Thermoelectric Cooling Solutions TO6609.2MDX04014XX Performance Parameters Mounted TEC Type ΔTmax Qmax K W Imax A Umax V Rt K/W 2.0 1.09 H mm 2MDX04-014-xx (n=14) 2MDX04-014-0510 2MDX04-014-0816 92 95 1.4 0.9 2.4 2.4 1.6 3.3 Performance data is specified at 300K, vacuum Dimensions Manufacturing options A. Header material: CRS D. TEC Ceramics Material: 1.Pure Al2O3(100%) - used by default 2.Alumina (Al2O3- 96%) B. Header surface finish: 3.Aluminum Nitride (AlN) G. Thermistor mounting: Au plaiting (base and pins) E. TEC Cold Side Finish: C. TEC to Header mounting: F. Thermistor (optional) Can be mounted to cold side ceramics edge. Epoxy gluing 1. Blank ceramics (not metallized) Solder 206 (Tmelt =206°C, 2. Metallized (Au plaiting) Sn-Ag-In-Cu, flux-free process) 3. Metallized and pre-tinned (various solder for pre-tinning available) H. Pinout configuration: the drawing contains standard pinout, can be revised by request) 46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 1 of 8 Thermoelectric Cooling Solutions 2MDX04-014-0510 Performance Data @ 27ºC, Vacuum ΔTmax K Qmax W Imax A Umax V @50ºC, N2 ΔTmax K Qmax W Imax A Umax V 2MDX04-014-0510 92 1.4 2.4 1.9 2MDX04-014-0510 95 1.6 2.4 2.1 Note: Performance data is specified at optimal heatsink. TO-66 Header thermal resistance is included into estimations. Use TECCad Software for estimations under different conditions or contact RMT Ltd or it’s branches directly. 2MDX04-014-0816 Performance Data @ 27ºC, Vacuum ΔTmax K Qmax W Imax A Umax V @50ºC, N2 ΔTmax K Qmax W Imax A Umax V 2MDX04-014-0816 95 0.9 1.6 1.9 2MDX04-014-0816 95 1.0 1.6 2.1 Note: Performance data is specified at optimal heatsink. TO-66 Header thermal resistance is included into estimations. Use TECCad Software for estimations under different conditions. 46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 2 of 8 Thermoelectric Cooling Solutions Application Tips 1. Never heat up the sub-assembly more than 200˚C. 2. Never use the sub-assembly without an attached heat sink. Header is NOT a heatsink by itself. 3. Connect TE cooler to DC power supply according to specified polarity. 4. Do not apply current/voltage higher than specified max values Mounting to TEC cold side Mounting to the cold side 1. Soldering of object to be cooled. Method suitable for a TE module with the metallized cold side (Ordering Options. Item E). Soldering requires careful procedures: A. Never overheat TEC (Application Tips. Item 1). B. Use solder with melting point less than 200ºC. TEC 2. Gluing of object to be cooled. Method available by glues with good thermoconductive properties. Not recommended for high vacuum applications and long operations at high temperature. Header 46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 3 of 8 Thermoelectric Cooling Solutions Sub-assembly Overview Thermoelectric Cooler 2MDX04-014-XX Thermistor (optional) NTC Thermistor 2.2kOhm or 10kOhm TO-66 9pin Header (Material CRS) TE Cooler Lead Free Internal Assembly Solder (Lead-Free Solder 230, Sn-Sb) Flexible pinout configuration for TEC and thermistor TEC to Header High-Temperature Mounting by Soldering (Lead-Free Solder 206, Sn-Ag-In-Cu, vacuum flux-free process) Laser Labeling (optional) is available for Header TO-66 Header Drawing 46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 4 of 8 Thermoelectric Cooling Solutions Additional Options TEC Polarity TEC Polarity can be modified by request. The specified polarity in this datasheet is typical. It can be reversed in accordance to Customer - application requirements. + + Standard polarity - Reversed polarity Terminal Wires Options The wires are of tinned Copper, blank (not isolated) by default. Various options for isolated wires are available by request. The available solutions include isolated wires, isolated color-coded wires, flexible multicore wires and more. S t a n d a rd w i re s , tinned Copper Isolated wires Customized Au Patterns Customized Au patterns on thermoelectric cooler cold side are available by request. Selective Pretinning over pattern is also available. Please, contact RMT Ltd for additional information about customized Au patterns requirements. Customized Au pattern on cold side Selective pre-tinning over pattern TEC Height modification Standard TEC height can be modified without performance changes by using ceramics of different thickness. Standard 2-stage thermoelectric cooler height (specified in this datasheet) may be modified in a range -0.75..+1.5mm by request. Standard height 46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 5 of 8 Modified height, another ceramics thickness Thermoelectric Cooling Solutions Thermoelectric Cooler Overview Cold side Ceramics (top side) Al2O3 Ceramics by default (AlN solution is available by request) TE Cooler Lead Free Internal Assembly (Lead-Free Solder 230, Sn-Sb) Middle Ceramics TEC Polarity (can be modified by request) Pellets (BiTe posts) - Hot Side Ceramics (bottom side) + Terminal Wires Application Tips 1. Never heat TE module more than 200˚C (TEC assembled at 230˚C). 2. Never use TE module without an attached heat sink 1. Connect TE module to DC power supply according to polarity. 2. Do not apply DC current higher than Imax. at hot (bottom) side. Installation 1. Mechanical Mounting. TEC is placed between two heat exchangers . This construction is fixed by screws or in another mechanical way. It is suitable for large modules (with dimensions 30x30mm and larger). Miniature types require other assembling methods in most cases. 1. Soldering. This method is suitable for a TE module with metallized outside surfaces. RMT provides this option and also makes pre-tinning for TE modules. 2. Glueing. It is an up-to-date method that is used by many customers due to availability of glues with good thermoconductive properties. A glue is usually based on some epoxy compound filled with some thermoconductive material such as graphite or diamond powders, silver, SiN and others. The application of a specific type depends on application features and the type of a TE module. Object being cooled Object being cooled TEC TEC 1 3 2 Screw mounting Heatsink Soldering Heatsink Gluing 46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 6 of 8 Thermoelectric Cooling Solutions Contacts RMT Ltd. Headquarters Warshavskoe sh. 46, 115230, Moscow Russia Phone: +7-499-678-2082 Fax: +7-499-678-2083 Web: www.rmtltd.ru Email: [email protected] EUROPE/USA - TEC Microsystems GmbH Schwarzschildstrasse 3, 12489 Berlin Germany Tel. +49 30 6789 3314 Fax+49 30 6789 3315 Web: www.tec-microsystems.com Email: [email protected] CHINA - ProTEC Ltd. 深圳市南山区登良路恒裕中心B座207 ：+86-755-61596066 真：+86-755-61596036 ：518054 Web: www.protecltd.com Email: [email protected] 46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 7 of 8 Thermoelectric Cooling Solutions Legal Notice All logos, images, trademarks and product names (collectively Materials) are proprietary to RMT Ltd and/ or any of its affiliates, or subsidiaries, or other respective owners that have granted RMT Ltd the permission and/or license to use such Materials. All images are provided by RMT Ltd. and are subjects of copyright protection. RMT Ltd, TEC Microsystems GmbH and ProTEC Ltd. do not grant a copyright license (express or implied) to the Recipient, except that Recipient may reproduce the logos, images and text materials in this press-release without any alteration for non-promotional or editorial purposes only with a written note about materials owner. Copyright protection warning Graphic materials and text from this datasheet may not be used commercially without a prior response in writing on company letterhead and signed by RMT Ltd authority. Thank you for respecting the intellectual property rights protected by the International Copyright laws. All Images contain RMT hidden watermark for the immediate proof of their origin. RMT Ltd. RMT Image Hidden Watermark 46 Warshavskoe shosse. Moscow 115230 Russia, ph: +7-499-678-2082, fax: +7-499-678-2083, web: www.rmtltd.ru Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice. Page 8 of 8