CPC1831

CPC1831
8V Output Solar Cell
INTEGRATED CIRCUITS DIVISION
Parameter
Open Circuit Voltage
Short Circuit Current
Rating
8
25
Units
V
A
* Direct sunlight (Approximately 6000 lux)
Features
•
•
•
•
•
•
•
•
8V Output
Triggers with Natural Sunlight
Provides True Wireless Power
No EMI/RFI Generation
Wave Solderable
Replacement of Discrete Components
Solid State Reliability
Small 8-Pin Surface Mount SOIC package
The CPC1831 is a monolithic photovoltaic string of
solar cells with switching circuitry. When operating
in sunlight or a bright artificial light environment the
optical energy will activate the cell array and generate
a voltage at the output. The solar cells are capable
of generating a floating source voltage and current
sufficient to drive and power CMOS ICs, logic gates
and/or provide “trickle charge” for battery applications.
Ordering Information
Part #
CPC1831N
CPC1831NTR
Portable Electronics
Solar Battery Chargers
Battery Operated Equipment
Consumer Electronics
Off-Grid Installation
Wireless Sensors and Detection
Flame Detection
Self Powered Sunlight/ Light Detection
Self Powered Products
Remote Installation
Pb
DS-CPC1831-R03
Description
8-Pin Clear Molded SOIC Package (100/Tube)
8-Pin Clear Molded SOIC Package (2000/Reel)
Pin Configuration
Applications
•
•
•
•
•
•
•
•
•
•
Description
1
2
8 V+
7
3
6
4
5 V-
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INTEGRATED CIRCUITS DIVISION
CPC1831
Absolute Maximum Ratings
Parameter
Reverse Voltage
Operational Temperature
Storage Temperature
Ratings
10
-40 to +85
-40 to +125
Units
V
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical absolute maximum ratings are at 25°C
Electrical Characteristics
Parameter
Output Characteristics @ 25°C
Open Circuit Voltage
Short Circuit Current
Conditions
Symbol
Min
Typ
Max
Units
Direct Sun (6000 lux)
High Intensity Lamp
Direct Sun (6000 lux)
VOC
VOC
ISC
-
7.3
7.8
25
-
V
V
A
PERFORMANCE DATA*
Normalized Open Circuit Output Voltage
vs. Light Intensity
Normalized Short Circuit Output Current
vs. Light Intensity
Normalized Output Current
Normalized Output Voltage
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
2
4
6
8
Light Intensity (lux X 1000)
0
10
1.0
0.8
0.6
0.4
0.2
10
1.2
Normalized Output Current
1.2
2
4
6
8
Light Intensity (lux X 1000)
Normalized Short Circuit Output Current
vs. Incident Angle of Light
to Photodiode Surface
Normalized Open Circuit Output Voltage
vs. Incident Angle of light
to Photodiode Surface
Normalized Output Voltage
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0.00
1.0
0.8
0.6
0.4
0.2
0.0
0.0
0
20
40
60
80
Incident Angle (Degrees)
100
0
20
40
60
80
Incident Angle (Degrees)
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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R03
INTEGRATED CIRCUITS DIVISION
CPC1831
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1831N
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1831N
260ºC for 30 seconds
Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or
fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.
Pb
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INTEGRATED CIRCUITS DIVISION
CPC1831
MECHANICAL DIMENSIONS
8-Pin SOIC Package
Recommended PCB Land Pattern
0.19 - 0.25
(0.008 - 0.010)
1.55
(0.061)
0.40 - 1.27
(0.016 - 0.050)
3.80 - 4.00
(0.15 - 0.16)
5.80 - 6.20
(0.23 - 0.24)
5.40
(0.213)
PIN 1
1.27 TYP
(0.05 TYP)
0.33 - 0.51
(0.013 - 0.020)
0.60
(0.024)
4.80 - 5.00
(0.19 - 0.20)
1.27
(0.050)
0.10 - 0.25
(0.004 - 0.010)
Dimensions
mm
(inches)
1.35 - 1.75
(0.053 - 0.069)
0.394 - 0.648
(0.016 - 0.026)
Tape and Reel Packaging for 8-Pin SOIC-N Surface Mount Package
4.00 ± 0.10
(0.157 ± 0.004)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
1.75 ± 0.10
(0.069 ± 0.004)
2.00 ± 0.10
(0.079 ± 0.004)
W = 12.00 ± 0.30
(0.472 ± 0.012)
5.50 ± 0.10
(0.217 ± 0.004)
B0 = 5.30 ± 0.10
(0.209 ± 0.004)
Top Cover
Tape
Embossed Carrier
K0= 2.10 ± 0.10
(0.083 ± 0.004)
P = 8.00 ± 0.10
(0.315 ± 0.004)
A0 = 6.50 ± 0.10
(0.256 ± 0.004)
User Direction of Feed
Embossment
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-CPC1831-R03
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/17/2012