HT6026 Remote Control Encoder Features · Operating voltage: 4V~18V · Two transmission words minimum · Low standby current · Built-in oscillator needs only 5% resistor · Low power and high noise immunity CMOS · Interface with RF or infrared transmission medium technology · Minimal external components · 39 difference codes · 16-pin DIP/NSOP package Applications · Burglar alarm system · Security system · Smoke and fire alarm system · Cordless telephones · Garage door controllers · Other remote control systems · Car alarm system General Description The HT6026 is a CMOS LSI encoder designed for use in remote control system. It is capable of encoding 9 bits of information which consists of N address bits and 9–N data bits. Each address/data input is externally trinary programmable by external switches. The programma- ble address/data is transmitted along with the header bits via an RF or an infrared transmission medium upon receipt of a trigger signal (TE). Pin Assignment Block Diagram A D 0 1 1 6 V D D A D 1 2 1 5 D O U T A D 2 3 1 4 T E A D 3 4 1 3 O S C 3 A D 4 5 1 2 O S C 2 A D 5 6 1 1 O S C 1 A D 6 7 1 0 A D 8 V S S 8 9 A D 7 The HT6026 is pin compatible with the MC145026. O S C 2 O S C 1 O s c illa to r ¸ 4 D iv id e r 9 ¸ 9 C o u n te r & 1 o f 9 D e c o d e r T r a n s m is s io n G a te C ir c u it T E H T 6 0 2 6 1 6 D IP -A /N S O P -A A D 0 Rev. 1.10 O S C 3 1 A D 8 D a ta S e le c t & B u ffe r D O U T S y n c . C ir c u it T r in a r y D e te c to r V D D V S S February 20, 2009 HT6026 Pad Coordinates Pad Assignment A D 0 V D D D O U T T E 1 A D 1 Pad No. 1 6 1 5 1 4 1 3 1 2 A D 2 A D 3 3 A D 4 4 A D 5 5 1 2 (0 ,0 ) A D 6 6 7 8 9 O S C 3 1 1 O S C 2 1 0 O S C 1 A D 8 A D 7 V S S Chip size: 1650 ´ 1680 (mm) Unit: mm X Y Pad No. X Y -598.00 689.00 9 160.00 -687.00 2 -674.00 433.00 10 670.00 -687.00 3 -674.00 126.00 11 670.00 -347.00 4 -674.00 -162.00 12 670.00 172.00 5 -674.00 -449.00 13 670.50 689.50 6 -598.00 -687.00 14 270.00 689.00 7 -342.00 -687.00 15 -84.00 689.00 8 -127.00 -687.00 16 -299.00 689.00 2 * The IC substrate should be connected to VSS in the PCB layout artwork. Pin Description Pin No. Pin Name I/O Internal Connection Description I Transmission Gate Input pins for address/data AD0~AD6 setting They can be externally set to VDD, VSS or left open ¾ ¾ 1~7 AD0~AD6 8 VSS 9~10 AD7~AD8 I Transmission Gate 11 12 13 OSC1 OSC2 OSC3 I O O Oscillator Oscillator input pin 14 TE I CMOS IN Pull-High Transmission enable, active low 15 DOUT O CMOS OUT 16 VDD ¾ ¾ Negative power supply, ground Input pins for address/data AD7~AD8 setting They can be externally set to VDD, VSS or left open Encoder data serial transmission output Positive power supply Approximate Internal Connection Circuits T R A N S M IS S IO N G A T E C M O S IN P u ll- H ig h V Rev. 1.10 C M O S O U T D D O S C IL L A T O R E N O S C 1 2 O S C 2 O S C 3 February 20, 2009 HT6026 Absolute Maximum Ratings Supply Voltage ...........................VSS-0.3V to VSS+24V Storage Temperature ...........................-50°C to 125°C Input Voltage .............................VSS-0.3V to VDD+0.3V Operating Temperature ..........................-20°C to 75°C Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Electrical Characteristics Symbol Ta=25°C Test Conditions Parameter VDD Operating Voltage ISTB Standby Current VDD Conditions ¾ ¾ 5V Oscillator stops Max. Unit 4 ¾ 18 V ¾ 0.1 0.3 mA ¾ 0.1 0.5 mA 5V ¾ 500 900 mA 15V No load, fOSC=22kHz ¾ 2000 3000 mA -1.0 -1.7 ¾ mA -8.0 -14.0 ¾ mA 0.8 1.5 ¾ mA 5.0 10.0 ¾ mA Operating Current 5V VOH=0.9 VDD (Source) 15V IDOUT Typ. No load, fOSC=18kHz 15V IDD Min. Output Drive Current 5V VOL=0.1 VDD (Sink) 15V VIH ²H² Input Voltage ¾ ¾ 0.7VDD ¾ VDD V VIL ²L² Input Voltage ¾ ¾ 0 ¾ 0.3VDD V ¾ kW TE Pull-High Resistance ¾ 800 RTE ¾ 250 ¾ kW ¾ 18 ¾ kHz ¾ 22 ¾ kHz 5V VTE=0V 15V 5V fOSC Oscillator Frequency 15V REXT=10kW, CEXT=2000PF RS=20kW Functional Description Operation The HT6026 encoder begins a one-word transmission cycle upon receipt of a transmission enable (TE, active low). This cycle will repeat itself as long as the transmission enable (TE ) is held low. Once the transmission enable returns high, the encoder output completes its final N´2 word cycle, and then stops as shown in Figure 1. The total number of transmission cycles allowed is always adjusted to an even number automatically. T E 6 5 n s < t < 1 w o rd t > 1 w o rd D O U T 2 w o rd s T r a n s m itte d C o n tin u o u s ly N 1 o r 2 w o rd s ´ 2 w o rd s (N = 1 ,2 ,3 ,....) Figure 1. Transmission timing Rev. 1.10 3 February 20, 2009 HT6026 Information Word An information word consists of 2 periods as shown: P ilo t p e r io d ( 1 8 c lo c k s ) A D 0 ~ A D 8 c o d e s p e r io d ( 7 2 c lo c k s ) P ilo t p e r io d ( 2 4 c lo c k s ) A D 0 ~ A D 8 c o d e s p e r io d ( 7 2 c lo c k s ) T h e 1 s t w o rd T h e 2 n d w o rd Figure 2. Composition of information Address/data Waveform Each programmable address/data pin can be externally set to one of the following three logic states: fO S C "O n e " "Z e ro " "O p e n " A d d r e s s /D a ta B it Figure 3. Address/Data bit waveform Address/Data Programming (Preset) The address pins are usually pre-set to transmit data codes with their own particular security codes by the DIP switches or PCB wiring, while the data is selected by the push button or electronic switches. The status of each address/data pin can be individually pre-set to logic ²high², ²low² or ²floating². If a transmission enable signal is applied, the encoder scans and transmits the status of 9-bit address/data serially in the order AD0 to AD8. But if the trigger signal is not applied, the chip only consumes a standby current which is less than 1mA (for VDD=5V). The following figure demonstrates an application using the HT6026: R R S C O S C 1 E X T E X T O S C 2 O S C 3 D O U T V D D V A D 0 A D 1 A D 2 A D 3 A D 4 A D 5 A D 6 A D 7 A D 8 T E T r a n s m is s io n M e d iu m V S S D D V S S The transmitted information is as listed: Pilot & Sync. AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD8 1 Z 1 Z Z Z 0 1 Z Z: floating Rev. 1.10 4 February 20, 2009 HT6026 Transmission Enable Transmission is enabled by applying a low signal to the TE pin. The HT6026 is enabled and outputs address/data codes from DOUT pin when the TE is set to ²low² and more than 65ns. Flowchart P o w e r o n S ta n d b y m o d e N o T r a n s m is s io n s till e n a b le ? N o T E = 0 ? Y e s C o d e w o rd tr a n s m itte d c o n tin u o u s ly Y e s C o d e w o rd tr a n s m itte d c o n tin u o u s ly Oscillator Frequency vs Supply Voltage fO S C (S c a le ) 3 .5 0 R E X T = 1 0 k W , R S = 2 0 k W , C E X T = 1 0 0 p F E X T = 1 0 k W , R S = 2 0 k W , C E X T = 2 5 0 p F R E X T = 1 0 k W , R S = 2 0 k W , C E X T = 5 0 0 p F R E X T = 1 0 k W , R S = 2 0 k W , C E X T = 1 0 0 0 p F R E X T = 1 0 k W , R S = 2 0 k W , C E X T = 2 0 0 0 p F E X T E X T E X T = 1 0 k W , R = 5 1 k W , R = 5 1 k W , R S = 2 0 k W , C E = 1 0 0 k W , C = 1 0 0 k W , C 3 .2 5 3 .0 0 2 .7 5 2 .5 0 2 .2 5 (2 0 0 k H z ) 2 .0 0 R 1 .7 5 1 .5 0 1 .2 5 1 .0 0 0 .7 5 0 .5 0 0 .2 5 0 .1 0 0 .0 5 0 .0 2 R R 2 Rev. 1.10 R 4 6 8 1 0 1 2 1 4 1 6 5 1 8 2 0 2 2 2 4 V D D S S X T = E X T E X T 5 0 0 0 p F = 2 0 0 0 p F = 5 0 0 0 p F (V D C ) February 20, 2009 HT6026 Application Circuit T r a n s m itte r C ir c u it A D 0 V D D 1 6 2 A D 1 D O U T 1 5 3 A D 2 T E 1 4 A D 3 O S C 3 A D 4 O S C 2 A D 5 O S C 1 A D 6 A D 8 V S S A D 7 4 1 5 6 7 8 V D D 1 0 0 m F /2 5 V 1 3 R E X T 1 2 C E X T 1 1 R S fO S C = 2 .3 R E X T (C fo r 1 k H z < fO E X T S C 1 + C 9 + 1 2 p F ) (H z ) < 4 0 0 k H z w h e re R S @ 2 R E X T R S > 2 0 k W R E X T > 1 0 k W 4 0 0 p F < C E X 1 0 L A Y O U T T < 1 5 m F H T 6 0 2 6 Rev. 1.10 6 February 20, 2009 HT6026 Package Information 16-pin DIP (300mil) Outline Dimensions A B A 1 6 9 1 8 B 1 6 9 1 8 H H C C D D G E G E I F I F Fig1. Full Lead Packages Fig2. 1/2 Lead Packages · MS-001d (see fig1) Symbol A Dimensions in mil Min. Nom. Max. 780 ¾ 880 B 240 ¾ 280 C 115 ¾ 195 D 115 ¾ 150 E 14 ¾ 22 F 45 ¾ 70 G ¾ 100 ¾ H 300 ¾ 325 I ¾ ¾ 430 · MS-001d (see fig2) Symbol Rev. 1.10 Dimensions in mil Min. Nom. Max. A 735 ¾ 775 B 240 ¾ 280 C 115 ¾ 195 D 115 ¾ 150 E 14 ¾ 22 F 45 ¾ 70 G ¾ 100 ¾ H 300 ¾ 325 I ¾ ¾ 430 7 February 20, 2009 HT6026 · MO-095a (see fig2) Symbol A Rev. 1.10 Dimensions in mil Min. Nom. Max. 745 ¾ 785 B 275 ¾ 295 C 120 ¾ 150 D 110 ¾ 150 E 14 ¾ 22 F 45 ¾ 60 G ¾ 100 ¾ H 300 ¾ 325 I ¾ ¾ 430 8 February 20, 2009 HT6026 16-pin NSOP (150mil) Outline Dimensions 1 6 A 9 B 8 1 C C ' G H D E a F · MS-012 Symbol Rev. 1.10 Dimensions in mil Min. Nom. Max. A 228 ¾ 244 B 150 ¾ 157 C 12 ¾ 20 C¢ 386 ¾ 394 D ¾ ¾ 69 E ¾ 50 ¾ F 4 ¾ 10 G 16 ¾ 50 H 7 ¾ 10 a 0° ¾ 8° 9 February 20, 2009 HT6026 Product Tape and Reel Specifications Reel Dimensions D T 2 A C B T 1 SOP 16N (150mil) Symbol Description A Reel Outer Diameter B Reel Inner Diameter C Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness Rev. 1.10 Dimensions in mm 330.0±1.0 100.0±1.5 13.0 +0.5/-0.2 2.0±0.5 16.8 +0.3/-0.2 22.2±0.2 10 February 20, 2009 HT6026 Carrier Tape Dimensions P 0 D P 1 t E F W C D 1 B 0 P K 0 A 0 R e e l H o le IC p a c k a g e p in 1 a n d th e r e e l h o le s a r e lo c a te d o n th e s a m e s id e . SOP 16N (150mil) Symbol Description Dimensions in mm W Carrier Tape Width 16.0±0.3 P Cavity Pitch 8.0±0.1 E Perforation Position 1.75±0.1 F Cavity to Perforation (Width Direction) 7.5±0.1 D Perforation Diameter 1.55 +0.1/-0.0 1.50 +0.25/-0.0 D1 Cavity Hole Diameter P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 6.5±0.1 B0 Cavity Width 10.3±0.1 K0 Cavity Depth 2.1±0.1 t Carrier Tape Thickness 0.30±0.05 C Cover Tape Width 13.3±0.1 Rev. 1.10 11 February 20, 2009 HT6026 Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) G Room, 3 Floor, No.1 Building, No.2016 Yi-Shan Road, Minhang District, Shanghai, China 201103 Tel: 86-21-5422-4590 Fax: 86-21-5422-4705 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, Gaoxin M 2nd, Middle Zone Of High-Tech Industrial Park, ShenZhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 86-10-6641-0030, 86-10-6641-7751, 86-10-6641-7752 Fax: 86-10-6641-0125 Holtek Semiconductor Inc. (Chengdu Sales Office) 709, Building 3, Champagne Plaza, No.97 Dongda Street, Chengdu, Sichuan, China 610016 Tel: 86-28-6653-6590 Fax: 86-28-6653-6591 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com Copyright Ó 2009 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.10 12 February 20, 2009