MIC5524 High-Performance 500mA LDO in Thin DFN Package General Description The MIC5524 is a low-power, µCap, low dropout regulator designed for optimal performance in a very-small footprint. It is capable of sourcing 500mA of output current and only draws 38µA of operating current to do so. The MIC5524 includes an auto-discharge feature on the output that is activated when the enable pin is low and it has an internal pull down resistor on the enable pin that will disable the output when the enable pin is left floating, this is ideal for applications where the control signal is floating during processor boot up. This high-performance LDO offers fast transient response and good PSRR in a 1mm × 1mm Thin (0.4mm ht.) DFN package. Ideal for battery-operated applications, the MIC5524 offers 2% accuracy, extremely low dropout voltage (260mV @ 500mA), and can regulate output voltages down to 1.0V. Equipped with a TTL logic-compatible enable pin, the MIC5524 can be put into a zero-off-mode current state, drawing no current when disabled. Features • • • • • • • • • • • Input voltage range: 2.5V to 5.5V Fixed output voltages down to 1.0V 500mA guaranteed output current High output initial accuracy (±1%) High PSRR 80dB Low quiescent current 38µA Stable with 2.2µF ceramic output capacitors Low dropout voltage 260mV @ 500mA Auto discharge and internal enable pulldown Thermal-shutdown and current-limit protection 4-pin 1mm x 1mm Thin DFN package Applications • • • • Portable communication equipment DSC, GPS, PMP, and PDAs Portable medical devices 5V POL applications The MIC5524 is a µCap design, operating with very small ceramic output capacitors for stability, reducing required board space and component cost for space-critical applications. The MIC5524 has an operating junction temperature range of –40°C to 125°C. Datasheets and support documentation are available on Micrel’s web site at: www.micrel.com. Typical Application Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com May 15, 2013 Revision 1.0 Micrel, Inc. MIC5524 Ordering Information Marking Code Output (1) Voltage Temperature Range MIC5524-1.2YMT C9 1.2V –40°C to +125°C 4-Pin 1mm × 1mm TDFN MIC5524-1.8YMT C6 1.8V –40°C to +125°C 4-Pin 1mm × 1mm TDFN MIC5524-2.8YMT 4C 2.8V –40°C to +125°C 4-Pin 1mm × 1mm TDFN MIC5524-3.0YMT 3C 3.0V –40°C to +125°C 4-Pin 1mm × 1mm TDFN MIC5524-3.3YMT C3 3.3V –40°C to +125°C 4-Pin 1mm × 1mm TDFN Part Number Package (2, 3) Note: 1. Other voltages available. Contact Micrel for details. 2. Thin DFN ▲ = Pin 1 identifier. 3. Thin DFN is a GREEN, RoHS-compliant package. Lead finish is NiPdAu. Mold compound is Halogen Free. Pin Configuration 4-Pin 1mm × 1mm Thin DFN (MT) (Top View) Pin Description Pin Number Pin Name 1 VOUT Output Voltage. When disabled the MIC5524 switches in an internal 25Ω load to discharge the external capacitors. 2 GND Ground. 3 EN Enable Input. Active High. High = ON; Low = OFF. The MIC5524 has an internal 4MΩ pulldown and this pin can be left floating. 4 VIN Supply Input. EP ePad May 15, 2013 Pin Function Exposed Heatsink Pad. Connect to GND. 2 Revision 1.0 Micrel, Inc. MIC5524 Absolute Maximum Ratings(4) Operating Ratings(5) Supply Voltage (VIN) .......................................... –0.3V to 6V Enable Voltage (VEN). ........................................ –0.3V to VIN (6) Power Dissipation (PD) ........................... Internally Limited Lead Temperature (soldering, 10s) ............................ 260°C Junction Temperature (TJ) ........................ –40°C to +150°C Storage Temperature (Ts) ......................... –65°C to +150°C (7) ESD Rating .................................................................. 3kV Supply Voltage (VIN) ......................................... 2.5V to 5.5V Enable Voltage (VEN) .............................................. 0V to VIN Junction Temperature (TJ) ........................ –40°C to +125°C Junction Thermal Resistance 1mm × 1mm Thin DFN-4 (θJA) ......................... 250°C/W Electrical Characteristics(8) VIN = VEN = VOUT + 1V; CIN = COUT = 2.2µF; IOUT = 100µA; TJ = 25°C, bold values indicate –40°C to 125°C, unless noted. Parameter Output Voltage Accuracy Line Regulation Min. Typ. Max. Variation from nominal VOUT –2.0 ±1 +2.0 Variation from nominal VOUT –3.0 VIN = VOUT +1V to 5.5V; IOUT = 100µA Load Regulation Dropout Voltage Condition (9) (10) Ground Pin Current (11) Ground Pin Current in Shutdown Ripple Rejection % +3.0 0.02 0.3 IOUT = 100µA to 500mA 10 IOUT = 150mA IOUT = 500mA 80 260 175 500 IOUT = 0mA IOUT = 500mA 38 42 55 VEN = 0V 0.05 1 f = 100Hz 80 f = 1kHz Units %/V mV mV µA µA dB 65 dB 800 mA f =10Hz to 100kHz 80 µVRMS VEN = 0V; VIN = 3.6V IOUT = –3mA 25 Ω 4 MΩ Current Limit VOUT = 0V Output Voltage Noise Auto-Discharge NFET Resistance 525 Enable Input Enable Pulldown Resistor Enable Input Voltage Enable Input Current Turn-On Time 0.2 Logic Low V 1.2 Logic High VEN = 0V 0.01 1 VEN = 5.5V 1.4 2 IOUT = 150mA 50 125 µA µs Notes: 4. Exceeding the absolute maximum rating can damage the device. 5. The device is not guaranteed to function outside its operating rating. 6. The maximum allowable power dissipation of any TA (ambient temperature) is PD(max) = (TJ(max) – TA) / θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. 7. Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5kΩ in series with 100pF. 8. Specification for packaged product only. 9. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 10. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. For outputs below 2.5V, dropout voltage is the input-to-output differential with the minimum input voltage 2.5V. 11. Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum of the load current plus the ground pin current. May 15, 2013 3 Revision 1.0 Micrel, Inc. MIC5524 Typical Characteristics Dropout Voltage vs. Output Current Power Supply Rejection Ratio 260 -90 240 -70 IOUT = 150mA -60 -50 -40 IOUT = 300mA -30 COUT = 2.2µF CIN = 2.2µF VIN = 4.3V VOUT = 3.3V -20 -10 500mA 350 500mA 220 200 180 160 140 120 100 80 60 40 VOUT = 3.3V CIN = COUT = 2.2µF 20 250 150 100 0 50 100 150 200 250 300 350 400 450 500 -40 GROUND CURRENT (µA) 50 500mA 40 35 100µA 30 VEN = VIN = VOUT + 1 VOUT = 3.3V CIN = COUT = 2.2µF 50 45 48 44 43 42 41 40 39 38 VIN = VEN = VOUT + 1 VOUT = 3.3V CIN = COUT = 2.2µF 3.5 4 4.5 5 5.5 LOAD CURRENT (mA) Output Voltage vs. Output Current Output Voltage vs.Supply Voltage 500mA 44 42 40 38 36 100µA VIN = VEN = VOUT + 1V VOUT = 3.3V CIN = COUT = 2.2µF 34 -20 0 20 3.25 3.20 VIN = VEN = VOUT+ 1V VOUT = 3.3V CIN = COUT = 2.2µF 3.15 50mA 3.2 3.1 300mA 3.0 2.9 2.8 2.7 500mA VIN = VEN = VOUT + 1 VOUT = 3.3V CIN = COUT = 2.2µF 100 200 300 400 OUTPUT CURRENT (mA) May 15, 2013 500 3.4 3.35 500mA 3.3 3.25 2.5 0 80 VIN = VOUT + 1V VOUT = 3.3V CIN =COUT = 2.2µF 3.45 3.3 2.6 3.10 60 3.5 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 3.30 40 Output Voltage vs.Temperature 3.4 3.35 80 TEMPERATURE (°C) 3.5 3.40 60 46 -40 50 100 150 200 250 300 350 400 450 500 SUPPLY VOLTAGE (V) 3.45 40 30 0 3.50 20 300mA 32 36 3 0 Ground Current vs. Temperature 46 37 20 50mA TEMPERATURE (°C) Ground Current vs. Load Current 55 2.5 -20 OUTPUT CURRENT (mA) Ground Current vs. Supply Voltage 25 VOUT = 3.3V CIN = COUT = 2.2µF 50 0 10M 1k 10,000100,000 100k1,000,000 100 100 1,000 10k 1M 10,000,000 FREQUENCY (Hz) 45 300mA 200 GROUND CURRENT (µA) 10 GROUND CURRENT (µA) 300 0 0 OUTPUT VOLTAGE (V) DROPOUT VOLTAGE (mV) 100µA -80 PSRR (dB) DROPOUT VOLTAGE (mV) -100 Dropout Voltage vs.Temperature 300mA 3.2 2.5 3.0 3.5 4.0 4.5 SUPPLY VOLTAGE (V) 4 5.0 5.5 -40 -20 0 20 40 60 80 TEMPERATURE (°C) Revision 1.0 Micrel, Inc. MIC5524 Typical Characteristics (Continued) Output Noise Spectral Density (MIC5524-3.3YMT) 10 NOISE µV/√Hz 1 0.1 0.01 VIN = VEN1= 4.5V COUT = 2.2µF VOUT = 3.3V 0.001 10 100 1K 10K 100K 1M 10M FREQUENCY (Hz) May 15, 2013 5 Revision 1.0 Micrel, Inc. MIC5524 Functional Characteristics May 15, 2013 6 Revision 1.0 Micrel, Inc. MIC5524 Functional Block Diagram May 15, 2013 7 Revision 1.0 Micrel, Inc. MIC5524 Application Information The MIC5524 is a high-performance, low-power 500mA LDO. The MIC5524 includes an auto-discharge circuit that is switched on when the regulator is disabled through the enable pin. The MIC5524 also offers an internal pulldown resistor on the enable pin to ensure the output is disabled if the control signal is tri-stated. The MIC5524 regulator is fully protected from damage due to fault conditions, offering linear current limiting and thermal shutdown. Enable/Shutdown The MIC5524 comes with an active-high enable pin that allows the regulator to be disabled. Forcing the enable pin low disables the regulator and sends it into an off mode current state drawing virtually zero current. When disabled the MIC5524 switches an internal 25Ω load on the regulator output to discharge the external capacitor. Forcing the enable pin high enables the output voltage. The MIC5524 has an internal pull down resistor on the enable pin to disable the output when the enable pin is floating. Input Capacitor The MIC5524 is a high-performance, high-bandwidth device. An input capacitor of 2.2µF is required from the input to ground to provide stability. Low-ESR ceramic capacitors provide optimal performance at a minimum of space. Additional high-frequency capacitors, such as small-valued NPO dielectric-type capacitors, help filter out high-frequency noise and are good practice in any RF-based circuit. X5R or X7R dielectrics are recommended for the input capacitor. Y5V dielectrics lose most of their capacitance over temperature and are therefore, not recommended. Thermal Considerations The MIC5524 is designed to provide 500mA of continuous current in a very small package. Maximum ambient operating temperature can be calculated based on the output current and the voltage drop across the part. For example if the input voltage is 3.6V, the output voltage is 3.3V, and the output current = 500mA. The actual power dissipation of the regulator circuit can be determined using Equation 1: Output Capacitor The MIC5524 requires an output capacitor of 2.2µF or greater to maintain stability. The design is optimized for use with low-ESR ceramic chip capacitors. High-ESR capacitors are not recommended because they may cause high-frequency oscillation. The output capacitor can be increased, but performance has been optimized for a 2.2µF ceramic output capacitor and does not improve significantly with larger capacitance. PD = (VIN − VOUT)IOUT + VIN IGND Because this device is CMOS and the ground current is typically <100µA over the load range, the power dissipation contributed by the ground current is <1% and can be ignored Equation 2: X7R/X5R dielectric-type ceramic capacitors are recommended because of their temperature performance. X7R-type capacitors change capacitance by 15% over their operating temperature range and are the most stable type of ceramic capacitors. Z5U and Y5V dielectric capacitors change value by as much as 50% and 60%, respectively, over their operating temperature ranges. To use a ceramic chip capacitor with Y5V dielectric, the value must be much higher than an X7R ceramic capacitor to ensure the same minimum capacitance over the equivalent operating temperature range. PD = (3.6 V − 3.3 V ) × 500mA PD = 0.150W Eq. 2 To determine the maximum ambient operating temperature of the package, use the junction-to-ambient thermal resistance of the device Equation 3: TJ(MAX ) − TA PD(MAX ) = θ JA No-Load Stability Unlike many other voltage regulators, the MIC5524 remains stable and in regulation with no load. This is especially important in CMOS RAM keep-alive applications. May 15, 2013 Eq. 1 Eq. 3 TJ(MAX) = 125°C, the maximum junction temperature of the die, θJA thermal resistance = 250°C/W for the TDFN package. 8 Revision 1.0 Micrel, Inc. MIC5524 Substituting PD for PD(MAX) and solving for the ambient operating temperature will give the maximum operating conditions for the regulator circuit. The junction-toambient thermal resistance for the minimum footprint is 250°C/W. The maximum power dissipation must not be exceeded for proper operation. For example, when operating the MIC5524-3.3YMT at an input voltage of 3.6V and a 500mA load with a minimum footprint layout, the maximum ambient operating temperature TA can be determined as in Equation 4: 0.15W = (125°C − TA ) / (250°C / W ) TA = 87.5°C Eq. 4 Therefore, the maximum ambient operating temperature allowed in a 1mm × 1mm TDFN package is 99°C. For a full discussion of heat sinking and thermal effects on voltage regulators, refer to the “Regulator Thermals” section of Micrel’s Designing with Low-Dropout Voltage Regulators handbook. This information can be found on Micrel's website at: http://www.micrel.com/_PDF/other/LDOBk_ds.pdf May 15, 2013 9 Revision 1.0 Micrel, Inc. MIC5524 Typical Application Schematic Bill of Materials Item C1, C2 U1 Part Number GRM188R71A225KE15D MIC5524-x.xYMT Manufacturer Murata (12) (13) Micrel, Inc Description Qty. Capacitor, 2.2µF Ceramic, 10V, X5R, Size 0603 2 High-Performance 500mA LDO in Thin DFN Package 1 Notes: 12. Murata: www.murata.com. 13. Micrel, Inc.: www.micrel.com. May 15, 2013 10 Revision 1.0 Micrel, Inc. MIC5524 PCB Layout Recommendations Top Layer Bottom Layer May 15, 2013 11 Revision 1.0 Micrel, Inc. MIC5524 Package Information(14) and Recommended Landing Pattern 4-Pin 1mm × 1mm Thin DFN (MT) Note: 14. Package information is correct as of the publication date. For updates and most current information, go to www.micrel.com. May 15, 2013 12 Revision 1.0 Micrel, Inc. MIC5524 MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This information is not intended as a warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry, specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Micrel’s terms and conditions of sale for such products, Micrel assumes no liability whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2013 Micrel, Incorporated. May 15, 2013 13 Revision 1.0