To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. 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Information Voltage Regulator of SMD SC-63 (3-pin MP-3Z) SC-98 (5-pin MP-3Z) SOT-89 (Power Mini Mold) SC-74A (5-pin Mini Mold) Document No. G11872EJ4V0IF00 (4th edition) Date Published May 2005 NS CP(K) 2000, 2005 Printed in Japan • The information in this document is current as of May, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 2 Information G11872EJ4V0IF 1. INTRODUCTION As demands for higher density have increased for electronic devices, demands for semiconductor packages that are small, have many pins, and can be surface-mounted have grown increasingly. To satisfy these market demands, NEC Electronics provides surface mount packages for power ICs, such as SC-63, SC-98, SOT-89, and SC-74A. This document describes the characteristics and taping specifications of these packages. DRAWINGS (Unit: mm) Figure 2−1. SC-63 2.3 ±0.2 1.5 −0.1 +0.2 6.5 ±0.2 5.0 ±0.2 0.5 ±0.1 3 1.0 MIN. 1.5 TYP. 5.5 ±0.2 2 1.1 ±0.2 0.9 MAX. 2.3 0.8 MAX. 2.3 0.5 2.0 MIN. 1 10.0 MAX. 4.3 MAX. 4 0.8 0.8 Figure 2−2. SC-98 0.5±0.1 1.0 MIN. 1.5 TYP. 5.5 0.2 1.5+Ð00..12 2.3±0.2 10.0 MAX. 6.5±0.2 5.0±0.2 0.9 MAX. 0.8 MAX. 0.5 2.0 MIN. PACKAGE 4.3 MAX. 2. 1.27 1.27 0.8 Information G11872EJ4V0IF 3 Figure 2−3. SOT-89 1.5 ±0.1 2.5 ±0.1 4.0 ±0.25 0.8 MIN. 4.5 ±0.1 1.6 ±0.2 0.42 ±0.06 0.47 1.5 ±0.06 3.0 0.42 ±0.06 0.41+0.03 −0.05 Figure 2−4. SC-74A 2.8 ±0.2 +0.1 0.16 +0.1 −0.06 0.95 1.9 0.32 +0.1 −0.06 0.95 0.65 −0.15 0 to 0.1 0.8 1.1 to 1.4 2.9 ±0.2 1.5 4 Information G11872EJ4V0IF 3. THERMAL RESISTANCE The thermal performance of a surface mount package varies depending on the materials and area of a PC board onto which it is to be mounted, because of its structure. The following graph shows, for your reference, the thermal resistance between the junction and atmosphere of each package when the package is mounted on a glass epoxy board. Figure 3−1. Thermal Resistance on Glass Epoxy Board (SC-63 and SC-98) Rth(J-A) - Thermal Resistance - ˚C/W 140 120 100 80 60 40 20 0 0 500 1000 1500 2000 2500 Copper Foil Area A - mm2 Measurement sample: µ PC29M05AT Board material: Glass epoxy (both side) Board size: 50 mm x 50 mm x 1.6 mm Copper foil thichness: 35 µ m Ambient temperature: 25˚C Wind velocity: 0 m/s Image of Board for Measurement Surface Rear Mount pad 50 mm Copper foil 50 mm The mount pad on the surface and the copper foil on the rear are joined by thermal via. Information G11872EJ4V0IF 5 Figure 3−2. Thermal Resistance on Glass Epoxy Board (SOT-89) Rth(J-A) - Thermal Resistance - ˚C/W 250 200 150 100 50 0 0 500 1000 1500 2000 2500 Copper Foil Area A - mm2 Measurement sample: µ PD120N15T1B Board material: Glass epoxy (single side) Board size: 50 mm x 50 mm x 1.6 mm Copper foil thichness: 35 µ m Ambient temperature: 25˚C Wind velocity: 0 m/s Image of Board for Measurement 50 mm Copper foil 50 mm 6 Information G11872EJ4V0IF Figure 3−3. Thermal Resistance on Glass Epoxy Board (SC-74A) 350 300 250 200 150 100 50 0 0 500 1000 1500 2000 2500 Copper Foil Area A - mm2 Measurement sample: µ PD120N15TA Board material: Glass epoxy (single side) Board size: 50 mm x 50 mm x 1.6 mm Copper foil thichness: 35 µ m Ambient temperature: 25˚C Wind velocity: 0 m/s Image of Board for Measurement Copper foil 50 mm Rth(J-A) - Thermal Resistance - ˚C/W 400 50 mm Information G11872EJ4V0IF 7 4. MOUNT PAD The dimensions of the mount pad are shown below (for reference). For the recommended soldering conditions, refer to the Data Sheet. Figure 4−1. Dimensions of Mount Pad of SC-63 Figure 4−2. (for Reference) Dimensions of Mount Pad of SC-98 (for Reference) (Unit: mm) (Unit: mm) 7.0 2.0 2.0 2.0 11.0 7.0 6.5 6.5 1.5 1.5 2.3 Figure 4−3. 1.27 0.9 2.3 Dimensions of Mount Pad of SOT-89 Figure 4−4. Dimensions of Mount Pad of SC-74A (for Reference) (for Reference) (Unit: mm) (Unit: mm) 2.2 0.95 1.0 0.9 0.6 2.4 1.5 45˚ 0.9 2.2 45˚ 1.0 1.0 1.5 8 0.95 1.0 1.5 Information G11872EJ4V0IF 5. TAPING SPECIFICATIONS The SC-63, SC-98, SOT-89, and SC-74A can be delivered packaged on a tape. The taping specifications of each package (tape shape, reel shape, and taping direction) are shown below. Figure 5−1. Taping Specifications of SC−63 and SC-98 (1) 16 mm wide embossed taping (a) Taping shape Unit: mm P0 D0 T B F W E P2 D1 P1 A T2 T Symbol Size A 7.1 MAX. B 10.7 MAX. D0 φ 1.5 +0.1 D1 φ 1.5 MIN. E 1.75 ±0.1 F 7.5 ±0.1 P0 4.0 ±0.1 P1 8.0 ±0.1 P2 2.0 ±0.1 T 0.2 −0 T2 2.7 ±0.1 W 16.0 ±0.3 (b) Reel shape 3-r V E K C B D θ2 W1 W1 W W2 Information G11872EJ4V0IF A F Symbol Size A 329 B 100 C 13 ±0.5 D 21 ±0.8 E 2.0 ±0.5 F 2 V 8 W 16.4 +2.0 W1 (2.5) W2 22.4 MAX. K 260 r 1.0 θ1 120° θ2 60° θ1 θ1 Unit: mm −0 9 (c) Taping direction "-E1" "-E2" Draw-out direction (2) 32 mm wide adhesive taping Unit: mm (a) Taping shape Symbol D (12-pitch) C 2-H G B A I d d A 32 +0 B 26 ±0.1 C 4.0 ±0.1 D 48 ±0.3 E 12 ±0.1 F J E t2t1 F SC-63 Size −0.4 φ 1.0 +0.1 −0 G 6.0 ±0.2 H R2.0 I 8.0 J 4.0 t2 0.15 t1 0.18 d 0 ±0.5 (b) Reel shape t t W F 10 Information G11872EJ4V0IF A B C Unit: mm Symbol Size A φ 300 B φ 80 C φ 15.5 W 34 t 2 F 38 ±1 (c) Taping direction "-T1" "-T2" Draw-out direction Figure 5−2. Taping Specifications of SOT-89 (1) 12 mm wide embossed carrier taping (a) Taping shape t H δ A J G W B θ θ C D E δ K0 K1 K F Unit: mm Item Symbol Size Remarks 5.0 +0.1 −0.1 +0.1 4.6 −0.1 Inside of cutout on plane 0.5 mm above inner bottom Inner space Depression Angular Length A Hole for Device Insertion Width B Depth K0 1.8 ±0.1 Pitch F Accumulative pitch: −0.3 MAX./ 10 pitch Diameter J 8.0 ±0.1 φ 1.5 +0.1 −0.05 Pitch H 4.0 ±0.1 Accumulative pitch: −0.3 MAX./ 10 pitch Position E 1.5 ±0.1 Distance from tape end to center of hole Distance Between Length direction G 2.0 ±0.05 Distance from center line of pocket to that of perforation Center-lines Width direction D Distance from center line of pocket to that of perforation Cover Tape Width W 5.65 ±0.05 +0.3 9.5 −0 Carrier Tape Width C 12 ±0.2 Thickness t 0.3 ±0.05 K1 2.1 ±0.1 θ 30° MAX. K 2.15 ±0.1 Round Hole for Feeding Outer depth of hole Device Whole Thickness Tilt Inside of cutout on plane 0.5 mm above inner bottom +0.1 +0.1 Thickness: 0.1 MAX. Warpage δ: 0.3 MAX. Total for cover tape and carrier tape Information G11872EJ4V0IF 11 (b) Reel shape Unit: mm θ1 B A C θ2 Symbol Size A φ 178 ±2 W 13 ±0.5 B φ 60 ±1 θ1 90° C φ 13 ±0.5 θ2 120° W (c) Taping direction "-E1" "-E2" Draw-out direction Figure 5−3. Taping Specifications of SC-74A (1) 8 mm width embossed taping (a) Taping shape Unit: mm P T P2 Size A0 3.18 B0 3.4 E P0 B0 W F φ D0 A0 φ D1 K0 12 Symbol Information G11872EJ4V0IF K0 1.6 W 8.0 ±0.3 F 3.5 ±0.1 E 1.75 ±0.1 P 4.0 ±0.1 P2 2.0 ±0.1 P0 4.0 ±0.1 D0 1.5−0 +0.1 T 0.3 D1 1.0 MIN. (b) Reel shape D W1 A E C B Unit: mm Symbol Size A φ 180 ±2.0 B φ 60 C φ 13 ±0.2 D φ 21 ±0.8 E 2.0 ±0.5 W 9 W1 2.0 ±0.5 W1 W (c) Taping direction "-E1" "-E2" Draw-out direction Information G11872EJ4V0IF 13 For further information, please contact: NEC Electronics Corporation 1753, Shimonumabe, Nakahara-ku, Kawasaki, Kanagawa 211-8668, Japan Tel: 044-435-5111 http://www.necel.com/ [North America] [Europe] [Asia & Oceania] NEC Electronics America, Inc. 2880 Scott Blvd. Santa Clara, CA 95050-2554, U.S.A. Tel: 408-588-6000 800-366-9782 http://www.necelam.com/ NEC Electronics (Europe) GmbH Arcadiastrasse 10 40472 Düsseldorf, Germany Tel: 0211-65030 http://www.ee.nec.de/ NEC Electronics Hong Kong Ltd. 12/F., Cityplaza 4, 12 Taikoo Wan Road, Hong Kong Tel: 2886-9318 Sucursal en España Juan Esplandiu, 15 28007 Madrid, Spain Tel: 091-504-2787 Seoul Branch 11F., Samik Lavied’or Bldg., 720-2, Yeoksam-Dong, Kangnam-Ku, Seoul, 135-080, Korea Tel: 02-558-3737 Succursale Française 9, rue Paul Dautier, B.P. 52 78142 Velizy-Villacoublay Cédex France Tel: 01-3067-5800 NEC Electronics Shanghai Ltd. Room 2509-2510, Bank of China Tower, 200 Yincheng Road Central, Pudong New Area, Shanghai P.R. China P.C:200120 Tel: 021-5888-5400 Filiale Italiana Via Fabio Filzi, 25/A 20124 Milano, Italy Tel: 02-667541 NEC Electronics Taiwan Ltd. 7F, No. 363 Fu Shing North Road Taipei, Taiwan, R. O. C. Tel: 02-2719-2377 Branch The Netherlands Boschdijk 187a 5612 HB Eindhoven The Netherlands Tel: 040-2445845 NEC Electronics Singapore Pte. Ltd. 238A Thomson Road, #12-08 Novena Square, Singapore 307684 Tel: 6253-8311 Tyskland Filial P.O. Box 134 18322 Taeby, Sweden Tel: 08-6380820 United Kingdom Branch Cygnus House, Sunrise Parkway Linford Wood, Milton Keynes MK14 6NP, U.K. Tel: 01908-691-133 Document No. G11872EJ4V0IF00 (4th edition) G04.1 Date Published May 2005 NS CP(K) C 2000, 2005 Printed in Japan