三極管工序流程圖 - Semtech

٣ઝሽ՗‫ૻڶ‬ֆ‫׹‬Կᄕጥʳ
௠ծഏᎾႃቸ‫ૻڶ‬ֆ‫׹‬Կᄕጥ
TO-236 TRANSISTOR
PROCESS FLOW CHART FOR SOT-23
TRANSISTOR
TO-236 Կ ᄕ ጥ ՠ ‫ ੌ ݧ‬࿓ ቹ
SOT-23
01
01=MATERIAL INCOMING INSPECTION
ࠐறᛀ਷
02=WAFER SAWING
02
LEAD FRAME
དྷׂ֊໊
03=DIE BONDING
֧ᒵ
དྷׂ෬൷
03
GOLD WIER
04=WIRE BONDING
C1
८ᒵ
ࣹႿ, ‫ֽ֊ކ‬Ց
C2
ᛩ௜ᖫ౟
H
C
05=MOLDING, TRIMMING
04
EPOXY MOLDING
෬ᒵ෬൷
06=LASER MARKING
ᖿ٠ࠥ‫ڗ‬
05
07=CUTTING, FORMING
ING
E
T
M
E
C3
೪㛮, ‫ګ‬ী
ATING
TING
08=PLATING
06
Ղᙔ
C4
4
09= 100% TESTING & TAPING
100%ྒྷᇢ
100%
ྒྷᇢ
ᇢ , Ղ൅
Ղ
Sn 100%
100% ᙔ
07
10=PACKING
10=
C5
‫ץ‬
‫ץ‬ᇘ
INSPECTION BEFORE DISPATCHING
11=FINAL
FINA IN
08
‫נ‬ᐗ᧭‫گ‬ᛀྒྷ
‫נ‬
C6
6
S
PACKING MATERIAL
‫ץ‬ᇘढற
່ึᛀ਷
09
10
෬ᒵIPQCመ࿓ᛀ਷֗൳ࠫ
QA
C3=QUALITY CONTROL AND MONITORING OF MOLDING
ࣹႿIPQCመ࿓ᛀ਷֗൳ࠫ
S1
C4=QUALITY CONTROL AND MONITORING OF LASER MARKING
ᖿ٠ࠥ‫ڗ‬ᛀ਷֗൳ࠫ
C5=QUALITY CONTROL AND MONITORING OF FORMING
‫ګ‬ীመ࿓ᛀ਷֗൳ࠫ
11
QUALITY CHECK POINT
঴ᔆᛀ਷រ
དྷׂ෬൷መ࿓ᛀ਷֗൳ࠫ
C2=QUALITY CONTROL AND MONITORING OF WIRE BONDING
ᛀ਷
ᚏ‫ژ‬
ପᚏ
C1=QUALITY CONTROL AND MONITORING OF DIE BONDING
ᖙ‫܂‬
STORAGE
S1=STORAGE
C7
OPERATION
INSPECTION
QA=QUALITY ASSURANCE
C6=QUALITY CONTROL AND MONITORING OF PLATING
ՂᙔIPQCመ࿓ᛀ਷֗൳ࠫ
C7=QUALITY CONTROL AND MONITORING OF TESTING & TAPING
ྒྷᇢՂ൅IPQCመ࿓ᛀ਷֗൳ࠫ
Date: 20-Jan-2010
Ref: D-WI-Q-097(17)
٣ઝሽ՗‫ૻڶ‬ֆ‫׹‬Կᄕጥʳ
௠ծഏᎾႃቸ‫ૻڶ‬ֆ‫׹‬Կᄕጥ
PROCESS FLOW CHART FOR SOT-323 TRANSISTOR
SOT-323 Կ ᄕ ጥ ՠ ‫ ੌ ݧ‬࿓ ቹ
01
01=MATERIAL INCOMING INSPECTION
ࠐறᛀ਷
02=WAFER SAWING
02
LEAD FRAME
དྷׂ֊໊
03=DIE BONDING
֧ᒵ
དྷׂ෬൷
03
GOLD WIER
04=WIRE BONDING
C1
८ᒵ
ࣹႿ, ‫ֽ֊ކ‬Ց
C2
ᛩ௜ᖫ౟
H
C
05=MOLDING, TRIMMING
04
EPOXY MOLDING
෬ᒵ෬൷
06=LASER MARKING
ᖿ٠ࠥ‫ڗ‬
05
07=CUTTING, FORMING
ING
E
T
M
E
C3
೪㛮, ‫ګ‬ী
ী
ATING
TING
08=PLATING
06
Ղᙔ
C4
4
09= 100% TESTING & TAPING
100%ྒྷᇢ
100%
ྒྷᇢ , Ղ൅
Ղ
Sn 100%
100% ᙔ
07
10=PACKING
10=
C5
‫ץ‬
‫ץ‬ᇘ
INSPECTION BEFORE DISPATCHING
11=FINAL
FINA IN
08
‫נ‬ᐗ᧭‫گ‬ᛀྒྷ
‫נ‬
C6
6
S
PACKING MATERIAL
‫ץ‬ᇘढற
່ึᛀ਷
09
10
෬ᒵIPQCመ࿓ᛀ਷֗൳ࠫ
QA
C3=QUALITY CONTROL AND MONITORING OF MOLDING
ࣹႿIPQCመ࿓ᛀ਷֗൳ࠫ
S1
C4=QUALITY CONTROL AND MONITORING OF LASER MARKING
ᖿ٠ࠥ‫ڗ‬ᛀ਷֗൳ࠫ
C5=QUALITY CONTROL AND MONITORING OF FORMING
‫ګ‬ীመ࿓ᛀ਷֗൳ࠫ
11
QUALITY CHECK POINT
঴ᔆᛀ਷រ
དྷׂ෬൷መ࿓ᛀ਷֗൳ࠫ
C2=QUALITY CONTROL AND MONITORING OF WIRE BONDING
ᛀ਷
ᚏ‫ژ‬
ପᚏ
C1=QUALITY CONTROL AND MONITORING OF DIE BONDING
ᖙ‫܂‬
STORAGE
S1=STORAGE
C7
OPERATION
INSPECTION
QA=QUALITY ASSURANCE
C6=QUALITY CONTROL AND MONITORING OF PLATING
ՂᙔIPQCመ࿓ᛀ਷֗൳ࠫ
C7=QUALITY CONTROL AND MONITORING OF TESTING & TAPING
ྒྷᇢՂ൅IPQCመ࿓ᛀ਷֗൳ࠫ
Date: 20-Jan-2010
Ref: D-WI-Q-097(17)
௠ծഏᎾႃቸ‫ૻڶ‬ֆ‫׹‬Կᄕጥ
٣ઝሽ՗‫ૻڶ‬ֆ‫׹‬Կᄕጥʳ
PROCESS FLOW CHART FOR TO-92 TRANSISTOR
TO-92ʳԿʳᄕʳጥʳՠʳ‫ݧ‬ʳੌʳ࿓ʳቹ
01
01=MATERIAL INCOMING INSPECTION
ࠐறᛀ਷
02=WAFER SAWING
02
LEAD FRAME
དྷׂ֊໊
03=DIE BONDING
֧ᒵ
དྷׂ෬൷
03
GOLD WIER
04=WIRE BONDING
C1
८ᒵ
05=MOLDING
04
EPOXY MOLDING
෬ᒵ෬൷
H
C
ࣹႿ
C2
ᛩ௜ᖫ౟
06=PLATING
ጥᆬՂ厧
05
Sn 100%
100% ᙔ
07=SINGULATION, 100% TESTING & SORTING
C3
ցٙ໢։,100%ሽࢤ։ᣊ
ሽࢤ։ᣊ
։ᣊ
E
T
M
E
ND
D TIME 100% TESTING & MARKI
08=SECOND
MARKING
06
Բ‫ڻ‬100%ྒྷᇢ,
Բ‫ڻ‬100%
Բ‫ڻ‬
100%ྒྷᇢ, ࠥ‫ڗ‬
C4
09=THIRD TIME 100% TESTING & TAPING
Կ‫ڻ‬100%ྒྷᇢ,
Կ‫ڻ‬
‫ڻ‬100%
100%ྒྷᇢ
ྒྷᇢ, Ղ൅
07
10=PACKING
KING
C5
‫ץ‬ᇘ
INSP
11=FINAL INSPECTION
BEFORE DISPATCHING
08
‫נ‬ᐗ᧭‫گ‬ᛀ਷
‫נ‬
‫נ‬ᐗ᧭
C6
QA=QUALITY
Q
ASSURANCE
່ึᛀ਷
S
0
09
PACKING
ACKING MATERIAL
‫ץ‬ᇘढற
S1=STORAGE
C7
C1=QUALITY CONTROL AND MONITORING OF DIE BONDING
10
དྷׂ෬൷መ࿓ᛀ਷֗൳ࠫ
C2=QUALITY CONTROL AND MONITORING OF WIRE BONDING
෬ᒵመ࿓ᛀ਷֗൳ࠫ
QA
C3=QUALITY CONTROL AND MONITORING OF MOLDING
OPERATION
ࣹႿመ࿓ᛀ਷֗൳ࠫ
C4=QUALITY CONTROL AND MONITORING OF PLATING
ᖙ‫܂‬
S1
INSPECTION
ᚏ‫ژ‬
11
QUALITY CHECK POINT
঴ᔆᛀ਷រ
Ղᙔመ࿓ᛀ਷֗൳ࠫ
C8
ᛀ਷
STORAGE
ପᚏ
C5=QUALITY CONTROL AND MONITORING OF SINGULATION
AND 100% TESTING
໢։Εྒྷᇢመ࿓ᛀ਷൳ࠫ
C6=QUALITY CONTROL AND MONITORING OF SECOND TIME 100%
TESTING & MARKING
Բ‫ڻ‬100%ྒྷᇢΕࠥ‫ڗ‬መ࿓൳ࠫ
C7=QUALITY CONTROL AND MONITORING OF TAPING
Ղ൅ྒྷᇢመ࿓ᛀ਷
C8=RELIABILITY TEST
‫ױ‬ᔾࢤྒྷᇢ
Date: 20-Jan-2010
Ref: I-WI-Q-020(15)
٣ઝሽ՗‫ૻڶ‬ֆ‫׹‬Կᄕጥʳ
௠ծഏᎾႃቸ‫ૻڶ‬ֆ‫׹‬Կᄕጥ
PROCESS FLOW CHART FOR SOT-89 TRANSISTOR
SOT-89 Կ ᄕ ጥ ՠ ‫ ੌ ݧ‬࿓ ቹ
01
01=MATERIAL INCOMING INSPECTION
ࠐறᛀ਷
02=WAFER SAWING
02
LEAD FRAME
དྷׂ֊໊
03=DIE BONDING
֧ᒵ
དྷׂ෬൷
03
GOLD WIER
04=WIRE BONDING
C1
८ᒵ
ࣹႿ, ‫ֽ֊ކ‬Ց
C2
ᛩ௜ᖫ౟
H
C
05=MOLDING, TRIMMING
04
EPOXY MOLDING
෬ᒵ෬൷
06=LASER MARKING
ᖿ٠ࠥ‫ڗ‬
05
07=CUTTING, FORMING
ING
E
T
M
E
C3
೪㛮, ‫ګ‬ী
ী
ATING
TING
08=PLATING
06
Ղᙔ
C4
4
09= 100% TESTING & TAPING
100%ྒྷᇢ
100%
ྒྷᇢ , Ղ൅
Ղ
Sn 100%
100% ᙔ
07
10=PACKING
10=
C5
‫ץ‬
‫ץ‬ᇘ
INSPECTION BEFORE DISPATCHING
11=FINAL
FINA IN
08
‫נ‬ᐗ᧭‫گ‬ᛀྒྷ
‫נ‬
C6
6
S
PACKING MATERIAL
‫ץ‬ᇘढற
່ึᛀ਷
09
10
෬ᒵIPQCመ࿓ᛀ਷֗൳ࠫ
QA
C3=QUALITY CONTROL AND MONITORING OF MOLDING
ࣹႿIPQCመ࿓ᛀ਷֗൳ࠫ
S1
C4=QUALITY CONTROL AND MONITORING OF LASER MARKING
ᖿ٠ࠥ‫ڗ‬ᛀ਷֗൳ࠫ
C5=QUALITY CONTROL AND MONITORING OF FORMING
‫ګ‬ীመ࿓ᛀ਷֗൳ࠫ
11
QUALITY CHECK POINT
঴ᔆᛀ਷រ
དྷׂ෬൷መ࿓ᛀ਷֗൳ࠫ
C2=QUALITY CONTROL AND MONITORING OF WIRE BONDING
ᛀ਷
ᚏ‫ژ‬
ପᚏ
C1=QUALITY CONTROL AND MONITORING OF DIE BONDING
ᖙ‫܂‬
STORAGE
S1=STORAGE
C7
OPERATION
INSPECTION
QA=QUALITY ASSURANCE
C6=QUALITY CONTROL AND MONITORING OF PLATING
ՂᙔIPQCመ࿓ᛀ਷֗൳ࠫ
C7=QUALITY CONTROL AND MONITORING OF TESTING & TAPING
ྒྷᇢՂ൅IPQCመ࿓ᛀ਷֗൳ࠫ
Date: 20-Jan-2010
Ref: D-WI-Q-097(17)
‫⾥ܜ‬䳏ᄤ᳝䰤݀ৌϝὉㅵ
PROCESS FLOW CHART FOR SOT-363 TRANSISTOR
SOT-363 Կ ᄕ ጥ ՠ ‫ ੌ ݧ‬࿓ ቹ
01
Wafer˄Chip˅
01=MATERIAL INCOMING INSPECTION
೧⠛˄㢃⠛˅
ࠐறᛀ਷
02=WAFER SAWING
02
LEAD FRAME
དྷׂ֊໊
03=DIE BONDING
֧ᒵ
དྷׂ෬൷
03
GOLD WIER
04=WIRE BONDING
C1
८ᒵ
05=MOLDING
04
EPOXY MOLDING
ࣹႿ
C2
ᛩ௜ᖫ౟
෬ᒵ෬൷
06=PLATING
Ղᙔ
05
Sn 100%
07=LASER MARKING
C3
100% ᙔ
ᖿ٠ࠥ‫ڗ‬
RMING
MING
08=CUTTING, FORMING
06
೪㛮, ‫ګ‬ী
ী
C4
09= 100%
% TESTING & TAPING
TAP
T
M
E
100%ྒྷᇢ
100 ྒྷᇢ , Ղ൅
100%
07
10=PACKING
C
C5
‫ץ‬ᇘ
11=FINAL
DISPATCHING
=FINAL INSPECTION BEFORE
B
08
‫נ‬ᐗ᧭
‫נ‬ᐗ᧭‫گ‬ᛀྒྷ
C6
QA=QUALITY
QA=QUAL
UAL
ASSURANCE
່ึᛀ਷
NG MATE
PACKING
MATERIAL
S
‫ץ‬ᇘढற
OPERATION
O
0
09
C7
10
ᚏ‫ژ‬
෬ᒵIPQCመ࿓ᛀ਷֗൳ࠫ
QA
C3=QUALITY CONTROL AND MONITORING OF MOLDING
ࣹႿIPQCመ࿓ᛀ਷֗൳ࠫ
S1
C4=QUALITY CONTROL AND MONITORING OF PLATING
ՂᙔIPQCመ࿓ᛀ਷֗൳ࠫ
C5=QUALITY CONTROL AND MONITORING OF LASER MARKING
ᖿ٠ࠥ‫ڗ‬ᛀ਷֗൳ࠫ
11
QUALITY CHECK POINT
঴ᔆᛀ਷រ
དྷׂ෬൷መ࿓ᛀ਷֗൳ࠫ
C2=QUALITY CONTROL AND MONITORING OF WIRE BONDING
ᛀ਷
STORAGE
ପᚏ
C1=QUALITY CONTROL AND MONITORING OF DIE BONDING
ᖙ‫܂‬
INSPECTION
S1=STORAGE
C6=QUALITY CONTROL AND MONITORING OF FORMING
‫ګ‬ীመ࿓ᛀ਷֗൳ࠫ
C7=QUALITY CONTROL AND MONITORING OF TESTING & TAPING
ྒྷᇢՂ൅IPQCመ࿓ᛀ਷֗൳ࠫ
Date :30-July-2013