Surface Mount Resistors Packaging Method (Taping) Surface Mount Resistors Series Products Packaging (Standard Quantity : pcs./reel) Size mm (inch) Part No. Pressed Carrier Taping (2 mm pitch) ✽ Punched Carrier Taping (2 mm pitch) Punched Carrier Taping (4 mm pitch) — — Embossed Carrier Taping (4 mm pitch) ✽✽ ERJXGN 0402(01005) ERJ1GN 0603(0201) 15,000 — — — ERJ2GE 1005(0402) — 10,000, 20,000 — — ERJ3GE 1608(0603) — — 5,000 — ERJ6GE 2012(0805) — — 5,000 — ERJ8GE 3216(1206) — — 5,000 — ERJ14 3225(1210) — — — 5,000 ERJ12 4532(1812) — — — 5,000 ERJ12Z 5025(2010) — — — 5,000 ERJ1T 6432(2512) — — — 4,000 ERJXGN 0402(01005) 20,000 — — — ERJ1GN/1RH 0603(0201) 15,000 — — — ERJ2RH/2RK 1005(0402) — 10,000 — — ERJ3RB/3RE/3EK 1608(0603) — — 5,000 — ERJ6RB/6RE/6EN 2012(0805) — — 5,000 — ERJ8EN 3216(1206) — — 5,000 — ERJ14N 3225(1210) — — — 5,000 ERJ12N 4532(1812) — — — 5,000 ERJ12S 5025(2010) — — — 5,000 ERJ1TN 6432(2512) — — — 4,000 ERA1A 0603(0201) 15,000 — — — ERA2A Metal Film Chip Resistors, ERA3A High Reliability Type ERA6A 1005(0402) — 10,000 — — 1608(0603) — — 5,000 — 2012(0805) — — 5,000 — ERA8A 3216(1206) — — 5,000 — ERJ2LW/2BW 1005(0402) 10,000 — — — ERJ2BS/2BQ 1005(0402) — 10,000 — — ERJ3L/3B/3R/L03 1608(0603) — — 5,000 — ERJ6B/6R/L06 2012(0805) — — 5,000 — ERJ8B/8R/8C/L08 3216(1206) — — 5,000 — ERJ14B/14R/L14 3225(1210) — — — 5,000 ERJ12R/L12 4532(1812) — — — 5,000 ERJ12Z/L1D 5025(2010) — — — 5,000 ERJ1TR 6432(2512) — — — 4,000 ERJL1W 6432(2512) — — — 3,000 ERJMS4 6432(2512) — — — 2,000 ERJMS6 6468(2526) — — — 1,000 (8 mm Pitch) ERJM1W 6432(2512) — — — 3,000 3264(1225) — — — 4,000 2550(1020) — — — 5,000 1632(0612) — — 5,000 — 1220(0508) — — 5,000 — Thick Film Chip Resistors Precision Thick Film Chip Resistors Thick Film Chip Resistors/ Low Resistance Type Current Sensing Resistors, Metal Plate Type ERJA1 (1) High Power ERJB1/ERJC1 Chip Resistors/ Wide Terminal Type ERJB2 ERJB3 20,000 4,0000 ✽ W8P2 : Width 8 mm, Pitch 2 mm, ✽✽ W4P1 : Width 4 mm, Pitch 1 mm (1) Anti-Sulfurated High Power Chip Resistors / Wide Terminal Type 08 Nov. 2014 Surface Mount Resistors Packaging Method (Taping) Surface Mount Resistors Series Size mm (inch) Punched Carrier Taping (2 mm pitch) Punched Carrier Taping (4 mm pitch) Embossed Carrier Taping (4 mm pitch) ERJP03/PA3 1608(0603) — — 5,000 — ERJP06 2012(0805) — — 5,000 — ERJP08 3216(1206) — — 5,000 — ERJP14 3225(1210) — — — 5,000 ERJT06 2012(0805) — — 5,000 — ERJT08 3216(1206) — — 5,000 — ERJT14 3225(1210) — — — 5,000 ERJU01 0603(0201) 15,000 — — — ERJS02/U02 1005(0402) — 10,000 — — ERJS03/U03 1608(0603) — — 5,000 — ERJS06/U06 ERJU6S/U6Q 2012(0805) — — 5,000 — ERJS08/U08 3216(1206) — — 5,000 — ERJS14/U14 3225(1210) — — — 5,000 ERJS12/U12 4532(1812) — — — 5,000 ERJS1D/U1D 5025(2010) — — — 5,000 ERJS1T/U1T 6432(2512) — — — 4,000 EXB14V 0806(0302) — 10,000 — — EXB24V 1010(0404) — 10,000 — — EXB34V 1616(0606) — — 5,000 — EXBV4V 1616(0606) — — 5,000 — EXB18V 1406(0502) — 10,000 — — EXB28V 2010(0804) — 10,000 — — EXBN8V 2010(0804) — 10,000 — — EXB38V 3216(1206) — — 5,000 — EXBV8V 3216(1206) — — 5,000 — EXBS8V 5022(2009) — — — 2,500 EXB2HV 3816(1506) — — 5,000 — ERA38V 3216(1206) — — 5,000 — EXBU24 1010(0404) — 10,000 — — EXBU34 1616(0606) — — 5,000 — EXBU28 2010(0804) — 10,000 — — EXBU38 3216(1206) — — 5,000 — EXBU2H 3816(1506) — — 5,000 — EXBD 3216(1206) — — 5,000 — EXBE 4021(1608) — — — 4,000 EXBA 6431(2512) — — — 4,000 EXBQ 3816(1506) — — 5,000 — EXB14AT 0806(0302) — 10,000 — — EXB24AT 1010(0404) — 10,000 — — Products Anti-Surge Thick Film Chip Resistors Anti-Pulse Thick Film Chip Resistors Anti-Sulfurated Thick Film Chip Resistors Chip Resistor Array Metal Film Chip Resistor Array Anti-Sulfurated Chip Resistor Array Chip Resistor Networks Chip Attenuator Packaging (Standard Quantity : pcs./reel) Pressed Carrier Taping (2 mm pitch) Part No. 08 Nov. 2014 Surface Mount Resistors Packaging Method (Taping) Carrier Tape Punched Carrier P1 fD0 Embossed Carrier P2 P0 B W F E Pressed Carrier T P1 (2 mm Pitch) A T T fD1 (Only Emboss) Pressed Carrier Taping (2 mm Pitch) ● Rectangular Part No. ERJXGN ERJ1GN ERJ1R□ ERJU01 ERA1A ERJ2LW ERJ2BW Type (Unit : mm) Size mm A B (inch) ±0.03 0402(01005) 0.24 0.45±0.03 0603 (0201) 0.38±0.05 0.68±0.05 W F E P1 P2 P0 0D0 T 0.31±0.05 8.00±0.20 3.50±0.05 1.75±0.10 2.00±0.10 2.00±0.05 4.00±0.10 1.50+0.10 0 1005(0402) 0.68±0.10 1.20±0.10 1005(0402) 0.67±0.10 1.17±0.10 0.42±0.05 0.60±0.05 0.61±0.05 Punched Carrier Taping (2 mm Pitch) ● Rectangular Part No. ERJ2□ ERJS02 ERJU02 ERA2A ● Chip Type (Unit : mm) Size mm (inch) 1005 (0402) A B W F E P1 P2 P0 0D0 T 0.67±0.05 1.17±0.05 8.00±0.20 3.50±0.05 1.75±0.10 2.00±0.10 2.00±0.05 4.00±0.10 1.50+0.10 0.52±0.05 0 Resistor Array / Anti-Sulfurated Chip Resistor Array / Chip Attenuator Size mm A (inch) 0806 EXB14V +0.10 EXB14AT (0302) 0.70−0.05 EXB18V 1406(0502) EXB24V 1010 EXBU24 (0404) EXB24AT 1.20±0.10 EXB28V 2010 EXBU28 (0804) EXBN8V Part No. B W F E P1 (Unit : mm) P2 P0 0D0 T 0.95+0.05 −0.10 1.60±0.10 ±0.20 3.50±0.05 1.75±0.10 2.00±0.10 2.00±0.05 4.00±0.10 1.50+0.10 0.52±0.05 0 1.20±0.10 8.00 2.20±0.10 Punched Carrier Taping (4 mm Pitch) ● Rectangular Part No. Type Size mm (inch) (Unit : mm) A ERJ3□ ERJ3LW(10 mΩ) ERJ3BW 1608 1.10±0.10 ERJ□□3 (0603) ERA3A ERJ3LW(5 mΩ) ERJ6□ 2012 ERJ□06 ERJU6S, U6Q (0805) 1.65±0.15 ERA6A ERJB3 1220(0508) ERJ6BW 2012(0805) 1.55±0.15 ERJ8□ 3216 ERJ8□W ERJ□08 (1206) 2.00±0.15 ERA8A ERJB2 1632(0612) B W F E P1 P2 P0 0D0 1.90±0.10 T 0.70±0.05 2.50±0.20 8.00±0.20 3.50±0.05 1.75±0.10 4.00±0.10 2.00±0.05 4.00±0.10 1.50+0.10 0 2.30±0.20 0.84±0.05 3.60±0.20 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 09 Nov. 2014 Surface Mount Resistors Packaging Method (Taping) ● Chip Resistor Array / Metal Film Chip Resistor Array / Anti-Sulfurated Chip Resistor Array / Chip Resistor Part No. EXB34V EXBU34 EXB38V ERA38V EXBU38 EXB2HV EXBU2H EXBV4V EXBV8V EXBD EXBQ Size mm (inch) A B W F E P1 P2 Networks 0D0 P0 (Unit : mm) T ±0.20 1616(0606) 1.95 3216(1206) 3.60±0.20 0.70±0.05 1.95±0.15 3816(1506) 4.10±0.15 8.00±0.20 3.50±0.05 1.75±0.10 4.00±0.10 2.00±0.05 4.00±0.10 1.50+0.10 0 1616(0606) 3216(1206) 3216(1206) 2.00±0.20 3816(1506) 1.90±0.20 1.95±0.20 3.60±0.20 3.60±0.20 4.10±0.20 0.84±0.05 0.84±0.10 0.64±0.05 Embossed Carrier Taping (1 mm Pitch) ● Rectangular Type (Unit : mm) Part No. Size mm (inch) A B W F E P1 P2 P0 0D0 T ±0.05 ±0.05 ±0.20 ±0.05 ±0.10 ±0.10 ±0.10 ±0.10 ±0.10 ERJXGN 0402(01005) 0.25 0.45 4.00 1.80 0.90 1.00 1.00 2.00 0.80 0.5 max. Embossed Carrier Taping (4 mm Pitch) ● Rectangular Type Part No. Size mm (inch) 3225 ERJ14□ ERJ□14 (1210) 4532 ERJ12□ ERJ□12 (1812) ERJ12Z 5025 ERJ12S (2010) ERJ□1D 2550 ERJB1 ERJC1 (1020) ERJ1T□ ERJ□1T 6432 ERJL1W (2512) ERJM1W ERJMS4 ERJA1 3264(1225) ● Chip (Unit : mm) A B W F E P1 P2 P0 0D0 0D1 T 1.00+0.10 0 2.80±0.20 3.50±0.20 8.00±0.30 3.50±0.05 3.50±0.20 4.80±0.20 1.00±0.10 2.80±0.20 5.30±0.20 1.75±0.10 4.00±0.10 2.00±0.05 4.00±0.10 1.50+0.10 0 12.00±0.30 5.50±0.20 1.5 min. 3.60±0.20 6.90±0.20 1.60±0.10 1.50±0.20 3.50±0.20 6.80±0.20 1.10±0.20 Resistor Array / Chip Resistor Networks Part No. Size mm (inch) A B EXBS8V 5022(2029) 2.80±0.20 5.70±0.20 W (Unit : mm) F E P1 P2 P0 0D0 EXBE 4021(1608) 2.50±0.20 4.40±0.20 12.00±0.30 5.50±0.20 1.75±0.10 4.00±0.10 2.00±0.05 4.00±0.10 1.50+0.10 0 EXBA 6431(2512) 3.50±0.20 6.80±0.20 T 1.6 max. 1.10±0.20 0D1 1.5 min. Embossed Carrier Taping (8 mm Pitch) ● Rectangular Type (Unit : mm) Part No. Size mm (inch) A B W F E P1 P2 P0 0D T 0D1 ±0.20 ±0.20 ±0.30 ±0.05 ±0.10 ±0.10 ±0.05 ±0.10 +0.10 ±0.10 ERJMS6 6468(2526) 6.90 7.50 12.00 5.50 1.75 8.00 2.00 4.00 1.50 0 2.10 1.5 min. 0 Taping Reel (Unit : mm) Tape Width 0A (W) 4mm Width 180.0±3.0 fN fC 8mm Width 12mm Width W1 fA 0 180.0 –1.5 0N 0C W1 ±0.5 4.5 60.0+1.0 0 24mm Width 380.0±2.0 80.0±1.0 13.0±0.2 9.0+1.0 0 W2 7.0±0.5 11.4±1.0 +1.0 0 15.4±1.0 25.4±1.0 29.4±1.0 13.0 W2 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 09 Nov. 2014 Surface Mount Resistors Land Pattern Recommended Land Pattern ● An example of a land pattern for the Rectangular Type is shown below. Chip Resistor Dimensions (mm) a b c 0402/01005 0.15 to 0.20 0.5 to 0.7 0.20 to 0.25 0603/0201 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 1005/0402 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 1608/0603 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0 2012/0805 1.0 to 1.4 3.2 to 3.8 0.9 to 1.4 3216/1206 2.0 to 2.4 4.4 to 5.0 1.2 to 1.8 3225/1210 2.0 to 2.4 4.4 to 5.0 1.8 to 2.8 High power (double-sided resistive elements structure) type 4532/1812 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5 Dimensions (mm) a b c ERJ2LW/2BW 1005/0402 0.52 1.4 to 1.6 0.4 to 0.6 ERJ3LW/3BW 1608/0603 0.5 to 0.8 2.5 to 2.7 0.9 to 1.1 ERJ6BW 2012/0805 0.9 3.2 to 3.8 1.1 to 1.4 ERJ8BW 1.2 4.4 to 5.0 1.3 to 1.8 ERJ8CW 3216/1206 (10 to 16 mΩ) ERJ8CW (18 to 50 mΩ) 3216/1206 2.0 to 2.6 4.4 to 5.0 1.2 to 1.8 5025/2010 3.6 to 4.0 6.2 to 7.0 1.8 to 2.8 5.0 to 5.4 7.6 to 8.6 2.3 to 3.5 3.6 to 4.0 7.6 to 8.6 2.3 to 3.5 c Size mm/inch a b Part No. ● An Size mm/inch 6432/2512 ✽ 6432/2512 ✽ ERJL1W example of a land pattern for High Power Chip Resistors / Wide Terminal Type is shown below. a b c b Part No. Dimensions (mm) a b c ERJA1 ERJB1 (1) ERJC1 ERJB2 6.4 1.70 0.60 5.0 1.30 0.75 3.2 0.95 0.70 ERJB3 2.0 0.80 0.60 (1) Anti-Sulfurated High Power Chip Resistors / Wide Terminal Type Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 06 Nov. 2014 Surface Mount Resistors Land Pattern ● An example of a land pattern for Chip Resistor Array, Metal Film Chip Resistor Array, Anti-Sulfurated Chip Resistor Array and Chip Attenuator is shown below. Conductor a d f a Solder resist b b P Dimensions (mm) Part No. EXB14V EXB14A EXB24V EXBU24 EXB24A f b c d 0.30 0.30 0.30 0.80 to 0.90 0.5 0.35 to 0.40 0.30 EXB18V 1.4 to 1.5 a b EXB28V 0.40 0.525 EXBU28 EXBN8V 0.45 to 0.50 0.35 to 0.38 d 0.25 0.25 1.40 0.25 0.25 1.40 to 2.00 f P 0.80 0.80 1.27 a Part No. f c 0.40 b c b 0.20 to 0.30 0.15 to 0.20 0.15 to 0.20 0.80 to 0.90 b Dimensions (mm) Part No. a EXBV4V,V8V 0.7 to 0.9 0.4 to 0.45 0.4 to 0.45 2 to 2.4 EXB34V,38V EXBU34,U38 0.7 to 0.9 0.4 to 0.5 0.4 to 0.5 2.2 to 2.6 ERA38V EXBS8V 1 to 1.2 0.5 to 0.75 0.5 to 0.75 3.2 to 3.8 f a d c d c d Dimensions (mm) Part No. a b EXB2HV EXBU2H d c d c d c d c d c d c d b Dimensions (mm) a b c d f 1.00 0.425 0.25 0.25 2.00 example of a land pattern for Chip Resistor Networks is shown below. EXBE Pitch 0.635 mm Through-hole less 0.2 EXBA10P 1.27 0.635 EXBA10E 0.2 1.27 0.635 1.27 0.1 to 0.15 EXBD 0.2 to 0.3 2.6 to 2.8 3.6 to 4.2 Pitch 0.5 mm 2.0 to 2.6 0.9 to 1.1 0.9 to 1.1 0.3 to 0.4 For popular pattern EXBQ 2.0 to 2.6 0.635 Pitch 0.635 mm 0.8 0.4 0.35 to 0.4 3.3 5.2 0.4 to 0.5 1.27 0.4 to 0.5 Pitch 0.4 mm Through-hole less 2.2 4.4 2.2 4.4 For high density ✽ pattern 3.3 to 3.4 5.0 to 5.4 0.4 to 0.6 0.5 1.27 1.4 to 1.5 For popular pattern 0.35 to 0.4 0.8 0.4 to 0.5 2.1 to 2.5 Pitch 0.8 mm 4.3 to 4.7 Pitch 1.27 mm 3.1 to 3.5 EXBA 1.4 3.4 ● An c c 0.20 to 0.25 0.50 ✽ When designing high density land patterns, examine the reliability of isolation among the lines and adopt the chip resistor networks. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 06 Nov. 2014 Surface Mount Resistors Recommended Soldering Conditions Recommended Soldering Conditions Recommendations and precautions are described below. ● Rectagular ● Type Recommended soldering conditions for reflow · Reflow soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specified. · Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. For soldering (Example : Sn/Pb) Preheating Main heating Peak Temperature 140 °C to 160 °C Above 200 °C 235 ± 5 °C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Peak Preheating Heating Preheating Main heating Peak Temperature 150 °C to 180 °C Above 230 °C max. 260 °C Time 60 s to 120 s 30 s to 40 s max. 10 s Time ● Recommended soldering conditions for flow For soldering Temperature Time 140 °C to 180 °C 60 s to 120 s 245 ± 5 °C 20 s to 30 s Preheating Soldering ● Chip ● For lead-free soldering Temperature Time 150 °C to 180 °C 60 s to 120 s max. 260 °C max. 10 s Resistor Array, Chip Resistor Networks and Chip Attenuator Recommended soldering conditions for reflow · Reflow soldering shall be performed a maximum of two times. · Please contact us for additional information when used in conditions other than those specified. · Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. For soldering (Example : Sn/Pb) Preheating Main heating Peak Temperature 140 °C to 160 °C Above 200 °C 235 ± 5 °C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Peak Preheating Heating Preheating Main heating Peak Temperature 150 °C to 180 °C Above 230 °C max. 260 °C Time 60 s to 120 s 30 s to 40 s max. 10 s Time ● Flow soldering We do not recommend flow soldering, because a solder bridge may form. Please contact us regarding flow soldering of EXBA series. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Sep. 2014