SMD CAPACITORS Type/ Series Voltage (V) Capacitance (µF) Multilayer Ceramic CE 16 - 2000 0.5pF- 6.8µF Tantalum TS, SAT 2.7 - 50 0.1µF - 330µF Tol (+/-%) Dissipation Case Factor Sizes Application Notes 0.1pf - 20% .02% - 4% 0201 3035 Wide range of sizes, tolerance, TC, and voltage. High reliability, and excellent frequency response. 10% - 20% 4% - 12% 0805 7343 Epoxy Molded, UL94V-0 flame retardant. Superior humidity and solder resist. Sinter-Anode is type SAT. SMD COILS & INDUCTORS Type/ Series Inductance Tolerance SRF Min. DCR Max. Rated (µH) (%) (MHz) (Ohms) Current (mA) Multilayer Ceramic MLI Case Sizes Application Notes .047 - 33µH 0.3nH - 20% 13 - 680 0.15 - 4.7 5 - 110 0603 1206 Multilayer structure provides outstanding reliability. Excellent Q and SRF char. Multilayer ‘High Frequency’ MHI 1.0 - 470µH 0.3nH - 20% 430 - 12,000 0.1 - 1.2 200 - 500 0402 0805 Advanced monolithic construction suited especially for higher frequency applications. Minature Wirewound ‘Open Core’ CI .0056 - 10µH 5% - 20% 60 - 6000 0 .04 - 4.0 210 - 1410 0805 1008 * Small package size. Flat-top design avail. Suitable for reflow soldering. ‘0603’ size in devel. * Molded Wirewound MCI .01 - 1000µH 5% - 20% 2.5 - 2500 0.13 - 40.0 30 - 480 1210 1812 Molded construction Excellent protection. New higher current sizes available. Molded ‘Shielded’ Wirewound MSI 0.1 - 1000µH 5% - 20% 2.0 - 460 0.23 - 16.0 15 - 450 1812 Electromagnetic shielding. Molded construction. Mini-sizes in develop. High Power, Low Profile HI330 1.0 - 1000µH 20% 2.0 - 100 .008 - 2.15 up to 20A .510 x .370 Low profile. High performance. Low DC resistance. High power-to-size. High Power, Shielded HI500 10.0 - 1000µH 20% 2.0 - 30 .04 - 2.01 up to 8A .730 x .600 Shielded construction Low DC resistance. Cost effective. Power Inductor Coil PIC 0.68 - 2200µH 5% - 20% .04 - 5.46 up to 3.5A .189 .433 Wide range of sizes. Low profile, and cost. Excellent high freq. Consult Factory Visit www.rcdcomponents.com for complete data sheets