NCE N-Channel Enhancement Mode Power MOSFET

Pb Free Product
NCE1205
http://www.ncepower.com
N and P-Channel Enhancement Mode Power MOSFET
Description
The NCE1205 uses advanced trench technology to provide
excellent RDS(ON) and low gate charge . The complementary
MOSFETs may be used to form a level shifted high side
switch, and for a host of other applications.
General Features
● N-Channel
N-channel
P-channel
VDS =12V,ID =5A
RDS(ON) <32mΩ @ VGS=4.5V
RDS(ON) <42mΩ @ VGS=2.5V
RDS(ON) < 80mΩ @ VGS=1.8V
● P-Channel
VDS = -12V,ID = -5A
RDS(ON) <74mΩ @ VGS=-4.5V
RDS(ON) <110mΩ @ VGS=-2.5V
Pin assignment
RDS(ON) < 220mΩ @ VGS=-1.8V
● Load Switch for Portable Devices
Package Marking and Ordering Information
Device Marking
Device
Device Package
Reel Size
Tape width
Quantity
1205
NCE1205
DFN2X2-6L
-
-
-
Absolute Maximum Ratings (TA=25℃unless otherwise noted)
Parameter
Symbol
N-Channel
P-Channel
Unit
Drain-Source Voltage
VDS
12
-12
V
Gate-Source Voltage
VGS
±12
±12
V
5
-5
4.5
-3.8
IDM
20
-15
A
PD
1.9
1.9
W
TJ,TSTG
-55 To 150
-55 To 150
℃
Continuous Drain Current
TA=25℃
ID
TA=70℃
Pulsed Drain Current (Note 1)
Maximum Power Dissipation
TA=25℃
Operating Junction and Storage Temperature Range
A
Thermal Characteristic
Thermal Resistance,Junction-to-Ambient (Note2)
RθJA
N-Ch
65
℃/W
(Note2)
RθJA
P-Ch
65
℃/W
Thermal Resistance,Junction-to-Ambient
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N-CH Electrical Characteristics (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=250μA
12
20
-
V
Zero Gate Voltage Drain Current
IDSS
VDS=12V,VGS=0V
-
-
1
μA
Gate-Body Leakage Current
IGSS
VGS=±12V,VDS=0V
-
-
±100
nA
VGS(th)
VDS=VGS,ID=250μA
0.4
0.6
1
V
VGS=4.5V, ID=5A
-
28
32
mΩ
VGS=2.5V, ID=4.6A
-
36
42
mΩ
VGS=1.8V, ID=4.1A
-
55
80
mΩ
VDS=10V,ID=5A
-
20
-
S
-
495
-
PF
-
155
-
PF
-
95
-
PF
-
7.0
-
nS
Off Characteristics
On Characteristics
(Note 3)
Gate Threshold Voltage
Drain-Source On-State Resistance
Forward Transconductance
Dynamic Characteristics
RDS(ON)
gFS
(Note4)
Input Capacitance
Clss
Output Capacitance
Coss
Reverse Transfer Capacitance
Switching Characteristics
Crss
VDS=6V,VGS=0V,
F=1.0MHz
(Note 4)
Turn-on Delay Time
td(on)
Turn-on Rise Time
tr
VDD=6V, RL=1.2Ω
-
5.0
-
nS
td(off)
VGS=10V,RGEN=4.5Ω
-
18
-
nS
-
6
-
nS
-
6.6
-
nC
-
1
-
nC
-
1.2
-
nC
-
-
1.2
V
Turn-Off Delay Time
Turn-Off Fall Time
tf
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
VDS=6V,ID=5A,
VGS=4.5V
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
VSD
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VGS=0V,IS=5A
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P-CH Electrical Characteristics (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=-250μA
-30
-33
-
V
Zero Gate Voltage Drain Current
IDSS
VDS=-12V,VGS=0V
-
-
-1
μA
Gate-Body Leakage Current
IGSS
VGS=±12V,VDS=0V
-
-
±100
nA
VGS(th)
VDS=VGS,ID=-250μA
-0.4
-0.7
-1
V
VGS=-4.5V, ID=-4.5A
-
60
74
mΩ
VGS=-2.5V, ID=-3.2A
-
84
110
mΩ
VGS=-1.8V, ID=-1A
-
130
220
mΩ
VDS=-10V,ID=-5A
-
10
-
S
-
520
-
PF
-
100
-
PF
-
65
-
PF
-
7.5
-
nS
Off Characteristics
On Characteristics
(Note 3)
Gate Threshold Voltage
Drain-Source On-State Resistance
Forward Transconductance
Dynamic Characteristics
RDS(ON)
gFS
(Note4)
Input Capacitance
Clss
Output Capacitance
Coss
Reverse Transfer Capacitance
Switching Characteristics
Crss
VDS=-6V,VGS=0V,
F=1.0MHz
(Note 4)
Turn-on Delay Time
td(on)
Turn-on Rise Time
tr
VDD=-6V, RL=2.3Ω
-
5.5
-
nS
td(off)
VGS=-10V,RGEN=6Ω
-
19
-
nS
-
7
-
nS
-
9.2
-
nC
-
1.6
-
nC
-
2.2
-
nC
-
-
-1.2
V
Turn-Off Delay Time
Turn-Off Fall Time
tf
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
VDS=-6V,ID=-4.5A
VGS=-4.5V
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
VSD
VGS=0V,IS=-5A
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
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Vdd
Rl
Vin
Vgs
Rgen
D
Vout
G
S
Normalized On-Resistance
N- Channel Typical Electrical and Thermal Characteristics (Curves)
Figure 1:Switching Test Circuit
ton
tr
td(on)
toff
tf
td(off)
90%
VOUT
90%
INVERTED
10%
10%
90%
VIN
50%
50%
10%
PULSE WIDTH
ID- Drain Current (A)
ID- Drain Current (A)
Figure 2:Switching Waveforms
Vds Drain-Source Voltage (V)
Vgs Gate-Source Voltage (V)
Figure 4 Transfer Characteristics
Normalized On-Resistance
Rdson On-Resistance(Ω)
Figure 3 Output Characteristics
TJ-Junction Temperature(℃)
ID- Drain Current (A)
Figure 5 Drain-Source On-Resistance
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Figure 6 Drain-Source On-Resistance
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PD Power(W)
Rdson On-Resistance(mΩ)
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TJ-Junction Temperature(℃)
Figure7 Rdson vs Vgs
Figure 8 Power Dissipation
Vgs Gate-Source Voltage (V)
Is- Reverse Drain Current (A)
Vgs Gate-Source Voltage (V)
Vds Drain-Source Voltage (V)
Qg Gate Charge (nC)
Figure 10 Source- Drain Diode Forward
ID- Drain Current (A)
C Capacitance (pF)
Figure 9 Gate Charge
Vds Drain-Source Voltage (V)
Vds Drain-Source Voltage (V)
Figure 11 Capacitance vs Vds
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Figure 12 Safe Operation Area
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NCE1205
r(t),Normalized Effective
Transient Thermal Impedance
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Square Wave Pluse Duration(sec)
Figure 13 Normalized Maximum Transient Thermal Impedance
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NCE1205
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-ID- Drain Current (A)
Normalized On-Resistance
P- Channel Typical Electrical and Thermal Characteristics (Curves)
TJ-Junction Temperature(℃)
-Vds Drain-Source Voltage (V)
Figure 4 Rdson-Junction Temperature
-ID- Drain Current (A)
Vgs Gate-Source Voltage (V)
Figure 1 Output Characteristics
Qg Gate Charge (nC)
Figure 2 Transfer Characteristics
Figure 5 Gate Charge
Rdson On-Resistance(Ω)
Is- Reverse Drain Current (A)
-Vgs Gate-Source Voltage (V)
ID- Drain Current (A)
Vsd Source-Drain Voltage (V)
Figure 3 Rdson- Drain Current
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Figure 6 Source- Drain Diode Forward
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NCE1205
Normalized BVdss
C Capacitance (pF)
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TJ-Junction Temperature(℃)
Figure 7 Capacitance vs Vds
Figure 9 BVDSS vs Junction Temperature
Vth (V) Variance
ID- Drain Current (A)
Vds Drain-Source Voltage (V)
TJ-Junction Temperature(℃)
Figure 8 Safe Operation Area
Figure 10 VGS(th) vs Junction Temperature
r(t),Normalized Effective
Transient Thermal Impedance
Vds Drain-Source Voltage (V)
Square Wave Pluse Duration(sec)
Figure 11 Normalized Maximum Transient Thermal Impedance
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NCE1205
DFN2X2-6L Package Information
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NCE1205
Attention
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Any and all NCE power products described or contained herein do not have specifications that can handle applications that
require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications
whose failure can be reasonably expected to result in serious physical and/or material damage. Consult
with your NCE power representative nearest you before using any NCE power products described or contained herein in
such applications.
NCE power assumes no responsibility for equipment failures that result from using products at values
that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters)
listed in products specifications of any and all NCE power products described or contained herein.
Specifications of any and all NCE power products described or contained herein stipulate the performance, characteristics,
and functions of the described products in the independent state, and are not guarantees of the performance, characteristics,
and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states
that cannot be evaluated in an independent device, the customer should always evaluate and test
devices mounted in the customer’s products or equipment.
NCE power Semiconductor CO.,LTD. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with some probability. It is possible that these probabilistic failures could
give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could
cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or
events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe
design, redundant design, and structural design.
In the event that any or all NCE power products(including technical data, services) described or contained herein are
controlled under any of applicable local export control laws and regulations, such products must not be exported without
obtaining the export license from the authorities concerned in accordance with the above law.
No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including
photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission
of NCE power Semiconductor CO.,LTD.
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume
production. NCE power believes information herein is accurate and reliable, but no guarantees are made or implied
regarding its use or any infringements of intellectual property rights or other rights of third parties.
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the NCE power
product that you intend to use.
This catalog provides information as of Sep.2010. Specifications and information herein are subject to change without notice.
Wuxi NCE Power Semiconductor Co., Ltd
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