BRIGHT BL-HE1G033B-TRB

BRIGHT LED ELECTRONICS CORP.
BL-HE1G033B-TRB
SINCE 1981
● Features:
1. Emitted Color :Hi-Eff Red and Yellow Green
●Package Dimensions:
2. Lens Appearance : Water Clear.
3. Bi-color type.
4. 3.2x2.7x1.1mm(1210) standard package.
5. Suitable for all SMT assembly methods.
6. Compatible with infrared and vapor phase
reflow solder process.
7. Compatible with automatic placement
equipment.
8. This product doesn’t contain restriction
Substance, comply ROHS standard.
● Applications:
1.
Automotive : Dashboards, stop lamps,
turn signals.
2.
Backlighting : LCDs, Key pads advertising.
3.
Status indicators : Comsumer & industrial
NOTES:
1.All dimensions are in millimeters (inches).
2.Tolerance is ±0.10mm (0.004”) unless otherwise specified.
3.Specifications are subject to change without notice.
electronics.
4. General use.
● Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Hi-Eff Red
Yellow Green
Unit
Power Dissipation
Pd
80
80
mW
Forward Current
IF
30
30
mA
Peak Forward Current *1
IFP
100
100
mA
Reverse Volage
VR
5
V
Operating Temperature
Topr
-25℃~80℃
-
Storage Temperature
Tstg
-30℃~85℃
-
Soldering Temperature
Tsol
See Page5
-
*1 Condition for IFP is pulse of 1/10 duty and 0.1msec width.
Ver.2.0 Page 1 of 7
BRIGHT LED ELECTRONICS CORP.
BL-HE1G033B-TRB
SINCE 1981
● Electrical and optical characteristics(Ta=25℃)
Parameter
Symbol
Condition
Forward Voltage
Vf
IF=20mA
Luminous Intensity
Iv
IF=20mA
Reverse Current
IR
VR=5V
Peak Wave Length
λp
IF=20mA
Dominant Wave Length
λd
IF=20mA
Spectral Line Half-width
Δλ
IF=20mA
Veiwing Angle
2θ1/2
IF=20mA
Color
Min.
Hi-Eff Red
Yellow Green
Hi-Eff Red
Yellow Green
Hi-Eff Red
Yellow Green
Hi-Eff Red
Yellow Green
Hi-Eff Red
Yellow Green
Hi-Eff Red
Yellow Green
Hi-Eff Red
Yellow Green
Typ.
Max.
Unit
2.6
2.6
V
3.7
2.4
2.0
2.2
10.0
8.0
-
mcd
-
-
100
µA
-
640
568
-
nm
638
576
nm
-
624
566
-
40
30
-
nm
-
120
-
deg
● Typical Electro-Optical Characteristics Curves
Fig.2 Forward current derating curve
Fig.1 Relative intensity vs. wavelength
(G)
1.0
vs. ambient temperature
(R)
60
Forward Current (mA)
0.5
40
30
20
10
0
20
40
60
80
100
Ambient temperature Ta( C)
0
530
580
630
680
Wavelength (nm)
Fig.4 Relative luminous intensity vs.
ambient temperature
Fig.3 Forward current vs. forward voltage
(R)
(G)
3.0
2.5
30
20
(Normalized @ 20mA)
Relative luminous intensity
Forward current (mA)
40
10
2.0
1.5
1.0
0.5
0
1
2
3
4
0
-40
5
-20
Forward voltage(V)
0
20
60
40
Ambient
temperature Ta( C)
A
Fig.5 Relative luminous intensity vs. forward current
Fig.6 Radiation diagram
0
4.0
10
20
3.0
(G)
(R)
2.0
1.0
Relative radlant intensity
30
Relative luminous intensity (@20mA)
Relative radiant intensity
50
40
1.0
0.9
50
0.8
60
70
0.7
80
90
0
5
10
20
30
40
50
0.5
0.3
0.1
0.2
0.4
0.6
Forward current (mA)
Ver.2.0 Page 2 of 7
BRIGHT LED ELECTRONICS CORP.
BL-HE1G033B-TRB
SINCE 1981
Tapping and packaging specifications(Units: mm)
1.5± 0.1
4.0 ± 0.1
179± 1
TRAILER
13.0± 0.5
3.5 ± 0.05
1.75 ± 0.1
4.0 ± 0.1
71.0± 0.1
END
8.0 ± 0.3
ANODE
2.82 ± 0.1
START
CATHODE
CATHODE
13.0± 0.5
1.27± 0.1
5.3 ± 0.05
ANODE
USER DIRECTION OF FEED
3.35± 0.1
●
LEADER
0.3
FIXING TAPE
2.0± 0.05
NOTE: 3000 pcs PER REEL
●Package Method:(unit:mm)
10 bag/box
3000 pcs/reel
215
Bar Code Label
245
230
220
Aluminum Foil Bag
167
645
6 box/carton
230
334
Ver.2.0 Page 3 of 7
BRIGHT LED ELECTRONICS CORP.
BL-HE1G033B-TRB
SINCE 1981
● Bin Limits
Intensity Bin Limits (E1) (At 20mA)
BIN CODE
Min. (mcd)
G
3.2
6.3
H
4.8
9.4
J
7.0
14.0
K
11 . 0
21.0
Intensity Bin Limits (G0) (At 20mA)
BIN CODE
Min. (mcd)
Max. (mcd)
F
2.1
4.2
G
3.2
6.3
H
4.8
9.4
J
7.0
14.0
Color Bin Limits (G0) (At 20mA)
BIN CODE
Min. (nm)
● B IN: x - x
Max. (mcd)
Max. (nm)
4
565
569
5
567
571
6
569
573
7
571
575
8
573
577
x
Color BIN CODE (G0)
Intensity BIN CODE (G0)
Intensity BIN CODE (E1)
Ver.2.0 Page 4 of 7
BRIGHT LED ELECTRONICS CORP.
BL-HE1G033B-TRB
SINCE 1981
● Reliability Test
Classification
Test Item
Reference Standard
Operation Life MIL-STD-750:1026
MIL-STD-883:1005
JIS-C-7021
:B-1
High
Temperature MIL-STD-202:103B
High Humidity JIS-C-7021
:B-11
Endurance
Storage
Test
High
MIL-STD-883:1008
Temperature
JIS-C-7021
:B-10
Storage
Low
:B-12
Temperature JIS-C-7021
Storage
Temperature MIL-STD-202:107D
Cycling
MIL-STD-750:1051
MIL-STD-883:1010
JIS-C-7021
:A-4
Thermal Shock MIL-STD-202:107D
Environmental
MIL-STD-750:1051
Test
MIL-STD-883:1011
Solder
MIL-STD-202:201A
Resistance
MIL-STD-750:2031
JIS-C-7021
:A-1
Test Conditions
Connect with a power If=20mA
Ta=Under room temperature
Test time=1,000hrs
Ta=+65℃±5℃
RH=90%-95%
Test time=240hrs
Result
0/20
0/20
High Ta=+85℃±5℃
Test time=1,000hrs
0/20
Low Ta=-35℃±5℃
Test time=1,000hrs
0/20
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
60min 20min
60min
20min
Test Time=5cycle
-35℃±5℃ ~+85℃±5℃
20min
20min
Test Time=10cycle
Preheating:
140℃-160℃,within 2 minutes.
Operation heating:
235℃(Max.), within 10seconds. (Max.)
0/20
0/20
0/20
● Judgment criteria of failure for the reliability
Measuring items
Forward voltage
Reverse current
Luminous intensity
Note:
Symbol
VF ( V)
IR(uA)
Iv ( mcd )
Measuring conditions
IF=20mA
VR=5V
IF=20mA
1.U means the upper limit of specified characteristics.
Judgement criteria for failure
Over Ux1.2
Over Ux2
Below SX0.5
S means initial value.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
Ver.2.0 Page 5 of 7
BRIGHT LED ELECTRONICS CORP.
BL-HE1G033B-TRB
SINCE 1981
● Soldering :
1. Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 235℃(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
10 SEC. MAX.
Temperature
140~160℃
235℃ MAX.
4℃ /SEC. MAX.
4℃ /SEC. MAX.
OVER 2 MIN.
Time
3. DIP soldering (Wave Soldering) :
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃ ± 5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
Temperature
Soldering heat Max. 260 ℃
245 ±5℃ within 5 sec.
120~150℃
Preheat
120~180 sec.
Time
● Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
Ver.2.0 Page 6 of 7
BRIGHT LED ELECTRONICS CORP.
BL-HE1G033B-TRB
SINCE 1981
● Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
● Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a. Completed within 24 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60℃±3℃.
● Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached
on each bag.
(2) Label:
BRIGHT LED LOGO
Part No.
Quantity
BIN.
Sealing Date
x
xx
Year
xx
Month
xx
Day
Manufacture Location
Ver.2.0 Page 7 of 7