DATA SHEET SMV1705: Hyperabrupt Tuning Varactors Supplied on Film Frame and Waffle Packs Applications Wide bandwidth VCOs VHF and UHF TV tuners Analog phase shifters Features Designed for high volume, low-cost battery applications Low series resistance High capacitance ratio Available as: Full wafer on film frame (SMV1705-099) Dice in waffle packs (SMV1705-000) Small footprint chip size: 12 x 12 x 5.5 mils Skyworks Green™ products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number SQ04-0074. Description Skyworks SMV1705 varactors are silicon hyperabrupt junction varactor diodes specifically designed for battery operation. These devices have a high capacitance ratio and low series resistance, which makes them appropriate for low phase noise voltage controlled oscillators (VCOs) operating at wireless frequencies of 2.5 GHz and higher. The SMV1705-099 is supplied as 100 percent electrically tested, fully singulated wafers mounted on a film frame. The SMV1705-000 is supplied as a 100 percent electrically tested die in waffle packs. The absolute maximum ratings of the SMV1705 varactors are provided in Table 1. Electrical specifications are specified in Table 2. Typical performance characteristics are provided in Figures 1 and 2. The SPICE model for the SMV1705 die is shown in Figure 3 and the associated model parameters are provided in Table 3. Die mechanical characteristics are listed in Table 4. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201124B • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • May 30, 2014 1 DATA SHEET • SMV1705-000 AND SMV1705-099: HYPERABRUPT TUNING VARACTORS Table 1. SMV1705-000/-099 Absolute Maximum Ratings (Note 1) Parameter Symbol Minimum Typical Maximum Units 250 mW Power dissipation @ cathode temperature of 25 °C PDIS Reverse voltage VR 12 V Forward current IF 20 mA Junction temperature TJ –55 +150 C Storage temperature TSTG –55 +150 C Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, electrostatic discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 2. SMV1705-000/-099 Electrical Specifications (Note 1) (Note 2) (Cathode Temperature = 25 C, Unless Otherwise Noted) Parameter Symbol Test Condition Min Typical Max Units 20 nA Reverse breakdown voltage VBR IR = 10 μA Reverse leakage current IR VR = 8 V Junction capacitance CJ1 VR = 1 V, f = 1 MHz 17.3 18.3 19.3 pF CJ4 VR = 4 V, f = 1 MHz 5.3 6.1 6.6 pF Capacitance ratio CJ1/CJ4 Series resistance RS 12 V 2.8 VR = 1 V, f = 470 MHz 3.0 – 0.32 Ω Note 1: Performance is guaranteed only under the conditions listed in this table and is not guaranteed over the full operating or storage temperature ranges. Operation at elevated temperatures may reduce reliability of the device. Note 2: The SMV1705-000 and SMV1705-099 are 100% tested for junction capacitance, capacitance ratio. reverse leakage current, and breakdown voltage. Electrical rejects of the SMV1705-099 devices (singulated wafer on film frame) are identified with black ink. 35 +5 30 +4 Percent of Variation (%) Capacitance (pF) Typical Performance Characteristics 25 20 15 10 5 VR = 1 V +3 VR = 2.5 V +2 +1 0 VR = 4 V –1 –2 –3 0 0 1 2 3 Varactor Voltage (V) Figure 1. Capacitance vs Voltage (TJ = 25 °C) 4 5 –4 –40 –20 0 +20 +40 +60 Temperature (°C) Figure 2. Relative Capacitance Change vs Temperature Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 +80 May 30, 2014 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 201124B DATA SHEET • SMV1705-000 AND SMV1705-099: HYPERABRUPT TUNING VARACTORS PORT P_anode port = 1 IND LS L = LS RES RS R = RS DIODEM Diode_Model IS = 1.00e-14 RS = 0 N=1 TT = 0 CJO = CJO M=M VJ = VJ EG = 1.11 XTI = 3 KF =0 AF =1 CAP CP C = CP DIODE Varactor_Diode AREA = 1 MODEL = Diode_Model MODE = nonlinear FC = 0.5 BV = 22 IBV = 1e-3 ISR = 0 NR = 2 IKF = 0 NBV = 1 IBVL = 0 NBVL = 1 TBV1 = 0 TNOM = 27 FFE = 1 PORT P_Cathode port = 2 Figure 3. SPICE Model Table 3. SPICE Model Parameters Part Number CJO (pF) VJ (V) M CP (pF) RS (Ω) LS (nH) SMV1705-000 31 3 2 0 0.32 0.15 SMV1705-099 31 3 2 0 0.32 0.15 Table 4. SMV1705 Die Characteristics Part Number Chip Size Quantity of Good Dice Per Wafer Typical Anode Contact Diameter Chip Thickness (in) (mm) (in) (mm) (in) (mm) SMV1705-000 N/A 0.012 x 0.012 0.3048 x 0.3048 0.0055 ± 0.0005 0.1397 ± 0.0127 0.00675 0.17145 SMV1705-099 60,000 Minimum 65,000 Typical 0.012 x 0.012 0.3048 x 0.3048 0.0055 ± 0.0005 0.1397 ± 0.0127 0.00675 0.17145 Package Outline Drawings Table 4 identifies the die part numbers with their corresponding quantity per wafer and chip measurements. The package outline die drawing for the SMV1705-000 (dice in waffle packs) is shown in Figure 4. The package outline die drawing for the SMV1705-099 (full wafer on film frame) is shown in Figure 5. The SMV1705-000 is supplied in quantities of 100 pieces per waffle pack. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com May 30, 2014 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 201124B 3 DATA SHEET • SMV1705-000 AND SMV1705-099: HYPERABRUPT TUNING VARACTORS 0.012 ± 0.002 in (0.3048 ± 0.0508 mm) ∅0.0067 in (0.1702 mm) 0.012 ± 0.002 in (0.3048 ± 0.0508 mm) 1 1 2 0.0055 ± 0.0005 in (0.1397 ± 0.0127 mm) S1612 2 Figure 4. SMV1705-000 Die Outline Drawing (Dice in Waffle Packs) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 May 30, 2014 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 201124B DATA SHEET • SMV1705-000 AND SMV1705-099: HYPERABRUPT TUNING VARACTORS 0.003 (0.076 mm) Nom. Separation Between Die 0.003 (0.076 mm) Separation Between Die 5.981 (151.92 mm) Outer Ring O.D. 5.520 (140.2 mm) Inner Ring I.D. 3.940 (100 mm) Wafer Dia. Grip Ring Wafer Film Frame Description Wafer on nitto tape Color: light blue Thickness: 2.2–3 mils Tensile strength: 6.6 (lbs. in width) Ring material: plastic 0.236 (5.99 mm) Ring Thickness S1611 Figure 5. SMV1705-099 Die Outline Drawing (Full Wafer on Film Frame) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201124B • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • May 30, 2014 5 DATA SHEET • SMV1705-000 AND SMV1705-099: HYPERABRUPT TUNING VARACTORS Ordering Information Model Name Manufacturing Part Number SMV1705-000 (dice, 100 per waffle pack) SMV1705-000 SMV1705-099 (singulated wafer on film frame) SMV1705-099 Copyright © 2009, 2014 Skyworks Solutions, Inc. All Rights Reserved. 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Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 May 30, 2014 • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • 201124B