PO3B3253A - Potato IC

PO3B3253A
www.potatosemi.com
Dual 4:1 Mux/DeMux
High Bandwidth Potato Chip
FEATURES:
DESCRIPTION:
• Patented technology
• High signal -3db passing bandwidth at 750 MHz
• Near-Zero propagation delay
• VCC = 1.65V to 3.6V
• Ultra-Low Quiescent Power: 0.1µA typical
• Ideally suited for low power applications
• Industrial operating temperature: -40°C to +85°C
• Available in 16pin 173mil wide TSSOP package
• Available in 16pin 150mil wide SOIC package
• Available in 16pin 150mil wide QSOP package
Potato Semiconductor’s PO3B3253A is
designed for world top performance using
submicron CMOS technology to achieve 750 MHz
high bandwidth.
Pin Configuration
Block Diagram
EA
1
16
VCC
S1
2
15
EB
IA3
IA2
14
3
13
4
IB3
EB
S0
S1
5
12
IA0
6
11
IB1
YA
7
10
IB0
GND
8
9
YB
Potato Semiconductor Corporation
Description
Data Inputs
Select Inputs
Enable
Data Outputs
Ground
Power
IA1
IA2
IA3
IB0
IB1
IB2
IB3
SW
S0
IA1
Pin Description
IA0
EA
IB2
Pin Name
IAN, IBN
S0-1
EA, EB
YA, YB
GND
VCC
The PO3B3253A is a Dual 4:1 Multiplexer /
Demultiplexer with 3-state outputs. The switch
introduces no additional ground bounce noise or
propagation delay.
SW
SW
SW
SW
Y
I
SW
SW
E
SW
SW
YA
YB
Truth Table
Enable
Select
YA
YB
Function
Hi-Z
X
Disable A
X
X
Hi-Z
Disable B
L
IA 0
IB0
S1-0 = 0
L
H
IA 1
IB1
S1-0 = 1
L
H
L
IA 2
IB2
S1-0 = 2
L
H
H
IA 3
IB3
S1-0 = 3
EA
EB
S1
S0
H
X
X
X
X
H
X
L
L
L
L
L
L
L
1
01/01/10
PO3B3253A
www.potatosemi.com
Dual 4:1 Mux/DeMux
High Bandwidth Potato Chip
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ................................................ –65°C to +150°C
Ambient Temperature with Power Applied ............... –40°C to +85°C
Supply Voltage to Ground Potential ........................... –0.5V to +4.6V
DC Input Voltage ........................................................ –0.5V to +Vcc
DC Output Current................................................................... 120mA
Power Dissipation ....................................................................... 0.5W
Note:
Stresses greater than those listed under
MAXIMUM RATINGS may cause permanent
damage to the device. This is a stress rating
only and functional operation of the device at
these or any other conditions above those
indicated in the operational sections of this
specification is not implied. Exposure to
absolute maximum rating conditions for
extended periods may affect reliability.
DC Electrical Characteristics, 3.3V Supply
(Over the Operating Range, TA = –40°C to +85°C, VCC = 3.3V ±10%)
Parameters
Description
Min.
Test Conditions
Max.
Typ.
VIH
Input HIGH Voltage
Guaranteed Logic HIGH Level
VIL
Input LOW Voltage
Guaranteed Logic LOW Level
0.8
IIH
Input HIGH Current
VCC = Max., VIN = VCC
±1
IIL
Input LOW Current
VCC = Max., VIN = GND
±1
IOZH
High Impedance Output Current 0
Y, In
2.0
VCC
ION = -48 mA or -64mA
Switch On-Resistance
V
A
±1
VCC = Min., VIN = 0.0V,
RON
Units
VCC = Min., VIN = VCC , ION = -15 mA
17
22
17
22
DC Electrical Characteristics, 2.5V Supply
(Over Operating Range, TA = –40°C to +85°C, VCC = 2.5V ± 10%)
Parameters
Description
Test Conditions
Min.
Typ.
Max.
VIH
Input HIGH Voltage
Guaranteed Logic HIGH Level
1.8
VCC + 0.3
VIL
Inout LOW Voltage
Guaranteed Logic LOW Level
–0.3
0.8
IIH
Input HIGH Current
VCC = Max., VIN = VCC
IIL
Input LOW Current
VCC = Max., VIN = GND
±1
IOZH
High Impedance Current
0
±1
RON
Switch On Resistance
Potato Semiconductor Corporation
Y, In
V
±1
VCC
VCC = Min., VIN = 0.0V,
ION = –48mA
18
25
VCC = Min., VIN = 2.25V,
ION = -15mA
18
25
2
Units
A
01/01/10
PO3B3253A
www.potatosemi.com
Dual 4:1 Mux/DeMux
High Bandwidth Potato Chip
Power Supply Characteristics
Symbol
Description
Quiescent Power Supply Current
Icc
Test Conditions (1)
Min
Typ
Vcc=Max, Vin=Vcc or GND
-
0.1
Max
Unit
3
uA
Notes:
1.
2.
3.
4.
5.
For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
Typical values are at Vcc = 3.3V, 25°C ambient.
This parameter is guaranteed but not tested.
Not more than one output should be shorted at one time. Duration of the test should not exceed one second.
VoH = Vcc – 0.6V at rated current
Capacitance
(TA = 25°C f = 1 MHz)
Parameters
CIN
Description
Test Conditions
Typical
Input Capacitance
3
COFFYN
YN Capacitance, Switch OFF
5
COFFIN
IN Capacitance, Switch OFF
CON
VIN = 0V
3.7
IN/YN Capacitance, Switch ON
Units
pF
8.7
Dynamic Electrical Characteristics Over the Operating Range
(TA = -40º to +85º, VCC = 3.3V ± 10%)
Parameter
Description
Test Condition
Typ.
XTALK
Crosstalk
RL = 100
-60
OIRR
Off-Isolation
RL = 100
-60
BW
-3dB Bandwidth
RL = 100
750
Units
dB
MHz
Switching Characteristics over 3.3V Operating Range
Parameters
Description
tPLH
tPHL
Propogation Delay
tPZH
tPZL
Bus Enable Time
tPHZ
tPLZ
Bus Disable Time
Potato Semiconductor Corporation
Conditions
See Test Diagram
Max.
Units
0.3
2.0
ns
See Test Diagram
3.0
3
01/01/10
PO3B3253A
www.potatosemi.com
Dual 4:1 Mux/DeMux
High Bandwidth Potato Chip
Switching Characteristics over 2.5V Operating Range
Parameters
Description
tPLH
tPHL
Propogation Delay
tPZH
tPZL
Bus Enable Time
tPHZ
tPLZ
Bus Disable Time
Max.
Conditions
See Test Diagram
Units
0.3
2.0
ns
See Test Diagram
3.0
Test Circuit for Electrical Characteristics
Switch Positions
Test
Switch
tPLZ, tPZL
6.0V
tPHZ, tPZH
GND
Prop Delay
Open
6.0V
VCC
200-ohm
Pulse
Generator
VOUT
VIN
D.U.T
10pF
CL
RT
200-ohm
Switching Waveforms
SEL
2.5V
Input
tPLH
Output
3.5V
2.5V
tPHL
2.5V
2.5V
1.5V
VOH
VOL
Voltage Waveforms Propagation Delay Times
Potato Semiconductor Corporation
Output
1.25V
1.25V
tPZL
VDD/2
VDD/2
0V
VOH
VOL +0.3V
tPHZ
tPZH
Output
tPLZ
2.5V
VOH –0.3V
VOL
VOH
VOL
Voltage Waveforms Enable and Disable Times
4
01/01/10
PO3B3253A
www.potatosemi.com
Dual 4:1 Mux/DeMux
High Bandwidth Potato Chip
Packaging Mechanical Drawing: 16 pin QSOP
Packaging Mechanical Drawing: 16 pin SOIC
16
.149
.157
.2284
.2440
3.78
3.99
1
.0075
.0098
.386
.393
9.80
10.00
.016
.050
5.80
6.20
0.41
1.27
0.19
0.25
.0155 0.393
.0260 0.660
.053
.068
.050
BSC
1.27
Potato Semiconductor Corporation
.013
.020
0.330
0.508
.0040
.0098
1.35
1.75
0.10
0.25
X.XX DENOTES DIMENSIONS
X.XX IN MILLIMETERS
5
01/01/10
PO3B3253A
www.potatosemi.com
Dual 4:1 Mux/DeMux
High Bandwidth Potato Chip
Packaging Mechanical Drawing: 16 pin TSSOP
IC Ordering Information
Ordering Code
Package
Top-Marking
TA
PO3B3253ATU for Tube
16-pin TSSOP
Pb-free & Green
PO3B3253AT
-40°C to 85°C
PO3B3253ATR for Tape & Reel
16-pin TSSOP
Pb-free & Green
PO3B3253AT
-40°C to 85°C
PO3B3253ASU for Tube
16-pin SOIC
Pb-free & Green
PO3B3253AS
-40°C to 85°C
PO3B3253ASR for Tape & Reel
16-pin SOIC
Pb-free & Green
PO3B3253AS
-40°C to 85°C
PO3B3253AQU for Tube
16-pin QSOP
Pb-free & Green
PO3B3253AQ
-40°C to 85°C
PO3B3253AQR for Tape & Reel
16-pin QSOP
Pb-free & Green
PO3B3253AQ
-40°C to 85°C
IC Package Information
PACKAGE
CODE
PACKAGE
TYPE
TAPE
WIDTH
(mm)
TAPE
PITCH
(mm)
PIN 1 LOCATION
TAPE TRAILER
LENGTH
QTY
PER REEL
TAPE LEADER
LENGTH
QTY
PER
TUBE
T
TSSOP 16
12
8
Top Left Corner
39 (12”)
3000
64 (20”)
96
S
SOIC 16
16
8
Top Left Corner
39 (12”)
3000
64 (20”)
48
Q
QSOP 16
12
8
Top Left Corner
39 (12”)
3000
64 (20”)
97
Potato Semiconductor Corporation
6
01/01/10