SANGDEST MICROELECTRONICS HD860 Technical Data Data Sheet N0249, Rev. - Green Products HD860 ULTRAFAST PLASTIC RECTIFIER Features: • • • • • • • • Utra-Fast Switching High Current Capability Low Reverse Leakage Current High Surge Current Capability Plastic Material has UL Flammability Classification 94V-O This is a Pb − Free Device All SMC parts are traceable to the wafer lot Additional testing can be offered upon request Mechanical Data: • • • • • Case: Molded Plastic Terminals: Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.39 grams (approx.) Marking: Type Number Mounting Position: Any HD860 Mechanical Dimensions: In mm /Inches DPAK MARKING, MOLDING RESIN Marking for HD860, 1st row HL, 2nd row AH0 LXX, 3rd row HD860 Where XX is Determined by customer • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS HD860 Technical Data Data Sheet N0249, Rev. - Green Products Ordering Information: Device Package DPAK (Pb-Free) HD860 Shipping 2500pcs / reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification. Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified Single Phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Characteristic Symbol HD860 Unit VRRM VRWM VR 600 V VR(RMS) 420 V Io 8.0 A Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) IFSM 110 A Forward Voltage (per element) VFM 1.7 V IRM 5.0 50 µA Trr 50 ns Max. Voltage Rate of Change dv/dt 10,000 V/µs Typical Thermal Resistance Junction to Ambient (Note 2) RθJA 25 K/W TSTG，TJ -55 to +150 °C Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current Peak Reverse Current At Rated DC Blocking Voltage @TA =100°C @IF = 8.0A, TJ=25°C @TA = 25°C @TA = 100°C Maximum Reverse Recovery Time (Note 1) Storage Temperature Range Case Style Note: DPAK 1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A 2. Mount on Cu-Pad Size 16mm×16mm on P.C.B. • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS HD860 Technical Data Data Sheet N0249, Rev. - Green Products 10 Reverse Leakage Current-IR(μA) TJ=125℃ 100 TJ=25℃ 10 1 0.1 0.01 TJ=25℃ 0.001 1 0 5 10 15 20 25 30 35 10 40 20 30 40 50 60 70 80 90 100 Percent of Rated Reverse Voltage(%) Reverse Voltage-VR(V) Fig.1-Typical Junction Capacitance Instantaneous Forward CurrentIF(A) Junction Capacitance-CT(PF) 1000 Fig.2-Typical Reverse Characteristics 100 10 TJ=25℃ 1 0.5 0.8 1.1 1.4 1.7 2 Forward Voltage Drop-VF(V) Fig.3-Typical Forward Voltage Drop Characteristics • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS Technical Data Data Sheet N0249, Rev. - HD860 Green Products DISCLAIMER: 1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales department for the latest version of the datasheet(s). 2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment, medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by means of users’ fail-safe precautions or other arrangement . 3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information, products or circuits described in the datasheets. 4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any secondary damage resulting from use at a value exceeding the absolute maximum rating. 5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics (Nanjing) Co., Ltd. 6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC - Sangdest Microelectronics (Nanjing) Co., Ltd. 7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and regulations.. • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •