SANGDEST MICROELECTRONICS Technical Data Data Sheet N1023, Rev. - 63SPB080/A 63SPB100/A Green Products Power Surface Mount Schottky Rectifier (80V/100V，60Amp) Applications: • • • • • Switching power supply Converters Reverse battery protection Redundant power subsystems Many other high current AC/DC power supplies Features: • • • • • • • • • 175 °C TJ operation Low forward voltage drop High surge capacities High frequency operation Guaranteed reverse avalanche capability Low profile surface mount package This is a Pb − Free Device All SMC parts are traceable to the wafer lot Additional testing can be offered upon request Mechanical Dimensions: In mm/ Inches Suffix“R”Denotes Reversed Polarity • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • 63SPB080/A 63SPB100/A SANGDEST MICROELECTRONICS Technical Data Data Sheet N1023, Rev. - Green Products Maximum Ratings: Characteristics Peak Inverse Voltage Max. Average Forward Max. Peak One Cycle NonRepetitive Surge Current (per leg) Non-Repetitive Avalanche Energy(per leg) Repetitive Avalanche Current(per leg) Symbol VRWM Condition - IF(AV) 50% duty cycle, rectangular wave form IFSM 8.3 ms, half Sine pulse EAS IAR 80 100 TJ=25℃,IAS=0.75A, L=40 mH IAS decaying linearly to 0 in 1 μsec Frequency limited by TJ max. VA=1.5×VR Max. (63SPB080/A) (63SPB100/A) 60 Units V A 860 A 11.25 mJ 0.75 A Electrical Characteristics: Characteristics Max. Forward Voltage Drop* Max. Reverse Current (per leg) * Symbol VF1 VF2 IR1 IR2 Max. Junction Capacitance (per leg) Max. Voltage Rated of Change * CJ dv/dt Condition @ 60A, Pulse, TJ = 25 °C @ 60A, Pulse, TJ = 125 °C @VR = rated VR TJ = 25 °C @VR = rated VR TJ = 125 °C @VR = 5V, TC = 25 °C fSIG = 1MHz - Max. 0.87 0.72 1.0 Units V V mA 24.0 mA 1500 pF 10,000 V/μs Specification -55 to +175 -55 to +175 0.37 Units °C °C Pulse Width < 300µs, Duty Cycle <2% Thermal-Mechanical Specifications: Characteristics Max. Junction Temperature Max. Storage Temperature Maximum Thermal Resistance Junction to Case Case Style Symbol TJ Tstg RθJC Condition DC operation °C/W SPD-2/A • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS Technical Data Data Sheet N1023, Rev. - 63SPB080/A 63SPB100/A Green Products • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS Technical Data Data Sheet N1023, Rev. - 63SPB080/A 63SPB100/A Green Products DISCLAIMER: 1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales department for the latest version of the datasheet(s). 2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment, medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by means of users’ fail-safe precautions or other arrangement . 3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information, products or circuits described in the datasheets. 4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any secondary damage resulting from use at a value exceeding the absolute maximum rating. 5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics (Nanjing) Co., Ltd. 6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC - Sangdest Microelectronics (Nanjing) Co., Ltd. 7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and regulations.. • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •