Layout Guidelines for the MAX16974/MAX16975

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Keywords: automotive power, automotive DC/DC, automotive switching power supply, automotive switcher, automotive
DC/DC, automotive grade power supply, AECQ100 power supply, AECQ100 DC/DC
REFERENCE DESIGN 5137 INCLUDES: Tested Circuit Schematic BOM Board Available Description Layout
Layout Guidelines for the
MAX16974/MAX16975/MAX16976 DC-DC Converters
By: Pankaj Kashikar
Oct 10, 2011
Abstract: The MAX16974/MAX16975/MAX16976 high-performance DC-DC converters are standard buck controllers
designed for automotive applications. This application note explains how to optimize the layout of these ICs. An example
layout is provided at the end of the document.
Introduction
The MAX16974/MAX16975/MAX16976 DC-DC converters are standard buck controllers designed for automotive
applications. These controllers feature an integrated high-side N-channel FET and an external free-wheeling diode. Proper
PCB layout of the IC, along with all the external components, is critical for reliable operation and for minimizing EMI
emissions. This application note highlights some of the key points of the circuits for optimizing the layout. Figure 1 shows
the typical application circuit of these high-performance converters.
Typical Applications Schematic
Figure 1. Typical application circuit.
DC and AC Current Paths
Figure 2 shows the AC and DC current paths for the MAX16974/MAX16975/MAX16976 family.
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Figure 2a. DC current paths when the HSFET is ON (black) and when the catch diode turns ON (red).
Figure 2b. AC current path subtraction of the DC current paths shown in Figure 2a.
Placement of Components Critical to the AC Current Path
For optimum layout and lowering EMI, the AC current path shown in Figure 2b is most critical. This path consists of input
capacitors C IN1 and C IN2 and the Schottky catch diode D. The input capacitors maintain a stable input voltage for the
SUP and SUPSW pins of the IC. C IN1 is the larger bulk capacitor and C IN2 is the ceramic capacitor, which provides
instantaneous current. The placement of C IN2 is critical and needs to be as close as possible to the SUPSW and SUP
pins. Use two different C IN2 capacitors and place them near the SUPSW and SUP pins. If C IN2 is placed away from the
SUP and SUPSW pins, then the inductance between the C IN2 and the IC pins will cause voltage change on the pin of the
IC and affect performance.
The Schottky catch diode is the next important component and needs to be placed close to the LX pin of the IC. This LX
pin is the switching pin and undergoes instantaneous change in current when the DC current paths switch from "black" to
"red" in Figure 2a. This pin is also the single source of noise for the IC. By placing the Schottky catch diode as close as
possible to the LX pin, we minimize any trace inductance and reduce the voltage change on the LX pin when the change
in the DC-current path occurs.
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Additionally, a snubber R-C network can be used and placed as close as possible to the LX pin. This R-C network will
minimize EMI and prevent instantaneous change in voltage on the pin due to the stray inductance. Another way to control
voltage on the LX pin is to add a series resistor with the boost capacitor C BST . This will slow down the turn-on of the
internal HSFET of the IC, which in turn will control the rate of voltage rise on the LX pin.
Finally, the AC current loop comprising of C IN2 , HSFET, the Schottky catch diode, and GNDs should be as tight as
possible. This will keep the current circulation within a small area and away from the sensitive control pins of the IC.
Placement of Other Components
Once the above critical components have been placed, the rest of the components should be placed around it. The
inductor L1 and the output capacitor C OUT should be placed next such that the corresponding DC current loops are as
compact as possible.
Another important component is the BIAS capacitor C BIAS . The voltage on this pin powers all the internal control circuitry
of the IC. Also, the boost capacitor C BST is charged from the bias capacitor when the Schottky catch diode conducts in a
normal switching cycle, as shown in Figure 3.
Figure 3. Boost charge cycle shown above (green).
To ensure stable operating voltage on the BIAS pin, the capacitor C BIAS should be place adjacent to the pin of the IC.
This will minimize the trace inductance between the BIAS pin and the C BIAS capacitor.
Thermal Considerations
The MAX16974 has an exposed pad at the back of the IC. This exposed pad is the primary heat dissipation element for
the package. MAX16974 has a HSFET integrated that is capable of delivering 2A. To extract full power out of the
package, proper soldering of the exposed pad to the PCB is critical. The MAX16974's exposed pad is at ground potential,
so good connection to the ground plane helps to remove heat from the package. A copper area should be used on the
PCB to solder the exposed pad directly onto this copper area. Vias should be added to this copper area and connected to
the ground planes in other layers. These vias help proper ground connectivity and dissipate the heat from the package
onto the PCB.
Example Layout of the MAX16974 Evaluation Kit
Figures 4 to 8 show the schematic and layout of the MAX16974 EV kit (MAX16974EVKIT) using a 4-layer PCB and
follow the above layout guidelines. The inner two layers (Figures 6 and 7) are used as ground planes and help dissipate
heat from the exposed pad of the MAX16974. The connection to these ground planes is primarily through vias in the
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exposed pad copper area in the top layer.
Figure 4. MAX16974EVKIT schematic.
Figure 5. Top layer of the MAX16974EVKIT.
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Figure 6. Layer 2 of the MAX16974EVKIT (ground plane).
Figure 7. Layer 3 of the MAX16974EVKIT (ground plane).
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Figure 8. Bottom layer of the MAX16974EVKIT.
Related Parts
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Free Samples More Information
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Application Note 5137: http://www.maximintegrated.com/an5137
REFERENCE DESIGN 5137, AN5137, AN 5137, APP5137, Appnote5137, Appnote 5137
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