RENESAS R5F21322ADSP

R8C/32A Group
REJ03B0229-0100
Rev.1.00
Sep 10, 2009
RENESAS MCU
1.
Overview
1.1
Features
The R8C/32A Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are
designed to maximize EMI/EMS performance.
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of
system components.
The R8C/32A Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.
1.1.1
Applications
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.
REJ03B0229-0100 Rev.1.00
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Sep 10, 2009
R8C/32A Group
1.1.2
1. Overview
Specifications
Tables 1.1 and 1.2 outline the Specifications for R8C/32A Group.
Table 1.1
Item
CPU
Specifications for R8C/32A Group (1)
Function
Central processing
unit
Memory
ROM, RAM, Data
flash
Power Supply Voltage detection
Voltage
circuit
Detection
I/O Ports
Programmable I/O
ports
Clock
Clock generation
circuits
Interrupts
Watchdog Timer
DTC (Data Transfer Controller)
Timer
Timer RA
Timer RB
Timer RC
Timer RE
REJ03B0229-0100 Rev.1.00
Page 2 of 53
Specification
R8C CPU core
• Number of fundamental instructions: 89
• Minimum instruction execution time:
50 ns (f(XIN) = 20 MHz, VCC = 2.7 to 5.5 V)
200 ns (f(XIN) = 5 MHz, VCC = 1.8 to 5.5 V)
• Multiplier: 16 bits × 16 bits → 32 bits
• Multiply-accumulate instruction: 16 bits × 16 bits + 32 bits → 32 bits
• Operation mode: Single-chip mode (address space: 1 Mbyte)
Refer to Table 1.3 Product List for R8C/32A Group.
• Power-on reset
• Voltage detection 3 (detection level of voltage detection 0 and voltage
detection 1 selectable)
• Input-only: 1 pin
• CMOS I/O ports: 15, selectable pull-up resistor
• High current drive ports: 15
• 3 circuits: XIN clock oscillation circuit,
XCIN clock oscillation circuit (32 kHz),
Low-speed on-chip oscillator,
• Oscillation stop detection: XIN clock oscillation stop detection function
• Frequency divider circuit: Dividing selectable 1, 2, 4, 8, and 16
• Low power consumption modes:
Standard operating mode (high-speed clock, low-speed clock, low-speed onchip oscillator), wait mode, stop mode
Real-time clock (timer RE)
• Number of interrupt vectors: 69
• External Interrupt: 7 (INT × 3, Key input × 4)
• Priority levels: 7 levels
• 14 bits × 1 (with prescaler)
• Reset start selectable
• Low-speed on-chip oscillator for watchdog timer selectable
• 1 channel
• Activation sources: 21
• Transfer modes: 2 (normal mode, repeat mode)
8 bits × 1 (with 8-bit prescaler)
Timer mode (period timer), pulse output mode (output level inverted every
period), event counter mode, pulse width measurement mode, pulse period
measurement mode
8 bits × 1 (with 8-bit prescaler)
Timer mode (period timer), programmable waveform generation mode (PWM
output), programmable one-shot generation mode, programmable wait oneshot generation mode
16 bits × 1 (with 4 capture/compare registers)
Timer mode (input capture function, output compare function), PWM mode
(output 3 pins), PWM2 mode (PWM output pin)
8 bits × 1
Real-time clock mode (count seconds, minutes, hours, days of week), output
compare mode
Sep 10, 2009
R8C/32A Group
Table 1.2
Item
Serial
Interface
1. Overview
Specifications for R8C/32A Group (2)
Function
UART0
UART2
Specification
Clock synchronous serial I/O/UART
Clock synchronous serial I/O/UART, I2C mode (I2C-bus),
multiprocessor communication function
1 (shared with I2C-bus)
Synchronous Serial
Communication Unit (SSU)
I2C bus
LIN Module
A/D Converter
Comparator A
Comparator B
Flash Memory
Operating Frequency/Supply
Voltage
Current consumption
Operating Ambient Temperature
Package
1 (shared with SSU)
Hardware LIN: 1 (timer RA, UART0)
10-bit resolution × 4 channels, includes sample and hold function, with sweep
mode
• 2 circuits (shared with voltage monitor 1 and voltage monitor 2)
• External reference voltage input available
2 circuits
• Programming and erasure voltage: VCC = 2.7 to 5.5 V
• Programming and erasure endurance: 10,000 times (data flash)
1,000 times (program ROM)
• Program security: ROM code protect, ID code check
• Debug functions: On-chip debug, on-board flash rewrite function
• Background operation (BGO) function
f(XIN) = 20 MHz (VCC = 2.7 to 5.5 V)
f(XIN) = 5 MHz (VCC = 1.8 to 5.5 V)
Typ. 6.5 mA (VCC = 5.0 V, f(XIN) = 20 MHz)
Typ. 3.5 mA (VCC = 3.0 V, f(XIN) = 10 MHz)
Typ. 3.5 µA (VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz))
Typ. 2.0 µA (VCC = 3.0 V, stop mode)
-20 to 85°C (N version)
-40 to 85°C (D version) (1)
20-pin LSSOP
Package code: PLSP0020JB-A (previous code: 20P2F-A)
Note:
1. Specify the D version if D version functions are to be used.
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Sep 10, 2009
R8C/32A Group
1.2
1. Overview
Product List
Table 1.3 lists Product List for R8C/32A Group, and Figure 1.1 shows a Part Number, Memory Size, and Package
of R8C/32A Group.
Table 1.3
Product List for R8C/32A Group
Part No.
R5F21321ANSP
R5F21322ANSP
R5F21324ANSP
R5F21321ADSP (P)
R5F21322ADSP (P)
R5F21324ADSP (P)
ROM Capacity
Program ROM
Data flash
4 Kbytes
1 Kbyte × 4
8 Kbytes
1 Kbyte × 4
16 Kbytes
1 Kbyte × 4
4 Kbytes
1 Kbyte × 4
8 Kbytes
1 Kbyte × 4
16 Kbytes
1 Kbyte × 4
Current of Sep. 2009
RAM
Capacity
512 bytes
1 Kbyte
1.5 Kbytes
512 bytes
1 Kbyte
1.5 Kbytes
Package Type
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
PLSP0020JB-A
Remarks
N version
D version
(P): Under planning
Part No.
R 5 F 21 32 4 A N SP
Package type:
SP: PLSP0020JB-A (0.65 mm pin-pitch)
Classification
N: Operating ambient temperature -20°C to 85°C
D: Operating ambient temperature -40°C to 85°C
ROM capacity
1: 4 KB
2: 8 KB
4: 16 KB
R8C/32A Group
R8C/3x Series
Memory type
F: Flash memory
Renesas MCU
Renesas semiconductor
Figure 1.1
Part Number, Memory Size, and Package of R8C/32A Group
REJ03B0229-0100 Rev.1.00
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Sep 10, 2009
R8C/32A Group
1.3
1. Overview
Block Diagram
Figure 1.2 shows a Block Diagram.
I/O ports
8
4
Port P1
Port P3
3
1
Port P4
Peripheral functions
Timers
Timer RA (8 bits × 1)
Timer RB (8 bits × 1)
Timer RC (16 bits × 1)
Timer RE (8 bits × 1)
UART or
clock synchronous serial I/O
(8 bits × 2)
System clock generation
circuit
XIN-XOUT
Low-speed on-chip oscillator
XCIN-XCOUT
I2C bus or SSU
(8 bits × 1)
Watchdog timer
(14 bits)
LIN module
Low-speed on-chip oscillator
for watchdog timer
Comparator B
A/D converter
(10 bits × 4 channels)
Voltage detection circuit
Comparator A
DTC
Memory
R8C CPU core
R0H
R1H
R0L
R1L
R2
R3
SB
ISP
INTB
A0
A1
FB
ROM (1)
USP
RAM (2)
PC
FLG
Multiplier
Notes:
1. ROM size varies with MCU type.
2. RAM size varies with MCU type.
Figure 1.2
Block Diagram
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Sep 10, 2009
R8C/32A Group
1.4
1. Overview
Pin Assignment
Figure 1.3 shows Pin Assignment (Top View). Table 1.4 outlines the Pin Name Information by Pin Number.
20
P1_0/AN8/LVCMP1/KI0(/TRCIOD)
2
19
P1_1/AN9/LVCMP2/KI1(/TRCIOA/TRCTRG)
RESET
3
18
P1_2/AN10/LVREF/Kl2(/TRCIOB)
P4_7/XOUT(/XCOUT)
4
VSS/AVSS
5
P4_6/XIN(/XCIN)
6
VCC/AVCC
7
P3_7/SDA/SSO/TRAO(/RXD2/SCL2/TXD2/SDA2)
8
P3_5/SCL/SSCK(/CLK2/TRCIOD)
9
10
P3_4/IVREF3/SSI(/RXD2/SCL2/TXD2/SDA2/TRCIOC)
R8C/32A Group
1
MODE
PLSP0020JB-A
(20P2F-A)
(top view)
P4_2/VREF
17
P1_3/AN11/LVCOUT1/Kl3/TRBO(/TRCIOC)
16
P1_4(/TXD0/TRCCLK)
15
P1_5(/INT1/RXD0/TRAIO)
14
P1_6/LVCOUT2/IVREF1(/CLK0)
13
P1_7/IVCMP1/INT1(/TRAIO)
12
P4_5/ADTRG/INT0(/RXD2/SCL2)
11
P3_3/IVCMP3/INT3/SCS(/CTS2/RTS2/TRCCLK)
Notes:
1. Can be assigned to the pin in parentheses by a program.
2. Confirm the pin 1 position on the package by referring to the package dimensions.
Figure 1.3
Pin Assignment (Top View)
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Sep 10, 2009
R8C/32A Group
Table 1.4
1. Overview
Pin Name Information by Pin Number
I/O Pin Functions for Peripheral Modules
Pin
Number
Control Pin
1
2
3
MODE
4
5
6
7
8
Port
Interrupt
Timer
Serial
Interface
SSU
I2C
bus
P4_2
RESET
XOUT(/XCOUT)
VSS/AVSS
XIN(/XCIN)
VCC/AVCC
P4_7
P4_6
P3_7
TRAO
9
10
P3_5
P3_4
(TRCIOD)
(TRCIOC)
11
P3_3
INT3
12
P4_5
INT0
13
P1_7
14
15
P1_6
P1_5
16
17
INT1
(RXD2/SCL2/ SSO
TXD2/SDA2)
(CLK2)
SSCK
(RXD2/SCL2/
SSI
TXD2/SDA2)
(TRCCLK) (CTS2/RTS2)
(RXD2/SCL2)
(TRAIO)
(INT1)
(TRAIO)
P1_4
P1_3
KI3
18
P1_2
KI2
(TRCCLK)
TRBO
(/TRCIOC)
(TRCIOB)
19
P1_1
KI1
20
P1_0
KI0
(CLK0)
(RXD0)
Sep 10, 2009
SCS
SDA
SCL
IVREF3
IVCMP3
ADTRG
IVCMP1
LVCOUT2/IVREF1
(TXD0)
(TRCIOA/
TRCTRG)
(TRCIOD)
Note:
1. Can be assigned to the pin in parentheses by a program.
REJ03B0229-0100 Rev.1.00
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A/D Converter,
Comparator A,
Comparator B,
Voltage Detection Circuit
VREF
AN11/LVCOUT1
AN10/LVREF
AN9/LVCMP2
AN8/LVCMP1
R8C/32A Group
1.5
1. Overview
Pin Functions
Tables 1.5 and 1.6 list Pin Functions.
Table 1.5
Pin Functions (1)
Item
Pin Name
I/O Type
Description
Power supply input
VCC, VSS
−
Apply 1.8 V to 5.5 V to the VCC pin. Apply 0 V to the VSS pin.
Analog power
supply input
AVCC, AVSS
−
Power supply for the A/D converter.
Connect a capacitor between AVCC and AVSS.
Reset input
RESET
I
Input “L” on this pin resets the MCU.
MODE
MODE
I
Connect this pin to VCC via a resistor.
XIN clock input
XIN
I
XIN clock output
XOUT
I/O
These pins are provided for XIN clock generation circuit I/O.
Connect a ceramic resonator or a crystal oscillator between
the XIN and XOUT pins (1). To use an external clock, input it
to the XOUT pin and leave the XIN pin open.
XCIN clock input
XCIN
I
XCIN clock output
XCOUT
O
INT interrupt input
INT0, INT1, INT3
I
INT interrupt input pins.
INT0 is timer RB, and RC input pin.
Key input interrupt
KI0 to KI3
I
Key input interrupt input pins
Timer RA
TRAIO
TRAO
O
Timer RA output pin
Timer RB
TRBO
O
Timer RB output pin
Timer RC
TRCCLK
I
External clock input pin
TRCTRG
I
External trigger input pin
Serial interface
I2C bus
SSU
I/O
These pins are provided for XCIN clock generation circuit I/O.
Connect a crystal oscillator between the XCIN and XCOUT
pins (1). To use an external clock, input it to the XCIN pin and
leave the XCOUT pin open.
Timer RA I/O pin
TRCIOA, TRCIOB,
TRCIOC, TRCIOD
I/O
Timer RC I/O pins
CLK0, CLK2
I/O
Transfer clock I/O pins
RXD0, RXD2
I
Serial data input pins
TXD0, TXD2
O
Serial data output pins
CTS2
I
Transmission control input pin
RTS2
O
Reception control output pin
SCL2
I/O
I2C mode clock I/O pin
SDA2
I/O
I2C mode data I/O pin
SCL
I/O
Clock I/O pin
SDA
I/O
Data I/O pin
SSI
I/O
Data I/O pin
SCS
I/O
Chip-select signal I/O pin
SSCK
I/O
Clock I/O pin
SSO
I/O
Data I/O pin
I: Input
O: Output
I/O: Input and output
Note:
1. Refer to the oscillator manufacturer for oscillation characteristics.
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Sep 10, 2009
R8C/32A Group
1. Overview
Table 1.6
Pin Functions (2)
Item
Pin Name
I/O Type
Description
Reference voltage input
VREF
I
Reference voltage input pin to A/D converter
A/D converter
AN8 to AN11
I
Analog input pins to A/D converter
ADTRG
I
AD external trigger input pin
LVCMP1, LVCMP2
I
Comparator A analog voltage input pins
LVREF
I
Comparator A reference voltage input pin
Comparator A
LVCOUT1, LVCOUT2
O
Comparator A output pins
Comparator B
IVCMP1, IVCMP3
I
Comparator B analog voltage input pins
IVREF1, IVREF3
I
Comparator B reference voltage input pins
Voltage detection circuit
LVCMP2
I
Detection voltage input pin for voltage detection 2
I/O port
P1_0 to P1_7,
P3_3 to P3_5, P3_7,
P4_5 to P4_7
Input port
P4_2
I: Input
O: Output
REJ03B0229-0100 Rev.1.00
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I/O: Input and output
Sep 10, 2009
I/O
I
CMOS I/O ports. Each port has an I/O select direction
register, allowing each pin in the port to be directed for
input or output individually.
Any port set to input can be set to use a pull-up resistor
or not by a program.
All ports can be used as LED drive ports.
Input-only port
R8C/32A Group
2.
2. Central Processing Unit (CPU)
Central Processing Unit (CPU)
Figure 2.1 shows the CPU Registers. The CPU contains 13 registers. R0, R1, R2, R3, A0, A1, and FB configure a
register bank. There are two sets of register bank.
b31
b15
R2
R3
b8b7
b0
R0H (high-order of R0) R0L (low-order of R0)
R1H (high-order of R1) R1L (low-order of R1)
Data registers (1)
R2
R3
A0
A1
FB
b19
b15
Address registers (1)
Frame base register (1)
b0
Interrupt table register
INTBL
INTBH
The 4 high order bits of INTB are INTBH and
the 16 low order bits of INTB are INTBL.
b19
b0
Program counter
PC
b15
b0
USP
User stack pointer
ISP
Interrupt stack pointer
SB
Static base register
b15
b0
FLG
b15
b8
IPL
b7
Flag register
b0
U I O B S Z D C
Carry flag
Debug flag
Zero flag
Sign flag
Register bank select flag
Overflow flag
Interrupt enable flag
Stack pointer select flag
Reserved bit
Processor interrupt priority level
Reserved bit
Note:
1. These registers comprise a register bank. There are two register banks.
Figure 2.1
CPU Registers
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Sep 10, 2009
R8C/32A Group
2.1
2. Central Processing Unit (CPU)
Data Registers (R0, R1, R2, and R3)
R0 is a 16-bit register for transfer, arithmetic, and logic operations. The same applies to R1 to R3. R0 can be split
into high-order bits (R0H) and low-order bits (R0L) to be used separately as 8-bit data registers. R1H and R1L are
analogous to R0H and R0L. R2 can be combined with R0 and used as a 32-bit data register (R2R0). R3R1 is
analogous to R2R0.
2.2
Address Registers (A0 and A1)
A0 is a 16-bit register for address register indirect addressing and address register relative addressing. It is also
used for transfer, arithmetic, and logic operations. A1 is analogous to A0. A1 can be combined with A0 and as a 32bit address register (A1A0).
2.3
Frame Base Register (FB)
FB is a 16-bit register for FB relative addressing.
2.4
Interrupt Table Register (INTB)
INTB is a 20-bit register that indicates the starting address of an interrupt vector table.
2.5
Program Counter (PC)
PC is 20 bits wide and indicates the address of the next instruction to be executed.
2.6
User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)
The stack pointers (SP), USP and ISP, are each 16 bits wide. The U flag of FLG is used to switch between
USP and ISP.
2.7
Static Base Register (SB)
SB is a 16-bit register for SB relative addressing.
2.8
Flag Register (FLG)
FLG is an 11-bit register indicating the CPU state.
2.8.1
Carry Flag (C)
The C flag retains carry, borrow, or shift-out bits that have been generated by the arithmetic and logic unit.
2.8.2
Debug Flag (D)
The D flag is for debugging only. Set it to 0.
2.8.3
Zero Flag (Z)
The Z flag is set to 1 when an arithmetic operation results in 0; otherwise to 0.
2.8.4
Sign Flag (S)
The S flag is set to 1 when an arithmetic operation results in a negative value; otherwise to 0.
2.8.5
Register Bank Select Flag (B)
Register bank 0 is selected when the B flag is 0. Register bank 1 is selected when this flag is set to 1.
2.8.6
Overflow Flag (O)
The O flag is set to 1 when an operation results in an overflow; otherwise to 0.
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Sep 10, 2009
R8C/32A Group
2.8.7
2. Central Processing Unit (CPU)
Interrupt Enable Flag (I)
The I flag enables maskable interrupts.
Interrupts are disabled when the I flag is set to 0, and are enabled when the I flag is set to 1. The I flag is set to 0
when an interrupt request is acknowledged.
2.8.8
Stack Pointer Select Flag (U)
ISP is selected when the U flag is set to 0; USP is selected when the U flag is set to 1.
The U flag is set to 0 when a hardware interrupt request is acknowledged or the INT instruction of software
interrupt numbers 0 to 31 is executed.
2.8.9
Processor Interrupt Priority Level (IPL)
IPL is 3 bits wide and assigns processor interrupt priority levels from level 0 to level 7.
If a requested interrupt has higher priority than IPL, the interrupt is enabled.
2.8.10
Reserved Bit
If necessary, set to 0. When read, the content is undefined.
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Sep 10, 2009
R8C/32A Group
3.
3. Memory
Memory
3.1
R8C/32A Group
Figure 3.1 is a Memory Map of R8C/32A Group. The R8C/32A Group has a 1-Mbyte address space from addresses
00000h to FFFFFh. The internal ROM (program ROM) is allocated lower addresses, beginning with address
0FFFFh. For example, a 16-Kbyte internal ROM area is allocated addresses 0C000h to 0FFFFh.
The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. The starting address of each interrupt
routine is stored here.
The internal ROM (data flash) is allocated addresses 03000h to 03FFFh.
The internal RAM is allocated higher addresses, beginning with address 00400h. For example, a 1.5-Kbyte internal
RAM area is allocated addresses 00400h to 009FFh. The internal RAM is used not only for data storage but also as
a stack area when a subroutine is called or when an interrupt request is acknowledged.
Special function registers (SFRs) are allocated addresses 00000h to 002FFh and 02C00h to 02FFFh. Peripheral
function control registers are allocated here. All unallocated spaces within the SFRs are reserved and cannot be
accessed by users.
00000h
002FFh
SFR
(Refer to 4. Special
Function Registers
(SFRs))
00400h
Internal RAM
0FFD8h
0XXXXh
02C00h
02FFFh
03000h
Reserved area
0FFDCh
SFR
(Refer to 4. Special Function
Registers (SFRs))
Undefined instruction
Overflow
BRK instruction
Address match
Single step
Internal ROM
(data flash) (1)
03FFFh
0YYYYh
Watchdog timer, oscillation stop detection, voltage monitor
(Reserved)
(Reserved)
Reset
Internal ROM
(program ROM)
0FFFFh
0FFFFh
Internal ROM
(program ROM)
ZZZZZh
FFFFFh
Notes:
1. Data flash indicates block A (1 Kbyte), block B (1 Kbyte), block C (1 Kbyte), and block D (1 Kbyte).
2. The blank areas are reserved and cannot be accessed by users.
Internal ROM
Part Number
R5F21321ANFP, R5F21321ADFP
R5F21322ANFP, R5F21322ADFP
R5F21324ANFP, R5F21324ADFP
Figure 3.1
Address 0YYYYh
Address ZZZZZh
Size
Address 0XXXXh
4 Kbytes
8 Kbytes
0F000h
0E000h
−
−
512 bytes
1 Kbyte
005FFh
007FFh
16 Kbytes
0C000h
−
1.5 Kbytes
009FFh
Memory Map of R8C/32A Group
REJ03B0229-0100 Rev.1.00
Page 13 of 53
Internal RAM
Size
Sep 10, 2009
R8C/32A Group
4.
4. Special Function Registers (SFRs)
Special Function Registers (SFRs)
An SFR (special function register) is a control register for a peripheral function. Tables 4.1 to 4.12 list the special
function registers. Table 4.13 lists the ID Code Areas and Option Function Select Area.
Table 4.1
Address
0000h
0001h
0002h
0003h
0004h
0005h
0006h
0007h
0008h
0009h
000Ah
000Bh
000Ch
000Dh
000Eh
000Fh
0010h
0011h
0012h
0013h
0014h
0015h
0016h
0017h
0018h
0019h
001Ah
001Bh
001Ch
001Dh
001Eh
001Fh
0020h
0021h
0022h
0023h
0024h
0025h
0026h
0027h
0028h
0029h
002Ah
002Bh
002Ch
002Dh
002Eh
002Fh
0030h
0031h
0032h
0033h
0034h
0035h
0036h
0037h
0038h
SFR Information (1) (1)
Register
Symbol
After Reset
Processor Mode Register 0
Processor Mode Register 1
System Clock Control Register 0
System Clock Control Register 1
Module Standby Control Register
System Clock Control Register 3
Protect Register
Reset Source Determination Register
Oscillation Stop Detection Register
Watchdog Timer Reset Register
Watchdog Timer Start Register
Watchdog Timer Control Register
PM0
PM1
CM0
CM1
MSTCR
CM3
PRCR
RSTFR
OCD
WDTR
WDTS
WDTC
00h
00h
00101000b
00100000b
00h
00h
00h
0XXXXXXXb (2)
00000100b
XXh
XXh
00111111b
Count Source Protection Mode Register
CSPR
00h
10000000b (3)
On-Chip Reference Voltage Control Register
OCVREFCR
00h
Clock Prescaler Reset Flag
CPSRF
00h
Voltage Monitor Circuit / Comparator A Control Register
Voltage Monitor Circuit Edge Select Register
CMPA
VCAC
00h
00h
Voltage Detect Register 1
Voltage Detect Register 2
VCA1
VCA2
00001000b
00h (4)
00100000b (5)
Voltage Detection 1 Level Select Register
VD1LS
00000111b
Voltage Monitor 0 Circuit Control Register
VW0C
1100X010b (4)
1100X011b (5)
10001010b
0039h
Voltage Monitor 1 Circuit Control Register
VW1C
X: Undefined
Notes:
1. The blank areas are reserved and cannot be accessed by users.
2. The CWR bit in the RSTFR register is set to 0 after power-on and voltage monitor 0 reset. Hardware reset, software reset, or watchdog timer
reset does not affect this bit.
3. The CSPROINI bit in the OFS register is set to 0.
4. The LVDAS bit in the OFS register is set to 1.
5. The LVDAS bit in the OFS register is set to 0.
REJ03B0229-0100 Rev.1.00
Page 14 of 53
Sep 10, 2009
R8C/32A Group
Table 4.2
4. Special Function Registers (SFRs)
SFR Information (2) (1)
Address
Register
003Ah
Voltage Monitor 2 Circuit Control Register
003Bh
003Ch
003Dh
003Eh
003Fh
0040h
0041h
Flash Memory Ready Interrupt Control Register
0042h
0043h
0044h
0045h
0046h
0047h
Timer RC Interrupt Control Register
0048h
0049h
004Ah
Timer RE Interrupt Control Register
004Bh
UART2 Transmit Interrupt Control Register
004Ch
UART2 Receive Interrupt Control Register
004Dh
Key Input Interrupt Control Register
004Eh
A/D Conversion Interrupt Control Register
004Fh
SSU Interrupt Control Register / IIC bus Interrupt Control Register (2)
0050h
0051h
UART0 Transmit Interrupt Control Register
0052h
UART0 Receive Interrupt Control Register
0053h
0054h
0055h
0056h
Timer RA Interrupt Control Register
0057h
0058h
Timer RB Interrupt Control Register
0059h
INT1 Interrupt Control Register
005Ah
INT3 Interrupt Control Register
005Bh
005Ch
005Dh
INT0 Interrupt Control Register
005Eh
UART2 Bus Collision Detection Interrupt Control Register
005Fh
0060h
0061h
0062h
0063h
0064h
0065h
0066h
0067h
0068h
0069h
006Ah
006Bh
006Ch
006Dh
006Eh
006Fh
0070h
0071h
0072h
Voltage Monitor 1 / Comparator A1 Interrupt Control Register
0073h
Voltage Monitor 2 / Comparator A2 Interrupt Control Register
0074h
0075h
0076h
0077h
0078h
0079h
007Ah
007Bh
007Ch
007Dh
007Eh
007Fh
X: Undefined
Notes:
1. The blank areas are reserved and cannot be accessed by users.
2. Selectable by the IICSEL bit in the SSUIICSR register.
REJ03B0229-0100 Rev.1.00
Page 15 of 53
Sep 10, 2009
VW2C
Symbol
After Reset
10000010b
FMRDYIC
XXXXX000b
TRCIC
XXXXX000b
TREIC
S2TIC
S2RIC
KUPIC
ADIC
SSUIC / IICIC
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
XXXXX000b
S0TIC
S0RIC
XXXXX000b
XXXXX000b
TRAIC
XXXXX000b
TRBIC
INT1IC
INT3IC
XXXXX000b
XX00X000b
XX00X000b
INT0IC
U2BCNIC
XX00X000b
XXXXX000b
VCMP1IC
VCMP2IC
XXXXX000b
XXXXX000b
R8C/32A Group
Table 4.3
Address
0080h
0081h
0082h
0083h
0084h
0085h
0086h
0087h
0088h
0089h
008Ah
008Bh
008Ch
008Dh
008Eh
008Fh
0090h
0091h
0092h
0093h
0094h
0095h
0096h
0097h
0098h
0099h
009Ah
009Bh
009Ch
009Dh
009Eh
009Fh
00A0h
00A1h
00A2h
00A3h
00A4h
00A5h
00A6h
00A7h
00A8h
00A9h
00AAh
00ABh
00ACh
00ADh
00AEh
00AFh
00B0h
00B1h
00B2h
00B3h
00B4h
00B5h
00B6h
00B7h
00B8h
00B9h
00BAh
00BBh
00BCh
00BDh
00BEh
00BFh
4. Special Function Registers (SFRs)
SFR Information (3) (1)
DTC Activation Control Register
Register
Symbol
DTCTL
00h
DTC Activation Enable Register 0
DTC Activation Enable Register 1
DTC Activation Enable Register 2
DTC Activation Enable Register 3
DTCEN0
DTCEN1
DTCEN2
DTCEN3
00h
00h
00h
00h
DTC Activation Enable Register 5
DTC Activation Enable Register 6
DTCEN5
DTCEN6
00h
00h
UART0 Transmit / Receive Mode Register
UART0 Bit Rate Register
UART0 Transmit Buffer Register
U0MR
U0BRG
U0TB
UART0 Transmit / Receive Control Register 0
UART0 Transmit / Receive Control Register 1
UART0 Receive Buffer Register
U0C0
U0C1
U0RB
UART2 Transmit / Receive Mode Register
UART2 Bit Rate Register
UART2 Transmit Buffer Register
U2MR
U2BRG
U2TB
UART2 Transmit / Receive Control Register 0
UART2 Transmit / Receive Control Register 1
UART2 Receive Buffer Register
U2C0
U2C1
U2RB
UART2 Digital Filter Function Select Register
URXDF
00h
XXh
XXh
XXh
00001000b
00000010b
XXh
XXh
00h
XXh
XXh
XXh
00001000b
00000010b
XXh
XXh
00h
UART2 Special Mode Register 5
UART2 Special Mode Register 4
UART2 Special Mode Register 3
UART2 Special Mode Register 2
UART2 Special Mode Register
U2SMR5
U2SMR4
U2SMR3
U2SMR2
U2SMR
00h
00h
000X0X0Xb
X0000000b
X0000000b
X: Undefined
Note:
1. The blank areas are reserved and cannot be accessed by users.
REJ03B0229-0100 Rev.1.00
Page 16 of 53
Sep 10, 2009
After Reset
R8C/32A Group
Table 4.4
Address
00C0h
00C1h
00C2h
00C3h
00C4h
00C5h
00C6h
00C7h
00C8h
00C9h
00CAh
00CBh
00CCh
00CDh
00CEh
00CFh
00D0h
00D1h
00D2h
00D3h
00D4h
00D5h
00D6h
00D7h
00D8h
00D9h
00DAh
00DBh
00DCh
00DDh
00DEh
00DFh
00E0h
00E1h
00E2h
00E3h
00E4h
00E5h
00E6h
00E7h
00E8h
00E9h
00EAh
00EBh
00ECh
00EDh
00EEh
00EFh
00F0h
00F1h
00F2h
00F3h
00F4h
00F5h
00F6h
00F7h
00F8h
00F9h
00FAh
00FBh
00FCh
00FDh
00FEh
00FFh
4. Special Function Registers (SFRs)
SFR Information (4) (1)
Register
Symbol
After Reset
XXh
000000XXb
XXh
000000XXb
XXh
000000XXb
XXh
000000XXb
XXh
000000XXb
XXh
000000XXb
XXh
000000XXb
XXh
000000XXb
A/D Register 0
AD0
A/D Register 1
AD1
A/D Register 2
AD2
A/D Register 3
AD3
A/D Register 4
AD4
A/D Register 5
AD5
A/D Register 6
AD6
A/D Register 7
AD7
A/D Mode Register
A/D Input Select Register
A/D Control Register 0
A/D Control Register 1
ADMOD
ADINSEL
ADCON0
ADCON1
00h
11000000b
00h
00h
Port P1 Register
P1
XXh
Port P1 Direction Register
PD1
00h
Port P3 Register
P3
XXh
Port P3 Direction Register
Port P4 Register
PD3
P4
00h
XXh
Port P4 Direction Register
PD4
00h
X: Undefined
Note:
1. The blank areas are reserved and cannot be accessed by users.
REJ03B0229-0100 Rev.1.00
Page 17 of 53
Sep 10, 2009
R8C/32A Group
Table 4.5
Address
0100h
0101h
0102h
0103h
0104h
0105h
0106h
0107h
0108h
0109h
010Ah
010Bh
010Ch
010Dh
010Eh
010Fh
0110h
0111h
0112h
0113h
0114h
0115h
0116h
0117h
0118h
0119h
011Ah
011Bh
011Ch
011Dh
011Eh
011Fh
0120h
0121h
0122h
0123h
0124h
0125h
0126h
0127h
0128h
0129h
012Ah
012Bh
012Ch
012Dh
012Eh
012Fh
0130h
0131h
0132h
0133h
0134h
0135h
0136h
0137h
0138h
0139h
013Ah
013Bh
013Ch
013Dh
013Eh
013Fh
Note:
1.
4. Special Function Registers (SFRs)
SFR Information (5) (1)
Timer RA Control Register
Timer RA I/O Control Register
Timer RA Mode Register
Timer RA Prescaler Register
Timer RA Register
LIN Control Register 2
LIN Control Register
LIN Status Register
Timer RB Control Register
Timer RB One-Shot Control Register
Timer RB I/O Control Register
Timer RB Mode Register
Timer RB Prescaler Register
Timer RB Secondary Register
Timer RB Primary Register
Register
Symbol
TRACR
TRAIOC
TRAMR
TRAPRE
TRA
LINCR2
LINCR
LINST
TRBCR
TRBOCR
TRBIOC
TRBMR
TRBPRE
TRBSC
TRBPR
00h
00h
00h
FFh
FFh
00h
00h
00h
00h
00h
00h
00h
FFh
FFh
FFh
Timer RE Second Data Register / Counter Data Register
Timer RE Minute Data Register / Compare Data Register
Timer RE Hour Data Register
Timer RE Day of Week Data Register
Timer RE Control Register 1
Timer RE Control Register 2
Timer RE Count Source Select Register
TRESEC
TREMIN
TREHR
TREWK
TRECR1
TRECR2
TRECSR
00h
00h
00h
00h
00h
00h
00001000b
Timer RC Mode Register
Timer RC Control Register 1
Timer RC Interrupt Enable Register
Timer RC Status Register
Timer RC I/O Control Register 0
Timer RC I/O Control Register 1
Timer RC Counter
TRCMR
TRCCR1
TRCIER
TRCSR
TRCIOR0
TRCIOR1
TRC
Timer RC General Register A
TRCGRA
Timer RC General Register B
TRCGRB
Timer RC General Register C
TRCGRC
Timer RC General Register D
TRCGRD
Timer RC Control Register 2
Timer RC Digital Filter Function Select Register
Timer RC Output Master Enable Register
Timer RC Trigger Control Register
TRCCR2
TRCDF
TRCOER
TRCADCR
01001000b
00h
01110000b
01110000b
10001000b
10001000b
00h
00h
FFh
FFh
FFh
FFh
FFh
FFh
FFh
FFh
00011000b
00h
01111111b
00h
The blank areas are reserved and cannot be accessed by users.
REJ03B0229-0100 Rev.1.00
Page 18 of 53
Sep 10, 2009
After Reset
R8C/32A Group
Table 4.6
4. Special Function Registers (SFRs)
SFR Information (6) (1)
Address
0140h
0141h
0142h
0143h
0144h
0145h
0146h
0147h
0148h
0149h
014Ah
014Bh
014Ch
014Dh
014Eh
014Fh
0150h
0151h
0152h
0153h
0154h
0155h
0156h
0157h
0158h
0159h
015Ah
015Bh
015Ch
015Dh
015Eh
015Fh
0160h
0161h
0162h
0163h
0164h
0165h
0166h
0167h
0168h
0169h
016Ah
016Bh
016Ch
016Dh
016Eh
016Fh
0170h
0171h
0172h
0173h
0174h
0175h
0176h
0177h
0178h
0179h
017Ah
017Bh
017Ch
017Dh
017Eh
017Fh
Register
X: Undefined
Note:
1. The blank areas are reserved and cannot be accessed by users.
REJ03B0229-0100 Rev.1.00
Page 19 of 53
Sep 10, 2009
Symbol
After Reset
R8C/32A Group
Table 4.7
Address
0180h
0181h
0182h
0183h
0184h
0185h
0186h
0187h
0188h
0189h
018Ah
018Bh
018Ch
018Dh
018Eh
018Fh
0190h
0191h
0192h
0193h
0194h
0195h
0196h
0197h
0198h
0199h
019Ah
019Bh
019Ch
019Dh
019Eh
019Fh
01A0h
01A1h
01A2h
01A3h
01A4h
01A5h
01A6h
01A7h
01A8h
01A9h
01AAh
01ABh
01ACh
01ADh
01AEh
01AFh
01B0h
01B1h
01B2h
01B3h
01B4h
01B5h
01B6h
01B7h
01B8h
01B9h
01BAh
01BBh
01BCh
01BDh
01BEh
01BFh
4. Special Function Registers (SFRs)
SFR Information (7) (1)
Timer RA Pin Select Register
Timer RC Pin Select Register
Timer RC Pin Select Register 0
Timer RC Pin Select Register 1
Register
Symbol
TRASR
TRBRCSR
TRCPSR0
TRCPSR1
00h
00h
00h
00h
UART0 Pin Select Register
U0SR
00h
UART2 Pin Select Register 0
UART2 Pin Select Register 1
SSU / IIC Pin Select Register
U2SR0
U2SR1
SSUIICSR
00h
00h
00h
INT Interrupt Input Pin Select Register
I/O Function Pin Select Register
INTSR
PINSR
00h
00h
SS Bit Counter Register
SS Transmit Data Register L / IIC bus Transmit Data Register (2)
SS Transmit Data Register H
SS Receive Data Register L / IIC bus Receive Data Register (2)
SS Receive Data Register H (2)
SS Control Register H / IIC bus Control Register 1 (2)
SS Control Register L / IIC bus Control Register 2 (2)
SS Mode Register / IIC bus Mode Register (2)
SS Enable Register / IIC bus Interrupt Enable Register (2)
SS Status Register / IIC bus Status Register (2)
SS Mode Register 2 / Slave Address Register (2)
SSBR
SSTDR / ICDRT
SSTDRH
SSRDR / ICDRR
SSRDRH
SSCRH / ICCR1
SSCRL / ICCR2
SSMR / ICMR
SSER / ICIER
SSSR / ICSR
SSMR2 / SAR
11111000b
FFh
FFh
FFh
FFh
00h
01111101b
00010000b / 00011000b
00h
00h / 0000X000b
00h
Flash Memory Status Register
FST
10000X00b
Flash Memory Control Register 0
Flash Memory Control Register 1
Flash Memory Control Register 2
FMR0
FMR1
FMR2
00h
00h
00h
X: Undefined
Notes:
1. The blank areas are reserved and cannot be accessed by users.
2. Selectable by the IICSEL bit in the SSUIICSR register.
REJ03B0229-0100 Rev.1.00
Page 20 of 53
Sep 10, 2009
After Reset
R8C/32A Group
Table 4.8
Address
01C0h
01C1h
01C2h
01C3h
01C4h
01C5h
01C6h
01C7h
01C8h
01C9h
01CAh
01CBh
01CCh
01CDh
01CEh
01CFh
01D0h
01D1h
01D2h
01D3h
01D4h
01D5h
01D6h
01D7h
01D8h
01D9h
01DAh
01DBh
01DCh
01DDh
01DEh
01DFh
01E0h
01E1h
01E2h
01E3h
01E4h
01E5h
01E6h
01E7h
01E8h
01E9h
01EAh
01EBh
01ECh
01EDh
01EEh
01EFh
01F0h
01F1h
01F2h
01F3h
01F4h
01F5h
01F6h
01F7h
01F8h
01F9h
01FAh
01FBh
01FCh
01FDh
01FEh
01FFh
4. Special Function Registers (SFRs)
SFR Information (8) (1)
Address Match Interrupt Register 0
Register
Symbol
RMAD0
Address Match Interrupt Enable Register 0
Address Match Interrupt Register 1
AIER0
RMAD1
Address Match Interrupt Enable Register 1
AIER1
After Reset
XXh
XXh
0000XXXXb
00h
XXh
XXh
0000XXXXb
00h
Pull-Up Control Register 0
Pull-Up Control Register 1
PUR0
PUR1
00h
00h
Port P1 Drive Capacity Control Register
P1DRR
00h
Drive Capacity Control Register 0
Drive Capacity Control Register 1
DRR0
DRR1
00h
00h
Input Threshold Control Register 0
Input Threshold Control Register 1
VLT0
VLT1
00h
00h
Comparator B Control Register 0
INTCMP
00h
External Input Enable Register 0
INTEN
00h
INT Input Filter Select Register 0
INTF
00h
Key Input Enable Register 0
KIEN
00h
X: Undefined
Note:
1. The blank areas are reserved and cannot be accessed by users.
REJ03B0229-0100 Rev.1.00
Page 21 of 53
Sep 10, 2009
R8C/32A Group
Table 4.9
Address
2C00h
2C01h
2C02h
2C03h
2C04h
2C05h
2C06h
2C07h
2C08h
2C09h
2C0Ah
:
:
2C3Ah
2C3Bh
2C3Ch
2C3Dh
2C3Eh
2C3Fh
2C40h
2C41h
2C42h
2C43h
2C44h
2C45h
2C46h
2C47h
2C48h
2C49h
2C4Ah
2C4Bh
2C4Ch
2C4Dh
2C4Eh
2C4Fh
2C50h
2C51h
2C52h
2C53h
2C54h
2C55h
2C56h
2C57h
2C58h
2C59h
2C5Ah
2C5Bh
2C5Ch
2C5Dh
2C5Eh
2C5Fh
2C60h
2C61h
2C62h
2C63h
2C64h
2C65h
2C66h
2C67h
2C68h
2C69h
2C6Ah
2C6Bh
2C6Ch
2C6Dh
2C6Eh
2C6Fh
4. Special Function Registers (SFRs)
SFR Information (9) (1)
Register
Symbol
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Transfer Vector Area
DTC Control Data 0
DTCD0
DTC Control Data 1
DTCD1
DTC Control Data 2
DTCD2
DTC Control Data 3
DTCD3
DTC Control Data 4
DTCD4
DTC Control Data 5
DTCD5
X: Undefined
Note:
1. The blank areas are reserved and cannot be accessed by users.
REJ03B0229-0100 Rev.1.00
Page 22 of 53
Sep 10, 2009
After Reset
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
R8C/32A Group
Table 4.10
Address
2C70h
2C71h
2C72h
2C73h
2C74h
2C75h
2C76h
2C77h
2C78h
2C79h
2C7Ah
2C7Bh
2C7Ch
2C7Dh
2C7Eh
2C7Fh
2C80h
2C81h
2C82h
2C83h
2C84h
2C85h
2C86h
2C87h
2C88h
2C89h
2C8Ah
2C8Bh
2C8Ch
2C8Dh
2C8Eh
2C8Fh
2C90h
2C91h
2C92h
2C93h
2C94h
2C95h
2C96h
2C97h
2C98h
2C99h
2C9Ah
2C9Bh
2C9Ch
2C9Dh
2C9Eh
2C9Fh
2CA0h
2CA1h
2CA2h
2CA3h
2CA4h
2CA5h
2CA6h
2CA7h
2CA8h
2CA9h
2CAAh
2CABh
2CACh
2CADh
2CAEh
2CAFh
4. Special Function Registers (SFRs)
SFR Information (10) (1)
DTC Control Data 6
Register
Symbol
DTCD6
DTC Control Data 7
DTCD7
DTC Control Data 8
DTCD8
DTC Control Data 9
DTCD9
DTC Control Data 10
DTCD10
DTC Control Data 11
DTCD11
DTC Control Data 12
DTCD12
DTC Control Data 13
DTCD13
X: Undefined
Note:
1. The blank areas are reserved and cannot be accessed by users.
REJ03B0229-0100 Rev.1.00
Page 23 of 53
Sep 10, 2009
After Reset
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
R8C/32A Group
Table 4.11
Address
2CB0h
2CB1h
2CB2h
2CB3h
2CB4h
2CB5h
2CB6h
2CB7h
2CB8h
2CB9h
2CBAh
2CBBh
2CBCh
2CBDh
2CBEh
2CBFh
2CC0h
2CC1h
2CC2h
2CC3h
2CC4h
2CC5h
2CC6h
2CC7h
2CC8h
2CC9h
2CCAh
2CCBh
2CCCh
2CCDh
2CCEh
2CCFh
2CD0h
2CD1h
2CD2h
2CD3h
2CD4h
2CD5h
2CD6h
2CD7h
2CD8h
2CD9h
2CDAh
2CDBh
2CDCh
2CDDh
2CDEh
2CDFh
2CE0h
2CE1h
2CE2h
2CE3h
2CE4h
2CE5h
2CE6h
2CE7h
2CE8h
2CE9h
2CEAh
2CEBh
2CECh
2CEDh
2CEEh
2CEFh
4. Special Function Registers (SFRs)
SFR Information (11) (1)
DTC Control Data 14
Register
Symbol
DTCD14
DTC Control Data 15
DTCD15
DTC Control Data 16
DTCD16
DTC Control Data 17
DTCD17
DTC Control Data 18
DTCD18
DTC Control Data 19
DTCD19
DTC Control Data 20
DTCD20
DTC Control Data 21
DTCD21
X: Undefined
Note:
1. The blank areas are reserved and cannot be accessed by users.
REJ03B0229-0100 Rev.1.00
Page 24 of 53
Sep 10, 2009
After Reset
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
R8C/32A Group
SFR Information (12) (1)
Table 4.12
Address
2CF0h
2CF1h
2CF2h
2CF3h
2CF4h
2CF5h
2CF6h
2CF7h
2CF8h
2CF9h
2CFAh
2CFBh
2CFCh
2CFDh
2CFEh
2CFFh
2D00h
:
2FFFh
4. Special Function Registers (SFRs)
DTC Control Data 22
Register
Symbol
DTCD22
DTC Control Data 23
DTCD23
After Reset
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
XXh
X: Undefined
Note:
1. The blank areas are reserved and cannot be accessed by users.
Table 4.13
ID Code Areas and Option Function Select Area
Address
:
FFDBh
:
FFDFh
:
FFE3h
:
FFEBh
:
FFEFh
:
FFF3h
:
FFF7h
:
FFFBh
:
FFFFh
Register
Notes:
1.
2.
Option Function Select Register 2
Symbol
OFS2
After Reset
(Note 1)
ID1
(Note 2)
ID2
(Note 2)
ID3
(Note 2)
ID4
(Note 2)
ID5
(Note 2)
ID6
(Note 2)
ID7
(Note 2)
Option Function Select Register
OFS
(Note 1)
The option function select area is allocated in the flash memory, not in the SFRs. Set appropriate values as ROM data by a program.
Do not write additions to the option function select area. If the block including the option function select area is erased, the option function select
area is set to FFh.
When blank products are shipped, the option function select area is set to FFh. It is set to the written value after written by the user.
When factory-programming products are shipped, the value of the option function select area is the value programmed by the user.
The ID code areas are allocated in the flash memory, not in the SFRs. Set appropriate values as ROM data by a program.
Do not write additions to the ID code areas. If the block including the ID code areas is erased, the ID code areas are set to FFh.
When blank products are shipped, the ID code areas are set to FFh. They are set to the written value after written by the user.
When factory-programming products are shipped, the value of the ID code areas is the value programmed by the user.
REJ03B0229-0100 Rev.1.00
Page 25 of 53
Sep 10, 2009
R8C/32A Group
5.
5. Electrical Characteristics
Electrical Characteristics
Table 5.1
Absolute Maximum Ratings
Symbol
Parameter
Rated Value
Unit
−0.3 to 6.5
V
Input voltage
−0.3 to VCC + 0.3
V
VO
Output voltage
−0.3 to VCC + 0.3
V
Pd
Power dissipation
500
mW
Topr
Operating ambient temperature
−20 to 85 (N version) /
−40 to 85 (D version)
°C
Tstg
Storage temperature
−65 to 150
°C
VCC/AVCC
Supply voltage
VI
REJ03B0229-0100 Rev.1.00
Page 26 of 53
Condition
−40°C ≤ Topr ≤ 85°C
Sep 10, 2009
R8C/32A Group
Table 5.2
5. Electrical Characteristics
Recommended Operating Conditions
Symbol
Parameter
Conditions
Standard
Min.
Typ.
Max.
Unit
VCC/AVCC Supply voltage
1.8
−
5.5
VSS/AVSS Supply voltage
−
0
−
V
0.8 VCC
−
VCC
V
VIH
Input “H” voltage
Other than CMOS input
CMOS
input
Input level Input level selection
switching : 0.35 VCC
function
(I/O port)
Input level selection
: 0.5 VCC
Input level selection
: 0.7 VCC
VIL
Input “L” voltage
4.0 V ≤ VCC ≤ 5.5 V
0.5 VCC
−
VCC
V
2.7 V ≤ VCC < 4.0 V 0.55 VCC
−
VCC
V
1.8 V ≤ VCC < 2.7 V 0.65 VCC
−
VCC
V
4.0 V ≤ VCC ≤ 5.5 V
0.65 VCC
−
VCC
V
2.7 V ≤ VCC < 4.0 V
0.7 VCC
−
VCC
V
1.8 V ≤ VCC < 2.7 V
0.8 VCC
−
VCC
V
4.0 V ≤ VCC ≤ 5.5 V
0.85 VCC
−
VCC
V
2.7 V ≤ VCC < 4.0 V 0.85 VCC
−
VCC
V
1.8 V ≤ VCC < 2.7 V 0.85 VCC
−
VCC
V
0
−
0.2 VCC
V
4.0 V ≤ VCC ≤ 5.5 V
0
−
0.2 VCC
V
2.7 V ≤ VCC < 4.0 V
0
−
0.2 VCC
V
1.8 V ≤ VCC < 2.7 V
0
−
0.2 VCC
V
4.0 V ≤ VCC ≤ 5.5 V
0
−
0.4 VCC
V
2.7 V ≤ VCC < 4.0 V
0
−
0.3 VCC
V
1.8 V ≤ VCC < 2.7 V
0
−
0.2 VCC
V
4.0 V ≤ VCC ≤ 5.5 V
0
−
0.55 VCC
V
2.7 V ≤ VCC < 4.0 V
0
−
0.45 VCC
V
1.8 V ≤ VCC < 2.7 V
0
−
0.35 VCC
V
−
−
−160
mA
Other than CMOS input
CMOS
input
Input level Input level selection
switching : 0.35 VCC
function
(I/O port)
Input level selection
: 0.5 VCC
Input level selection
: 0.7 VCC
V
IOH(sum)
Peak sum output “H” current
Sum of all pins IOH(peak)
IOH(sum)
Average sum output “H” current Sum of all pins IOH(avg)
−
−
−80
mA
IOH(peak)
Peak output “H” current
Drive capacity Low
−
−
−10
mA
Drive capacity High
−
−
−40
mA
Drive capacity Low
−
−
−5
mA
mA
IOH(avg)
Average output “H” current
Drive capacity High
−
−
−20
IOL(sum)
Peak sum output “L” current
Sum of all pins IOL(peak)
−
−
160
mA
IOL(sum)
Average sum output “L” current
Sum of all pins IOL(avg)
−
−
80
mA
IOL(peak)
Peak output “L” current
Drive capacity Low
−
−
10
mA
Drive capacity High
−
−
40
mA
Drive capacity Low
−
−
5
mA
IOL(avg)
Average output “L” current
−
−
20
mA
f(XIN)
XIN clock input oscillation frequency
2.7 V ≤ VCC ≤ 5.5 V
−
−
20
MHz
1.8 V ≤ VCC < 2.7 V
−
−
5
MHz
f(XCIN)
XCIN clock input oscillation frequency
1.8 V ≤ VCC ≤ 5.5 V
−
32.768
50
kHz
−
System clock frequency
2.7 V ≤ VCC ≤ 5.5 V
−
−
20
MHz
1.8 V ≤ VCC < 2.7 V
−
−
5
MHz
f(BCLK)
CPU clock frequency
2.7 V ≤ VCC ≤ 5.5 V
−
−
20
MHz
1.8 V ≤ VCC < 2.7 V
−
−
5
MHz
Drive capacity High
Notes:
1. VCC = 1.8 to 5.5 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. The average output current indicates the average value of current measured during 100 ms.
REJ03B0229-0100 Rev.1.00
Page 27 of 53
Sep 10, 2009
R8C/32A Group
5. Electrical Characteristics
P1
P3
P4
Figure 5.1
30 pF
Ports P1, P3, P4 Timing Measurement Circuit
REJ03B0229-0100 Rev.1.00
Page 28 of 53
Sep 10, 2009
R8C/32A Group
Table 5.3
5. Electrical Characteristics
A/D Converter Characteristics
Symbol
Parameter
−
Resolution
−
Absolute accuracy
Min.
A/D conversion clock
Typ.
Max.
Unit
−
−
10
Bit
Vref = AVCC = 5.0 V
AN8 to AN11 input
−
−
±3
LSB
Vref = AVCC = 3.3 V
AN8 to AN11 input
−
−
±5
LSB
Vref = AVCC = 3.0 V
AN8 to AN11 input
−
−
±5
LSB
Vref = AVCC = 2.2 V
AN8 to AN11 input
−
−
±5
LSB
Vref = AVCC = 5.0 V
AN8 to AN11 input
−
−
±2
LSB
Vref = AVCC = 3.3 V
AN8 to AN11 input
−
−
±2
LSB
Vref = AVCC = 3.0 V
AN8 to AN11 input
−
−
±2
LSB
Vref = AVCC = 2.2 V
AN8 to AN11 input
−
−
±2
LSB
4.0 V ≤ Vref = AVCC ≤ 5.5 V (2)
2
−
20
MHz
3.2 V ≤ Vref = AVCC ≤ 5.5 V (2)
2
−
16
MHz
2.7 V ≤ Vref = AVCC ≤ 5.5 V (2)
2
−
10
MHz
2.2 V ≤ Vref = AVCC ≤ 5.5 V
2
−
5
MHz
Vref = AVCC
10-bit mode
8-bit mode
φAD
Standard
Conditions
(2)
−
Tolerance level impedance
−
3
−
kΩ
DNL
Differential non-linearity error
−
−
±1
LSB
tCONV
Conversion time
10-bit mode
Vref = AVCC = 5.0 V, φAD = 20 MHz
2.15
−
−
µs
8-bit mode
Vref = AVCC = 5.0 V, φAD = 20 MHz
2.15
−
−
µs
0.75
−
−
µs
−
45
−
µA
2.2
−
AVCC
V
0
−
Vref
V
tSAMP
Sampling time
φAD = 20 MHz
IVref
Vref current
VCC = 5 V, XIN = f1 = φAD = 20 MHz
Vref
Reference voltage
VIA
Analog input voltage (3)
Notes:
1. VCC/AVCC = Vref = 2.2 to 5.5 V, VSS = 0 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise
specified.
2. When the CPU and flash memory stop, the A/D conversion result will be undefined.
3. When the analog input voltage is over the reference voltage, the A/D conversion result will be 3FFh in 10-bit mode and FFh in
8-bit mode.
REJ03B0229-0100 Rev.1.00
Page 29 of 53
Sep 10, 2009
R8C/32A Group
Table 5.4
5. Electrical Characteristics
Comparator A Electrical Characteristics
Symbol
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
LVREF
External reference voltage input range
1.4
−
VCC
V
LVCMP1,
LVCMP2
External comparison voltage input
range
−0.3
−
VCC + 0.3
V
−
Offset
mV
−
Comparator output delay time (2)
−
Comparator operating current
−
50
200
At falling, VI = Vref − 100 mV
−
3
−
µs
At falling, VI = Vref − 1 V or below
−
1.5
−
µs
At rising, VI = Vref + 100 mV
−
2
−
µs
At rising, VI = Vref + 1 V or above
−
0.5
−
µs
VCC = 5.0 V
−
0.5
−
µA
Notes:
1. VCC = 2.7 to 5.5 V, Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. When the digital filter is disabled.
Table 5.5
Comparator B Electrical Characteristics
Symbol
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
0
−
VCC − 1.4
−0.3
−
VCC + 0.3
V
−
5
100
mV
V
Vref
IVREF1, IVREF3 input reference voltage
VI
IVCMP1, IVCMP3 input voltage
−
Offset
td
Comparator output delay time (2)
VI = Vref ± 100 mV
−
0.1
−
µs
ICMP
Comparator operating current
VCC = 5.0 V
−
17.5
−
µA
Notes:
1. VCC = 2.7 to 5.5 V, Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. When the digital filter is disabled.
REJ03B0229-0100 Rev.1.00
Page 30 of 53
Sep 10, 2009
R8C/32A Group
Table 5.6
5. Electrical Characteristics
Flash Memory (Program ROM) Electrical Characteristics
Symbol
Parameter
Conditions
Standard
Min.
Typ.
Max.
1,000 (3)
Unit
−
Program/erase endurance (2)
−
−
times
−
Byte program time
−
80
−
µs
−
Block erase time
−
0.3
−
s
td(SR-SUS)
Time delay from suspend request until
suspend
−
−
5 + CPU clock
× 3 cycles
ms
−
Interval from erase start/restart until
following suspend request
33
−
−
ms
−
Suspend interval necessary for autoerasure to complete
33
−
−
ms
−
Time from suspend until erase restart
−
−
30 + CPU clock
× 1 cycle
µs
−
Program, erase voltage
2.7
−
5.5
V
−
Read voltage
1.8
−
5.5
V
−
Program, erase temperature
0
−
60
°C
−
Data hold time (7)
20
−
−
year
Ambient temperature = 55°C
Notes:
1. VCC = 2.7 to 5.5 V at Topr = 0 to 60°C, unless otherwise specified.
2. Definition of programming/erasure endurance
The programming and erasure endurance is defined on a per-block basis.
If the programming and erasure endurance is n (n = 1,000), each block can be erased n times. For example, if 1,024 1-byte
writes are performed to different addresses in block A, a 1 Kbyte block, and then the block is erased, the
programming/erasure endurance still stands at one.
However, the same address must not be programmed more than once per erase operation (overwriting prohibited).
3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed).
4. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential
addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example,
when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups
before erasing them all in one operation. It is also advisable to retain data on the erasure endurance of each block and limit
the number of erase operations to a certain number.
5. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase
command at least three times until the erase error does not occur.
6. Customers desiring program/erase failure rate information should contact their Renesas technical support representative.
7. The data hold time includes time that the power supply is off or the clock is not supplied.
REJ03B0229-0100 Rev.1.00
Page 31 of 53
Sep 10, 2009
R8C/32A Group
Table 5.7
5. Electrical Characteristics
Flash Memory (Data flash Block A to Block D) Electrical Characteristics
Symbol
Parameter
Standard
Conditions
Min.
Typ.
Max.
10,000 (3)
Unit
−
Program/erase endurance (2)
−
−
times
−
Byte program time
(program/erase endurance ≤ 1,000 times)
−
160
−
µs
−
Byte program time
(program/erase endurance > 1,000 times)
−
300
−
µs
−
Block erase time
(program/erase endurance ≤ 1,000 times)
−
0.2
−
s
−
Block erase time
(program/erase endurance > 1,000 times)
−
0.3
−
s
td(SR-SUS)
Time delay from suspend request until
suspend
−
−
5 + CPU clock
× 3 cycles
ms
−
Interval from erase start/restart until
following suspend request
33
−
−
ms
−
Suspend interval necessary for autoerasure to complete
33
−
−
ms
−
Time from suspend until erase restart
−
−
30 + CPU clock
× 1 cycle
µs
−
Program, erase voltage
2.7
−
5.5
V
−
Read voltage
1.8
−
5.5
V
−
Program, erase temperature
−20 (7)
−
85
°C
−
Data hold time (8)
20
−
−
year
Ambient temperature = 55°C
Notes:
1. VCC = 2.7 to 5.5 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. Definition of programming/erasure endurance
The programming and erasure endurance is defined on a per-block basis.
If the programming and erasure endurance is n (n = 10,000), each block can be erased n times. For example, if 1,024 1-byte
writes are performed to different addresses in block A, a 1 Kbyte block, and then the block is erased, the
programming/erasure endurance still stands at one.
However, the same address must not be programmed more than once per erase operation (overwriting prohibited).
3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed).
4. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential
addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example,
when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups
before erasing them all in one operation. In addition, averaging the erasure endurance between blocks A to D can further
reduce the actual erasure endurance. It is also advisable to retain data on the erasure endurance of each block and limit the
number of erase operations to a certain number.
5. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase
command at least three times until the erase error does not occur.
6. Customers desiring program/erase failure rate information should contact their Renesas technical support representative.
7. −40°C for D version.
8. The data hold time includes time that the power supply is off or the clock is not supplied.
Suspend request
(FMR21 bit)
FST6 bit
Fixed time
Clock-dependent
time
td(SR-SUS)
FST6: Bit in FST register
FMR21: Bit in FMR2 register
Figure 5.2
Time delay until Suspend
REJ03B0229-0100 Rev.1.00
Page 32 of 53
Sep 10, 2009
Access restart
R8C/32A Group
Table 5.8
5. Electrical Characteristics
Voltage Detection 0 Circuit Electrical Characteristics
Symbol
Vdet0
Parameter
Condition
Standard
Unit
Min.
Typ.
Max.
Voltage detection level Vdet0_0 (2)
1.80
1.90
2.05
V
Voltage detection level Vdet0_1 (2)
2.15
2.35
2.50
V
Voltage detection level Vdet0_2
(2)
2.65
2.85
3.00
V
Voltage detection level Vdet0_3
(2)
3.55
3.80
4.05
V
−
6
150
µs
−
1.5
−
µA
−
−
100
µs
−
Voltage detection 0 circuit response time (4)
At the falling of VCC from 5 V
to (Vdet0_0 − 0.1) V
−
Voltage detection circuit self power consumption
VCA25 = 1, VCC = 5.0 V
td(E-A)
Waiting time until voltage detection circuit
operation starts (3)
Notes:
1. The measurement condition is VCC = 1.8 V to 5.5 V and Topr = −20 to 85°C (N version) / −40 to 85°C (D version).
2. Select the voltage detection level with bits VDSEL0 and VDSEL1 in the OFS register.
3. Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA25 bit in the VCA2
register to 0.
4. Time until the voltage monitor 0 reset is generated after the voltage passes Vdet0.
Table 5.9
Voltage Detection 1 Circuit Electrical Characteristics
Symbol
Vdet1
Parameter
Typ.
Max.
Unit
At the falling of VCC
2.00
2.20
2.40
V
(2)
At the falling of VCC
2.15
2.35
2.55
V
Voltage detection level Vdet1_2 (2)
At the falling of VCC
2.30
2.50
2.70
V
Voltage detection level Vdet1_3 (2)
At the falling of VCC
2.45
2.65
2.85
V
Voltage detection level Vdet1_4 (2)
At the falling of VCC
2.60
2.80
3.00
V
Voltage detection level Vdet1_5
(2)
At the falling of VCC
2.75
2.95
3.15
V
Voltage detection level Vdet1_6
(2)
At the falling of VCC
2.90
3.10
3.30
V
Voltage detection level Vdet1_7 (2)
At the falling of VCC
3.05
3.25
3.45
V
Voltage detection level Vdet1_8 (2)
At the falling of VCC
3.20
3.40
3.60
V
Voltage detection level Vdet1_9
(2)
At the falling of VCC
3.35
3.55
3.75
V
Voltage detection level Vdet1_A
(2)
At the falling of VCC
3.50
3.70
3.90
V
Voltage detection level Vdet1_B (2)
At the falling of VCC
3.65
3.85
4.05
V
Voltage detection level Vdet1_C (2)
At the falling of VCC
3.80
4.00
4.20
V
Voltage detection level Vdet1_D
(2)
At the falling of VCC
3.95
4.15
4.35
V
Voltage detection level Vdet1_E
(2)
At the falling of VCC
4.10
4.30
4.50
V
Voltage detection level Vdet1_F (2)
At the falling of VCC
4.25
4.45
4.65
V
Hysteresis width at the rising of Vcc in voltage
detection 1 circuit
Vdet1_0 to Vdet1_5
selected
−
0.07
−
V
Vdet1_6 to Vdet1_F
selected
−
0.10
−
V
−
60
150
µs
−
1.7
−
µA
−
−
100
µs
−
Voltage detection 1 circuit response time (3)
At the falling of Vcc from 5 V
to (Vdet1_0 − 0.1) V
−
Voltage detection circuit self power consumption
VCA26 = 1, VCC = 5.0 V
td(E-A)
Waiting time until voltage detection circuit operation
starts (4)
Notes:
1.
2.
3.
4.
Standard
Min.
Voltage detection level Vdet1_0 (2)
Voltage detection level Vdet1_1
−
Condition
The measurement condition is VCC = 1.8 V to 5.5 V and Topr = −20 to 85°C (N version) / −40 to 85°C (D version).
Select the voltage detection level with bits VD1S0 to VD1S3 in the VD1LS register.
Time until the voltage monitor 1 interrupt request is generated after the voltage passes Vdet1.
Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA26 bit in the VCA2
register to 0.
REJ03B0229-0100 Rev.1.00
Page 33 of 53
Sep 10, 2009
R8C/32A Group
Table 5.10
5. Electrical Characteristics
Voltage Detection 2 Circuit Electrical Characteristics
Symbol
Vdet2
Parameter
Standard
Condition
Min.
Unit
Max.
Voltage detection level Vdet2_0 (2)
At the falling of VCC
3.70
4.00
4.30
V
Voltage detection level Vdet2_EXT (2)
At the falling of LVCMP2
1.20
1.34
1.48
V
−
0.10
−
V
−
20
150
µs
−
1.7
−
µA
−
−
100
µs
−
Hysteresis width at the rising of Vcc in voltage detection
2 circuit
−
Voltage detection 2 circuit response time (3)
At the falling of Vcc from
5 V to (Vdet2_0 − 0.1) V
−
Voltage detection circuit self power consumption
VCA27 = 1, VCC = 5.0 V
td(E-A)
Waiting time until voltage detection circuit operation
starts (4)
Notes:
1.
2.
3.
4.
Typ.
The measurement condition is VCC = 1.8 V to 5.5 V and Topr = −20 to 85°C (N version) / −40 to 85°C (D version).
The voltage detection level varies with detection targets. Select the level with the VCA24 bit in the VCA2 register.
Time until the voltage monitor 2 interrupt request is generated after the voltage passes Vdet2.
Necessary time until the voltage detection circuit operates after setting to 1 again after setting the VCA27 bit in the VCA2
register to 0.
Table 5.11
Power-on Reset Circuit (2)
Symbol
Parameter
Condition
Standard
Min.
Typ.
Max.
0
−
50000
External power VCC rise gradient
trth
Unit
mV/msec
Notes:
1. The measurement condition is Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. To use the power-on reset function, enable voltage monitor 0 reset by setting the LVDAS bit in the OFS register to 0.
Vdet0 (1)
Vdet0 (1)
trth
trth
External
Power VCC
0.5 V
Voltage detection 0
circuit response time
tw(por) (2)
Internal
reset signal
1
× 32
fOCO-S
1
× 32
fOCO-S
Notes:
1. Vdet0 indicates the voltage detection level of the voltage detection 0 circuit. Refer to 6. Voltage Detection
Circuit of Hardware Manual (REJ09B0458) for details.
2. tw(por) indicates the duration the external power VCC must be held below the valid voltage (0.5 V) to enable
a power-on reset. When turning on the power after it falls with voltage monitor 0 reset disabled, maintain
tw(por) for 1 ms or more.
Figure 5.3
Power-on Reset Circuit Electrical Characteristics
REJ03B0229-0100 Rev.1.00
Page 34 of 53
Sep 10, 2009
R8C/32A Group
Table 5.12
5. Electrical Characteristics
Low-speed On-Chip Oscillator Circuit Electrical Characteristics
Symbol
Parameter
Condition
Standard
Min.
Typ.
Max.
Unit
fOCO-S
Low-speed on-chip oscillator frequency
60
125
250
−
Oscillation stability time
VCC = 5.0 V, Topr = 25°C
−
30
100
kHz
µs
−
Self power consumption at oscillation
VCC = 5.0 V, Topr = 25°C
−
2
−
µA
Note:
1. VCC = 1.8 to 5.5 V, Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
Table 5.13
Power Supply Circuit Timing Characteristics
Symbol
td(P-R)
Parameter
Condition
Time for internal power supply stabilization during
power-on(2)
Notes:
1. The measurement condition is VCC = 1.8 to 5.5 V and Topr = 25°C.
2. Waiting time until the internal power supply generation circuit stabilizes during power-on.
REJ03B0229-0100 Rev.1.00
Page 35 of 53
Sep 10, 2009
Standard
Min.
Typ.
Max.
−
−
2000
Unit
µs
R8C/32A Group
Table 5.14
Symbol
5. Electrical Characteristics
Timing Requirements of Synchronous Serial Communication Unit (SSU) (1)
Parameter
Conditions
Standard
Min.
Typ.
Unit
Max.
tSUCYC
SSCK clock cycle time
4
−
−
tCYC (2)
tHI
SSCK clock “H” width
0.4
−
0.6
tSUCYC
tLO
SSCK clock “L” width
0.4
−
0.6
tSUCYC
tRISE
SSCK clock rising
time
Master
−
−
1
tCYC (2)
Slave
−
−
1
µs
tFALL
SSCK clock falling
time
Master
−
−
1
tCYC (2)
−
−
1
µs
tSU
SSO, SSI data input setup time
100
−
−
ns
tH
SSO, SSI data input hold time
1
−
−
tCYC (2)
tLEAD
Slave
SCS setup time
Slave
1tCYC + 50
−
−
ns
tLAG
SCS hold time
Slave
1tCYC + 50
−
−
ns
tOD
SSO, SSI data output delay time
tSA
SSI slave access time
tOR
SSI slave out open time
−
−
1
tCYC (2)
2.7 V ≤ VCC ≤ 5.5 V
−
−
1.5tCYC + 100
ns
1.8 V ≤ VCC < 2.7 V
−
−
1.5tCYC + 200
ns
2.7 V ≤ VCC ≤ 5.5 V
−
−
1.5tCYC + 100
ns
1.8 V ≤ VCC < 2.7 V
−
−
1.5tCYC + 200
ns
Notes:
1. VCC = 1.8 to 5.5 V, VSS = 0 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. 1tCYC = 1/f1(s)
REJ03B0229-0100 Rev.1.00
Page 36 of 53
Sep 10, 2009
R8C/32A Group
5. Electrical Characteristics
4-Wire Bus Communication Mode, Master, CPHS = 1
VIH or VOH
SCS (output)
VIL or VOL
tHI
tFALL
tRISE
SSCK (output)
(CPOS = 1)
tLO
tHI
SSCK (output)
(CPOS = 0)
tLO
tSUCYC
SSO (output)
tOD
SSI (input)
tSU
tH
4-Wire Bus Communication Mode, Master, CPHS = 0
VIH or VOH
SCS (output)
VIL or VOL
tHI
tFALL
tRISE
SSCK (output)
(CPOS = 1)
tLO
tHI
SSCK (output)
(CPOS = 0)
tLO
tSUCYC
SSO (output)
tOD
SSI (input)
tSU
tH
CPHS, CPOS: Bits in SSMR register
Figure 5.4
I/O Timing of Synchronous Serial Communication Unit (SSU) (Master)
REJ03B0229-0100 Rev.1.00
Page 37 of 53
Sep 10, 2009
R8C/32A Group
5. Electrical Characteristics
4-Wire Bus Communication Mode, Slave, CPHS = 1
VIH or VOH
SCS (input)
VIL or VOL
tLEAD
tHI
tFALL
tRISE
tLAG
SSCK (input)
(CPOS = 1)
tLO
tHI
SSCK (input)
(CPOS = 0)
tLO
tSUCYC
SSO (input)
tSU
tH
SSI (output)
tSA
tOD
tOR
4-Wire Bus Communication Mode, Slave, CPHS = 0
VIH or VOH
SCS (input)
VIL or VOL
tLEAD
tHI
tFALL
tRISE
tLAG
SSCK (input)
(CPOS = 1)
tLO
tHI
SSCK (input)
(CPOS = 0)
tLO
tSUCYC
SSO (input)
tSU
tH
SSI (output)
tSA
tOD
tOR
CPHS, CPOS: Bits in SSMR register
Figure 5.5
I/O Timing of Synchronous Serial Communication Unit (SSU) (Slave)
REJ03B0229-0100 Rev.1.00
Page 38 of 53
Sep 10, 2009
R8C/32A Group
5. Electrical Characteristics
tHI
VIH or VOH
SSCK
VIL or VOL
tLO
tSUCYC
SSO (output)
tOD
SSI (input)
tSU
Figure 5.6
tH
I/O Timing of Synchronous Serial Communication Unit (SSU) (Clock Synchronous
Communication Mode)
REJ03B0229-0100 Rev.1.00
Page 39 of 53
Sep 10, 2009
R8C/32A Group
Table 5.15
5. Electrical Characteristics
Timing Requirements of I2C bus Interface (1)
Symbol
Parameter
Condition
tSCL
SCL input cycle time
tSCLH
SCL input “H” width
tSCLL
SCL input “L” width
tsf
tSP
SCL, SDA input fall time
SCL, SDA input spike pulse rejection time
tBUF
Standard
Typ.
(2)
−
12tCYC + 600
(2)
−
3tCYC + 300
Min.
Max.
−
Unit
−
ns
ns
5tCYC + 500 (2)
−
−
−
−
ns
−
300
−
SDA input bus-free time
5tCYC (2)
−
1tCYC (2)
−
ns
ns
tSTAH
Start condition input hold time
3tCYC (2)
−
−
ns
tSTAS
Retransmit start condition input setup time
3tCYC (2)
−
−
ns
tSTOP
Stop condition input setup time
3tCYC (2)
−
−
ns
tSDAS
Data input setup time
−
−
ns
tSDAH
Data input hold time
1tCYC + 40 (2)
10
−
−
ns
Notes:
1. VCC = 1.8 to 5.5 V, VSS = 0 V and Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.
2. 1tCYC = 1/f1(s)
VIH
SDA
VIL
tBUF
tSTAH
tSCLH
tSTAS
tSP
tSTOP
SCL
P(2)
S(1)
tsf
Sr(3)
tSCLL
tsr
tSCL
Notes:
1. Start condition
2. Stop condition
3. Retransmit start condition
Figure 5.7
I/O Timing of I2C bus Interface
REJ03B0229-0100 Rev.1.00
Page 40 of 53
Sep 10, 2009
P(2)
tSDAS
tSDAH
ns
R8C/32A Group
Table 5.16
5. Electrical Characteristics
Electrical Characteristics (1) [4.2 V ≤ Vcc ≤ 5.5 V]
Symbol
Parameter
VOH
Output “H” voltage
VOL
Output “L” voltage
VT+-VT-
Hysteresis
IIH
IIL
RPULLUP
RfXIN
RfXCIN
VRAM
Drive capacity High
Drive capacity Low
Drive capacity High
Drive capacity Low
INT0, INT1, INT3,
KI0, KI1, KI2, KI3,
TRAIO, TRBO,
TRCIOA, TRCIOB,
TRCIOC, TRCIOD,
TRCTRG, TRCCLK,
ADTRG,
RXD0, RXD2,
CLK0, CLK2,
SSI, SCL, SDA, SSO
RESET
Input “H” current
Input “L” current
Pull-up resistance
Feedback XIN
resistance
Feedback XCIN
resistance
RAM hold voltage
Standard
Min.
Typ.
VCC = 5.0 V IOH = −20 mA VCC − 2.0
−
VCC = 5.0 V IOH = −5 mA VCC − 2.0
−
VCC = 5.0 V IOL = 20 mA
−
−
VCC = 5.0 V IOL = 5 mA
−
−
0.1
1.2
Condition
VI = 5 V, VCC = 5.0 V
VI = 0 V, VCC = 5.0 V
VI = 0 V, VCC = 5.0 V
During stop mode
Max.
VCC
VCC
2.0
2.0
−
Unit
V
V
V
V
V
0.1
1.2
−
V
−
−
µA
−
25
−
−
50
0.3
5.0
−5.0
100
−
µA
kΩ
MΩ
−
8
−
MΩ
1.8
−
−
V
Note:
1. 4.2 V ≤ VCC ≤ 5.5 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), f(XIN) = 20 MHz, unless otherwise specified.
REJ03B0229-0100 Rev.1.00
Page 41 of 53
Sep 10, 2009
R8C/32A Group
Table 5.17
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (2) [3.3 V ≤ Vcc ≤ 5.5 V]
(Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.)
Parameter
Condition
Power supply current High-speed XIN = 20 MHz (square wave)
(VCC = 3.3 to 5.5 V)
clock mode Low-speed on-chip oscillator on = 125 kHz
No division
Single-chip mode,
output pins are open,
XIN = 16 MHz (square wave)
Low-speed on-chip oscillator on = 125 kHz
other pins are VSS
Min.
−
Standard
Typ.
Max.
6.5
15
Unit
mA
−
5.3
12.5
mA
XIN = 10 MHz (square wave)
Low-speed on-chip oscillator on = 125 kHz
No division
−
3.6
−
mA
XIN = 20 MHz (square wave)
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
−
3.0
−
mA
XIN = 16 MHz (square wave)
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
−
2.2
−
mA
XIN = 10 MHz (square wave)
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8
−
1.5
−
mA
XIN clock off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR27 = 1, VCA20 = 0
−
90
400
µA
XIN clock off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz
No division
FMR27 = 1, VCA20 = 0
−
85
400
µA
XIN clock off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz
No division
Program operation on RAM
Flash memory off, FMSTP = 1, VCA20 = 0
−
47
−
µA
XIN clock off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0, VCA20 = 1
−
15
100
µA
XIN clock off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0, VCA20 = 1
−
4
90
µA
XIN clock off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (peripheral clock off)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0, VCA20 = 1
−
3.5
−
µA
XIN clock off, Topr = 25°C
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
−
2.0
5.0
µA
XIN clock off, Topr = 85°C
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
−
5.0
−
µA
No division
Low-speed
on-chip
oscillator
mode
Low-speed
clock mode
Wait mode
Stop mode
REJ03B0229-0100 Rev.1.00
Page 42 of 53
Sep 10, 2009
R8C/32A Group
5. Electrical Characteristics
Timing Requirements
(Unless Otherwise Specified: VCC = 5 V, VSS = 0 V at Topr = 25°C)
Table 5.18
XIN Input, XCIN Input
Symbol
tc(XIN)
tWH(XIN)
tWL(XIN)
tc(XCIN)
tWH(XCIN)
tWL(XCIN)
Standard
Min.
Max.
50
−
24
−
24
−
14
−
7
−
7
−
Parameter
XIN input cycle time
XIN input “H” width
XIN input “L” width
XCIN input cycle time
XCIN input “H” width
XCIN input “L” width
tC(XIN)
Unit
ns
ns
ns
µs
µs
µs
VCC = 5 V
tWH(XIN)
XIN input
tWL(XIN)
Figure 5.8
Table 5.19
XIN Input and XCIN Input Timing Diagram when VCC = 5 V
TRAIO Input
Symbol
tc(TRAIO)
tWH(TRAIO)
tWL(TRAIO)
Standard
Min.
Max.
100
−
40
−
40
−
Parameter
TRAIO input cycle time
TRAIO input “H” width
TRAIO input “L” width
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.9
TRAIO Input Timing Diagram when VCC = 5 V
REJ03B0229-0100 Rev.1.00
Page 43 of 53
Sep 10, 2009
Unit
ns
ns
ns
VCC = 5 V
R8C/32A Group
Table 5.20
5. Electrical Characteristics
Serial Interface
Symbol
tc(CK)
tW(CKH)
tW(CKL)
td(C-Q)
th(C-Q)
tsu(D-C)
th(C-D)
Standard
Min.
Max.
200
−
100
−
100
−
−
50
0
−
50
−
90
−
Parameter
CLKi input cycle time
CLKi input “H” width
CLKi input “L” width
TXDi output delay time
TXDi hold time
RXDi input setup time
RXDi input hold time
Unit
ns
ns
ns
ns
ns
ns
ns
i = 0, 2
VCC = 5 V
tC(CK)
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TXDi
td(C-Q)
tsu(D-C)
th(C-D)
RXDi
i = 0, 2
Figure 5.10
Table 5.21
Serial Interface Timing Diagram when VCC = 5 V
External Interrupt INTi (i = 0, 1, 3) Input, Key Input Interrupt KIi (i = 0 to 3)
INTi input “H” width, KIi input “H” width
Standard
Min.
Max.
−
250 (1)
INTi input “L” width, KIi input “L” width
250 (2)
Symbol
tW(INH)
tW(INL)
Parameter
−
Unit
ns
ns
Notes:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 5 V
INTi input
(i = 0, 1, 3)
tW(INL)
KIi input
(i = 0 to 3)
Figure 5.11
tW(INH)
Input Timing for External Interrupt INTi and Key Input Interrupt KIi when Vcc = 5 V
REJ03B0229-0100 Rev.1.00
Page 44 of 53
Sep 10, 2009
R8C/32A Group
Table 5.22
5. Electrical Characteristics
Electrical Characteristics (3) [2.7 V ≤ Vcc < 4.2 V]
Symbol
Parameter
VOH
Output “H” voltage
VOL
Output “L” voltage
VT+-VT-
Hysteresis
IIH
IIL
RPULLUP
RfXIN
RfXCIN
VRAM
RESET
Input “H” current
Input “L” current
Pull-up resistance
Feedback resistance XIN
Feedback resistance XCIN
RAM hold voltage
INT0, INT1, INT3,
KI0, KI1, KI2, KI3,
TRAIO, TRBO,
TRCIOA, TRCIOB,
TRCIOC, TRCIOD,
TRCTRG, TRCCLK,
ADTRG,
RXD0, RXD2,
CLK0, CLK2,
SSI, SCL, SDA, SSO
Condition
Drive capacity High
Drive capacity Low
Drive capacity High
Drive capacity Low
VCC = 3.0 V
VCC = 3.0 V
VI = 3 V, VCC = 3.0 V
VI = 0 V, VCC = 3.0 V
VI = 0 V, VCC = 3.0 V
During stop mode
IOH = −5 mA
IOH = −1 mA
IOL = 5 mA
IOL = 1 mA
Standard
Min.
Typ.
VCC − 0.5
−
VCC − 0.5
−
−
−
−
−
0.1
0.4
Max.
VCC
VCC
0.5
0.5
−
Unit
V
V
V
V
V
0.1
0.5
−
V
−
−
µA
−
42
−
−
1.8
−
84
0.3
8
−
4.0
−4.0
168
−
−
−
µA
kΩ
MΩ
MΩ
V
Note:
1. 2.7 V ≤ VCC < 4.2 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), f(XIN) = 10 MHz, unless otherwise specified.
REJ03B0229-0100 Rev.1.00
Page 45 of 53
Sep 10, 2009
R8C/32A Group
Table 5.23
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (4) [2.7 V ≤ Vcc < 3.3 V]
(Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.)
Parameter
Condition
Power supply current High-speed XIN = 10 MHz (square wave)
(VCC = 2.7 to 3.3 V)
clock mode Low-speed on-chip oscillator on = 125 kHz
No division
Single-chip mode,
output pins are open,
XIN = 10 MHz (square wave)
Low-speed on-chip oscillator on = 125 kHz
other pins are VSS
Min.
−
Standard
Typ.
Max.
3.5
10
Unit
mA
−
1.5
7.5
mA
−
90
390
µA
−
80
400
µA
XIN clock off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz
No division
Program operation on RAM
Flash memory off, FMSTP = 1, VCA20 = 0
−
40
−
µA
XIN clock off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0, VCA20 = 1
−
15
90
µA
XIN clock off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0, VCA20 = 1
−
4
80
µA
XIN clock off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (peripheral clock off)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0, VCA20 = 1
−
3.5
−
µA
XIN clock off, Topr = 25°C
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
−
2.0
5.0
µA
XIN clock off, Topr = 85°C
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
−
5.0
−
µA
Divide-by-8
Low-speed
on-chip
oscillator
mode
XIN clock off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR27 = 1, VCA20 = 0
Low-speed XIN clock off
clock mode Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz
No division
FMR27 = 1, VCA20 = 0
Wait mode
Stop mode
REJ03B0229-0100 Rev.1.00
Page 46 of 53
Sep 10, 2009
R8C/32A Group
5. Electrical Characteristics
Timing requirements
(Unless Otherwise Specified: VCC = 3 V, VSS = 0 V at Topr = 25°C)
XIN Input, XCIN Input
Table 5.24
Symbol
tc(XIN)
tWH(XIN)
tWL(XIN)
tc(XCIN)
tWH(XCIN)
tWL(XCIN)
Standard
Min.
Max.
50
−
24
−
24
−
14
−
7
−
7
−
Parameter
XIN input cycle time
XIN input “H” width
XIN input “L” width
XCIN input cycle time
XCIN input “H” width
XCIN input “L” width
tC(XIN)
Unit
ns
ns
ns
µs
µs
µs
VCC = 3 V
tWH(XIN)
XIN input
tWL(XIN)
XIN Input and XCIN Input Timing Diagram when VCC = 3 V
Figure 5.12
Table 5.25
TRAIO Input
Symbol
tc(TRAIO)
tWH(TRAIO)
tWL(TRAIO)
Standard
Min.
Max.
300
−
120
−
120
−
Parameter
TRAIO input cycle time
TRAIO input “H” width
TRAIO input “L” width
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.13
TRAIO Input Timing Diagram when VCC = 3 V
REJ03B0229-0100 Rev.1.00
Page 47 of 53
Sep 10, 2009
Unit
ns
ns
ns
VCC = 3 V
R8C/32A Group
Table 5.26
5. Electrical Characteristics
Serial Interface
Symbol
tc(CK)
tW(CKH)
tW(CKL)
td(C-Q)
th(C-Q)
tsu(D-C)
th(C-D)
Standard
Min.
Max.
300
−
150
−
150
−
−
80
0
−
70
−
90
−
Parameter
CLKi input cycle time
CLKi input “H” width
CLKi Input “L” width
TXDi output delay time
TXDi hold time
RXDi input setup time
RXDi input hold time
Unit
ns
ns
ns
ns
ns
ns
ns
i = 0, 2
VCC = 3 V
tC(CK)
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TXDi
td(C-Q)
tsu(D-C)
th(C-D)
RXDi
i = 0, 2
Figure 5.14
Table 5.27
Serial Interface Timing Diagram when VCC = 3 V
External Interrupt INTi (i = 0, 1, 3) Input, Key Input Interrupt KIi (i = 0 to 3)
INTi input “H” width, KIi input “H” width
Standard
Min.
Max.
−
380 (1)
INTi input “L” width, KIi input “L” width
380 (2)
Symbol
tW(INH)
tW(INL)
Parameter
Unit
−
ns
ns
Notes:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 3 V
INTi input
(i = 0, 1, 3)
tW(INL)
KIi input
(i = 0 to 3)
Figure 5.15
tW(INH)
Input Timing for External Interrupt INTi and Key Input Interrupt KIi when Vcc = 3 V
REJ03B0229-0100 Rev.1.00
Page 48 of 53
Sep 10, 2009
R8C/32A Group
Table 5.28
5. Electrical Characteristics
Electrical Characteristics (5) [1.8 V ≤ Vcc < 2.7 V]
Symbol
Parameter
VOH
Output “H” voltage
VOL
Output “L” voltage
VT+-VT-
Hysteresis
IIH
IIL
RPULLUP
RfXIN
RfXCIN
VRAM
RESET
Input “H” current
Input “L” current
Pull-up resistance
Feedback resistance XIN
Feedback resistance XCIN
RAM hold voltage
Condition
Drive capacity High
Drive capacity Low
Drive capacity High
Drive capacity Low
IOH = −2 mA
IOH = −1 mA
IOL = 2 mA
IOL = 1 mA
INT0, INT1, INT3,
KI0, KI1, KI2, KI3,
TRAIO, TRBO,
TRCIOA, TRCIOB,
TRCIOC, TRCIOD,
TRCTRG, TRCCLK,
ADTRG,
RXD0, RXD2,
CLK0, CLK2,
SSI, SCL, SDA, SSO
VI = 2.2 V, VCC = 2.2 V
VI = 0 V, VCC = 2.2 V
VI = 0 V, VCC = 2.2 V
During stop mode
Standard
Min.
Typ.
VCC − 0.5
−
VCC − 0.5
−
−
−
−
−
0.05
0.2
Max.
VCC
VCC
0.5
0.5
−
Unit
V
V
V
V
V
0.05
0.20
−
V
−
−
µA
−
70
−
−
1.8
−
140
0.3
8
−
4.0
−4.0
300
−
−
−
µA
kΩ
MΩ
MΩ
V
Note:
1. 1.8 V ≤ VCC < 2.7 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), f(XIN) = 5 MHz, unless otherwise specified.
REJ03B0229-0100 Rev.1.00
Page 49 of 53
Sep 10, 2009
R8C/32A Group
Table 5.29
Symbol
ICC
5. Electrical Characteristics
Electrical Characteristics (6) [1.8 V ≤ Vcc < 2.7 V]
(Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.)
Parameter
Condition
Power supply current High-speed XIN = 5 MHz (square wave)
(VCC = 1.8 to 2.7 V)
clock mode Low-speed on-chip oscillator on = 125 kHz
No division
Single-chip mode,
output pins are open,
XIN = 5 MHz (square wave)
Low-speed on-chip oscillator on = 125 kHz
other pins are VSS
Min.
−
Standard
Typ.
Max.
2.2
−
Unit
mA
−
0.8
−
mA
XIN clock off
Low-speed on-chip oscillator on = 125 kHz
Divide-by-8, FMR27 = 1, VCA20 = 0
−
90
300
µA
XIN clock off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz
No division
FMR27 = 1, VCA20 = 0
−
80
350
µA
XIN clock off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz
No division
Program operation on RAM
Flash memory off, FMSTP = 1, VCA20 = 0
−
40
−
µA
XIN clock off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock operation
VCA27 = VCA26 = VCA25 = 0, VCA20 = 1
−
15
90
µA
XIN clock off
Low-speed on-chip oscillator on = 125 kHz
While a WAIT instruction is executed
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0, VCA20 = 1
−
4
80
µA
XIN clock off
Low-speed on-chip oscillator off
XCIN clock oscillator on = 32 kHz (peripheral clock off)
While a WAIT instruction is executed
VCA27 = VCA26 = VCA25 = 0, VCA20 = 1
−
3.5
−
µA
XIN clock off, Topr = 25°C
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
−
2.0
5
µA
XIN clock off, Topr = 85°C
Low-speed on-chip oscillator off
CM10 = 1
Peripheral clock off
VCA27 = VCA26 = VCA25 = 0
−
5.0
−
µA
Divide-by-8
Low-speed
on-chip
oscillator
mode
Low-speed
clock mode
Wait mode
Stop mode
REJ03B0229-0100 Rev.1.00
Page 50 of 53
Sep 10, 2009
R8C/32A Group
5. Electrical Characteristics
Timing requirements
(Unless Otherwise Specified: VCC = 2.2 V, VSS = 0 V at Topr = 25°C)
XIN Input, XCIN Input
Table 5.30
Symbol
tc(XIN)
tWH(XIN)
tWL(XIN)
tc(XCIN)
tWH(XCIN)
tWL(XCIN)
Standard
Min.
Max.
200
−
90
−
90
−
14
−
7
−
7
−
Parameter
XIN input cycle time
XIN input “H” width
XIN input “L” width
XCIN input cycle time
XCIN input “H” width
XCIN input “L” width
tC(XIN)
Unit
ns
ns
ns
µs
µs
µs
VCC = 2.2 V
tWH(XIN)
XIN input
tWL(XIN)
Figure 5.16
XIN Input and XCIN Input Timing Diagram when VCC = 2.2 V
Table 5.31
TRAIO Input
Symbol
tc(TRAIO)
tWH(TRAIO)
tWL(TRAIO)
Standard
Min.
Max.
500
−
200
−
200
−
Parameter
TRAIO input cycle time
TRAIO input “H” width
TRAIO input “L” width
tC(TRAIO)
tWH(TRAIO)
TRAIO input
tWL(TRAIO)
Figure 5.17
TRAIO Input Timing Diagram when VCC = 2.2 V
REJ03B0229-0100 Rev.1.00
Page 51 of 53
Sep 10, 2009
Unit
ns
ns
ns
VCC = 2.2 V
R8C/32A Group
Table 5.32
5. Electrical Characteristics
Serial Interface
Symbol
tc(CK)
tW(CKH)
tW(CKL)
td(C-Q)
th(C-Q)
tsu(D-C)
th(C-D)
Standard
Min.
Max.
800
−
400
−
400
−
−
200
0
−
150
−
90
−
Parameter
CLKi input cycle time
CLKi input “H” width
CLKi input “L” width
TXDi output delay time
TXDi hold time
RXDi input setup time
RXDi input hold time
Unit
ns
ns
ns
ns
ns
ns
ns
i = 0, 2
VCC = 2.2 V
tC(CK)
tW(CKH)
CLKi
tW(CKL)
th(C-Q)
TXDi
td(C-Q)
tsu(D-C)
th(C-D)
RXDi
i = 0, 2
Figure 5.18
Table 5.33
Serial Interface Timing Diagram when VCC = 2.2 V
External Interrupt INTi (i = 0, 1, 3) Input, Key Input Interrupt KIi (i = 0 to 3)
INTi input “H” width, KIi input “H” width
Standard
Min.
Max.
−
1000 (1)
INTi input “L” width, KIi input “L” width
1000 (2)
Symbol
tW(INH)
tW(INL)
Parameter
−
Unit
ns
ns
Notes:
1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock
frequency × 3) or the minimum value of standard, whichever is greater.
VCC = 2.2 V
INTi input
(i = 0, 1, 3)
tW(INL)
KIi input
(i = 0 to 3)
Figure 5.19
tW(INH)
Input Timing for External Interrupt INTi and Key Input Interrupt KIi when Vcc = 2.2 V
REJ03B0229-0100 Rev.1.00
Page 52 of 53
Sep 10, 2009
R8C/32A Group
Package Dimensions
Package Dimensions
Diagrams showing the latest package dimensions and mounting information are available in the “Packages” section of
the Renesas Technology website.
JEITA Package Code
P-LSSOP20-4.4x6.5-0.65
RENESAS Code
PLSP0020JB-A
MASS[Typ.]
0.1g
11
*1
E
20
HE
Previous Code
20P2F-A
NOTE)
1. DIMENSIONS "*1" AND "*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION "*3" DOES NOT
INCLUDE TRIM OFFSET.
F
1
Index mark
10
c
A1
Reference Dimension in Millimeters
Symbol
D
A
L
*2
A2
*3
e
bp
Detail F
y
D
E
A2
A
A1
bp
c
HE
e
y
L
REJ03B0229-0100 Rev.1.00
Page 53 of 53
Sep 10, 2009
Min
6.4
4.3
Nom Max
6.5 6.6
4.4 4.5
1.15
1.45
0.1 0.2
0
0.17 0.22 0.32
0.13 0.15 0.2
0°
10°
6.2 6.4 6.6
0.53 0.65 0.77
0.10
0.3 0.5 0.7
REVISION HISTORY
REVISION HISTORY
R8C/32A Group Datasheet
R8C/32A Group Datasheet
Description
Rev.
Date
0.01
Oct 26, 2007
−
First Edition issued
0.02
Feb 05, 2008
2
Table 1.1 Interrupts: Specification “• Number of interrupt vectors: 42” →
“• Number of interrupt vectors: 69”
3
Table 1.2 Serial Interface: Specification revised, Note1 deleted
6
Figure 1.3 revised
7
Table 1.4 revised
8
Table 1.5 XIN clock input, XIN clock output: revised
Note2 added
13
Figure 3.1 “Expanded area” deleted, Note1 revised
9
Table 1.6 Reference voltage input: revised
15
Table 4.2 004Fh, 0072h, 0073h: revised
16
Table 4.3 008Ch: deleted
20
Table 4.7 0181h, 0186h: revised
018Fh: deleted
0.10
Apr 01, 2008
Page
Summary
26 to 52 5. Electrical Characteristics
0.20
Dec 05, 2008
1
1.1 “... These MCUs also use an .... designed to withstand EMI.” →
“... These MCUs are ... EMI/EMS performance.”
2
Table 1.1 revised
3
Table 1.2 revised
4
Figure 1.1 “FP” → “SP”
5
Figure 1.2 revised
6
Figure 1.3 revised
14
Table 4.1 000Bh: After Reset “0XXX00XXb” → “0XXXXXXXb”
Note2 revised
17
Table 4.4 00C0h: “XXXh” → “XXh”
20
Table 4.7 019Ah: After Reset “00010000b /” added
018Fh added
26, 27, 29 Table 5.1 to Table 5.14, Table 5.16 to Table 5.18,
to 35, 37 Table 5.23 to Table 5.25, Table 5.29, Table 5.30 revised
to 42, 45 Figure 5.3 to Figure 5.6 revised
to 47, 49,
50
1.00
Sep 10, 2009 All pages “Preliminary” “Under development” “High-speed on-chip oscillator”
deleted
4
Table 1.3 revised
8
Table 1.5 Note 2 deleted
25
Table 4.12 revised, Table 4.13 added
27
Table 5.2 revised, Note 3 deleted
31, 32
Table 5.6, Table 5.7 revised
33
Table 5.8, Table 5.9 revised
C-1
REVISION HISTORY
Rev.
Date
1.00
Sep 10, 2009
R8C/32A Group Datasheet
Description
Page
Summary
34
Table 5.10, Table 5.11 revised
35
Old Table 5.12 deleted
41, 45, 49 Table 5.16, Table 5.22, Table 5.28 revised
42, 46, 50 Table 5.17, Table 5.23, Table 5.29 revised
44, 48, 52 Table 5.21, Table 5.27, Table 5.33 INT0 → INTi
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C-2
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