PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan. Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 E-mail: [email protected] http://www.para.com.tw DATA SHEET PART NO. : L-354YD REV : A/ 1 CUSTOMER’S APPROVAL : _______________ DRAWING NO. : DS-33-02-0241 DCC : ____________ DATE : 2013-3-20 Page : 1 HD-R/RD012 3.0 mm DIA LED LAMP L-354YD REV:A / 1 PACKAGE DIMENSIONS Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm(0.010 ") Unless otherwise specified. 3.Protruded resin under flange is 1.5mm(0.059 ") max. 4.Lead spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice DRAWING NO. : DS-33-02-0241 DATE : 2013-3-20 Page : 2 HD-R/RD013 3.0 mm DIA LED LAMP L-354YD REV:A / 1 FEATURES * 3.0mm DIA LED LAMP * LOW POWER CONSUMPTION * I.C. COMPATIBLE * LONG LIFE SOLID STATE RELIABILITY CHIP MATERIALS * Dice Material : GaAsP/GaP * Light Color : YELLOW * Lens Color : YELLOW DIFFUSED ABSOLUTE MAXIMUM RATING : ( Ta = 25 C ) PARAMETER SYMBOL YELLOW UNIT PAD Power Dissipation Per Chip 85 mW VR Reverse Voltage Per Chip 5 V IAF Continuous Forward Current Per Chip 30 mA IPF Peak Forward Current Per Chip (Duty0.1,1KHz) 80 mA Derating Linear From 25 C Per Chip 0.40 mA/ C Topr Operating Temperature Range -25 C to 85 C Tstg Storage Temperature Range -40 C to 85 C Lead Soldering Temperature1.6mm(0.063 inch) From Body260°C ± 5°C for 5 Seconds ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25 C ) SYMBOL PARAMETER TEST CONDITION MIN. TYP. MAX. UNIT VF Forward Voltage IF = 20mA IR Reverse Current VR = 5V 2.15 2.8 V 100 A Dominant Wavelength IF = 20mA 586 nm Spectral Line Half-Width IF = 20mA 35 nm 2 1/2 Half Intensity Angle IF = 20mA 60 deg IV Luminous Intensity IF = 20mA 35 mcd D DRAWING NO. : DS-33-02-0241 DATE : 2013-3-20 Page : 3 HD-R/RD014 3.0 mm DIA LED LAMP L-354YD DRAWING NO. : DS-33-02-0241 DATE : 2013-3-20 REV:A / 1 Page : 4 3.0 mm DIA LED LAMP L-354YD REV:A / 1 SOLDERING METHOD SOLDERING CONDITIONS DIP Bath temperature: 260±5 SOLDERING Immersion time: with 5 sec REMARK Solder no closer than 3mm from the base of the package Using soldering flux,” RESIN FLUX” is recommended. During soldering, take care not to press the tip of iron against the Soldering iron: 30W or smaller lead. SOLDERING Temperature at tip of iron: 260 or lower (To prevent heat from being IRON transferred directly to the lead, hold Soldering time: within 5 sec. the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip. 2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package. $&%"' ! "# ! DRAWING NO. : DS-33-02-0241 DATE : 2013-3-20 Page : 5 3.0 mm DIA LED LAMP L-354YD REV:A / 1 3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3). ()+*,-./ 1 0 4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature. LED MOUNTING METHOD 1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4) DRAWING NO. : DS-33-02-0241 DATE : 2013-3-20 Page : 6 3.0 mm DIA LED LAMP L-354YD REV:A / 1 2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. FORMED LEAD 1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7) 2 33 2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8) DRAWING NO. : DS-33-02-0241 DATE : 2013-3-20 Page : 7 3.0 mm DIA LED LAMP L-354YD REV:A / 1 LEAD STRENGTH 1) Bend strength Do not bend the lead more than twice. (Fig.9) 2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) !4 ! " HANDLING PRECAUTIONS Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care when handling. CHEMICAL RESISTANCE 1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT ADAPTABILITY Freon TE Chlorothene Isopropyl Alcohol Thinner Acetone Trichloroethylene --Usable --Do not use. DRAWING NO. : DS-33-02-0241 NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical. DATE : 2013-3-20 Page : 8 3.0 mm DIA LED LAMP L-354YD REV:A / 1 Experiment Item: Item OPERATION LIFE HIGH TEMPERATURE HIGH HUMIDITY STORAGE TEMPERATURE CYCLING THERMAL SHOCK SOLDER RESISTANCE SOLDERABILITY Test Condition Lamp & IR Ta 255 IF= 20mA RH =60%RH DYNAMIC:100mA 1ms 1/10 duty STATIC STATE: IF20mA TEST TIME: 168HRS-24HRS+24HRS 500HRS-24HRS+24HRS 1000HRS-24HRS+72HRS Reference Standard MIL-STD-7501026 MIL-STD-8831005 JIS C 7021B-1 Ta 655 RH 90 95%RH TEST TIME240HRS2HRS MIL-STD-202103B JIS C 7021 B-1 105 25 -55 25 30min 5min 30min 5min 10CYCLES MIL-STD-202107D MIL-STD-7501051 MIL-STD-8831010 JIS C 7021 A-4 1055 -555 10min 10min 10CYCLES Tsol2605 DWELL TIME10lsec Tsol2305 DWELL TIME5lsec DRAWING NO. : DS-33-02-0241 DATE : 2013-3-20 MIL-STD-202107D MIL-STD-7501051 MIL-SYD-8831011 MIL-STD-202210A MIL-STD-750-2031 JIS C 7021A-1 MIL-STD-202208D MIL-STD-7502026 MIL-STD-8832003 JIS C 7021 A-2 Page :9 3.0 mm DIA LED LAMP L-354YD REV:A / 1 # #" 5 5 5 $ % & # #" ' ( ( ) * ( ' ' ' DRAWING NO. : DS-33-02-0241 + , +, ( ( . ( ( # 1 1 + . /# , " "" #0 . /#", 1 . / ( " ! #0 DATE : 2013-3-20 . /#" Page :10 PARA LIGHT ELECTRONICS CO., LTD. FILE RESUME FILE CODE Revision DS-33-02-0241 L-354YD Modified Establish/Change The directions of the contents that Date A/0 A/1 FILE NAME 2013-3-20 Order number be changed PAGE Effective Date 1 Authorizer New adding Up date LD-R/O204