lg-008dgm-a02 Pdf - Ligitek Electronics Co. Ltd.

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-008DGM-A02
DATA SHEET
DOC. NO : QW0905-LG-008DGM-A02
REV.
:
A
DATE
:
01 - Jul. - 2014
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/11
PART NO. LG-008DGM-A02
Features:
1. Side view LED.
2. White SMT package.
3. Leadframe package with individual 2 pin.
4.Wide viewing angle.
5.Soldering methods:IR reflow soldering.
6.Feature of the device:more light due to higher optical efficiency;extremely
wide viewing angle;ideal for backlighting and coupling in light guide.
7.Pb free
Applications:
1. LCD back light.
2. Mobile phones.
3. Indicators.
4. Switch lights.
Device Selection Guide:
PART NO
MATERIAL
LG-008DGM-A02
InGaN
COLOR
Emitted
Lens
Green
Water Clear
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Page 2/11
PART NO. LG-008DGM-A02
Package Dimensions
2.5
1.20
0.8
0.55
2.8
0.73
1.20
0.63
0.65
Andoe
Cathode
0.43
Polarity
Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
1.4
1
0.9
Note : The tolerances unless mentioned is ±0.1mm,Angle±0.5. Unit=mm.
1.4
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Page 3/11
PART NO. LG-008DGM-A02
Absolute Maximum Ratings at Ta=25 ℃
Symbol
Ratings
UNIT
Forward Current
IF
30
mA
Peak Forward Current
Duty 1/11@10KHz
IFP
100
mA
Power Dissipation
PD
108
mW
Reverse Current @5V
Ir
50
μA
Electrostatic Discharge
ESD
500
V
Operating Temperature
Topr
- 20 ~ + 80
°C
Storage Temperature
Tstg
- 30 ~ + 100
°C
Parameter
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Symbol
Min.
Typ.
Max. UNIT
Luminous Intensity
Iv
1000
----
2000
mcd
IF=20mA
Dominant Wavelength
λD
519
----
528
nm
IF=20mA
△λ
----
36
----
nm
IF=20mA
VF
2.8
----
3.4
V
IF=20mA
2θ 1/2
----
115
----
deg
IF=20mA
Items
Spectral Line Half-Width
Forward Voltage
Viewing Angle
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2.The luminous intensity data did not including ±15% testing tolerance.
3.The dominant wavelength data did not including ±1nm testing tolerance
CONDITION
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Page 4/11
PART NO. LG-008DGM-A02
Luminous Intensity Classification
BIN CODE
Iv(mcd) at 20mA
Min.
Max.
V-2
1000
1250
W-1
1250
1600
W-2
1600
2000
Dominant Wavelength Classification
BIN CODE
1O
1P
1Q
λD(nm) at 20mA
Min.
Max.
519
522
525
522
525
528
Forward Voltage Classification
BIN CODE
Vf(v) at20mA
Min.
Max.
1
2.8
3
2
3
3.2
3
3.2
3.4
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Page 5/11
PART NO. LG-008DGM-A02
Typical Electro-Optical Characteristics Curve
DGM CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
1.0
2.0
3.0
4.0
5.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
1.0
0.5
0.0
500
550
Wavelength (nm)
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Fig.6 Directive Radiation
Fig.5 Relative Intensity vs. Wavelength
450
2.5
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
100
600
100
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Page 6/11
PART NO. LG-008DGM-A02
Carrier Type Dimensions
4.0±0.2
1.5
0.23
Cathode
1.75
3.5
8.0±0.3
5.3
Andoe
3.05
2.0
Polarity
1.35
0.95
4.0±0.2
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
‧ Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No.
Description
Quantity/Reel
LG-008DGM-A02
8.0mm tape,7"reel
3000 devices
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Page 7/11
PART NO. LG-008DGM-A02
Label Explanation
LIGITEK ELECTRONICS CO., LTD.
Pb
PART :
LG-008DGM-A02
BIN : Luminous Intensity
LOT :
GS113A0168
HUE : Dominant Wavelength
QTY(PCS):
3000
3.0 - 3.2 : Forward Voltage
BIN/HUE :
W-1/1P
VF:3.0-3.2
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.2
0.4
0.6
2.0±0.5
178±1.5
6.0±1.0
9.0±1.0
ψ13.5±1.0
12.0±1.0
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 8/11
PART NO. LG-008DGM-A02
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm
L
W
H
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Page 9/11
PART NO. LG-008DGM-A02
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 280°C 3 sec one time only.
2 PB-Free Reflow Solder
1~5°C/sec
1~5°C/sec
Preheat
180~200°C
260°C MaX. 10sec.Max
6°C/sec
Above 220°C
60 sec.Max.
120 sec.Max.
Note:
1.Reflow soldering should not be done more than two times.
2.When soldering,do not put stress on the LEDs during heating.
3.After soldering,do not warp the circuit board.
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Page 10/11
PART NO. LG-008DGM-A02
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%,
they should be treated at 60 ℃±5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forward
current should not be allowed to change by more than 40% of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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Page 11/11
PART NO. LG-008DGM-A02
Reliability Test:
(1)Test items and results
Test Item
Classification
Test Condition
Sample
Size
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs
22
High Temperature
Storage Test
1.Ta=105 ℃± 5℃
2.t= 500 hrs
22
Low Temperature
Storage Test
1.Ta=-40°C±5°C
2.t=1000 hrs
22
High Temperature
High Humidity
Storage Test
1.IR-Reflow In-Board, 2 Times
2.Ta= 85°C±5°C
3.RH=90 %~95 %
4.t= 500hrs±2hrs
22
1.IR-Reflow In-Board,2 times
2.Ta=105 ℃ ±5℃ &
-40 ℃± 5℃
( 30min) (30min)
3.total 100 cycles
22
1.T.Sol=260 ℃±5℃
2.Dwell Time= 10 Max.
22
1.105 ℃ ~ 25℃ ~ - 40℃
30mins 15mins 30mins
2.10 0 Cyeles
22
Endurance
Test
Thermal Shock Test
Environmental
Test
Reflow Soldering Test
Temperature
Cycling
(2)Criteria for judging the damage
Item
Symbol Test Conditions
Criteria for Judgement
Min.
Max.
Forward Voltage
Vf
If=20mA
-
U.S.L x1.2
Reverse Current
Ir
Vr=5V
-
U.S.L x2.0
Luminous Intensity
Iv
If=20mA
L.S.L x 0.5
-
Note:
1.U.S.L.:Upper Standard Level.
2.L.S.L.:Lower Standard Level.