RU60E25L MOSFET

RU60E25L
N-Channel Advanced Power MOSFET
MOSFET
Features
Pin Description
• 60V/25A,
RDS (ON) =35mΩ(Typ.)@VGS=10V
RDS (ON) =42mΩ(Typ.)@VGS=4.5V
• Super High Dense Cell Design
• ESD protected
• Reliable and Rugged
TO252
• Lead Free and Green Devices Available
(RoHS Compliant)
Applications
• Power Management.
N-Channel MOSFET
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS
Drain-Source Voltage
60
VGSS
Gate-Source Voltage
±20
Maximum Junction Temperature
175
°C
-55 to 175
°C
TC=25°C
25
A
TC=25°C
100
TC=25°C
TC=100°C
25
19
TC=25°C
50
TC=100°C
25
TJ
TSTG
IS
Storage Temperature Range
Diode Continuous Forward Current
V
Mounted on Large Heat Sink
IDP
300μs Pulse Drain Current Tested
ID
Continuous Drain Current(VGS=10V)
PD
RθJC
Maximum Power Dissipation
Thermal Resistance-Junction to Case
①
A
②
A
W
3
°C/W
150
mJ
Drain-Source Avalanche Ratings
EAS
③
Avalanche Energy, Single Pulsed
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– MAR., 2012
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RU60E25L
Electrical Characteristics
Symbol
(TA=25°C Unless Otherwise Noted)
Parameter
Static Characteristics
BVDSS Drain-Source Breakdown Voltage
IDSS
VGS(th)
IGSS
RDS(ON)
Zero Gate Voltage Drain Current
Test Condition
VGS=0V, IDS=250µA
Min.
Typ.
Gate Leakage Current
VGS=±16V, VDS=0V
Unit
V
1
TJ=85°C
VDS=VGS, IDS=250µA
Max.
60
VDS= 60V, VGS=0V
Gate Threshold Voltage
④
RU60E25L
30
1.5
2
µA
2.7
V
±10
µA
VGS= 10V, IDS=25A
35
40
mΩ
VGS= 4.5V, IDS=17A
42
65
mΩ
0.8
1.2
V
Drain-Source On-state Resistance
Diode Characteristics
VSD
④
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ISD=25A, VGS=0V
ISD=25A, dlSD/dt=100A/µs
40
ns
70
nC
1.8
Ω
⑤
Dynamic Characteristics
RG
Gate Resistance
VGS=0V,VDS=0V,F=1MHz
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(ON)
Turn-on Delay Time
tr
Turn-on Rise Time
td(OFF)
Turn-off Delay Time
tf
VGS=0V,
VDS= 30V,
Frequency=1.0MHz
1340
285
pF
90
10
VDD=30V, RL=2.4Ω,
IDS=25A, VGEN= 10V,
RG=6Ω
Turn-off Fall Time
13
28
ns
15
⑤
Gate Charge Characteristics
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
Notes:
55
VDS=48V, VGS= 10V,
IDS=25A
8
nC
28
Pulse width limited by safe operating area.
Calculated continuous current based on maximum allowable junction temperature.
Limited by TJmax, IAS =11A, VDD = 48V, RG = 50Ω , Starting TJ = 25°C.
Pulse test ; Pulse width≤300µs, duty cycle≤2%.
Guaranteed by design, not subject to production testing.
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– MAR., 2012
2
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RU60E25L
Typical Characteristics
Drain Current
Ptot - Power (W)
ID - Drain Current (A)
Power Dissipation
Tj - Junction Temperature (°C)
Tj - Junction Temperature (°C)
Thermal Transient Impedance
ID - Drain Current (A)
Normalized Effective Transient
Safe Operation Area
VDS - Drain-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– MAR., 2012
Square Wave Pulse Duration (sec)
3
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RU60E25L
Typical Characteristics
Drain-Source On Resistance
ID - Drain Current (A)
RDS(ON) - On Resistance (mΩ)
Output Characteristics
VDS - Drain-Source Voltage (V)
ID - Drain Current (A)
Gate Threshold Voltage
RDS(ON) - On - Resistance (m)
Normalized Threshold Voltage
Drain-Source On Resistance
VGS - Gate-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– MAR., 2012
Tj - Junction Temperature (°C)
4
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RU60E25L
Typical Characteristics
Source-Drain Diode Forward
IS - Source Current (A)
Normalized On Resistance
Drain-Source On Resistance
Tj - Junction Temperature (°C)
VSD - Source-Drain Voltage (V)
Gate Charge
C - Capacitance (pF)
VGS - Gate-Source Voltage (V)
Capacitance
VDS - Drain-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– MAR., 2012
QG - Gate Charge (nC)
5
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RU60E25L
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– MAR., 2012
6
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RU60E25L
Ordering and Marking Information
Device
Marking
Package
Packaging
Quantity
Reel Size
Tape width
RU60E25L
RU60E25L
TO-252
Tape&Reel
2500
13’’
16mm
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– MAR., 2012
7
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RU60E25L
Package Information
TO252-2L
SYMBOL
MM
INCH
MM
SYMBOL
INCH
MIN
MAX
MIN
MAX
A
2.200
2.400
0.087
0.094
L
A1
0.000
0.127
0.000
0.005
L1
b
0.660
0.860
0.026
0.034
L2
C
0.460
0.580
0.018
0.023
L3
D
6.500
6.700
0.256
0.264
L4
0.600
1.000
0.024
0.039
D1
5.100
5.460
0.201
0.215
Φ
1.100
1.300
0.043
0.051
θ
0°
8°
0°
8°
0.000
0.300
0.000
0.012
D2
4.830 REF.
0.190 REF.
E
6.000
6.200
0.236
0.244
h
e
2.186
2.386
0.086
0.094
V
MIN
MAX
MIN
MAX
9.800
10.400
0.386
0.409
2.900 REF.
1.400
1.700
1.600 REF.
5.350 REF.
0.114 REF.
0.055
0.067
0.063REF.
0.211 REF.
ALL DIMENSIONS REFER TO JEDEC STANDARD
DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– MAR., 2012
8
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RU60E25L
Customer Service
Worldwide Sales and Service:
[email protected]
Technical Support:
[email protected]
Investor Relations Contacts:
[email protected]
Marcom Contact:
[email protected]
Editorial Contact:
[email protected]
HR Contact:
[email protected]
Legal Contact:
[email protected]
Shen Zhen RUICHIPS Semiconductor CO., LTD
Room 501, the 5floor An Tong Industrial Building,
NO.207 Mei Hua Road Fu Tian Area Shen Zhen City, CHINA
TEL: (86-755) 8311-5334
FAX: (86-755) 8311-4278
E-mail: [email protected]
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– MAR., 2012
9
www.ruichips.com