MPTS Series Polymeric PTC (Low Rho) MERITEK FEATURE AND APPLICATIONS ROHS Compliant & Halogen Free Excellent for high density applications Surface Mount, 0603, 0805, 1206, 1210, 1812 Faster time to trip than standard SMD devices Lower resistance than standard SMD devices Operation Current: 0.75A ~ 3.70A Maximum Voltage: 6V Temperature Range: -40ºC to 85ºC TYPICAL APPLICATIONS Battery Pack for Tablet PC & Smart Phone Battery Pack for Toy Battery Pack for GPS Battery Cell Power Bank PCM (Protection Circuit Module) USB port of smart phone and tablet PC Note: Due to its material property, Low Rho series are ONLY suitable for Short lifecycle product, such as Powerbank, Rechargeable battery, Smart Phone, Tablet PC. It is not suitable for Medium-Long lifecycle products, such as Automotive, Equipment, Medical, Aerospace, Military, PART NUMBERING SYSTEM MPTS 0805 L 10 R Z Meritek Series Size 0603 0805 1206 1210 1812 Current rating Semi-circular Termination Lo Rho Series ELECTRICAL CHARACTERISTICS (23ºC) MPTS0603 Part Number MPTS0603L025RZ MPTS0603L035RZ MPTS0603L050RZ MPTS0603L075RZ MPTS0603L100RZ Hold Trip Current Current Rated Voltage Max Current Typical Max Time to Trip Power Current Time Resistance RMIN R1MAX IH, A IT, A VMAX, VDC IMAX, A Pd, W A Sec Ohms Ohms 0.25 0.35 0.50 0.75 1.00 0.55 0.75 1.00 1.50 1.80 9 6 6 6 6 100 100 100 100 100 0.5 0.5 0.6 0.6 0.6 8.0 8.0 8.0 8.0 8.0 0.08 0.10 0.10 0.20 0.30 0.500 0.200 0.070 0.050 0.040 3.000 1.000 0.350 0.250 0.120 E223037 R50223766 ● ● ● ● IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour post trip. Termination pad characteristics Termination pad materials: Pure Tin Rev. 7d MPTS Series Polymeric PTC (Low Rho) MERITEK PRODUCT DIMENSIONS (MILLIMETERS) MPTS0603 Part Number MPTS0603L025RZ MPTS0603L035RZ MPTS0603L050RZ MPTS0603L075RZ MPTS0603L100RZ A Min 1.40 1.40 1.40 1.40 1.40 B Max 1.80 1.80 1.80 1.80 1.80 Min 0.45 0.45 0.45 0.45 0.45 C Max 1.00 1.00 1.00 1.00 1.00 Min 0.35 0.35 0.35 0.35 0.35 D Max 0.75 0.75 0.75 0.75 0.75 Min 0.10 0.10 0.10 0.10 0.10 E Max 0.50 0.50 0.50 0.50 0.50 Min 0.08 0.08 0.08 0.08 0.08 Max 0.40 0.40 0.40 0.40 0.40 THERMAL DERATING CURVE Rev. 7d MPTS Series Polymeric PTC (Low Rho) MERITEK TYPICAL TIME-TO-TRIP AT 23ºC A = MPTS0603L025RZ B = MPTS0603L035RZ C = MPTS0603L050RZ D = MPTS0603L075RZ E = MPTS0603L100RZ The dimension in the table below provides the recommended pad layout for each MPTS0603 device. Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Time maintained above: Temperature(TL) Time (tL) Peak/Classification Temperature(Tp) : Time within 5°C of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 °C to Peak Temperature : Pad dimensions (millimeters) A Device Nominal B Nominal C Nominal All 0603 Series 0.60 0.80 Pb-Free Assembly 3 °C/second max. 150 °C 200 °C 60-180 seconds 217 °C 60-150 seconds 260 °C 20-40 seconds 6 °C/second max. 8 minutes max. 0.80 Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage to other components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. These changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev. 7d Polymeric PTC MPTS Series (Low Rho) MERITEK Rev. 7d MPTS Series Polymeric PTC (Low Rho) MERITEK ELECTRICAL CHARACTERISTICS (23ºC) MPTS0805 Part Number MPTS0805L075RZ MPTS0805L110RZ MPTS0805L125RZ MPTS0805L150RZ MPTS0805L175RZ MPTS0805L200RZ Hold Trip Rated Current Current Voltage Max Current Typical Power Max Time to Trip Resistance Current Time RMIN R1MAX IH, A IT, A VMAX, VDC IMAX, A Pd, W A Sec Ohms Ohms 0.75 1.10 1.25 1.50 1.75 2.00 1.50 1.80 2.50 3.00 3.50 4.00 6 6 6 6 6 6 100 100 100 100 100 100 0.6 0.6 0.6 0.6 0.6 0.6 8.0 8.0 8.0 8.0 8.0 8.0 0.20 0.30 0.30 0.30 0.60 1.00 0.040 0.030 0.025 0.015 0.005 0.005 0.160 0.130 0.110 0.065 0.055 0.045 E223037 R50223766 ● ● ● ● ● ● IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour post trip. Termination pad characteristics Termination pad materials: Pure Tin PRODUCT DIMENSIONS (MILLIMETERS) MPTS0805 Part Number MPTS0805L075RZ MPTS0805L110RZ MPTS0805L125RZ MPTS0805L150RZ MPTS0805L175RZ MPTS0805L200RZ A Min 2.00 2.00 2.00 2.00 2.00 2.00 B Max 2.20 2.20 2.20 2.20 2.20 2.20 Min 1.20 1.20 1.20 1.20 1.20 1.20 C Max 1.50 1.50 1.50 1.50 1.50 1.50 Min 0.40 0.40 0.40 0.40 0.40 0.40 D Max 0.75 0.75 0.75 0.75 0.75 0.75 Min 0.20 0.20 0.20 0.20 0.20 0.20 E Max 0.60 0.60 0.60 0.60 0.60 0.60 Min 0.10 0.10 0.10 0.10 0.10 0.10 Max 0.45 0.45 0.45 0.45 0.45 0.45 Rev. 7d Polymeric PTC MPTS Series (Low Rho) MERITEK THERMAL DERATING CURVE TYPICAL TIME-TO-TRIP AT 23ºC A = MPTS0805L075RZ B = MPTS0805L110RZ C = MPTS0805L125RZ D = MPTS0805L150RZ E = MPTS0805L175RZ F = MPTS0805L200RZ Rev. 7d MPTS Series Polymeric PTC (Low Rho) MERITEK The dimension in the table below provides the recommended pad layout for each MPTS0805 device. Pad dimensions (millimeters) Device A Nominal B Nominal C Nominal All 0805 Series 1.20 1.00 1.50 Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Time maintained above: Temperature(TL) Time (tL) Peak/Classification Temperature(Tp) : Time within 5°C of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 °C to Peak Temperature : Pb-Free Assembly 3 °C/second max. 150 °C 200 °C 60-180 seconds 217 °C 60-150 seconds 260 °C 20-40 seconds 6 °C/second max. 8 minutes max. Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage to other components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. These changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev. 7d MPTS Series Polymeric PTC (Low Rho) MERITEK ELECTRICAL CHARACTERISTICS (23º) MPTS1206 Part Number MPTS1206L050RZ MPTS1206L075RZ MPTS1206L110RZ MPTS1206L150RZ MPTS1206L175RZ MPTS1206L200RZ MPTS1206L260RZ MPTS1206L300RZ MPTS1206L350RZ MPTS1206L380RZ MPTS1206L450RZ MPTS1206L500RZ Hold Trip Rated Max Current Current Voltage Current VMAX, IH, A IT, A IMAX, A VDC 0.50 1.50 6 100 0.75 1.80 6 100 1.10 2.20 6 100 1.50 3.00 6 100 1.75 3.50 6 100 2.00 4.00 6 100 2.60 5.20 6 100 3.00 6.00 6 100 3.50 7.00 6 100 3.80 8.00 6 100 4.50 9.00 6 100 5.00 10.00 6 100 Typical Power Max Time to Trip Current Time Resistance RMIN R1MAX Pd, W A Sec Ohms Ohms 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 22.5 25.0 0.20 0.30 0.30 0.30 0.40 0.50 4.00 4.00 5.00 5.00 2.00 5.00 0.025 0.018 0.015 0.010 0.005 0.005 0.003 0.003 0.003 0.002 0.001 0.002 0.200 0.180 0.100 0.065 0.030 0.025 0.026 0.020 0.018 0.014 0.014 0.010 E223037 ● ● ● ● R50223766 ● ● ● ● ● ● IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour post trip. Termination pad characteristics Termination pad materials: Pure Tin PRODUCT DIMENSIONS (MILLIMETERS) MPTS1206 Part Number MPTS1206L050RZ MPTS1206L075RZ MPTS1206L110RZ MPTS1206L150RZ MPTS1206L175RZ MPTS1206L200RZ MPTS1206L260RZ MPTS1206L300RZ MPTS1206L350RZ MPTS1206L380RZ MPTS1206L450RZ MPTS1206L500RZ A Min 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 B Max 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 3.50 Min 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 C Max 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 Min 0.40 0.40 0.40 0.40 0.40 0.40 0.60 0.60 0.60 0.60 0.60 0.80 D Max 0.75 0.75 0.75 0.75 0.75 0.75 1.00 1.00 1.00 1.00 1.00 1.40 Min 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 E Max 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 Min 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Max 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 Rev. 7d Polymeric PTC MPTS Series (Low Rho) MERITEK THERMAL DERATING CURVE TYPICAL TIME-TO-TRIP AT 23º A= MPTS1206L050RZ B= MPTS1206L075RZ C= MPTS1206L110RZ D= MPTS1206L150RZ E= MPTS1206L175RZ F= MPTS1206L200RZ G= MPTS1206L260RZ H= MPTS1206L300RZ I = MPTS1206L350RZ J= MPTS1206L380RZ K= MPTS1206L450RZ L= MPTS1206L500RZ Rev. 7d MPTS Series Polymeric PTC (Low Rho) MERITEK The dimension in the table below provides the recommended pad layout for each MPTS1206 device Pad dimensions (millimeters) Device A Nominal B Nominal C Nominal All 1206 Series 2.00 1.00 1.90 Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Time maintained above: Temperature(TL) Time (tL) Peak/Classification Temperature(Tp) : Time within 5°C of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 °C to Peak Temperature : Pb-Free Assembly 3 °C/second max. 150 °C 200 °C 60-180 seconds 217 °C 60-150 seconds 260 °C 20-40 seconds 6 °C/second max. 8 minutes max. Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage together components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. These changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev. 7d MPTS Series Polymeric PTC (Low Rho) MERITEK ELECTRICAL CHARACTERISTICS (23º) MPTS1210 Part Number Hold Trip Current Current MPTS1210L175RZ MPTS1210L200RZ MPTS1210L260RZ MPTS1210L300RZ MPTS1210L350RZ MPTS1210L380RZ MPTS1210L400RZ MPTS1210L450RZ MPTS1210L650RZ IH, A IT, A 1.75 2.00 2.60 3.00 3.50 3.80 4.00 4.50 6.50 3.50 4.90 5.00 6.00 7.00 8.00 8.00 9.00 13.00 Rated Max Typical Voltage Current Power VMAX, IMAX, A Pd, W VDC 6 100 1.0 6 100 1.0 6 100 0.8 6 100 0.8 6 100 1.0 6 100 1.0 6 100 1.0 6 100 1.0 6 100 1.2 Max Time to Trip Current Time Resistance RMIN R1MAX A Sec Ohms Ohms 8.0 8.0 8.0 15.00 17.50 8.0 8.00 22.50 32.50 2.50 3.00 4.00 2.00 2.00 5.00 5.00 2.00 2.00 0.006 0.005 0.003 0.003 0.003 0.002 0.002 0.001 0.001 0.040 0.024 0.020 0.020 0.018 0.016 0.016 0.014 0.009 E223037 50223766 ● ● ● ● ● ● ● IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour post trip. Termination pad characteristics Termination pad materials: Pure Tin PRODUCT DIMENSIONS (MILLIMETERS) MPTS1210 Part Number MPTS1210L175RZ MPTS1210L200RZ MPTS1210L260RZ MPTS1210L300RZ MPTS1210L350RZ MPTS1210L380RZ MPTS1210L400RZ MPTS1210L450RZ MPTS1210L650RZ A Min 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 B Max 3.43 3.43 3.43 3.43 3.43 3.43 3.43 3.43 3.43 Min 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.35 C Max 2.80 2.80 2.80 2.80 2.80 2.80 2.80 2.80 2.80 Min 0.40 0.40 0.40 0.40 0.40 0.40 0.60 0.60 0.60 D Max 0.75 0.75 0.75 1.00 1.00 1.00 1.00 1.00 1.40 Min 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 E Max 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 Min 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Max 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 Rev. 7d Polymeric PTC MPTS Series (Low Rho) MERITEK THERMAL DERATING CURVE TYPICAL TIME-TO-TRIP AT 23ºC A = MPTS1210L175RZ B = MPTS1210L200RZ C = MPTS1210L260RZ D = MPTS1210L300RZ E = MPTS1210L350RZ F = MPTS1210L380RZ G = MPTS1210L400RZ H = MPTS1210L450RZ I = MPTS1210L650RZ Rev. 7d MPTS Series Polymeric PTC (Low Rho) MERITEK The dimension in the table below provides the recommended pad layout for each MPTS1210 device Pad dimensions (millimeters) Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Time maintained above: Temperature(TL) Time (tL) Peak/Classification Temperature(Tp) : Time within 5°C of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 °C to Peak Temperature : Device A Nominal B Nominal C Nominal All 1210 Series 2.00 1.00 2.80 Pb-Free Assembly 3 °C/second max. 150 °C 200 °C 60-180 seconds 217 °C 60-150 seconds 260 °C 20-40 seconds 6 °C/second max. 8 minutes max. Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage to other components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. These changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev. 7d MPTS Series Polymeric PTC (Low Rho) MERITEK ELECTRICAL CHARACTERISTICS (23º) MPTS1812 Part Number MPTS1812L140RZ MPTS1812L190RZ MPTS1812L270RZ MPTS1812L300RZ MPTS1812L370RZ MPTS1812L500RZ MPTS1812L600RZ Hold Current Trip Current Rated Voltage Max Current Typical Power IH, A 1.40 1.90 2.70 3.00 3.70 5.00 6.00 IT, A 3.60 4.90 6.20 7.00 9.10 10.00 12.00 VMAX, VDC 6 6 6 6 6 6 6 IMAX, A 100 100 100 100 100 100 100 Pd, W 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Max Time to Trip Current A 8.0 8.0 13.5 15.0 18.5 25.0 30.0 Time Sec 3.00 5.00 3.00 2.00 2.00 2.00 3.00 Resistance RMIN Ohms 0.010 0.003 0.003 0.003 0.003 0.0015 0.0010 R1MAX E223037 50223766 Ohms 0.035 ● ● 0.025 0.023 ● ● 0.022 ● ● 0.018 ● ● 0.0140 0.0100 IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour post trip. Termination pad characteristics Termination pad materials: Pure Tin PRODUCT DIMENSIONS (MILLIMETERS) MPTS1812 Part Number MPTS1812L140RZ MPTS1812L190RZ MPTS1812L270RZ MPTS1812L300RZ MPTS1812L370RZ MPTS1812L500RZ MPTS1812L600RZ A Min 4.37 4.37 4.37 4.37 4.37 4.37 4.37 B Max 4.73 4.73 4.73 4.73 4.73 4.73 4.73 Min 3.07 3.07 3.07 3.07 3.07 3.07 3.07 C Max 3.41 3.41 3.41 3.41 3.41 3.41 3.41 Min 0.30 0.30 0.40 0.40 0.40 0.40 0.60 D Max 0.70 0.70 0.75 0.75 0.75 0.75 1.00 Min 0.25 0.25 0.25 0.25 0.25 0.25 0.25 E Max 0.95 0.95 0.95 0.95 0.95 0.95 0.95 Min 0.25 0.25 0.25 0.25 0.25 0.25 0.25 Max 0.65 0.65 0.65 0.65 0.65 0.65 0.65 Rev. 7d Polymeric PTC MPTS Series (Low Rho) MERITEK THERMAL DERATING CURVE TYPICAL TIME-TO-TRIP AT 23ºC A = MPTS1812L140RZ B = MPTS1812L190RZ C = MPTS1812L270RZ D = MPTS1812L300RZ E = MPTS1812L370RZ F = MPTS1812L500RZ G = MPTS1812L600RZ Rev. 7d MPTS Series Polymeric PTC (Low Rho) MERITEK The dimension in the table below provides the recommended pad layout for each MPTS1812 device Pad dimensions (millimeters) Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Time maintained above: Temperature(TL) Time (tL) Peak/Classification Temperature(Tp) : Time within 5°C of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 °C to Peak Temperature : Device A Nominal B Nominal C Nominal All 1812 Series 3.45 1.78 3.50 Pb-Free Assembly 3 °C/second max. 150 °C 200 °C 60-180 seconds 217 °C 60-150 seconds 260 °C 20-40 seconds 6 °C/second max. 8 minutes max. Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage to other components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. These changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev. 7d