Data Sheet

HT6026
Remote Control Encoder
Features
· Operating voltage: 4V~18V
· Two transmission words minimum
· Low standby current
· Built-in oscillator needs only 5% resistor
· Low power and high noise immunity CMOS
· Interface with RF or infrared transmission medium
technology
· Minimal external components
· 39 difference codes
· 16-pin DIP/NSOP package
Applications
· Burglar alarm system
· Security system
· Smoke and fire alarm system
· Cordless telephones
· Garage door controllers
· Other remote control systems
· Car alarm system
General Description
The HT6026 is a CMOS LSI encoder designed for use in
remote control system. It is capable of encoding 9 bits of
information which consists of N address bits and 9–N
data bits. Each address/data input is externally trinary
programmable by external switches. The programma-
ble address/data is transmitted along with the header
bits via an RF or an infrared transmission medium upon
receipt of a trigger signal (TE).
Pin Assignment
Block Diagram
A D 0
1
1 6
V D D
A D 1
2
1 5
D O U T
A D 2
3
1 4
T E
A D 3
4
1 3
O S C 3
A D 4
5
1 2
O S C 2
A D 5
6
1 1
O S C 1
A D 6
7
1 0
A D 8
V S S
8
9
A D 7
The HT6026 is pin compatible with the MC145026.
O S C 2
O S C 1
O s c illa to r
¸ 4 D iv id e r
9
¸ 9 C o u n te r
& 1 o f 9
D e c o d e r
T r a n s m is s io n
G a te C ir c u it
T E
H T 6 0 2 6
1 6 D IP -A /N S O P -A
A D 0
Rev. 1.10
O S C 3
1
A D 8
D a ta S e le c t
& B u ffe r
D O U T
S y n c .
C ir c u it
T r in a r y
D e te c to r
V D D
V S S
February 20, 2009
HT6026
Pad Coordinates
Pad Assignment
A D 0
V D D
D O U T
T E
1
A D 1
Pad
No.
1 6
1 5
1 4
1 3
1
2
A D 2
A D 3
3
A D 4
4
A D 5
5
1 2
(0 ,0 )
A D 6
6
7
8
9
O S C 3
1 1
O S C 2
1 0
O S C 1
A D 8
A D 7
V S S
Chip size: 1650 ´ 1680 (mm)
Unit: mm
X
Y
Pad
No.
X
Y
-598.00
689.00
9
160.00
-687.00
2
-674.00
433.00
10
670.00
-687.00
3
-674.00
126.00
11
670.00
-347.00
4
-674.00 -162.00
12
670.00
172.00
5
-674.00 -449.00
13
670.50
689.50
6
-598.00 -687.00
14
270.00
689.00
7
-342.00 -687.00
15
-84.00
689.00
8
-127.00 -687.00
16
-299.00
689.00
2
* The IC substrate should be connected to VSS in the PCB layout artwork.
Pin Description
Pin No.
Pin Name
I/O
Internal
Connection
Description
I
Transmission
Gate
Input pins for address/data AD0~AD6 setting They can be externally
set to VDD, VSS or left open
¾
¾
1~7
AD0~AD6
8
VSS
9~10
AD7~AD8
I
Transmission
Gate
11
12
13
OSC1
OSC2
OSC3
I
O
O
Oscillator
Oscillator input pin
14
TE
I
CMOS IN
Pull-High
Transmission enable, active low
15
DOUT
O
CMOS OUT
16
VDD
¾
¾
Negative power supply, ground
Input pins for address/data AD7~AD8 setting They can be externally
set to VDD, VSS or left open
Encoder data serial transmission output
Positive power supply
Approximate Internal Connection Circuits
T R A N S M IS S IO N
G A T E
C M O S IN
P u ll- H ig h
V
Rev. 1.10
C M O S O U T
D D
O S C IL L A T O R
E N
O S C 1
2
O S C 2
O S C 3
February 20, 2009
HT6026
Absolute Maximum Ratings
Supply Voltage ...........................VSS-0.3V to VSS+24V
Storage Temperature ...........................-50°C to 125°C
Input Voltage .............................VSS-0.3V to VDD+0.3V
Operating Temperature ..........................-20°C to 75°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
Electrical Characteristics
Symbol
Ta=25°C
Test Conditions
Parameter
VDD
Operating Voltage
ISTB
Standby Current
VDD
Conditions
¾
¾
5V
Oscillator stops
Max.
Unit
4
¾
18
V
¾
0.1
0.3
mA
¾
0.1
0.5
mA
5V
¾
500
900
mA
15V
No load, fOSC=22kHz
¾
2000
3000
mA
-1.0
-1.7
¾
mA
-8.0
-14.0
¾
mA
0.8
1.5
¾
mA
5.0
10.0
¾
mA
Operating Current
5V
VOH=0.9 VDD (Source)
15V
IDOUT
Typ.
No load, fOSC=18kHz
15V
IDD
Min.
Output Drive Current
5V
VOL=0.1 VDD (Sink)
15V
VIH
²H² Input Voltage
¾
¾
0.7VDD
¾
VDD
V
VIL
²L² Input Voltage
¾
¾
0
¾
0.3VDD
V
¾
kW
TE Pull-High Resistance
¾
800
RTE
¾
250
¾
kW
¾
18
¾
kHz
¾
22
¾
kHz
5V
VTE=0V
15V
5V
fOSC
Oscillator Frequency
15V
REXT=10kW,
CEXT=2000PF
RS=20kW
Functional Description
Operation
The HT6026 encoder begins a one-word transmission cycle upon receipt of a transmission enable (TE, active low).
This cycle will repeat itself as long as the transmission enable (TE ) is held low. Once the transmission enable returns
high, the encoder output completes its final N´2 word cycle, and then stops as shown in Figure 1. The total number of
transmission cycles allowed is always adjusted to an even number automatically.
T E
6 5 n s < t < 1 w o rd
t > 1 w o rd
D O U T
2
w o rd s
T r a n s m itte d
C o n tin u o u s ly
N
1 o r 2 w o rd s
´ 2 w o rd s
(N = 1 ,2 ,3 ,....)
Figure 1. Transmission timing
Rev. 1.10
3
February 20, 2009
HT6026
Information Word
An information word consists of 2 periods as shown:
P ilo t p e r io d
( 1 8 c lo c k s )
A D 0 ~ A D 8 c o d e s
p e r io d ( 7 2 c lo c k s )
P ilo t p e r io d
( 2 4 c lo c k s )
A D 0 ~ A D 8 c o d e s p e r io d
( 7 2 c lo c k s )
T h e 1 s t w o rd
T h e 2 n d w o rd
Figure 2. Composition of information
Address/data Waveform
Each programmable address/data pin can be externally set to one of the following three logic states:
fO
S C
"O n e "
"Z e ro "
"O p e n "
A d d r e s s /D a ta B it
Figure 3. Address/Data bit waveform
Address/Data Programming (Preset)
The address pins are usually pre-set to transmit data
codes with their own particular security codes by the DIP
switches or PCB wiring, while the data is selected by the
push button or electronic switches.
The status of each address/data pin can be individually
pre-set to logic ²high², ²low² or ²floating². If a transmission enable signal is applied, the encoder scans and
transmits the status of 9-bit address/data serially in the
order AD0 to AD8. But if the trigger signal is not applied,
the chip only consumes a standby current which is less
than 1mA (for VDD=5V).
The following figure demonstrates an application using
the HT6026:
R
R
S
C
O S C 1
E X T
E X T
O S C 2
O S C 3
D O U T
V D D
V
A D 0
A D 1
A D 2
A D 3
A D 4
A D 5
A D 6
A D 7
A D 8
T E
T r a n s m is s io n
M e d iu m
V S S
D D
V
S S
The transmitted information is as listed:
Pilot
&
Sync.
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD8
1
Z
1
Z
Z
Z
0
1
Z
Z: floating
Rev. 1.10
4
February 20, 2009
HT6026
Transmission Enable
Transmission is enabled by applying a low signal to the TE pin. The HT6026 is enabled and outputs address/data
codes from DOUT pin when the TE is set to ²low² and more than 65ns.
Flowchart
P o w e r o n
S ta n d b y m o d e
N o
T r a n s m is s io n
s till e n a b le ?
N o
T E = 0 ?
Y e s
C o d e w o rd
tr a n s m itte d
c o n tin u o u s ly
Y e s
C o d e w o rd
tr a n s m itte d
c o n tin u o u s ly
Oscillator Frequency vs Supply Voltage
fO S C
(S c a le )
3 .5 0
R
E X T
= 1 0 k W , R
S
= 2 0 k W , C
E X T
= 1 0 0 p F
E X T
= 1 0 k W , R
S
= 2 0 k W , C
E X T
= 2 5 0 p F
R
E X T
= 1 0 k W , R
S
= 2 0 k W , C
E X T
= 5 0 0 p F
R
E X T
= 1 0 k W , R
S
= 2 0 k W , C
E X T
= 1 0 0 0 p F
R
E X T
= 1 0 k W , R
S
= 2 0 k W , C
E X T
= 2 0 0 0 p F
E X T
E X T
E X T
= 1 0 k W , R
= 5 1 k W , R
= 5 1 k W , R
S
= 2 0 k W , C E
= 1 0 0 k W , C
= 1 0 0 k W , C
3 .2 5
3 .0 0
2 .7 5
2 .5 0
2 .2 5
(2 0 0 k H z ) 2 .0 0
R
1 .7 5
1 .5 0
1 .2 5
1 .0 0
0 .7 5
0 .5 0
0 .2 5
0 .1 0
0 .0 5
0 .0 2
R
R
2
Rev. 1.10
R
4
6
8
1 0
1 2
1 4
1 6
5
1 8
2 0
2 2
2 4
V
D D
S
S
X T =
E X T
E X T
5 0 0 0 p F
= 2 0 0 0 p F
= 5 0 0 0 p F
(V D C )
February 20, 2009
HT6026
Application Circuit
T r a n s m itte r C ir c u it
A D 0
V D D
1 6
2
A D 1
D O U T
1 5
3
A D 2
T E
1 4
A D 3
O S C 3
A D 4
O S C 2
A D 5
O S C 1
A D 6
A D 8
V S S
A D 7
4
1
5
6
7
8
V
D D
1 0 0 m F /2 5 V
1 3
R E X T
1 2
C E X T
1 1
R S
fO
S C
=
2 .3 R
E X T
(C
fo r 1 k H z < fO
E X T
S C
1
+ C
9
+ 1 2 p F )
(H z )
< 4 0 0 k H z
w h e re R S @ 2 R E X T
R S > 2 0 k W
R E X T > 1 0 k W
4 0 0 p F < C E X
1 0
L A Y O U T
T
< 1 5 m F
H T 6 0 2 6
Rev. 1.10
6
February 20, 2009
HT6026
Package Information
16-pin DIP (300mil) Outline Dimensions
A
B
A
1 6
9
1
8
B
1 6
9
1
8
H
H
C
C
D
D
G
E
G
E
I
F
I
F
Fig1. Full Lead Packages
Fig2. 1/2 Lead Packages
· MS-001d (see fig1)
Symbol
A
Dimensions in mil
Min.
Nom.
Max.
780
¾
880
B
240
¾
280
C
115
¾
195
D
115
¾
150
E
14
¾
22
F
45
¾
70
G
¾
100
¾
H
300
¾
325
I
¾
¾
430
· MS-001d (see fig2)
Symbol
Rev. 1.10
Dimensions in mil
Min.
Nom.
Max.
A
735
¾
775
B
240
¾
280
C
115
¾
195
D
115
¾
150
E
14
¾
22
F
45
¾
70
G
¾
100
¾
H
300
¾
325
I
¾
¾
430
7
February 20, 2009
HT6026
· MO-095a (see fig2)
Symbol
A
Rev. 1.10
Dimensions in mil
Min.
Nom.
Max.
745
¾
785
B
275
¾
295
C
120
¾
150
D
110
¾
150
E
14
¾
22
F
45
¾
60
G
¾
100
¾
H
300
¾
325
I
¾
¾
430
8
February 20, 2009
HT6026
16-pin NSOP (150mil) Outline Dimensions
1 6
A
9
B
8
1
C
C '
G
H
D
E
a
F
· MS-012
Symbol
Rev. 1.10
Dimensions in mil
Min.
Nom.
Max.
A
228
¾
244
B
150
¾
157
C
12
¾
20
C¢
386
¾
394
D
¾
¾
69
E
¾
50
¾
F
4
¾
10
G
16
¾
50
H
7
¾
10
a
0°
¾
8°
9
February 20, 2009
HT6026
Product Tape and Reel Specifications
Reel Dimensions
D
T 2
A
C
B
T 1
SOP 16N (150mil)
Symbol
Description
A
Reel Outer Diameter
B
Reel Inner Diameter
C
Spindle Hole Diameter
D
Key Slit Width
T1
Space Between Flange
T2
Reel Thickness
Rev. 1.10
Dimensions in mm
330.0±1.0
100.0±1.5
13.0
+0.5/-0.2
2.0±0.5
16.8
+0.3/-0.2
22.2±0.2
10
February 20, 2009
HT6026
Carrier Tape Dimensions
P 0
D
P 1
t
E
F
W
C
D 1
B 0
P
K 0
A 0
R e e l H o le
IC
p a c k a g e p in 1 a n d th e r e e l h o le s
a r e lo c a te d o n th e s a m e s id e .
SOP 16N (150mil)
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
16.0±0.3
P
Cavity Pitch
8.0±0.1
E
Perforation Position
1.75±0.1
F
Cavity to Perforation (Width Direction)
7.5±0.1
D
Perforation Diameter
1.55
+0.1/-0.0
1.50
+0.25/-0.0
D1
Cavity Hole Diameter
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
6.5±0.1
B0
Cavity Width
10.3±0.1
K0
Cavity Depth
2.1±0.1
t
Carrier Tape Thickness
0.30±0.05
C
Cover Tape Width
13.3±0.1
Rev. 1.10
11
February 20, 2009
HT6026
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Copyright Ó 2009 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.
Rev. 1.10
12
February 20, 2009