NO : REV： DATE QW0905- LGFLB-321E-60 A : 28 - Dec. -2011 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Typical Applications Features *. High Flux per LED *. Very long operating life(up to 100k hours). *. Available in White. *. More Energy Efficient than lncandescent and most Halogen lamps. *. Low voltage DC operated.. *. Cool beam, safe to the touch. *. Instant light(less than 100 ns). *. Fully dimmable. *. No UV. *. Superior ESD protection.. *. Soldering methods: hand Soldering or reflow solder. *. Reading Light (car,bus,aircraft) *. Portable(flashlight,bicycle). *. LCD Backlights / Light Guides. *. Automotive Exterior (Stop-Tail-Tum,CHMSL,Mirror Side Repeat). *. Commercial and Residential Architectural lighting. *. Mini-accent / Uplighters / Downlighters / Orientation lighting *. Fiber Optic Alternative / Decorative / Entertainment lighting. *. Security / Garden lighting. *. Cove / Undershelf / Task lighting. *. Traffic signaling / Beacons / Rail crossing and Wayside lighting. *. Decorative. *. Sign and channel Letter. Dimension ∅8±0.2 Anode 2x1.5±0.2 6 Anode(+) Cathode(-) 5.0±0.2 1.31±0.2 9.2±0.3 2.4 5.8±0.3 14.2±0.3 Note:1.All dimension are in millimeter 2.Specifications are subject to change without notice Page 1/12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol UNIT Blue DC Forward Current IF 350 mA Power Dissipation PD 1.05 W Peak pulse current Duty 1/10@10KHz IFP 500 mA LED junction Temperature Tj 125 ℃ Reverse Current(VR=5V) Ir 100 μA Storage Temperature Tstg -40 ~ +120 ℃ Operating Temperature Topr -40 ~ +100 ℃ Manual Soldering Time at 260° C(Max) Tsol 5 seconds . Luminous Flux Characteristics at 350mA (Ratings At 25℃ Ambient) Radiation Pattern Lambertian PART NO LGFLB-321E-60 Luminous Flux @350mA(lm) Emission Color Blue Units Min. Typ. Max. 6.3 10.7 ---- Page 2/12 lm LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only . Forward Voltage Characteristics at 350mA (Ratings At 25℃ Ambient) Radiation Pattern PART NO Lambertian LGFLB-321E-60 Vf Emission Color Min. Typ. Max. Blue 3.0 3.6 4.0 Units V Note : Forward Voltage is measuBlue with an accuracy of ±0.1V . Dominant Wavelength Characteristics at 350mA (Ratings At 25℃ Ambient ) Radiation Pattern PART NO Lambertian LGFLB-321E-60 λD Emission Color Min. Typ. Max. Blue 450 ---- 462 Units nm . Tempeature Coefficient Of Forward Voltage&Thermal Resistance Junction To Board Characteristics at 350mA (Ratings At 25℃ Ambient ) Radiation Pattern PART NO Lambertian LGFLB-321E-60 VF/ T Emission Color Typ. Units -2 mV/° C Blue . Emission Angle Characteristics at 350mA (Ratings At 25℃ Ambient ) PART NO Emission Color Lambertian Units LGFLB-321E-60 Blue 60 Degrees Page 3/12 Rth,j-B Typ. Units 18 ° C/W LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Brightness Code For High Power LED Group Luminous flux(lm) Min Max F15 6.3 8.2 F16 8.2 10.7 F17 10.7 13.9 F18 13.9 18.1 Note : Flux is measuBlue with an accuracy of ±10% Dominant Wavelength For High Power LED λD (nm) Group B Min Max OI 450 453 OH 453 456 OG 456 459 OF 459 462 Page 4/12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Recommended Solder Pad Design 16.65 11.65 5.82 Page 4/9 2 Solder Mark Solder Pad Slug independent NOTE: 1. All dimensions are in mm. 2. The drawings are not to scale. 3. Solder pad can't be connected to slug. Precautions For Use: Storage : 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%,After the package is opened, LEDs should be stored at temperatures less than 30 ℃ and humidity less than 30%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the products life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃ ,RH60%, they should be treated at 60 ℃± 5 ℃for 6hrs. Page 5/12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Manual Hand Soldering 1. Thermal Conductive Glue MCPCB 2. Emitter - + LIGITEK + Place Emitter on the MCPCB. Place Thermal Comductive Glue on the MCPCB. 4. 3. Soldering Iron Solder Wire Heat Plate Heat Plate Use Soldering Iron to solder the leads of Emitter within 5 seconds. Handling Precaution: 1. For prototype builds or small series production runs it possible to place and solder the emitters by hand. 2. Solder tip temperature : 230°C max for Lead Solder and 260 °C max for Lead-Free Solder. 3. Avoiding damage to the emitter or to the MCPCB dielectric layer.Damage to the epoxy layer can cause a short circuit in the array. 4. Do not let the solder contact from solder pad to back-side of MCPCB.This one will cause a short circuit and damage emitter. 5. 6. 7. 8. Avoid leaving fingerprints or scratches (by sharp tools) on the silicone resin parts. Do not force over 2000gf impact or pressure on the silicone molding lens. The LEDs should only be picked up by making contact with the sides of the LED body. When populating in SMT production, the pick-and-place nozzle must not place excessive pressure on the silicone molding lens. Page 6/12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.1 Forward current vs. Forward Voltage Forward Current(mA) 400 300 200 100 0 2.0 2.5 3.0 3.5 4.0 4.5 Forward Voltage(V) Fig.2 Operating current vs. Ambient Temperature Forward Current(mA) 400 300 200 100 50 0 Rth(J-A)=60C/W Rth(J-A)=50C/W Rth(J-A)=40C/W Rth(J-A)=30C/W 25 50 75 100 Ambient Temperature( ° C) Page 7/12 125 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.3 Forward current vs. Luminous Flux Relative Luminous Flux( %) 1.2 1.0 0.8 0.6 0.4 0.2 0 100 200 300 400 500 IF(mA) Fig.4 Junction Temperature vs. Forward Voltage 2.0 Relative Flux(%) 1.8 1.6 Blue 1.4 1.2 1.0 0.8 0.6 0.4 0.2 -20 0 20 40 60 80 Junction Temperature( ° C) Page 8/12 100 120 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.5 Relative Luminous Flux vs. Wavelength SPECTRAL RADIANCE Relative Luminous Flux SPECTRAL RADIANCE 1.0 0.5 0.0 400 450 500 550 Wavelength (nm) Fig.6 Directivity Radiation 0° -30° 30° -60° 100% 75% 50% 60° 25% 0 Page 9/12 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PACKING SPECIFICATION 1. 50PCS / TUBE 9.6 Anode 420 4.76 8 2.2 0.56 16.6 2. 20 TUBES / INNER BOX (10*2) SIZE : L X W X H 460cm X 110cm X 60cm L 3. 10 INNER BOXES / CARTON SIZE : L X W X H 480cm X 240cm X 325cm L W C/NO: MADE IN CHINA . NO M IT E Y : Q'T ,: W : N, , W G, S PC s g k s kg Page 10/12 H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Recommended Soldering Conditions 1. PB-Free Reflow Solder D 1~5° C/sec C A 250° C MaX. 10sec.Max E Preheat 180~200 ° C 1~5°C/sec Above 220 ° C 60 sec.Max. B 120 sec.Max. Reflow Soldering should not be done more than two times. Solder Reflow Process Parameters: 1.Reflow soldering of Helixeon emitters requires effective control of heating and cooling. Both the rate of heating and cooling and the absolute temperatures reached are critical in assuring the formation of a reliable solder joint while avoiding damage to the emitter during the reflow process. The recommended temperature profile of solder reflow process is shown below in the figure. 1-1. Preheat Set the temperature rising speed A at a rate of 1~5 ℃/s. Careful about rapid temperature rise in preheat zone as it may cause excessive slumping of the solder paste.Appropriate preheat time B will be from 60 to 120 seconds. If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if performed excessively, fine balls and large balls will generate in clusters at a time.Appropriate preheat ending temperature C will be from 180 to 200℃. If the temperature is too low, non-melting tends to be caused in the area with large heat capacity after reflow. 1-2. Heating Careful about sudden rise in temperature as it may worsen the slump of solder paste. Set the peak temperature D in the range from 220 to 250 ℃.Adjust the melting time that the time over 220℃, E, will be from 30 to 60 seconds. 1-3. Cooling Careful about slow cooling as it may cause the positional shift of parts and decline in joining strength at times. Page 11/12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reliability Test Item Description Stress Condition Test Duration RTOL Room Temperature Operation Life 25°C, Max. IF 1000 hours WHT Wet High Temperature 85° C/85%RH 1000 hours TC Temperature Cycling -40/+110°C, 30min dwell,<5min trans. 200 cycles TS Thermal Shock -40/+110°C, 20min dwell,<20min trans. 200 cycles HTSL High Temperature Storage Life 120° C 1000 hours LTSL Low Temperature Storage Life -40° C 1000 hours SHR Solder Heat Resistance 260±5° C, 5secs MS Mechanical Shock 1500G,0.5msec pulse, 5 shocks each 6 axis ND Natural Drop On concrete from 1.2m, 3xtimes RV Random Vibration 6G RMS from 10 to 2KHz, 10mins/axis VVF Variable Vibration Frequency 10-2000-10Hz, 20G 1 min, 1.5mm, 3timesx/axis Note : Failure criteria: Electrical failures VF shife >= 10% IR < 50uA@Vr = 5v Ligitek output Degradation %Iv shift >= 30%@1000hrs or 200cycle Visual failures Broken or damaged pockage or lead Dimension out of tolerance Page 12/12