MA4L & MADL Series Silicon PIN Limiter Diodes V20 Chip Outlines Features • • • • • • Low Insertion Loss and Noise Figure High Peak and Average Operating Power Various P1dB Compression Powers Low Flat Leakage Power Proven Reliable, Silicon Nitride Passivation RoHS Compliant A Square See pg 2 (Anode) Description M/A-COM Technology Solutions manufactures a series of silicon PIN limiter diodes with small and medium I-region lengths which are specifically designed for high signal applications. The devices are designed to provide low insertion loss, at zero bias, as well as low flat leakage power with fast signal response/recovery times. Parts are available as discrete die or assembled into a variety of surface mount or ceramic pill packages. See the Available Case Style table on page 6 for the specific ceramic package styles and their availability for individual part numbers. B Full Area Cathode ODS Dimension mils mm 134 A B 15 ± 2 7 ±1* .381 ± .51 .178 ± .025 Applications The MA4L and MADL Series of PIN limiter diodes are designed for use in passive limiter control circuits to protect sensitive receiver components such as low noise amplifiers (LNA), detectors, and mixers covering the 10 MHz to 18 GHz frequency range. Note: For the MADL-000301-01340W, MADL-000301-13880G, MA4L401-134 and MADL-000401-13880G, “B” dimension, is 10 ±1 mils A Square Absolute Maximum Ratings1 TAMB = 25°C (Unless otherwise specified) Parameter Absolute Maximum Forward Current 100mA Operating Temperature -55°C to +125°C Storage Temperature -55°C to +150°C Junction Temperature +175°C C (Anode) RF Peak & C.W. Incident Power Per Performance Table Mounting Temperature B +320°C for 10 sec. Note: 1. Exceeding any of the above ratings may cause permanent damage. Full Area Cathode ODS Dimension mils mm 1421 A B C 15 ± 2 7 ±1 2.6 X 5.8 .381 ± .51 .178 ± .025 0.067 X .147 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4L & MADL Series Silicon PIN Limiter Diodes V20 Un-Packaged Die Electrical Specifications at TAMB = 25°C Nominal Characteristics Part Number MA4L011-134 MA4L021-134 MADL-011021-14210G MA4L022-134 MADL-011009-01340W MA4L031-134 MA4L032-134 MADL-011010-01340W MA4L062-134 MADL-011011-01340W MA4L101-134 MADL-000301-01340W MA4L401-134 Carrier I-Region Contact Thermal Lifetime Thickness Diameter Resistance Minimum Maximum Minimum Maximum Maximum Cj0V Cj0V RS 10mA IFOR =10mA VREV VREV 1 MHz 1 MHz 10 µA 10 µA 500 MHz IREV = -6mA VR 35 35 35 35 35 50 50 50 75 75 VR 15 20 20 20 20 30 30 30 60 60 100 200 250 pF 0.08 0.10 0.17 0.09 0.16 0.14 0.13 0.17 0.07 0.05 Ohms1 2.10 2.10 2.00 2.00 1.50 2.00 2.50 1.50 2.50 2.30 2.00 1.50 1.20 pF 0.18 0.20 0.24 0.19 0.23 0.21 0.20 0.24 0.15 0.17 0.15 0.20 0.30 nS1 10 10 10 10 10 20 15 15 10 10 90 200 800 µm 2 2 2 2 2 3 3 3 4 4 13 20 25 mils 1.2 1.2 2.6 X 5.8 1.2 3.0 1.4 1.5 3.0 1.5 3.0 3.5 3.0 4.5 °C/W1 175 175 175 175 175 150 150 150 150 150 30 30 25 Note: 1. Test performed with the chip bonded into a ceramic pill package,ODS-30, mounted to an infinite heatsink. Chip only thermal resistance is approximately 2°C/W less * Nominal High Signal Performance at TAMB = 25°C Incident Peak Incident Peak Power for Power for 10dB 1dB Limiting Limiting Incident Peak Power for 15dB Limiting Recovery Time 3 dB Maximum Incident Maximum CW Part Number Freq. = 9.4GHz Freq. = 9.4GHz Freq. = 9.4GHz Peak Power = 50W Peak Power MA4L011-134 MA4L021-134 MA4L022-134 MADL-011009-01340W MADL-011021-14210G MA4L031-134 MA4L032-134 MADL-011010-01340W MA4L062-134 MADL-011011-01340W MA4L101-134 MADL-000301-01340W MA4L401-134 2 Input Power dBm dBm dBm nS Watts Watts 7 8 8 8 8 10 11 11 15 15 20 23 30 30 31 31 31 31 33 34 34 38 38 45 46 52 40 41 41 41 41 43 44 44 50 50 53 59 60 10 15 15 10 10 25 25 25 75 75 100 50 250 80 90 90 90 90 125 125 125 200 200 250 500 1000 2 3 3 3 3 4 4 4 5 5 6 7 10 *See page 3 for high signal performance parameter notes. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4L & MADL Series Silicon PIN Limiter Diodes V20 Typical High Signal Peak Power Performance in a Single Shunt 50Ω Circuit Typical Peak Power Performance for Single Shunt Limiter Diode in 50 Ohm System Frequency = 9.4GHz, Pulse Width = 1µS, Duty Cycle = .001% at 9.4 GHz, 1uS Pulse Width, 0.001 Duty 45 40 MA4L011-134, MA4L021-134, MA4L022-134 MADL-011009-01340W, MADL-011021-14210G MA4L031-134, MA4L032-134 MADL-011010-01340W 35 MA4L062-134 MADL-011011-01340W MA4L101-134 Pout ( dBm ) 30 MA4L401-132 25 20 15 10 0 dB Loss Line 5 10 dB Loss Line 20 dB Loss Line 30 dB Loss Line 0 0 *Refer to Note 3 10 20 30 40 50 Pin ( dBm ) High Signal Performance: Measured in a single shunt diode (die) configuration attached directly to the gold plated RF ground of a 50Ω, SMA connectorized, test fixture using 2 mil thick conductive silver epoxy . Chip anode contact is thermo-compression wire bonded using a 1 mil. diameter gold wire onto a 7.2 mil thick Rogers 5880 Duroid microstrip trace. A shunt coil provides the D.C. return. 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4L & MADL Series Silicon PIN Limiter Diodes V20 Application Circuits Typical +60dBm Peak Power, 1µS P.W., 0.001% Duty Cycle, +20dBm Flat Leakage Limiter Circuit Transmission Line: 90º @ Fo Transmission Line: 90º @ Fo RF Input RF Output MA4L401-134 MA4L032-134 MA4L101-134 Coil: D.C. Return Typical +50dBm Peak Power, 1µS P.W., 0.001% Duty Cycle, +20dBm Flat Leakage Limiter Circuit Transmission Line: 90º @ Fo RF Input RF Output MA4L032-134 MA4L022-134 Coil: D.C. Return 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4L & MADL Series Silicon PIN Limiter Diodes V20 Notes for Specification and Nominal High Signal Performance Tables: Maximum Series Resistance: RS, is measured at 500 MHz in the ODS-30 package and is equivalent to the total diode resistance: RS = Rj (Chip Junction Resistance) + RO (Package Ohmic Resistance) Maximum High Signal Performance: Test freq.= 9.4GHz, RF pulse width = 1.0µS, Duty Cycle = 0.001% Measured with a single shunt diode (die) attached directly to the gold plated RF housing ground with 2 mil thick conductive silver epoxy in a 50Ω, SMA, connectorized test fixture. Chip anode contact is thermo-compression wire bonded using a 1 mil. diameter gold wire onto a 7.2 mil thick Rogers 5880 Duroid microstrip trace. A shunt coil provides the D.C. return. Maximum C.W. Incident Power: Measured in a 50Ω, SMA, connectorized housing @ 4GHz utilizing a TWT amplifier and the same single diode assembly configuration as stated above. Die Handling and Mounting Information Handling: All semiconductor chips should be handled with care in order to avoid damage or contamination from particulates, salts, and skin oils. For individual die, the use of plastic tipped tweezers or vacuum pick up tools is strongly recommended. Bulk handling should ensure that abrasion and mechanical shock are minimized. Die Attach: The die have Ti-Pt-Au back and anode metal, with a final gold thickness of 1.0µm. Die can be mounted with a gold-tin, eutectic solder perform or conductive silver epoxy. The metal RF and D.C. ground plane mounting surface must be free of contamination and should have a surface flatness or < ± 2 mils. • Eutectic Die Attachment Using Hot Gas Die Bonder: An 80/20, gold / tin eutectic solder perform is recommended with a work surface temperature of 255°C and a tool tip temperature of 220°C. When the hot gas is applied, the temperature at the tool tip should be approximately 290°C. The chip should not be exposed to a temperatures in excess of 320°C for more than 10 seconds. • Eutectic Die Attachment Using Reflow Oven: Refer to Application Note M538, “Surface Mounting Instructions”. • Epoxy Die Attachment: A thin, controlled amount of electrically conductive silver epoxy should be applied, approximately 1-2 mils thick to minimize ohmic and thermal resistances. A small epoxy fillet should be visible around the outer perimeter of the chip after placement to ensure full area coverage. Cure the conductive silver epoxy per the manufacturer’s schedule, typically 150˚C for 1 hour. Wire Bonding: The chip’s top contact (anode) metallization layer is comprised of Ti/Pt/Au with a final gold thickness of 1.0µm. Thermo-compression wedge bonding using a .7 or 1 mil diameter gold wire is recommended. The heat stage temperature should be set to approximately 200°C with a tool tip temperature of 125˚C and a force of 18 to 40 grams. Use of ultrasonic energy is not advised but if necessary should be adjusted to the minimum setting required to achieve a good bond. Excessive energy or force applied to the top contact will cause the metallization to dislodge and lift off. Automatic ball bonding may also be used. See Application Note M541, “Bonding and Handling Procedures for Chip Diode Devices” for more detailed handling and assembly information. 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4L & MADL Series Silicon PIN Limiter Diodes V20 Part Numbering and Ordering Information When ordering : Use the base part number followed by a dash plus the desired package style suffix or base part only as defined in Table I “Available Case Styles” below. For example: The MA4L011 in the 186 style package becomes MA4L011-186 or for just the chip MA4L011-134. Table I Available Case Styles Base Part Available Package Styles MA4L011 30, 31, 32, 54, 134 (chip), 137,186, 1056, 1088 MADL-000011-13880G Base part (MA4L011-134 chip with flying leads) MA4L021 31, 120, 134 (chip), 1056 MADL-011021-14210G Base part (MA4L021-134 chip with rectangular contact) MA4L022 30, 32, 120, 134 (chip), 137, 186, 1056 MADL-011009-01340W Base part (134 chip) MA4L031 31, 36, 134 (chip), 186, 1056 MADL-000031-13880G Base part (MA4L031-134 chip with flying leads) MA4L032 31, 32, 134 (chip), 186, 1056 MADL-000032-00300 Base part (MA4L032 chip in 30 package) MADL-011010-01340W Base part (134 chip) MA4L062-134 Base part (134 chip) MADL-000062-105600 Base part (MA4L062 chip in 1056 package) MADL-000062-13880G Base part (MA4L062-134 chip with flying leads) MADL-011011-01340W Base part (134 chip) MA4L101 30, 134 (chip), 186 MADL-000101-13880G Base part (MA4L101-134 chip with flying leads) MA4L301 31,1056 MADL-000301-01340W Base part (MA4L301 chip) MADL-000301-13870G Base part (MA4L301-134 chip with flying leads) MA4L401 30, 31, 120,134 (chip), 1056 MADL-000401-13870G Base part (MA4L401-134 chip with flying leads) Note: See Table I on page 7 for associated package parasitics. 6 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4L & MADL Series Silicon PIN Limiter Diodes V20 Table I Associated Package Parasitics Nominal Package Style Package Description 30 CPKG pF LS nH Ceramic Pill 0.18 0.60 31 Ceramic Pill 0.18 0.60 32 Ceramic Pill 0.30 0.40 120 Ceramic Pill 0.13 0.40 134 Chip - - 137 Epoxy Encapsulated Ceramic Surface Mount with Leads 0.14 0.70 186 Ceramic Surface Mount with Leads 0.15 0.70 1056 Ceramic Surface Mount with Wrap Around Contacts 0.20 0.70 1088 Epoxy Encapsulated Ceramic Surface Mount with Leads 0.12 0.70 1387 Chip with Flying Leads - - 1388 Chip with Flying Leads - - 1421 Chip with Rectangular Contact - - Chip with Flying Chip 30 120 31,32 134 137 186 1088 1056 1249 1387 1388 1421 Package dimensions can be found on the M/A-COM Technology Solutions website under Outline Drawings 7 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.