APG2C3-590

APG2C3-590
High Power Single Chip LED
APG2C3-590 is a InGaN based, high power 590 nm single chip LED in standard emitter package for general
application.
Specifications
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Structure: InGaN, 3W high power chip
Peak Wavelength: 590 nm
Optical Output: 36 lm
Life Time: > 30.000 hours
Lead free product - RoHS compliant
Absolute Maximum Ratings (Ta=25°C)
Parameter
Power Dissipation, DC
Forward Current, DC
Pulsed Current (10% duty cycle, 100 µs kHz)
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature (max. 3 s)
Symbol
PD
IF
IFP
UR
Topr
Tstg
Tsol
Value
2.8
700
1400
-5
-40 … +65
-40 … +100
260
Unit
W
mA
mA
V
°C
°C
°C
Electro-Optical Characteristics (Ta=25°C)
Parameter
Forward Current
Viewing Angle
Luminous Flux
Peak Wavelength
Half Width (FWHM)
Forward Voltage
Symbol
IF
φ
Φv
λP
Δλ
UF
Condition
IF = 700 mA
IF = 700 mA
IF = 700 mA
IF = 700 mA
IF = 700 mA
Min.
580
2.8
Typ.
700
± 60
36
20
-
Max.
600
3.2
Unit
mA
deg.
lm
nm
nm
V
Device Materials
Item
Foundation
Lens
Electrodes
Heat Sink
13.08.2012
Material
Plastic
Acryl
AgCu
AgCu
APG2C3-590
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Outline Dimensions
Emitter:
Static Electricity
LEDs are very sensitive to static Electricity and surge voltage. It is recommended to wear a wristband or
an anti-electrostatic glove whenever handling the LEDs
All devices, equipment, and machinery that is used when handling the LEDs must be grounded
properly.
Heat Generation
It is advised to operate these LEDs at a reasonable low temperature for long lifetime and stability. High
operating temperature will result in premature degradation and shortened lifetime.
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Soldering Conditions
Reflow Soldering:
APG2C3 LEDs have a maximum storage temperature of 85°. Therefor it is not possible to use
a reflow soldering process for array assembly!
Hot Bar Soldering:
A Hot Bar Soldering process is recommended when soldering APG2C1 emitters. This process
will only transfer heat to the leads and avoids overheating the emitter which will damage the
device. In order to transfer sufficient heat from the hot bar to the device, following parameters
must be carefully considered:
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Amount of flux
Pressing force of solder tip
Hot bar temperature
For the standard assembly process, following parameters should be maintained:
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Hot Bar temperature: 330 °C
Force of Hot Bar. 40 N
Soldering time: 1.5 s
It is recommended to use a copper nickel-plated hot bar mounted to standard temperature
controlled soldering equipment.
Manual Hand Soldering:
For prototype build or small series production runs, it is possible to place and solder the
emitters by hand. It is therefore recommended to maintain the following parameters:
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Solder Tip Temperature 330 °C
Soldering time. < 1.5 s
Junction temperature must be kept below 70 °C
A visual inspection may be used to check the quality of the solder joint
General Soldering Precautions:
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13.08.2012
Mechanical stress, shock and vibration must be avoided during soldering
Only use non corrosive flux.
Do not apply current to the device until it has cooled down to room temperature after
soldering.
APG2C3-590
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Radiation Pattern (lambertian lens without optics)
Relative Intensity vs. Angular Displacement
Accessories
Collimating optics, holders, reflectors
10158 + 10146, 2° half angle spot optic + optic holder
10048 + 10076, 4° half angle spot optic + optic holder
10003 + 10043, 6° half angle spot optic + optic holder
10003/15 + 10043, 15° half angle spot optic + optic holder
10003/25 + 10043, 25° half angle spot optic + optic holder
CLP17CR, 6° metalized polycarbonate reflector
CLP23CR, 20° metalized polycarbonate reflector
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