MILL-MAX MFG. CORP.
190 PINE HOLLOW ROAD
PO BOX 300
OYSTER BAY, NY 11771-0300
PHONE: (516) 922-6000 FAX: (516) 922-9253
www.mill-max.com
PROPERTIES OF METALS USED BY MILL-MAX
Copper alloy rod and wire for precision-machined pins, receptacles & solder terminals (Alloys C36000 & C54400
contain 3 to 4% lead to permit “free machining” and is permitted by EC Directive 2002/95 Annex 6; so all pin
materials are RoHS compliant).
BRASS ALLOY 360 (UNS C36000) per ASTM B 16
PHOSPHOR BRONZE Alloy 544 (UNS C54400) per ASTM B 139
TELLURIUM COPPER Alloy 145 (UNS C14500) per ASTM B 301
Spring alloy strip for stamping “multi-finger” spring contacts
BERYLLIUM COPPER Alloy 172 (UNS C17200) per ASTM B 194
BERYLLIUM NICKEL Alloy 360 (UNS N03360)
Properties of BRASS:
Stock diameters available: .062/.072/.078/.093/.125/.156/.187/.250”
Chemical composition: Cu 61.5%, Zn 35.4%, Pb 3.1%
Temper as machined: H02/H04
Modulus of elasticity: 14x106 psi
3
Tensile strength: 70-90x10 psi
Hardness as machined: 80-90 Rockwell B
After machining, brass parts are often annealed (softened) for subsequent bending, swaging or crimping. A
partial anneal down to 60±10 RB is recommended for 90° bends, a full anneal down to 35±15 RB is
recommended for pins or terminals that are swaged (riveted) to a circuit board or crimped to a wire.
Density: .307 lbs/in3
Electrical conductivity: 26% IACS*
Melting point: 900°C/885°C (liquidus/solidus)
Properties of PHOSPHOR BRONZE:
Used for pins requiring more durability than brass.
Stock diameters available: .072/.078”
Chemical composition: Cu 88%, Sn 4%, Zn 4%, Pb 4%
Temper as machined: H04
6
Modulus of elasticity: 15x10 psi
3
Tensile strength: 70-80x10 psi
Hardness as machined: 83 Rockwell B
Density: .321 lbs/in3
Electrical conductivity: 19% IACS*
Melting point: 1000°C/930°C (liquidus/solidus)
Properties of TELLURIUM COPPER:
Used for pins requiring a higher current carrying capacity than brass or phosphor bronze.
Stock diameters available: .079/.125/.156”
Chemical composition: Cu 99.44%, Te .55%, P .008%
Temper as machined: H02
Modulus of elasticity: 17x106 psi
3
Tensile strength: 43x10 psi
Hardness as machined: 43 Rockwell B
3
Density: .323 lbs/in
MILL-MAX® ELECTRONIC INTERCONNECT COMPONENTS
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MILL-MAX MFG. CORP.
190 PINE HOLLOW ROAD
PO BOX 300
OYSTER BAY, NY 11771-0300
PHONE: (516) 922-6000 FAX: (516) 922-9253
www.mill-max.com
Electrical conductivity: 93% IACS*
Thermal conductivity: 91% IACS*
Melting point: 1075ºC/1051ºC (liquidus/solidus)
Properties of BERYLLIUM COPPER:
Chemical composition: Cu 98.1%, Be 1.9%
Temper as stamped: TD01
Properties after heat treatment (TH01):
Modulus of Elasticity: 19x106 psi
3
Tensile Strength: 175-205x10 psi
Yield Strength (0.2% offset): 150-185x103 psi
Elongation: 3-10%
Stress Relaxation†: 96% of stress remains after 1,000 hours @ 100 ºC
70% of stress remains after 1,000 hours @ 200 ºC
Hardness: 36-43 Rockwell C
3
Density: .298 lbs/in
Electrical Conductivity: 22% IACS*
Melting point: 980°C/865°C (liquidus/solidus)
†Since BeCu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150°C.
For “down-hole” and “burn-in” applications up to 300°C, Mill-Max offers four contacts (#24, #26, #27 & #38) made
from Beryllium Nickel Alloy 360 (UNS N03360)
Properties of BERYLLIUM NICKEL:
Chemical composition: Ni 97.6%, Be 1.9%, Ti 0.5%
6
Modulus of Elasticity: 27-30x10 psi
3
Tensile Strength: 245x10 psi min.
3
Yield Strength (0.2% offset): 200x10 psi min.
Elongation: 9% min.
Hardness: 49 Rockwell C
Density: .294 lbs/in3
Electrical Conductivity: 7% IACS*
Melting point: 1,325°C/1,195°C (liquidus/solidus)
*International Annealed Copper Standard, i.e.: as a % of pure copper.
MILL-MAX® ELECTRONIC INTERCONNECT COMPONENTS
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MILL-MAX MFG. CORP.
190 PINE HOLLOW ROAD
PO BOX 300
OYSTER BAY, NY 11771-0300
PHONE: (516) 922-6000 FAX: (516) 922-9253
www.mill-max.com
PROPERTIES OF PLASTICS USED BY MILL-MAX
Injection Molded
PBT Polyester, Standard (Valox 420-SEO, black)
PCT Polyester, High Temp (Thermx CG933, black)
Nylon46, High Temp (Stanyl TE250F6 {30% glass} or TE250F9 {45% glass}, black)
PPS, High Temp (Ryton R-4-200)
Machined
FR-4 Epoxy/Glass Laminate
Thicknesses available: .010”, .020”, .031”, .047”, .062”, .093”, .125” (natural color, beige)
FR-4 Epoxy/Glass Laminate, .055” thick (black)
G-30 Polyimide/Glass Laminate, .062” thick (natural color, brown)
TEMPERATURE COMPARISON OF MILL-MAX MOLDED INSULATOR MATERIALS
MATERIAL
PBT Polyester
PCT Polyester
Nylon 46
PPS
BRAND
GRADE
Valox
Thermx
Stanyl
Ryton
420-SEO
CG-933
TE250-F6 or F9
R-4 -200
HEAT DEFLECTION
TEMP. (@ 264psi)
400°F
204°C
491°F
255°C
554°F
290°C
>500ºF
>260ºC
Note: Materials above 446°F (230°C) are considered suitable for “eutectic” reflow soldering, above 482°F (250°C)
for “lead-free” reflow soldering. PCT is the standard plastic used with RoHS “lead-free” plated pins.
MILL-MAX® ELECTRONIC INTERCONNECT COMPONENTS
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MILL-MAX MFG. CORP.
190 PINE HOLLOW ROAD
PO BOX 300
OYSTER BAY, NY 11771-0300
PHONE: (516) 922-6000 FAX: (516) 922-9253
www.mill-max.com
MILL-MAX STANDARD PLATINGS (FINISHES):
GOLD per ASTM B 488,
Type 1 (99.7% min. gold),
Code C (130-200 HK {Knoop hardness}),
Class (thickness) per customer’s requirements
SILVER per ASTM B 700,
Type 1 (99.9% min. silver),
Grade B (Bright),
Class S (anti-tarnish treatment),
Thickness (7.5µm/300µ” used for solder terminals)
TIN/LEAD (93/7) per ASTM B 545 (Appendix X6.3.2.5 to eliminate whisker growth)
Class A (2.5µm/100µ”) or Class B (5µm/200µ”),
Bright finish (Matte available to order)
ELECTRO-SOLDER (60/40) per ASTM B 579, SC2 (8µm/300µ”),
Bright finish (Matte available to order)
STANDARD FINISHES AVAILABLE FOR RoHS “lead-free” APPLICATIONS:
GOLD per ASTM B 488,
Type 1 (99.7% min. gold),
Code C (130-200 HK {Knoop hardness}),
Class (thickness) per customer’s requirements
TIN (100%) per ASTM B 545, Class A (2.5µm/100µ”) or Class B (5µm/200µ”),
Matte finish (With whisker and oxide inhibitors and a nickel underplate)
ALL MILL-MAX PARTS REQUIRE AN UNDERPLATE:
Brass parts need a barrier plate to prevent zinc diffusion, 50µ” min. nickel or 100µ” min. copper is recommended by
ASTM B 545 & 579. ASTM B 488 also recommends a 50µ” min. nickel barrier plate beneath gold to
prevent copper diffusion inherent with all copper alloy products.
MILL-MAX STANDARD UNDERPLATE:
NICKEL per ASTM B 689,
Type 2 (Bright),
Class 1.25 (1.25µm/50µ”) or Class 2.5 (2.5µm/100µ”)
ALSO AVAILABLE FOR MILITARY & “NON-MAGNETIC” APPLICATIONS:
COPPER per ASTM B 734,
Class 2.5 (2.5µm/100µ”) or Class 5 (5µm/200µ”)
MILL-MAX® ELECTRONIC INTERCONNECT COMPONENTS
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