٣ઝሽૻڶֆԿᄕጥʳ ծഏᎾႃቸૻڶֆԿᄕጥ TO-236 TRANSISTOR PROCESS FLOW CHART FOR SOT-23 TRANSISTOR TO-236 Կ ᄕ ጥ ՠ ੌ ݧ࿓ ቹ SOT-23 01 01=MATERIAL INCOMING INSPECTION ࠐறᛀ 02=WAFER SAWING 02 LEAD FRAME དྷׂ֊໊ 03=DIE BONDING ֧ᒵ དྷׂ෬൷ 03 GOLD WIER 04=WIRE BONDING C1 ८ᒵ ࣹႿ, ֽ֊ކՑ C2 ᛩᖫ H C 05=MOLDING, TRIMMING 04 EPOXY MOLDING ෬ᒵ෬൷ 06=LASER MARKING ᖿ٠ࠥڗ 05 07=CUTTING, FORMING ING E T M E C3 ೪㛮, ګী ATING TING 08=PLATING 06 Ղᙔ C4 4 09= 100% TESTING & TAPING 100%ྒྷᇢ 100% ྒྷᇢ ᇢ , Ղ Ղ Sn 100% 100% ᙔ 07 10=PACKING 10= C5 ץ ץᇘ INSPECTION BEFORE DISPATCHING 11=FINAL FINA IN 08 נᐗ᧭گᛀྒྷ נ C6 6 S PACKING MATERIAL ץᇘढற ່ึᛀ 09 10 ෬ᒵIPQCመ࿓ᛀ֗൳ࠫ QA C3=QUALITY CONTROL AND MONITORING OF MOLDING ࣹႿIPQCመ࿓ᛀ֗൳ࠫ S1 C4=QUALITY CONTROL AND MONITORING OF LASER MARKING ᖿ٠ࠥڗᛀ֗൳ࠫ C5=QUALITY CONTROL AND MONITORING OF FORMING ګীመ࿓ᛀ֗൳ࠫ 11 QUALITY CHECK POINT ᔆᛀរ དྷׂ෬൷መ࿓ᛀ֗൳ࠫ C2=QUALITY CONTROL AND MONITORING OF WIRE BONDING ᛀ ᚏژ ପᚏ C1=QUALITY CONTROL AND MONITORING OF DIE BONDING ᖙ܂ STORAGE S1=STORAGE C7 OPERATION INSPECTION QA=QUALITY ASSURANCE C6=QUALITY CONTROL AND MONITORING OF PLATING ՂᙔIPQCመ࿓ᛀ֗൳ࠫ C7=QUALITY CONTROL AND MONITORING OF TESTING & TAPING ྒྷᇢՂIPQCመ࿓ᛀ֗൳ࠫ Date: 20-Jan-2010 Ref: D-WI-Q-097(17) ٣ઝሽૻڶֆԿᄕጥʳ ծഏᎾႃቸૻڶֆԿᄕጥ PROCESS FLOW CHART FOR SOT-323 TRANSISTOR SOT-323 Կ ᄕ ጥ ՠ ੌ ݧ࿓ ቹ 01 01=MATERIAL INCOMING INSPECTION ࠐறᛀ 02=WAFER SAWING 02 LEAD FRAME དྷׂ֊໊ 03=DIE BONDING ֧ᒵ དྷׂ෬൷ 03 GOLD WIER 04=WIRE BONDING C1 ८ᒵ ࣹႿ, ֽ֊ކՑ C2 ᛩᖫ H C 05=MOLDING, TRIMMING 04 EPOXY MOLDING ෬ᒵ෬൷ 06=LASER MARKING ᖿ٠ࠥڗ 05 07=CUTTING, FORMING ING E T M E C3 ೪㛮, ګী ী ATING TING 08=PLATING 06 Ղᙔ C4 4 09= 100% TESTING & TAPING 100%ྒྷᇢ 100% ྒྷᇢ , Ղ Ղ Sn 100% 100% ᙔ 07 10=PACKING 10= C5 ץ ץᇘ INSPECTION BEFORE DISPATCHING 11=FINAL FINA IN 08 נᐗ᧭گᛀྒྷ נ C6 6 S PACKING MATERIAL ץᇘढற ່ึᛀ 09 10 ෬ᒵIPQCመ࿓ᛀ֗൳ࠫ QA C3=QUALITY CONTROL AND MONITORING OF MOLDING ࣹႿIPQCመ࿓ᛀ֗൳ࠫ S1 C4=QUALITY CONTROL AND MONITORING OF LASER MARKING ᖿ٠ࠥڗᛀ֗൳ࠫ C5=QUALITY CONTROL AND MONITORING OF FORMING ګীመ࿓ᛀ֗൳ࠫ 11 QUALITY CHECK POINT ᔆᛀរ དྷׂ෬൷መ࿓ᛀ֗൳ࠫ C2=QUALITY CONTROL AND MONITORING OF WIRE BONDING ᛀ ᚏژ ପᚏ C1=QUALITY CONTROL AND MONITORING OF DIE BONDING ᖙ܂ STORAGE S1=STORAGE C7 OPERATION INSPECTION QA=QUALITY ASSURANCE C6=QUALITY CONTROL AND MONITORING OF PLATING ՂᙔIPQCመ࿓ᛀ֗൳ࠫ C7=QUALITY CONTROL AND MONITORING OF TESTING & TAPING ྒྷᇢՂIPQCመ࿓ᛀ֗൳ࠫ Date: 20-Jan-2010 Ref: D-WI-Q-097(17) ծഏᎾႃቸૻڶֆԿᄕጥ ٣ઝሽૻڶֆԿᄕጥʳ PROCESS FLOW CHART FOR TO-92 TRANSISTOR TO-92ʳԿʳᄕʳጥʳՠʳݧʳੌʳ࿓ʳቹ 01 01=MATERIAL INCOMING INSPECTION ࠐறᛀ 02=WAFER SAWING 02 LEAD FRAME དྷׂ֊໊ 03=DIE BONDING ֧ᒵ དྷׂ෬൷ 03 GOLD WIER 04=WIRE BONDING C1 ८ᒵ 05=MOLDING 04 EPOXY MOLDING ෬ᒵ෬൷ H C ࣹႿ C2 ᛩᖫ 06=PLATING ጥᆬՂ厧 05 Sn 100% 100% ᙔ 07=SINGULATION, 100% TESTING & SORTING C3 ցٙ։,100%ሽࢤ։ᣊ ሽࢤ։ᣊ ։ᣊ E T M E ND D TIME 100% TESTING & MARKI 08=SECOND MARKING 06 Բڻ100%ྒྷᇢ, Բڻ100% Բڻ 100%ྒྷᇢ, ࠥڗ C4 09=THIRD TIME 100% TESTING & TAPING Կڻ100%ྒྷᇢ, Կڻ ڻ100% 100%ྒྷᇢ ྒྷᇢ, Ղ 07 10=PACKING KING C5 ץᇘ INSP 11=FINAL INSPECTION BEFORE DISPATCHING 08 נᐗ᧭گᛀ נ נᐗ᧭ C6 QA=QUALITY Q ASSURANCE ່ึᛀ S 0 09 PACKING ACKING MATERIAL ץᇘढற S1=STORAGE C7 C1=QUALITY CONTROL AND MONITORING OF DIE BONDING 10 དྷׂ෬൷መ࿓ᛀ֗൳ࠫ C2=QUALITY CONTROL AND MONITORING OF WIRE BONDING ෬ᒵመ࿓ᛀ֗൳ࠫ QA C3=QUALITY CONTROL AND MONITORING OF MOLDING OPERATION ࣹႿመ࿓ᛀ֗൳ࠫ C4=QUALITY CONTROL AND MONITORING OF PLATING ᖙ܂ S1 INSPECTION ᚏژ 11 QUALITY CHECK POINT ᔆᛀរ Ղᙔመ࿓ᛀ֗൳ࠫ C8 ᛀ STORAGE ପᚏ C5=QUALITY CONTROL AND MONITORING OF SINGULATION AND 100% TESTING ։Εྒྷᇢመ࿓ᛀ൳ࠫ C6=QUALITY CONTROL AND MONITORING OF SECOND TIME 100% TESTING & MARKING Բڻ100%ྒྷᇢΕࠥڗመ࿓൳ࠫ C7=QUALITY CONTROL AND MONITORING OF TAPING Ղྒྷᇢመ࿓ᛀ C8=RELIABILITY TEST ױᔾࢤྒྷᇢ Date: 20-Jan-2010 Ref: I-WI-Q-020(15) ٣ઝሽૻڶֆԿᄕጥʳ ծഏᎾႃቸૻڶֆԿᄕጥ PROCESS FLOW CHART FOR SOT-89 TRANSISTOR SOT-89 Կ ᄕ ጥ ՠ ੌ ݧ࿓ ቹ 01 01=MATERIAL INCOMING INSPECTION ࠐறᛀ 02=WAFER SAWING 02 LEAD FRAME དྷׂ֊໊ 03=DIE BONDING ֧ᒵ དྷׂ෬൷ 03 GOLD WIER 04=WIRE BONDING C1 ८ᒵ ࣹႿ, ֽ֊ކՑ C2 ᛩᖫ H C 05=MOLDING, TRIMMING 04 EPOXY MOLDING ෬ᒵ෬൷ 06=LASER MARKING ᖿ٠ࠥڗ 05 07=CUTTING, FORMING ING E T M E C3 ೪㛮, ګী ী ATING TING 08=PLATING 06 Ղᙔ C4 4 09= 100% TESTING & TAPING 100%ྒྷᇢ 100% ྒྷᇢ , Ղ Ղ Sn 100% 100% ᙔ 07 10=PACKING 10= C5 ץ ץᇘ INSPECTION BEFORE DISPATCHING 11=FINAL FINA IN 08 נᐗ᧭گᛀྒྷ נ C6 6 S PACKING MATERIAL ץᇘढற ່ึᛀ 09 10 ෬ᒵIPQCመ࿓ᛀ֗൳ࠫ QA C3=QUALITY CONTROL AND MONITORING OF MOLDING ࣹႿIPQCመ࿓ᛀ֗൳ࠫ S1 C4=QUALITY CONTROL AND MONITORING OF LASER MARKING ᖿ٠ࠥڗᛀ֗൳ࠫ C5=QUALITY CONTROL AND MONITORING OF FORMING ګীመ࿓ᛀ֗൳ࠫ 11 QUALITY CHECK POINT ᔆᛀរ དྷׂ෬൷መ࿓ᛀ֗൳ࠫ C2=QUALITY CONTROL AND MONITORING OF WIRE BONDING ᛀ ᚏژ ପᚏ C1=QUALITY CONTROL AND MONITORING OF DIE BONDING ᖙ܂ STORAGE S1=STORAGE C7 OPERATION INSPECTION QA=QUALITY ASSURANCE C6=QUALITY CONTROL AND MONITORING OF PLATING ՂᙔIPQCመ࿓ᛀ֗൳ࠫ C7=QUALITY CONTROL AND MONITORING OF TESTING & TAPING ྒྷᇢՂIPQCመ࿓ᛀ֗൳ࠫ Date: 20-Jan-2010 Ref: D-WI-Q-097(17) ⾥ܜ䳏ᄤ᳝䰤݀ৌϝὉㅵ PROCESS FLOW CHART FOR SOT-363 TRANSISTOR SOT-363 Կ ᄕ ጥ ՠ ੌ ݧ࿓ ቹ 01 Wafer˄Chip˅ 01=MATERIAL INCOMING INSPECTION ೧⠛˄㢃⠛˅ ࠐறᛀ 02=WAFER SAWING 02 LEAD FRAME དྷׂ֊໊ 03=DIE BONDING ֧ᒵ དྷׂ෬൷ 03 GOLD WIER 04=WIRE BONDING C1 ८ᒵ 05=MOLDING 04 EPOXY MOLDING ࣹႿ C2 ᛩᖫ ෬ᒵ෬൷ 06=PLATING Ղᙔ 05 Sn 100% 07=LASER MARKING C3 100% ᙔ ᖿ٠ࠥڗ RMING MING 08=CUTTING, FORMING 06 ೪㛮, ګী ী C4 09= 100% % TESTING & TAPING TAP T M E 100%ྒྷᇢ 100 ྒྷᇢ , Ղ 100% 07 10=PACKING C C5 ץᇘ 11=FINAL DISPATCHING =FINAL INSPECTION BEFORE B 08 נᐗ᧭ נᐗ᧭گᛀྒྷ C6 QA=QUALITY QA=QUAL UAL ASSURANCE ່ึᛀ NG MATE PACKING MATERIAL S ץᇘढற OPERATION O 0 09 C7 10 ᚏژ ෬ᒵIPQCመ࿓ᛀ֗൳ࠫ QA C3=QUALITY CONTROL AND MONITORING OF MOLDING ࣹႿIPQCመ࿓ᛀ֗൳ࠫ S1 C4=QUALITY CONTROL AND MONITORING OF PLATING ՂᙔIPQCመ࿓ᛀ֗൳ࠫ C5=QUALITY CONTROL AND MONITORING OF LASER MARKING ᖿ٠ࠥڗᛀ֗൳ࠫ 11 QUALITY CHECK POINT ᔆᛀរ དྷׂ෬൷መ࿓ᛀ֗൳ࠫ C2=QUALITY CONTROL AND MONITORING OF WIRE BONDING ᛀ STORAGE ପᚏ C1=QUALITY CONTROL AND MONITORING OF DIE BONDING ᖙ܂ INSPECTION S1=STORAGE C6=QUALITY CONTROL AND MONITORING OF FORMING ګীመ࿓ᛀ֗൳ࠫ C7=QUALITY CONTROL AND MONITORING OF TESTING & TAPING ྒྷᇢՂIPQCመ࿓ᛀ֗൳ࠫ Date :30-July-2013