CPC1560

CPC1560
Normally Open Solid State Relay
with Integrated Current Limit
INTEGRATED CIRCUITS DIVISION
Features
Description
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•
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The CPC1560 is a 1-Form-A (Single Pole, Normally
Open) optically isolated MOSFET switch that provides
fast turn-on of loads up to 600mADC in a DC-Only
configuration, 300mArms in an AC/DC configuration;
active current-limit circuitry; and 3750Vrms of I/O
isolation.
Fast Turn-On
Built-In Active Current Limit Protection
Thermal Shutdown
Linear AC or DC Operation
Low Power Consumption
Clean, Bounce-Free Switching
High Surge Capability
Low Power Drive Requirements
Surface Mount Version Available
Tape & Reel Packaging Available
Fast turn-on is accomplished with the use of an
external charge storage capacitor that provides the
necessary charge required by the internal switching
MOSFETs. The device charges this capacitor, through
bootstrap diodes, from the load voltage, thereby
alleviating the need for an additional power supply.
Applications
• Instrumentation
• Automatic Tuning/Balancing
• Analog Multiplex
• Peripherals
• Automatic Tuning/Balancing
• Transducer Driver
• Security
• Medical Equipment
The CPC1560 incorporates thermal shutdown
circuitry for improved survivability in harsh
environments, and is designed to pass regulatory
voltage surge requirements when provided with
appropriate over-voltage protection circuitry.
Approvals
• UL 508 Approved Component: File # E69938
Designed specifically for environmentally demanding
AC or DC applications, where printed circuit board
space is at a premium and additional power supplies
are not available, the CPC1560 is an ideal solution.
Ordering Information
Pb
e3
Part
Description
CPC1560G
8-Pin, DIP Through-Hole (50/Tube)
CPC1560GS
8-Pin, Surface Mount (50/Tube)
CPC1560GSTR
8-Pin, Surface Mount (1000/Reel)
Figure 1. CPC1560 Block Diagram
8
NC
1
7
LED+
NC
DS-CPC1560-R01
OUTPUT
Current
Limit
Control
2
LED-
C+
3
6
4
5
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OUTPUT
C-
1
INTEGRATED CIRCUITS DIVISION
CPC1560
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Typical Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 General Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.8 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.9 Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.10 Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
3
3
4
4
5
5
5
6
2. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. Device Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 LED Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Storage Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5. Operational Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1 Operating Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1.1 Duty Cycle/Power Dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1.2 Temperature Effects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1.3 Elements of Operating Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.2 Switching Losses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.2.1 Effects of Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3 Current Limit and Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3.1 Current Limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3.2 Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.4 dV/dt Fault Tolerance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.5 Power Derating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.6 Rise and Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.7 Over-Voltage Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.7.1 Stored Energy in the Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.7.2 Protection Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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INTEGRATED CIRCUITS DIVISION
CPC1560
1. Specifications
1.1 Package Pinout
1.2 Pin Description
NC
1
8
C+
LED +
2
7
OUTPUT
LED -
3
6
OUTPUT
NC
4
5
C-
Pin#
Name
Description
1
NC
2
LED +
Positive input to LED
3
LED -
Negative input to LED
4
NC
Not connected
5
C-
External Capacitor, Negative Terminal
Not connected
6
OUTPUT Switch Output
7
OUTPUT Switch Output
8
C+
External Capacitor, Positive Terminal
1.3 Absolute Maximum Ratings
Parameter
Rating
Units
Blocking Voltage (VL)
60
VP
Reverse Input Voltage
5
V
Continuous
50
mA
Peak (10ms)
1
A
10
mA
Input LED Current
Input Control Current
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
1.4 ESD Rating
Peak Turn-On Energy Dissipation
AC/DC Configuration (85°C)
0.67
DC-Only Configuration (85°C)
1.34
mJ
ESD Rating
(Human Body Model)
1000 V
dV/dt Fault Tolerance
AC/DC Configuration
160
DC-Only Configuration
80
Total Power Dissipation 1
800
mW
Output Power Dissipation
787
mW
Isolation Voltage (Input to Output)
3750
Vrms
Operating Temperature
-40 to +85
°C
Storage Temperature
-40 to +125
°C
1
V/s
Derate Total Power linearly by 7.5mW/°C.
Absolute maximum electrical ratings are at 25°C,
unless otherwise specified.
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CPC1560
INTEGRATED CIRCUITS DIVISION
1.5 Recommended Operating Conditions
Parameter
Symbol
Configuration
Min
Typ
Max
Units
AC/DC
-
-
300
mArms/
mADC
DC-Only
-
-
600
mADC
IF
-
2.5
-
10
mA
VL
-
-
V
nF
Load Current, Continuous
AC/DC Configuration
IL
DC-Only Configuration
Input Control Current
Load Voltage
External Storage Capacitor
Load Inductance
1
Operating Temperature
1
-
10
CEXT
-
2
-
6
LLOAD,AC
AC/DC
-
-
3.0
LLOAD,DC
DC-Only
-
-
1.75
-40
-
+85
TA
mH
°C
Maximum load inductance corresponds to a maximum load capacitance. If a TVS or other protection method is used, then no maximum load inductance applies.
1.6 Typical Configurations
+V
8
C+
2
5
AC/DC Application
C-
7
3
Control
Logic
ZLOAD
+/VL
6 +/-
+/- Supply
+/- Supply
+V
7
2
+
6
8 C+
4
+ Supply
DC-Only Application
3
Control
Logic
ZLOAD
VL
-
5
- Supply
C-
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INTEGRATED CIRCUITS DIVISION
CPC1560
1.7 General Conditions
Unless otherwise specified, minimum and maximum values are guaranteed by production testing at 25°C only.
Typical values are characteristic of the device at 25°C and are the result of engineering evaluations. They are
provided for informational purposes only and are not part of the manufacturing testing requirements.
Operating temperature range: TA= -40°C to +85°C
1.8 Electrical Specifications
Parameter
Conditions
Symbol
Min
Typ
Max
Units
470
614
900
mAP
1.0
1.2
1.5
A
-
3.9
1.09
-
5.6
1.4
1

Output Characteristics @ 25°C
Current Limit
AC/DC Configuration
IF=5mA, VL=±4V, t=2ms
ILMT
DC-Only Configuration
IF=5mA, VL=4V, t=2ms
On-Resistance
AC/DC Configuration
DC-Only Configuration
Off-State Leakage Current
IF=5mA, IL=100mA
RON
VL=60V
ILEAK
Switching Speeds
Turn-On
IF=5mA, IL=100mA, VL=10V
Turn-Off
IF=0mA, VL=1.0V
Output Capacitance, AC Configuration
Thermal Shutdown
ton
-
18
100
toff
40
88
400
CO
-
220
-
TSD
130
A
s
pF
°C
Input Characteristics @ 25°C
Input Control Current
IL=100mA
IF
-
-
1.1
Input Dropout Current
IL=100mA
IF
0.1
0.43
-
LED Forward Voltage
IF=5mA
VF
0.9
1.22
1.40
V
-
CI/O
-
3
-
pF
-
RJA
-
114
-
°C/W
mA
Common Characteristics @ 25°C
Input to Output Capacitance
Thermal Characteristics
Thermal Resistance, Junction-to-Ambient
1.9 Timing Diagram
Switching Time Test Circuit
8
IF
+/- Supply
C+
2
Pulse Width=5ms
Duty Cycle=50%
IF
ZLOAD
5
C7
3
+/VL
6 +/-
tF
VL
VL
90%
10%
+/- Supply
t on
R01
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t off
5
CPC1560
INTEGRATED CIRCUITS DIVISION
1.10 Performance Data
12
1.6
On-Resistance (Ω)
On-Resistance (Ω)
1.5
1.4
1.3
1.2
1.1
1.0
Typical On-Resistance vs. Temperature
(AC/DC Configuration)
(IF=5mA, IL=100mA)
1.1
10
1.0
8
0.9
IF=10mA
6
4
2
0.9
-40
-20
0
20
40
60
Temperature (ºC)
80
-40
100
Maximum Allowed Load Current
vs. Temperature
(AC/DC Configuration)
400
ILIM (ADC)
IF=5mA
250
IF=2.5mA
200
150
-40
-20
0
20
40
60
Temperature (ºC)
80
AC Negative Current Limit
vs. Temperature
(IF=5mA)
900
20
40
60
Temperature (ºC)
80
0.5
-40
100
800
750
1.3
700
1.2
1.1
550
500
80
600
550
84
300
-20
0
20
40
60
Temperature (ºC)
80
Load Current vs. Load Voltage
(AC/DC Configuration)
(IF=5mA)
0
20
40
60
Temperature (ºC)
80
0.0
100
1.40
IF=10mA
IF=5mA
IF=2.5mA
1.30
1.25
-100
1.20
-200
1.15
-300
-1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0
VL (VAC)
1.10
0.1
0.2
0.3
VL (VDC)
0.4
0.5
0.6
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
1.35
1.35
VF (V)
IL (mA)
0
300
0
-20
1.40
100
100
Load Current vs. Load Voltage
(DC-Only Configuration)
(IF=5mA)
LED Forward Voltage
vs. Temperature
200
80
100
80
-40
100
20
40
60
Temperature (ºC)
200
82
1.30
IF (mA)
-40
0
400
86
500
450
-20
500
88
IL (mA)
Blocking Voltage (VP)
ILIM- (mA)
650
IF=2.5mA
600
850
700
100
IF=5mA
450
-40
100
Blocking Voltage vs. Temperature
750
80
IF=10mA
600
0.9
20
40
60
Temperature (ºC)
20
40
60
Temperature (ºC)
650
1.0
0
0
850
1.4
-20
-20
AC Positive Current Limit
vs. Temperature
90
800
IF=2.5mA
0.7
1.5
0.8
-40
100
0
ILIM+ (mA)
IF=10mA
300
-20
DC Current Limit vs. Temperature
(IF=5mA)
1.6
350
IF=5mA
0.8
0.6
0
0.8
IL Max (mArms, mADC)
Maximum Allowed Load Current
vs. Temperature
(DC-Only Configuration)
IL Max (A)
Typical On-Resistance vs. Temperature
(DC-Only Configuration)
(IF=5mA, IL=100mA)
1.25
1.20
1.15
1.10
1.05
-40
-20
0
20
40
60
Temperature (ºC)
80
100
1.00
-40
-20
0
20
40
60
Temperature (ºC)
80
100
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not
indicated in the written specifications, please contact our application department.
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INTEGRATED CIRCUITS DIVISION
Typical IF for Switch Dropout
vs. Temperature
(IL=100mA)
Maximum Allowed
Energy Dissipation During tRISE
(DC-Only Configuration)
0.65
0.60
0.55
0.50
-40
0.28
0.12
0.27
0.11
0.26
Energy (mJ)
IF (mA)
0.70
Maximum Allowed
Energy Dissipation During tRISE
(AC/DC Configuration)
-20
0
20
40
60
Temperature (ºC)
80
100
Energy (mJ)
0.75
CPC1560
0.25
0.24
0.23
0.09
0.08
0.22
0.07
0.21
0.06
0.20
-40
-20
0
20
40
60
Temperature (ºC)
Maximum Allowed
Energy Dissipation During tFALL
(AC/DC Configuration)
80
100
0.05
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Maximum Allowed
Energy Dissipation During tFALL
(DC-Only Configuration)
2.0
4.0
1.8
3.5
1.6
Energy (mJ)
Energy (mJ)
0.10
1.4
1.2
1.0
3.0
2.5
2.0
1.5
0.8
0.6
-40
-20
0
20
40
60
Temperature (ºC)
80
100
1.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not
indicated in the written specifications, please contact our application department.
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7
CPC1560
INTEGRATED CIRCUITS DIVISION
2. Introduction
The CPC1560 is an optically coupled Solid State
Relay (SSR) that is self-biased from the load supply.
An external charge storage capacitor is used to greatly
speed up SSR turn-on. The CPC1560 also
incorporates current limiting and a thermal shutdown
feature in the output circuitry, which make the device
ideal for use in harsh conditions.
3. Functional Description
Internally, the device is composed of an LED, a
photovoltaic array with control circuitry, and two
MOSFET output switches.
Input current to the LED is the turn-on signal to the
SSR’s output MOSFET switches. The LED illuminates
the photovoltaics, which provide current to the gates of
the output MOSFETs, causing them to conduct. The
charge provided to the MOSFET gates initially
includes the charge stored in the external capacitor,
which causes the SSR to conduct much more quickly
than if only the photovoltaic current were used.
When the Load Voltage (VL) is first applied to the
inactive outputs, the external storage capacitor begins
to charge. To ensure proper operation, the storage
capacitor should be equal to or greater than the total
gate capacitance of the two output MOSFET switches.
The charge is passed through bootstrap diodes, which
prevent the charge from escaping and discharging the
capacitor through the MOSFET output switch when
the SSR is turned on. The input control current is
applied, then the charge is transferred from the
storage capacitor through the internal NPN bipolar
transistor along with the charge from the photovoltaic,
to the MOSFET gates to accomplish a rapid turn-on.
After the capacitor has discharged and the MOSFETs
have turned on, the photocurrent from the photovoltaic
continues to flow into the gates, keeping the
MOSFETs turned on.
“Recommended Operating Conditions” on page 4). The
device will operate at input currents above and below
this range, but device operating characteristics are
not guaranteed.
• There is a minimum LED input current required for
the device to shut off: typically about 0.43mA at 25°C
(see “Electrical Specifications” on page 5).
• The output switch will only withstand a maximum of
60 volts across its terminals before breaking down
(see“Absolute Maximum Ratings” on page 3). The
maximum voltage generally occurs when the load is
off.
The CPC1560 has two different operating
configurations: unidirectional DC-only configuration,
and bidirectional AC/DC configuration.
In the unidirectional DC-only configuration, the device
switches load voltages with a fixed polarity, while in the
AC/DC configuration it can switch voltages with either
positive or negative polarities.
The advantage of operating the device in the DC-only
configuration is the ability to switch larger load
currents. The advantage of operating it in the AC/DC
configuration is the flexibility of switching load voltages
of either polarity.
4. Device Configuration
4.1 LED Resistor
To assure proper operation of the CPC1560, the LED
resistor selection should comply with the
recommended operating conditions. Although the LED
is capable of being operated up to the absolute
maximum ratings, this is not recommended.
Operating the LED beyond the recommended
operating conditions may prevent the current limit and
thermal shutdown functions from performing properly.
The equation used to calculate the max resistor value:
When the input control current is removed, the gate
current stops flowing and the PNP bipolar transistor is
on, discharging the MOSFET gates. The MOSFETs
are now off. At this point the capacitor begins to
recharge for the next turn on cycle.
RLED_MAX =
8
IF_MIN
VIN
RLED
The non-conducting, optical coupling space between
the LED and the photovoltaics provides 3750Vrms of
isolation between the control input and the switched
output of the CPC1560.
Important things to note about the operation of the
CPC1560:
• The device is designed to maintain its guaranteed
operating characteristics with DC input control
current (IF) in the range of 2.5mA to 10mA (see
VIN_MIN - VLOW_MAX - VF_MAX
+
VF
VLOW
•
•
•
•
•
IF_MIN = Minimum Input Control Current
VIN_MIN = Minimum Input Power Source
VLOW_MAX = Maximum Logic Level Low Voltage
VF_MAX = Maximum Forward Voltage Drop of LED
RLED_MAX = Maximum Input Resistor to LED
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INTEGRATED CIRCUITS DIVISION
CPC1560
4.2 Storage Capacitor
5.1.2 Temperature Effects
The CPC1560 requires the use of an external
capacitor (CEXT) to meet the device’s specifications.
This external storage capacitor enables the relay to
turn on quickly by holding a reservoir of charge to be
transferred to the gates of the MOSFET pair. The
capacitor must have a minimum working voltage
greater than the load voltage, and must be connected
from pin 8 (C+), the capacitor’s positive voltage
terminal, to pin 5 (C-), the capacitor’s negative voltage
terminal.
Proper selection of the external capacitor begins with
the recommended range provided in the
“Recommended Operating Conditions” on page 4, and the
maximum voltage at the CPC1560 outputs, including
transients and faults. The nominal value of the
capacitor needs to be chosen so that when the effects
of tolerance, temperature coefficient, and (for some
types of capacitor) derating due to bias voltage are
accounted for, the capacitor’s value remains within the
recommended range over the operational conditions
of the end product.
5. Operational Behavior
5.1 Operating Frequency
5.1.1 Duty Cycle/Power Dissipation
Equation 1 shows the relationship between power
dissipation, operating frequency, and duty cycle for the
CPC1560 device. From this equation, it can be seen
that both switching frequency (fswitch) and duty cycle
(D) contribute to power dissipation. The first one by
generating switching losses, and the second one by
generating ON losses. Switching losses are those
caused by changes in the energy state of the load
components when the device is switching on and off
(i.e. ERISE and EFALL), and ON losses are those
caused by the flow of current (IL) through the part’s
on-resistance (RON) when it is switched on.
(1) Pavg = IL2 • RON • D + fswitch • (ERISE + EFALL)
Because a higher operating frequency translates into
higher power consumed by the part, care must be
taken to limit its value in order to protect the device
from exceeding its maximum power rating. When
doing this, both the maximum allowed power
dissipation in the part and the ON duty cycle,
D=tON / (tON+tOFF), must be taken into consideration.
When setting the operating frequency of the
CPC1560, the user must also take into account power
dissipation over temperature.
5.1.3 Elements of Operating Frequency
In addition to ambient temperature, the maximum
frequency of the CPC1560 is also determined by the
MOSFET’s turn-on and turn-off times and the load
voltage rise and fall times as follows:
(2)
fMAX =
1
3
(tON + tOFF)
-1
Where 1/3 is a multiplication factor for temperature
and process variations.
5.2 Switching Losses
During the transition intervals of the switching process,
the load components change energy states, which
results in switching losses as the energy passes
through the MOSFETs. This energy transfer is
manifested in the form of heat dissipation and must be
taken into consideration.
Energy is transferred during the turn-off intervals. This
energy, called Erise, will be absorbed by the MOSFET
output switches, and if present parasitic load
capacitance and the protection device.
Energy is also transferred during the turn-on intervals
and is called Efall. This energy will be absorbed by the
MOSFET output switches, which is why this energy
should be limited to the “peak turn-on energy” values
specified in the Absolute Maximum Ratings Table of
this datasheet.
The user of the CPC1560 device must understand the
details of the load behavior and keep in mind the
device’s recommended operating conditions in order
to adequately size the load components and protect
the application circuit.
The average power of the CPC1560 output MOSFET
for any specific application and for any load type given
by Equation 1 and repeated here is:
(3) Pavg = IL2 • RON • D + fswitch • (ERISE + EFALL)
From this equation we can see how the switching
losses (ERISE and EFALL), together with the “on
losses,” contribute to the CPC1560’s output power
dissipation.
The user must also know that the recommended
operating conditions for IL, fSWITCH, load capacitance
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9
CPC1560
INTEGRATED CIRCUITS DIVISION
(CLOAD) and load Inductance (LLOAD), along with other
recommended operating conditions given in this
datasheet, are constrained by the 85°C operation of
most industrial applications. For lower operating
temperature ranges, these values can be de-rated
using the information provided in the temperature
graphs in this datasheet.
device in the form of heat or an increase in the
ambient temperature.
The thermal shutdown feature and the current limit
feature provide great power cross immunity to the
device for improved survivability in harsh
environments.
5.4 dV/dt Fault Tolerance
5.2.1 Effects of Ambient Temperature
One of the most important factors is the temperature
variation of the environment. From the Maximum
Allowed Energy Dissipation During tRISE graphs
(AC and DC) in this datasheet, the user can see how
the energy dissipated in the part during tRISE
increases with increasing ambient temperature.
The operating frequency of the device is directly
related to the amount of energy dissipated in it during
the transition times, tRISE and tFALL, which increases
rapidly with temperature, as seen in the previously
mentioned graphs. Depending on the operating
temperature range of the application, the user must
derate the maximum allowed energy in the part during
tRISE and tFALL (according to the temperature graphs
provided) in order to limit the operating switching
frequency.
5.3 Current Limit and Thermal Shutdown
5.3.1 Current Limit
The CPC1560 has a current limit feature in which
current through the output switches is limited to a
value larger than the recommended operating current.
The CPC1560 device has a finite dV/dt fault tolerance
for both the AC/DC and DC-only configurations, which
must not be exceeded.
The dV/dt tolerance for the device in the AC/DC
configuration is double that of the DC-only
configuration (see “Absolute Maximum Ratings” on
page 3). This is because the dV/dt value of the
CPC1560 is inversely proportional to the size of the
output switch’s Crss, or “reverse transfer capacitance,”
and this capacitance in the DC-only configuration is
double that in the AC/DC configuration.
5.5 Power Derating
Bear in mind the power rating of the CPC1560 when
operating the device at elevated temperatures. The
Absolute Maximum Ratings table shows that the
maximum allowed power dissipation at 25°C is
800mW, which is the maximum power that can be
dissipated before the junction temperature of the
device reaches 125°C.
In order to keep the CPC1560 operating within its
power rating, use the Maximum Allowed Load Current
graphs provided earlier in this document.
In the AC/DC configuration, the CPC1560 has
bidirectional current limiting, which consists of current
limit circuits in both positive and negative polarities. In
the DC-only configuration, the DC current limit
consists of the parallel of the two AC current limit
circuits in the positive DC polarity.
The current limit function has a negative temperature
coefficient in which increasing temperature lowers the
current limit threshold of the device. Prolonged periods
of current limiting will cause the temperature of the
device to increase, and, if allowed to continue, will
activate the device’s thermal shutdown circuitry,
forcing the output switches to turn off.
5.3.2 Thermal Shutdown
The purpose of the thermal shutdown feature is to
completely shut down the operation of the device
when its junction temperature has gone above 130°C,
whether this is due to high power dissipation in the
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INTEGRATED CIRCUITS DIVISION
CPC1560
5.7 Over-Voltage Protection
DC-Only Application Circuit
Resistive Load Turn-Off Characteristics
(Supply=45VDC, RLOAD =75Ω)
1.0
50
VL
0.8
40
IL
30
0.6
20
0.4
10
0.2
0
0.0
-80
-60
-40
-20
0
20
Time (μs)
40
60
80
MOSFET Current (A)
MOSFET Voltage (V)
tRISE=46μs
5.7.1 Stored Energy in the Load
During the CPC1560’s switching periods, energy is
transferred between the load components, the
CPC1560 device, and, if used, the over-voltage
protection circuitry.
When the output switch turns off, inductive loads
(LLOAD) transfer their stored energy into the MOSFET
switches, the load capacitance, and the over-voltage
protector. (See the turn-off graph for a 45V inductive
load application circuit.)
When the output switch turns on, the energy in the
load inductor is zero, and the load capacitor (CLOAD)
must transfer its stored energy into the MOSFET.
DC-Only Application Circuit
Inductive Load Turn-Off Characteristics
(Supply=45V, RLOAD =75Ω, LLOAD= 630μH)
50
0.8
40
IL
30
0.6
20
0.4
10
0.2
0
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1.0
VL
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MOSFET Current (A)
The CPC1560 has rise and fall times that are primarily
limited by internal parasitic elements of the device; the
load components only play a secondary role. This can
be appreciated in the turn-off graph of an application
circuit operating at 45V, where the slope of the load
voltage starts scooping down into a more capacitive
shape after approximately 15 volts.
MOSFET Voltage (V)
5.6 Rise and Fall Times
0.0
-80
-60
-40
-20
0
20
Time (μs)
40
60
80
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CPC1560
INTEGRATED CIRCUITS DIVISION
5.7.2 Protection Methods
One way to protect the CPC1560 and application
circuit components from damage when excessive
stored energy is suddenly released into the output
MOSFETs of the CPC1560, is to add a Transient
Voltage Suppressor (TVS) across the output switches.
Use a unidirectional TVS from the outputs to C- for the
DC-only configuration, and use a bidirectional TVS
across the output pins for the AC/DC configuration as
shown in the diagrams below.
In order to calculate the required TVS value, the user
has to compare working voltage of the application
circuit to the breakdown voltage of the CPC1560 with
the TVS maximum clamping voltage ratings. The TVS
maximum clamping voltage capability must be, at a
minimum, equal to the specific peak pulse current of
the load. This must be done to ensure the TVS can
easily absorb any excess energy coming from the
inductive load (LLOAD).
In addition to the TVS, other protection techniques are
also available depending on the type of load the user
is trying to switch. For purely resistive loads the user
may rely on the output transistor to handle any
parasitic energy. For very low to moderately inductive
loads (e.g. remote switching of a load through a long
cable), a voltage suppressor or TVS can be used as
explained before. For heavily inductive loads, a
fly-back diode connected across the load element is
recommended
For much higher inductive loads, other circuit
techniques, device ratings and/or protector types must
be considered1. Of paramount importance is that the
designer know the characteristics of the load being
switched.
Figure 2. CPC1560 DC-Only Configuration with Over-Voltage Protection
CPC1560
CEXT
C+
RLED
VIN
1
8
2
7
3
6
4
5
ZLOAD
Output
Supply
DOVP
Output
C-
Supply
Figure 3. CPC1560 AC/DC Configuration with Over-Voltage Protection
CPC1560
RLED
VIN
1
8
2
7
3
6
4
5
C+
CEXT
ZLOAD
Supply
Output
Output
DOVP
CSupply
1
For more over voltage protection techniques consult: Switchmode Power Supply Handbook, 2nd Edition, Keith
Billings, ISBN 0-07-006719-8, or Power MOSFET Design, B.E. Taylor, ISBN 0-471-93-802-5
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INTEGRATED CIRCUITS DIVISION
CPC1560
6 Manufacturing Information
6.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1560G / CPC1560GS
MSL 1
6.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
6.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
CPC1560G / CPC1560GS
250°C for 30 seconds
6.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
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13
CPC1560
INTEGRATED CIRCUITS DIVISION
6.5 Mechanical Dimensions
6.5.1 CPC1560G DIP Package Dimensions
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
3.302 ± 0.051
(0.130 ± 0.002)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.127
(0.300 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
6.5.2 CPC1560GS Surface Mount Package Dimensions
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
3.302 ± 0.051
(0.130 ± 0.002)
0.635 ± 0.127
(0.025 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
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INTEGRATED CIRCUITS DIVISION
CPC1560
6.5.3 CPC1560GSTR Tape and Reel Specification
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W=16.00
(0.63)
Bo=10.30
(0.406)
K0 =4.90
(0.193)
Ao=10.30
(0.406)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed
or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability
whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a
particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical
harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes
to its products at any time without notice.
Specification: DS-CPC1560-R01
©Copyright 2013, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
7/24/2013
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