SMB1N-670D v 1.0 11.06.2014 Description SMB1N-670D is a surface mount AlGaInP High Power LED with a typical peak wavelength of 670 nm and radiation of 250 mW. It comes in SMD package (PA9T) with silver plated soldering pads (lead free solderable), copper heat sink, and molded with silicone resin. Maximum Ratings (TCASE=25°C) Parameter Values Symbol Min. PD IF IFP VF RTHJA TJ TCASE TSTG TSLD Power Dissipation Forward Current 1 Pulse Forward Current * Reverse Voltage Thermal Resistance Junction Temperature Operating Temperature Storage Temperature 2 Lead Solder Temperature * Unit Max. 1500 500 1000 5 10 100 + 85 + 100 + 250 - 40 - 40 mW mA mA V K/W °C °C °C °C 1 * duty=1%, pulse width = 10 µs 2 * must be completed within 5 seconds Electro-Optical Characteristics Parameter Symbol Conditions λP ∆λ VF VFP Peak Wavelength Half Width Forward Voltage 1 Radiated Power * 2 (TCASE=25°C) PO Radiant Intensity * IE Viewing Angle Rise Time Fall Time φ tR tF IF=350mA IF=350mA IF=350mA IFP=1A IF=350mA IFP=1A IF=350mA IFP=1A IF=100mA IF=350mA IF=350mA Min. 660 Values Typ. 670 16 2.3 2.7 250 710 110 310 124 90 90 Max. 680 3.0 Unit nm nm V mW mW/sr deg. ns ns 1 * measured by S3584-08 2 * measured by Tektronix J-6512 www.roithner-laser.com 1 Typical Performance Curves Forward Current vs. Forward Voltage Rel. Radiant Intensity vs. Forward Current Forward Current vs. Pulse Duration Allowed Forward Current vs. Ambient Temperature Forward Voltage vs. Ambient Temperature Rel. Radiant Intensity vs. Ambient Temperature www.roithner-laser.com 2 Peak Wavelength vs. Ambient Temperature Relative Spectral Emission Radiation Characteristics Outline Dimensions SMB1N flat Lead Description Pin a1 Pin c1 LED Anode LED Cathode All Dimensions in mm www.roithner-laser.com 3 Precautions Soldering: • • • • • Do avoid overheating of the LED Do avoid electrostatic discharge (ESD) Do avoid mechanical stress, shock, and vibration Do only use non-corrosive flux Do not apply current to the LED until it has cooled down to room temperature after soldering Recommended soldering conditions: This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered, its reliability cannot be guarantee. Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. IR Reflow Soldering Profile (Lead-free Solder) Recommended Soldering Patterns Unit: mm Above table specifies the maximum allowed duration and temperature during soldering. It is strongly advised to perform soldering at the shortest time and lowest temperature possible. Cleaning: Cleaning with isopropyl alcohol, propanol, or ethyl alcohol is recommended DO NOT USE acetone, chloroseen, trichloroethylene, or MKS DO NOT USE ultrasonic cleaners Static Electricity: LEDs are sensitive to electrostatic discharge (ESD). Precautions against ESD must be taken when handling or operating these LEDs. Surge voltage or electrostatic discharge can result in complete failure of the device. Radiation: During operation these LEDs do emit high intensity light, which is hazardous to skin and eyes, and may cause cancer. Do avoid exposure to the emitted light. Protective glasses are recommended. It is further advised to attach a warning label on products/systems. Operation: Do only operate LEDs with a current source. Running these LEDs from a voltage source will result in complete failure of the device. Current of a LED is an exponential function of the voltage across it. Usage of current regulated drive circuits is mandatory. © All Rights Reserved The above specifications are for reference purpose only and subjected to change without prior notice www.roithner-laser.com 4