SCHOTTKY DIE SPECIFICATION Product Name: BWS-118-50-JA General Description: 118mil 50V High Barrier ELECTRICAL CHARACTERISTICS Reverse Breakdown Voltage: Ir=0.20mA Average Rectified Forward Current SYM Spec. Limit UNIT VBRM 50 Volt IFAV 15.0 Amp Maximum Instantaneous Forward Voltage @ 10 Amperes, Ta=25℃ 0.480 @ 15 Amperes, Ta=25℃ VF MAX 0.530 Volt IR MAX 50 uA IFSM 80 Amp Tj 150 ℃ TSTG -50 to +150 ℃ Maximum Instantaneous Reverse Current VR= 53 Volt, Ta=25℃ MAXIMUM RATINGS Nonrepetitive Peak Surge Current Semi-Sine Wave, Duty = 8.3ms、1cycle Operating Junction Temperature Storage Temperatures 1. Specification is applied to die only. Actual performance may degrade when assembled. BW does not guarantee device performance after assembly. 2. Suggest to storage in Nitrogen cabinet, 45-60% RH, 22-26 ℃ for 6 months. 3. Data sheet information is subjected to change without notice. 4. Suggest Soldering profile (Pb92.5%,5%Sn,Ag2.5%): Soldering peak Temp. 340~350 ℃ 3~5min. DICE OUTLINE DRAWING DIM A B μm Mil A Die Size 1397 55.00 B Top Metal Pad Size 1197 47.13 C Thickness 280 11.00 (1)Cutting street width is around 60µm. Top-side Metal C ITEM SiO2 Passivation P+ Guard Ring Back-side Metal (2)Both of top-side and back-side metals are Ti/Ni/Ag. (3) Top-side Ti/Ni thk: 0.42um, Ag thk: 3.5um (4) Thickness(C) tolerance: +/-10um