Datasheet

Thermoelectric Cooling Solutions
TO812.1ML06031xxAN25
Performance Parameters
Mounted TEC
Type
ΔTmax Qmax
K
W
Imax
A
Umax
V
Rt
K/W
H
mm
1ML06-031-xxAN25 (n=31)
1ML06-031-05AN25
63
6.2
2.8
1.1
1ML06-031-07AN25
66
4.8
2.1
1ML06-031-09AN25
68
3.9
1.7
1ML06-031-12AN25
69
3.1
1.3
1.8
1ML06-031-15AN25
70
2.5
1.1
2.1
1.3
3.8
1.07
1.5
Performance data is specified at 300K, vacuum
Dimensions
1ML06-031-xxAN25
Manufacturing options
A. Header material:
Kovar
D. TEC Ceramics Material:
1.Pure Al2O3(100%)
2.Alumina (Al2O3- 96%)
B. Header surface finish:
3.Aluminum Nitride (AlN) - used by default
G. Thermistor mounting:
Au plaiting (base and pins)
E. TEC Cold Side Finish:
C. TEC to Header mounting:
F. Thermistor (optional)
Can be mounted to cold side
ceramics edge.
Epoxy gluing
1. Blank ceramics (not metallized)
Solder 206 (Tmelt =206°C,
2. Metallized (Au plaiting)
Sn-Ag-In-Cu, flux-free process)
3. Metallized and pre-tinned
(various solder for pre-tinning available)
H. Pinout configuration:
the drawing contains standard
pinout, can be revised by
request)
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 1 of 9
Thermoelectric Cooling Solutions
1ML06-031-05AN25
Performance Data
@ 27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1ML06-031-05AN25
63
6.19
2.8
3.8
1ML06-031-05AN25
67
6.68
2.7
3.9
Note: Performance data is specified at optimal heatsink. TO-8 Header thermal resistance is included into estimations. Use
TECCad Software for estimations under different conditions or contact RMT Ltd or it’s branches directly.
1ML06-031-07AN25
Performance Data
@ 27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1ML06-031-07AN25
66
4.82
2.1
3.8
1ML06-031-07AN25
70
5.21
2.0
4.0
Note: Performance data is specified at optimal heatsink. TO-8 Header thermal resistance is included into estimations. Use
TECCad Software for estimations under different conditions.
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 2 of 9
Thermoelectric Cooling Solutions
1ML06-031-09AN25
Performance Data
@ 27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1ML06-031-09AN25
68
3.93
1.7
3.8
1ML06-031-09AN25
71
4.26
1.7
4.1
Note: Performance data is specified at optimal heatsink. TO-8 Header thermal resistance is included into estimations. Use
TECCad Software for estimations under different conditions or contact RMT Ltd or it’s branches directly.
1ML06-031-12AN25
Performance Data
@ 27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1ML06-031-12AN25
69
3.07
1.3
3.8
1ML06-031-12AN25
72
3.34
1.3
4.2
Note: Performance data is specified at optimal heatsink. TO-8 Header thermal resistance is included into estimations. Use
TECCad Software for estimations under different conditions.
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 3 of 9
Thermoelectric Cooling Solutions
1ML06-031-15AN25
Performance Data
@ 27ºC, Vacuum
ΔTmax
K
Qmax
W
Imax
A
Umax
V
@50ºC, N2
ΔTmax
K
Qmax
W
Imax
A
Umax
V
1ML06-031-15AN25
70
2.52
1.1
3.8
1ML06-031-15AN25
73
2.75
1.1
4.2
Note: Performance data is specified at optimal heatsink. TO-8 Header thermal resistance is included into estimations. Use
TECCad Software for estimations under different conditions.
Application Tips
1. Never heat up the sub-assembly more than 200˚C.
2. Never use the sub-assembly without an attached
heat sink. Header is NOT a heatsink by itself.
3. Connect TE cooler to DC power supply according
to specified polarity.
4. Do not apply current/voltage higher than specified
max values
Mounting to TEC cold side
1. Soldering of object to be cooled.
Method suitable for a TE module with the metallized cold side
(Ordering Options. Item E). Soldering requires careful
procedures:
A. Never overheat TEC (Application Tips. Item 1).
B. Use solder with melting point less than 200ºC.
Mounting to the
cold side
TEC
2. Gluing of object to be cooled.
Method available by glues with good thermoconductive
properties. Not recommended for high vacuum applications
and long operations at high temperature.
Header
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 4 of 9
Thermoelectric Cooling Solutions
Sub-assembly Overview
Thermistor (optional)
Thermoelectric Cooler
1ML06-031-xxAN25
NTC Thermistor
2.2kOhm or
10kOhm
TO-8 12pin Header
(Material Kovar)
TE Cooler Lead Free
Internal Assembly Solder
(Lead-Free
Solder 230, Sn-Sb)
Flexible pinout configuration
for TEC and thermistor
TEC to Header High-Temperature
Mounting by Soldering
(Lead-Free Solder 206,
Sn-Ag-In-Cu,
vacuum flux-free process)
Laser Labeling (optional)
is available for Header
TO-8 12pin Header Drawing
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 5 of 9
Thermoelectric Cooling Solutions
Additional Options
TEC Polarity
TEC Polarity can be modified by request. The
specified polarity in this datasheet is typical.
It can be reversed in accordance to Customer
application requirements.
-
+
+
Standard polarity
-
Reversed polarity
Terminal Wires Options
The wires are of tinned Copper, blank (not isolated)
by default. Various options for isolated wires are
available by request. The available solutions
include isolated wires, isolated color-coded wires,
flexible multicore wires and more.
S t a n d a rd w i re s ,
tinned Copper
Isolated wires
Customized Au Patterns
Customized Au patterns on thermoelectric cooler
cold side are available by request. Selective Pretinning over pattern is also available. Please,
contact RMT Ltd for additional information about
customized Au patterns requirements.
Customized Au pattern
on cold side
Selective pre-tinning
over pattern
TEC Height modification
Standard TEC height can be modified without
performance changes by using ceramics of
different thickness. Standard thermoelectric cooler
height (specified in the datasheet) may be
increased in a range +0.25..+1.5mm for singlestage TEC by request.
Standard height
M o d i fi e d h e i g h t ,
another ceramics
thickness
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 6 of 9
Thermoelectric Cooling Solutions
Thermoelectric Cooler Overview
Cold side Ceramics
(top side)
AlN Ceramics by default
(Al2O3 solution is available
by request)
TE Cooler Lead Free
Internal Assembly
(Lead-Free Solder 230,
Sn-Sb)
-
Pellets (BiTe posts)
TEC Polarity
(can be modified by
request)
+
Hot Side Ceramics
(bottom side)
Terminal Wires
Application Tips
1. Never heat TE module more than 200˚C (TEC
assembled at 230˚C).
2. Never use TE module without an attached heat sink
1. Connect TE module to DC power supply according
to polarity.
2. Do not apply DC current higher than Imax.
at hot (bottom) side.
Installation
1. Mechanical Mounting. TEC is placed between two heat exchangers . This construction is fixed by screws or in
another mechanical way. It is suitable for large modules (with dimensions 30x30mm and larger). Miniature types
require other assembling methods in most cases.
1. Soldering. This method is suitable for a TE module with metallized outside surfaces. RMT provides this option
and also makes pre-tinning for TE modules.
2. Glueing. It is an up-to-date method that is used by many customers due to availability of glues with good
thermoconductive properties. A glue is usually based on some epoxy compound filled with some
thermoconductive material such as graphite or diamond powders, silver, SiN and others. The application of a
specific type depends on application features and the type of a TE module.
Object being cooled
Object being cooled
TEC
TEC
1
3
2
Screw mounting
Heatsink
Soldering
Heatsink
Gluing
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 7 of 9
Thermoelectric Cooling Solutions
Contacts
RMT Ltd. Headquarters
Warshavaskoe sh. 46, 115230, Moscow
Russia
Phone: +7-499-678-2082
Fax: +7-499-678-2083
Web: www.rmtltd.ru
Email: [email protected]
EUROPE/USA - TEC Microsystems GmbH
Schwarzschildstrasse 3, 12489 Berlin
Germany
Tel. +49 30 6789 3314
Fax+49 30 6789 3315
Web: www.tec-microsystems.com
Email: [email protected]
CHINA - ProTEC Ltd.
深圳市南山区登良路恒裕中心B座207
:+86-755-61596066
真:+86-755-61596036
:518054
Web: www.protecltd.com
Email: [email protected]
46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 8 of 9
Thermoelectric Cooling Solutions
Legal Notice
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46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru
Copyright 2013. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
Page 9 of 9