APG2C3-590 High Power Single Chip LED APG2C3-590 is a InGaN based, high power 590 nm single chip LED in standard emitter package for general application. Specifications • • • • • Structure: InGaN, 3W high power chip Peak Wavelength: 590 nm Optical Output: 36 lm Life Time: > 30.000 hours Lead free product - RoHS compliant Absolute Maximum Ratings (Ta=25°C) Parameter Power Dissipation, DC Forward Current, DC Pulsed Current (10% duty cycle, 100 µs kHz) Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature (max. 3 s) Symbol PD IF IFP UR Topr Tstg Tsol Value 2.8 700 1400 -5 -40 … +65 -40 … +100 260 Unit W mA mA V °C °C °C Electro-Optical Characteristics (Ta=25°C) Parameter Forward Current Viewing Angle Luminous Flux Peak Wavelength Half Width (FWHM) Forward Voltage Symbol IF φ Φv λP Δλ UF Condition IF = 700 mA IF = 700 mA IF = 700 mA IF = 700 mA IF = 700 mA Min. 580 2.8 Typ. 700 ± 60 36 20 - Max. 600 3.2 Unit mA deg. lm nm nm V Device Materials Item Foundation Lens Electrodes Heat Sink 13.08.2012 Material Plastic Acryl AgCu AgCu APG2C3-590 1/4 Outline Dimensions Emitter: Static Electricity LEDs are very sensitive to static Electricity and surge voltage. It is recommended to wear a wristband or an anti-electrostatic glove whenever handling the LEDs All devices, equipment, and machinery that is used when handling the LEDs must be grounded properly. Heat Generation It is advised to operate these LEDs at a reasonable low temperature for long lifetime and stability. High operating temperature will result in premature degradation and shortened lifetime. 13.08.2012 APG2C3-590 2/4 Soldering Conditions Reflow Soldering: APG2C3 LEDs have a maximum storage temperature of 85°. Therefor it is not possible to use a reflow soldering process for array assembly! Hot Bar Soldering: A Hot Bar Soldering process is recommended when soldering APG2C1 emitters. This process will only transfer heat to the leads and avoids overheating the emitter which will damage the device. In order to transfer sufficient heat from the hot bar to the device, following parameters must be carefully considered: • • • Amount of flux Pressing force of solder tip Hot bar temperature For the standard assembly process, following parameters should be maintained: • • • Hot Bar temperature: 330 °C Force of Hot Bar. 40 N Soldering time: 1.5 s It is recommended to use a copper nickel-plated hot bar mounted to standard temperature controlled soldering equipment. Manual Hand Soldering: For prototype build or small series production runs, it is possible to place and solder the emitters by hand. It is therefore recommended to maintain the following parameters: • • • Solder Tip Temperature 330 °C Soldering time. < 1.5 s Junction temperature must be kept below 70 °C A visual inspection may be used to check the quality of the solder joint General Soldering Precautions: • • • 13.08.2012 Mechanical stress, shock and vibration must be avoided during soldering Only use non corrosive flux. Do not apply current to the device until it has cooled down to room temperature after soldering. APG2C3-590 3/4 Radiation Pattern (lambertian lens without optics) Relative Intensity vs. Angular Displacement Accessories Collimating optics, holders, reflectors 10158 + 10146, 2° half angle spot optic + optic holder 10048 + 10076, 4° half angle spot optic + optic holder 10003 + 10043, 6° half angle spot optic + optic holder 10003/15 + 10043, 15° half angle spot optic + optic holder 10003/25 + 10043, 25° half angle spot optic + optic holder CLP17CR, 6° metalized polycarbonate reflector CLP23CR, 20° metalized polycarbonate reflector 13.08.2012 APG2C3-590 4/4