Power Inductors Multilayer Power Inductors Type: ELGUEB Features ● Realized the high current by the original laminating process technology shielded structure ● Small and thin structure (2.0×1.6×1.0mm max.) ● RoHS compliant ● Magnetic Recommended Applications ● DC/DC converter circuit use of the small portable device Smart phone, mobile phone, DSC . Standard Packing Quantity ● 4000 pcs./Reel Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 E L G U E B R 4 7 M A 12 Suffix T dimension Construction Nominal Size Product Code Inductance Design Code Inductance Tolerance EX. Height Code High ELG Multilayer Inductor Code mm (inch) Code A High-Isat Current Type EX. Code E 1.0 mm max. B U 2016 (0806) ±20 % R47→0.47 µH R Low-Rdc M 2R2→2.2 µH 0.5±0.2 0.8±0.2 Recommended Land Pattern in mm (not to scale) 1.2 to 1.4 Dimensions in mm (not to scale) 0.8 to 1.2 2.0±0.2 1.6±0.2 2.4 to 3.0 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Jul. 2014 Power Inductors Ratings and Characteristics Inductance at 1 MHz Part Number ● Rated Current (A) DC Resistance at 20 °C dL/L=–30% ✽1 max. (typ.) dt/t=40 ˚C ✽2 max. (typ.) ELGUEBR24MA (µH) 0.24 Tol. ±20 % (mΩ) max. (typ.) 29 (22) 3.7 (4.2) 3.7 (4.2) ELGUEBR47MA 0.47 ±20 % 52 (40) 3.2 (3.5) 3.2 (3.5) ELGUEBR68MA 0.68 ±20 % 75 (60) 2.4 (2.9) 2.9 (3.3) ELGUEB1R0MA 1.0 ±20 % 85 (70) 1.6 (1.9) 1.7 (1.9) ELGUEB2R2MR 2.2 ±20 % 108 (90) 0.7 (0.8) 1.6 (1.8) Operating Temperature Range : –40 to 125 °C (Including self-temperature rise) ✽1 This indicate the value of current when inductance change dL/L=-30 % from initial value. ✽2 This indicates the value of current when temperature rise dt/t=40 °C (at 20 °C). DC current bias characteristics 2.5 0.8 0.68 µH 2.2 µH 0.7 2.0 0.5 Inductance (µH) Inductance (µH) 0.6 0.47 µH 0.4 0.3 0.24 µH 0.2 1.5 1.0 µH 1.0 0.5 0.1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 DC Current (A) 3.4 4.0 0 0.0 4.5 0.2 0.4 0.6 0.8 1.0 1.2 1.4 DC Current (A) 1.6 1.8 2.0 2.2 Packaging Methods (Taping) ● Punched Feeding hole fD0 Reel W1 Chip pocket E C E t1 ● Taping Carrier Taping (Pitch 4mm) B F W B A t2 D P1 Chip component P2 P0 Tape running direction W2 A (Unit : mm) Symbol Dim (mm) A B W F E P1 P2 P0 0D0 t1 t2 2.0 2.4 8.0 3.50 1.75 4.0 2.00 4.0 1.5 1.1 1.4 ±0.2 ±0.2 ±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1 +0.1 max. max. 0 (Unit : mm) Symbol 0A Dim (mm) 180–30 0B C D E W1 W2 60.0±0.5 13.0±0.5 21.0±0.8 2.0±0.5 9.0+1.0 11.4±1.0 0 ● Leader Part and Taped End Leader part Tape end Cover tape 100 min. Vacant position 400 min. 160 min. Vacant position (Unit : mm) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Jul. 2014