LESHAN RADIO COMPANY, LTD. Schottky Barrier Diodes These Schottky barrier diodes are designed for high speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand held and portable applications where space is limited. • Extremely Fast Switching Speed • Low Forward Voltage — 0.35 Volts (Typ) @ I F = 10 mAdc • Device Marking: JV LBAT54XV2T1G S- LBAT54XV2T1G 1 We declare that the material of product compliance with RoHS requirements. S- Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable. 2 SOD-523 ORDERING INFORMATION Device LBAT54XV2T1G S-LBAT54XV2T1G LBAT54XV2T3G S-LBAT54XV2T3G Marking Shipping JV 3000/Tape & Reel JV 10000/Tape & Reel 1 CATHODE 2 ANODE MAXIMUM RATINGS (TJ =125°C unless otherwise noted ) Rating Reverse Voltage Symbol VR Value 30 Unit V Symbol PD Max 200 Unit mW THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR-5 Board,* TA = 25°C Derate above 25°C Thermal Resistance Junction to Ambient Junction Temperature Storage Temperature 1.57 635 125 -40 to +125 RθJA TJ Tstg mW/°C °C/W °C °C * FR-4 Minimum Pad ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted) (EACH DIODE) Characteristic Reverse Breakdown Voltage (I R = 10 µA) Total Capacitance (V R = 1.0 V, f = 1.0 MHz) Reverse Leakage (V R = 25 V) Forward Voltage (I F = 0.1 mAdc) Forward Voltage (I F = 1.0 mAdc) Forward Voltage (I F = 10 mAdc) Forward Voltage (I F = 30 mAdc) Forward Voltage (I F = 100 mAdc) Reverse Recovery Time (I F = I R = 10 mAdc, I R(REC) = 1.0 mAdc, Figure 1) Forward Current (DC) Repetitive Peak Forward Current Non–Repetitive Peak Forward Current (t < 1.0 s) Symbol V(BR)R CT IR VF VF VF Min 30 — — — — — Typ — — 0.5 0.22 0.29 0.35 Max — 10 2.0 0.24 0.32 0.40 Unit Volts pF µAdc Vdc Vdc Vdc VF VF — — 0.41 0.52 0.5 1.0 Vdc Vdc trr — — 5.0 ns IF — — — — — — 200 300 600 mAdc mAdc mAdc IFRM IFSM Rev.B 1/3 LESHAN RADIO COMPANY, LTD. LBAT54XV2T1G , S- LBAT54XV2T1G 820 Ω +10 V 2k 0.1 µF tp tr IF 100 µH 0.1 µF IF t trr 10% t DUT 50 Ω OUTPUT PULSE GENERATOR 50 Ω INPUT SAMPLING OSCILLOSCOPE 90% iR(REC) = 1 mA IR VR OUTPUT PULSE (IF = IR = 10 mA; measured at iR(REC) = 1 mA) INPUT SIGNAL Notes: 1. A 2.0 kΩ variable resistor adjusted for a Forward Current (IF) of 10 mA. Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. Notes: 3. tp » trr Fig.1 RECOVERY TIME EQUIVALENT TEST CIRCUIT 100 REVERSE CURRENT :IR(uA) FORWARD CURRENT:IF(mA) 100 10 1 10 1 0.1 0.01 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0 5 FORWARD VOLTAGE:VF(V) -55℃ 25℃ 75℃ 10 15 20 25 30 35 REVERSE VOLTAGE:VR(V) 100℃ 125℃ Fig.2 FORWARD CHARACTERISTICS -55℃ 25℃ 75℃ 100℃ 125℃ Fig.3 REVERSE CHARACTERISTICS 12 TERMINAL CAPACITANCE : CT (pF) f=1MHz 10 8 6 4 2 0 0 5 10 15 20 25 30 35 REVERSE VOLTAGE:VR(V) Fig.4 VR-CT CHARACTERISTICS Rev.B 2/3 LESHAN RADIO COMPANY, LTD. LBAT54XV2T1G , S- LBAT54XV2T1G SOD-523 −X− D −Y− E 2X b 0.08 1 M 2 X Y TOP VIEW A c NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A b c D E HE L L2 MILLIMETERS MIN NOM MAX 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 1.10 1.20 1.30 0.70 0.80 0.90 1.50 1.60 1.70 0.30 REF 0.15 0.20 0.25 HE SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT* 2X 0.48 PACKAGE OUTLINE 1.80 2X 0.40 DIMENSION: MILLIMETERS Rev.B 3/3