NGD0805C2R450G3TRF - NIC Components Corp.

Multilayer Chip Diplexers
NGD_C Series
FEATURES
• LOW INSERTION LOSS
• HIGH ATTENTUATION
• LOW COST LTCC CONSTRUCTION
• SURFACE MOUNTABLE CONSTRUCTION
• TAPED AND REELED FOR AUTOMATIC INSERTION
RoHS
Compliant
includes all homogeneous materials
*See Part Number System for Details
CHARACTERISTICS
Case Code
0603
0805
1210
Low Frequency Range (Min.)
2400 ~ 2500 MHz
High Frequency Range (Max.)
9800 ~ 11800 MHz
Refer to Part
Number Table
1650 ~ 2200 MHz
Operating Temperature Range
900 ~ 1450 MHz
-40°C ~ +85°C
Impedance
50Ω
Resistance to Solder Heat
+260°C for 10 seconds
DIMENSIONS (mm)
LAND PATTERNS
DIMENSIONS
Case Code
NGD0603C
A
B
1.6 ± 0.1
0.8 ± 0.1
NGD0805C
2.0 ± 0.15
1.2 ± 0.15
NGD1210C
3.2 ± 0.2
2.5 ± 0.2
C
D
E
F
G
H
I
J
K
0.6 ± 0.1
0.15 ± 0.1
0.2 ± 0.1
0.5 ± 0.1
0.3
0.55
0.25
0.5
-
0.2 ± 0.1
0.3 ± 0.15
0.65 ± 0.1
0.75
0.5
0.35
0.65
-
0.3 ± 0.2
0.55 ± 0.2
1.0 ± 0.1
1.6
0.95
0.6
-
0.35
0.95 ± 0.1
0.8 ± 0.1
1.5 ± 0.1
LAND PATTERNS
COMPONENT LAYOUT
A
E
(3)
(2)
(1)
(4)
(5)
(6)
J
C
B
K
G
F
D
H
I
Refer to Part Number
Table for PIN Layout
PART NUMBER SYSTEM
NGD 0805C 2R450 G1 TR F
RoHS Compliant
Packaging: TR = Tape & Reel
Layout Code
Frequency Code (Ghz): “R” indicates decimal
Size Code (see dimensions table for details)
Series
®
NIC COMPONENTS CORP. www.niccomp.com
www.lowESR.com
www.RFpassives.com
Specifications are subject to change
www.SMTmagnetics.com
1
Multilayer Chip Diplexers
NGD_C Series
NGD0603C Size
Multilayer Chip Diplexers
NGD_C Series
NGD0805C Size
Standard Values - Case Size 0603 (1.6 x 0.8 x 0.6mm)
Part Number
Frequency
Range
Impedance
(Ω)
Low
NGD0603C2R450G1TRF
50
High
Low
NGD0603C2R450G2TRF
50
High
PIN
(1)
NGD0603C2R450G1TRF
High
NGD0603C2R450G2TRF
Low
(2)
Ground
(3)
Low
High
Standard Values - Case Size 0805 (2.0 x 1.2 mm)
Frequency
(MHz)
Max. IL in BW
@ 25°C (dB)
Ripple in
BW @
25°C (dB)
Max. VSWR
in BW @
25°C (dB)
Min.
Attenuation
@ 25°C (dB)
Part Number
Frequency
Range
Impedance
(Ω)
Max. IL in BW
@ 25°C (dB)
Ripple in
BW @
25°C (dB)
Max. VSWR
in BW @
25°C (dB)
Min.
Attenuation
@ 25°C (dB)
2400 ~ 2500
1.0
0.5
2.0
-
824 ~ 960
0.6
0.3
2.0
-
4800 ~ 6000
-
-
-
18
1710 ~ 1880
1.0
0.5
2.0
-
7200 ~ 7500
-
-
-
18
1880 ~ 1990
1.5
0.7
2.0
-
2400 ~ 2500
-
-
-
18
2400 ~ 2500
-
-
-
15
4900 ~ 5900
1.6
1.0
2.0
-
9800 ~ 11800
-
-
-
15
2400 ~ 2500
1.0
0.5
2.0
-
4800 ~ 6000
-
-
-
18
7200 ~ 7500
-
-
-
18
2400 ~ 2500
-
-
-
18
4900 ~ 5900
1.6
1.0
2.0
-
9800 ~ 11800
-
-
-
15
(4)
Ground
(5)
(6)
Common
(3)
(2)
(1)
(4)
(5)
(6)
NGD0805C2R450G1TRF
(C: 0.95 ± 0.1 mm)
Low
50
High
Low
NGD0805C2R450G2TRF
(C: 0.95 ± 0.1 mm)
50
High
Ground
Low
NGD0805C2R450G3TRF
(C: 0.8 ± 0.1 mm)
50
High
Low
NGD0805C2R450G4TRF
(C: 0.8 ± 0.1 mm)
50
High
PIN
(1)
NGD0805C2R450G1TRF
High
NGD0805C2R450G2TRF
High
NGD0805C2R450G3TRF
Low
NGD0805C2R450G4TRF
High
(2)
Ground
Ground
(3)
Low
Low
High
Low
824 ~ 1990
-
-
-
20
2400 ~ 2500
2.0
1.0
2.0
-
2400 ~ 2500
0.7
0.3
2.0
-
4800 ~ 6000
-
-
-
18
7200 ~ 7500
-
-
-
18
4900 ~ 5900
1.0
0.5
2.0
19
1800 ~ 2500
-
-
-
10300 ~ 10700
-
-
-
25
824 ~ 915
-
-
-
28
1545 ~ 1610
-
-
-
28
1710 ~ 1990
-
-
-
24
2110 ~ 2170
-
-
-
18
2400 ~ 2500
2.4
-
2.0
-
4800 ~ 5000
-
-
-
27
7200 ~ 7500
-
-
-
20
1545 ~ 1610
-
-
-
25
2400 ~ 2500
-
-
-
25
5150 ~ 5850
1.2
-
2.0
-
10300 ~ 11700
-
-
-
20
824 ~ 915
-
-
-
28
1545 ~ 1610
-
-
-
28
1710 ~ 1990
-
-
-
24
2110 ~ 2170
-
-
-
18
2400 ~ 2500
2.4
-
2.0
-
4800 ~ 5000
-
-
-
27
7200 ~ 7500
-
-
-
20
1545 ~ 1610
-
-
-
25
2400 ~ 2500
-
-
-
25
5150 ~ 5850
1.2
-
2.0
-
10300 ~ 11700
-
-
-
20
(4)
(5)
(6)
Ground
Common
Ground
(3)
(2)
(1)
Ground
Common
Ground
(4)
(5)
(6)
®
®
2
Frequency
(MHz)
NIC COMPONENTS CORP. www.niccomp.com
www.lowESR.com
www.RFpassives.com
Specifications are subject to change
www.SMTmagnetics.com
NIC COMPONENTS CORP. www.niccomp.com
www.lowESR.com
www.RFpassives.com
Specifications are subject to change
www.SMTmagnetics.com
3
Multilayer Chip Diplexers
NGD_C Series
Multilayer Chip Diplexers
NGD_C Series
NGD1210C Size
Standard Values - Case Size 1210 (3.2 x 2.5 x 1.8mm)
Part Number
Frequency
Range
Impedance
(Ω)
Low
NGD1210C2R200G1TRF
50
High
Frequency
(MHz)
Max. IL in BW
@ 25°C (dB)
Ripple in
BW @
25°C (dB)
Max. VSWR
in BW @
25°C (dB)
Case Size
Min.
Attenuation
@ 25°C (dB)
NGD0603C
900 ~ 1450
2.2
1.6
2.0
-
NGD0805C
1425 ~ 1450
-
0.3
-
-
NGD1210C
1450 ~ 1475
-
1.0
-
-
1650 ~ 2200
-
-
-
27
1800
-
-
-
30
900 ~ 1450
-
-
-
27
1300
-
-
-
30
1625 ~ 1650
-
1.0
-
-
1650 ~ 1675
-
0.3
-
-
1650 ~ 2200
2.2
1.6
2.0
-
CARRIER TAPING DIMENSIONS (mm) AND REEL QUANTITY
Tape
Ao
Bo
Paper
1.00
1.80
1.42
2.25
2.75
3.45
Embossed
1.75mm ±0.1
Po
So
Co
4.0
2.0 ±0.05
3.5 ± 0.1
PIN
(1)
(2)
(3)
(4)
(5)
(6)
Ground
Common
Ground
High
Ground
Low
(6)
(5)
(4)
(1)
(2)
(3)
t
0.75 max.
-
1.14 max.
4.0mm ±0.1
So
W
Qty
4,000
8.0 ± 0.3
0.27 max.
1.80 max.
4,000
2,000
1.5mm ± 0.1
t
Co
Bo
Ao
NGD1210C2R200G1TRF
Ko
W
Ko
Po
(Paper)
Tape Width
Ko
(Embossed)
REEL DIMENSIONS (mm)
A(mm)
B(mm)
D(mm)
9.0 ± 1.5
58 ± 2.0
178 ± 2.0
NGD0603C
NGD0805C
NGD1210C
B
D
A
REFLOW SOLDERING PROFILE
®
®
4
NIC COMPONENTS CORP. www.niccomp.com
www.lowESR.com
www.RFpassives.com
Specifications are subject to change
www.SMTmagnetics.com
NIC COMPONENTS CORP. www.niccomp.com
www.lowESR.com
www.RFpassives.com
Specifications are subject to change
www.SMTmagnetics.com
5