Datasheet 1 Channel Compact High Side Switch ICs 1ch Adjustable Current Limit High Side Switch ICs BD2222G BD2242G BD2243G Description Key Specifications BD2222G, BD2242G and BD2243G are low on-resistance N-channel MOSFET high-side power switches, optimized for Universal Serial Bus (USB) applications. These devices are equipped with the function of over-current detection, thermal shutdown, under-voltage lockout and soft-start. Moreover, the range of Current limit threshold can be adjusted from 0.2A to 1.7A by changing the external resistance. Input Voltage Range: 2.8V to 5.5V On Resistance: (IN=5V) 89mΩ(Typ) Current Limit Threshold: 0.2A to 1.7A adjustable Standby Current: 0.01µA (Typ) Operating Temperature Range: -40°C to +85°C Package Features W(Typ) D(Typ) H (Max) 2.90mm x 2.80mm x 1.25mm SSOP6 Adjustable Current Limit Threshold: 200mA to 1.7A Low On-Resistance (Typ 89mΩ) N-channel MOSFET Built-in Soft-Start Circuit Output Discharge Function BD2242G, BD2243G Open-Drain Fault Flag Output Thermal Shutdown Under-Voltage Lockout Reverse Current Protection when Power Switch Off Control Input Logic Active-High Active-High: BD2222G, BD2242G Active-Low: BD2243G SSOP6 Applications USB hub in consumer appliances, PC, PC peripheral equipment and so forth Typical Application Circuit 5V (Typ) 3.3V CIN 10µF 1µF 10kΩ to 100kΩ IN OUT GND ILIM + RLIM EN - CL 120µF /OC Figure 1. Typical Application Circuit Lineup Output Load Current Max Adjustable Current Limit Threshold Channel Control input logic Output Discharge function 1.5A 200mA to 1.7A 1ch High No SSOP6 Reel of 3000 BD2222G – GTR 1.5A 200mA to 1.7A 1ch High Yes SSOP6 Reel of 3000 BD2242G – GTR 1.5A 200mA to 1.7A 1ch Low Yes SSOP6 Reel of 3000 BD2243G – GTR Package Orderable Part Number ○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays www.rohm.com TSZ02201-0E3E0H300280-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 1/26 TSZ22111・14・001 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Block Diagram OUT IN Reverse current Protection Under-voltage Lockout GND Charge Pump Thermal Shutdown EN ILIM /OC Delay Counter Over-current Protection Figure 2. Block Diagram (BD2222G) IN OUT Reverse current Protection /EN Under-voltage Lockout GND Charge Pump EN ILIM Thermal Shutdown /OC Delay Counter Over-current Protection Figure 3. Block Diagram (BD2242G, BD2243G) Pin Configuration IN 1 6 OUT GND 2 5 ILIM EN 3 4 /OC Figure 4. Pin Configuration (TOP VIEW) Pin Descriptions Pin No. Symbol I/O 1 IN I Switch input and the supply voltage for the IC. 2 GND - Ground. 3 EN I 4 /OC O 5 ILIM O Current limit threshold set Pin. External resistor used to set Current limit threshold. Recommended 11.97 kΩ ≤ RLIM ≤ 106.3 kΩ 6 OUT O Power switch output. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Function Enable input. High-level input turns on the switch (BD2222G, BD2242G) Low-level input turns on the switch (BD2243G) Over-current notification terminal. Low level output during over-current or over-temperature condition. Open-drain fault flag output. 2/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Absolute Maximum Ratings(Ta=25°C) Parameter Symbol Rating Unit VIN -0.3 to +7.0 V EN Input Voltage VEN -0.3 to +7.0 V ILIM Voltage VILIM -0.3 to +7.0 V ILIM Source Current IILIM 1 mA /OC Voltage V/OC -0.3 to +7.0 V /OC Sink Current I/OC 10 mA IN Supply Voltage OUT Voltage VOUT -0.3 to +7.0 V Storage Temperature Tstg -55 to +150 °C Pd 0.67 W Power Dissipation (Note1) (Note 1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1℃ above 25℃ Caution: Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings. Recommended Operating Conditions Parameter IN Operating Voltage Operating Temperature Symbol Rating Unit Min Typ Max VIN 2.8 5.0 5.5 V TOPR -40 - +85 °C Electrical Characteristics (VIN = 5V, RLIM =20kΩ, Ta = 25°C, unless otherwise specified.) DC Characteristics Parameter Operating Current Standby Current EN Input Voltage Symbol IDD Limit Min - Typ 120 Max 168 Unit Conditions µA VEN = 5V, VOUT = open, (BD2222G, BD2242G) VEN = 0V, VOUT = open, (BD2243G) ISTB - 0.01 5 µA VEN = 0V, VOUT = open, (BD2222G, BD2242G) VEN = 5V, VOUT = open, (BD2243G) VENH 2.0 - - V High input VENL - - 0.8 V Low input EN Input Leakage IEN -1 0.01 1 µA VEN = 0V or 5V On-Resistance RON - 89 120 mΩ IOUT = 500mA Reverse Leak Current IREV µA Current Limit Threshold Output Discharge Resistance /OC Output Low Voltage UVLO Threshold www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ITH - - 1 112 212 313 VOUT = 5V, VIN = 0V 911 1028 1145 1566 1696 1826 RLIM = 12kΩ RLIM = 100kΩ mA RLIM = 20kΩ RDISC 30 60 120 Ω IOUT = -1mA, VEN = 0V (BD2242G) IOUT = -1mA, VEN = 5V (BD2243G) V/OC - - 0.4 V I/OC = -1mA VTUVH 2.35 2.55 2.75 V VIN increasing VTUVL 2.30 2.50 2.70 V VIN decreasing 3/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G AC Characteristics Parameter Limits Symbol Min Typ Max Unit Output rise Time tON1 - 0.6 6 ms Output Turn-On Time tON2 - 1 10 ms Output Fall Time tOFF1 - 1.8 20 µs Output Turn-Off Time tOFF2 - 3.2 40 µs /OC Delay Time t/OC 4 7 12 ms Conditions RL = 100Ω Measurement Circuit VIN VIN IIN A CIN= IN 1µF GND VEN OUT EN ILIM CIN= IN 1µF GND RLIM OUT RL ILIM RLIM VEN /OC A. Operating Current, Standby Current EN /OC B. EN Input Voltage, Output Rise/Fall Time Output Turn-On/ Turn-Off Time VIN VIN I/OC= 1mA 10kΩ A ※ 100µF IIN CIN= IN 1µF GND IOUT OUT IOUT CIN= IN 1µF GND CL= 100µF ILIM OUT CL= 100µF ILIM RLIM VEN EN RLIM VEN /OC C. On-Resistance, Current Limit Threshold, /OC Delay Time EN /OC D. /OC Output Low Voltage ※Use capacitance more than 100µF at output short circuit test by using external power supply. VIN CIN= IN 1µF GND VIN OUT CIN= IN 1µF GND RL ILIM IOUT= 1mA OUT ILIM RLIM VEN EN RLIM VEN /OC E. UVLO Threshold EN /OC F. Output Discharge Resistance Figure 5. Measurement Circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Timing Diagram VEN VENL VENH tON2 90% 10% tOFF1 90% 10% 10% tON1 tOFF1 Figure 7. Output Rise/Fall Time (BD2243G) Figure 6. Output Rise/Fall Time (BD2222G, BD2242G) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 tOFF2 90% VOUT 10% tON1 VENH VENL tON2 tOFF2 90% VOUT VEN 5/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Typical Performance Curves 160 160 VIN=5.0V RLIM=20kΩ DD [µA] 120 Operationg Current : I Operating Current : I DD [µA] Ta=25°C RLIM=20kΩ 80 40 0 120 80 40 0 2 3 4 5 Supply Voltage : VIN [V] 6 -50 1.0 1.0 Ta=25°C RLIM=20kΩ VIN=5.0V RLIM=20kΩ 0.8 STB [µA] 0.8 0.6 Standby Current : I STB [µA] 100 Figure 9. Operating Current vs Ambient Temperature EN Enable Figure 8. Operating Current vs Supply Voltage EN Enable Standby Current : I 0 50 Ambient Temperature : Ta[°C] 0.4 0.2 0.6 0.4 0.2 0.0 0.0 2 3 4 5 Supply Voltage : VIN [V] 6 -50 Figure 10. Standby Current vs Supply Voltage EN Disable www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 50 Ambient Temperature : Ta[°C] 100 Figure 11. Standby Current vs Ambient Temperature EN Disable 6/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Typical Performance Curves - continued 2.0 2.0 Ta=25°C RLIM=20kΩ VIN=5.0V RLIM=20kΩ EN [V] 1.5 Low to High Enable Input Voltage : V Enable Input Voltage : V EN [V] Low to High High to Low 1.0 0.5 0.0 1.5 High to Low 1.0 0.5 0.0 2 3 4 5 Supply Voltage : VIN [V] 6 -50 0 50 Ambient Temperature : Ta[°C] Figure 12. EN Input Voltage vs Supply Voltage Figure 13. EN Input Voltage vs Ambient Temperature 200 200 VIN=5.0V RLIM=20kΩ IOUT=500mA ON [m Ω] 150 On Resistance : R ON [m Ω] Ta=25°C RLIM=20kΩ IOUT=500mA On Resistance : R 100 100 50 0 150 100 50 0 2 3 4 5 Supply Voltage : VIN [V] 6 -50 100 Figure 15. On-Resistance vs Ambient Temperature Figure 14. On-Resistance vs Supply Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 50 Ambient Temperature : Ta[°C] 7/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Typical Performance Curves - continued 0.5 0.5 VIN=5.0V RLIM=100kΩ TH [A] 0.4 Over Current Threshold : I Over Current Threshold : I TH [A] Ta=25°C RLIM=100kΩ 0.3 0.2 0.1 0.4 0.3 0.2 0.1 0.0 0.0 2 3 4 5 Supply Voltage : VIN [V] 6 -50 Figure 16. Over-Current Threshold 1 vs Supply Voltage 1.3 Ta=25°C RLIM=20kΩ VIN=5.0V RLIM=20kΩ TH [A] 1.2 Over Current Threshold : I TH [A] 100 Figure 17. Over-Current Threshold 1 vs Ambient Temperature 1.3 Over Current Threshold : I 0 50 Ambient Temperature : Ta[°C] 1.1 1.0 0.9 0.8 1.2 1.1 1.0 0.9 0.8 2 3 4 5 Supply Voltage : VIN [V] 6 -50 Figure 18. Over-Current Threshold 2 vs Supply Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 50 Ambient Temperature : Ta[°C] 100 Figure 19. Over-Current Threshold 2 vs Ambient Temperature 8/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Typical Performance Curves - continued 2.0 2.0 VIN=5.0V RLIM=12kΩ TH [A] 1.9 Over Current Threshold : I Over Current Threshold : I TH [A] Ta=25°C RLIM=12kΩ 1.8 1.7 1.6 1.9 1.8 1.7 1.6 1.5 1.5 2 3 4 5 Supply Voltage : VIN [V] 6 -50 0 50 Ambient Temperature : Ta[°C] Figure 20. Over-Current Threshold 3 vs Supply Voltage Figure 21. Over-Current Threshold 3 vs Ambient Temperature 100 /OC [mV] Ta=25°C RLIM=20kΩ I/OC=1mA 80 /OC Output Low Voltage : V /OC [mV] 100 /OC Output Low Voltage : V 100 60 40 20 0 VIN=5.0V RLIM=20kΩ I/OC=1mA 80 60 40 20 0 2 3 4 5 Supply Voltage : VIN [V] 6 -50 Figure 22. /OC Output Low Voltage vs Supply Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 50 Ambient Temperature : Ta[°C] 100 Figure 23. /OC Output Low Voltage vs Ambient Temperature 9/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Typical Performance Curves - continued 2.7 1.0 RLIM=20kΩ HSY [V] 2.6 UVLO Hysteresis Voltage:V UVLO Threshold : V TUVH , VTUVL [V] RLIM=20kΩ VTUVH 2.5 VTUVL 2.4 2.3 2.2 0.8 0.6 0.4 0.2 0.0 -50 0 50 Ambient Temperature : Ta[℃] 100 -50 Figure 24. UVLO Threshold vs Ambient Temperature 3.0 Ta=25°C RLIM=20kΩ RL=100Ω 2.5 ON1 [ms] 2.5 2.0 Output Rise Time : t ON1 [ms] 100 Figure 25. UVLO Hysteresis Voltage vs Ambient Temperature 3.0 Output Rise Time : t 0 50 Ambient Temperature : Ta[°C] 1.5 1.0 0.5 VIN=5.0V RLIM=20kΩ RL=100Ω 2.0 1.5 1.0 0.5 0.0 0.0 2 3 4 5 Supply Voltage : VIN [V] 6 Figure 26. Output Rise Time vs Supply Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -50 0 50 Ambient Temperature : Ta[°C] 100 Figure 27. Output Rise Time vs Ambient Temperature 10/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Typical Performance Curves - continued 3.0 3.0 Ta=25°C RLIM=20kΩ RL=100Ω ON2 [ms] 2.5 2.0 Output Turn On Time : t Output Turn On Time : t ON2 [ms] 2.5 1.5 1.0 0.5 0.0 VIN=5.0V RLIM=20kΩ RL=100Ω 2.0 1.5 1.0 0.5 0.0 2 3 4 5 Supply Voltage : VIN [V] 6 -50 Figure 28. Output Turn-On Time vs Supply Voltage 5.0 Ta=25°C RLIM=20kΩ RL=100Ω VIN=5.0V RLIM=20kΩ RL=100Ω 4.0 OFF1 [µs] 4.0 3.0 Output Fall Time : t OFF1 [µs] 100 Figure 29. Output Turn-On Time vs Ambient Temperature 5.0 Output Fall Time : t 0 50 Ambient Temperature : Ta[°C] 2.0 1.0 0.0 3.0 2.0 1.0 0.0 2 3 4 5 Supply Voltage : VIN [V] 6 Figure 30. Output Fall Time vs Supply Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -50 0 50 Ambient Temperature : Ta[°C] 100 Figure 31. Output Fall Time vs Ambient Temperature 11/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Typical Performance Curves - continued 6.0 6.0 Ta=25°C RLIM=20kΩ RL=100Ω OFF2 [µs] 5.0 4.0 Output Turn Off Time : t Output Turn Off Time : t OFF2 [µs] 5.0 VIN=5.0V RLIM=20kΩ RL=100Ω 3.0 2.0 1.0 4.0 3.0 2.0 1.0 0.0 0.0 2 3 4 5 Supply Voltage : VIN [V] 6 -50 10 10 Ta=25°C RLIM=20kΩ VIN=5.0V RLIM=20kΩ 8 /OC [ms] 8 6 /OC Delay Time : t /OC [ms] 100 Figure 33. Output Turn-Off Time vs Ambient Temperature Figure 32. Output Turn-Off Time vs Supply Voltage /OC Delay Time : t 0 50 Ambient Temperature : Ta[°C] 4 2 0 6 4 2 0 2 3 4 5 Supply Voltage : VIN [V] 6 0 50 Ambient Temperature : Ta[°C] 100 Figure 35. /OC Delay Time vs Ambient Temperature Figure 34. /OC Delay Time vs Supply Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -50 12/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Typical Performance Curves - continued 200 200 DISC [Ω] VIN=5.0V RLIM=20kΩ IOUT=1mA 150 Disc On Resistance : R Dsic On Resistance : R DISC [Ω ] Ta=25°C RLIM=20kΩ IOUT=1mA 100 50 0 150 100 50 0 2 3 4 5 Supply Voltage : VIN [V] 6 Figure 36. Discharge On Resistance vs Supply Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -50 0 50 Ambient Temperature : Ta[°C] 100 Figure 37. Discharge On Resistance vs Ambient Temperature 13/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Typical Wave Forms VEN (5V/div.) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) IIN (50mA/div.) IIN (50mA/div.) VIN=5V RLIM=20kΩ RL=100Ω TIME (0.5ms/div.) Figure 38. Output Rise Characteristic (BD2242G) VIN=5V RLIM=20kΩ RL=100Ω TIME (1µs/div.) Figure 39. Output Fall Characteristic (BD2242G) VEN (5V/div.) V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) CL=47µF CL=100µF Limit current Current limit threshold VOUT (5V/div.) CL=220µF VIN=5V RLIM=20kΩ RL=100Ω IIN (0.5A/div.) CL=47µF IIN (0.5A/div.) CL=100µF TIME (1ms/div.) Figure 40. Inrush Current Response (BD2242G) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VIN=5V RLIM=20kΩ CL=100µF TIME (20ms/div.) Figure 41. Over Current Response Ramped Load 14/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Typical Wave Forms - continued VEN (5V/div.) VEN (5V/div.) VIN=5V RLIM=20kΩ CL=100µF V/OC (5V/div.) V/OC (5V/div.) TSD detection Removal of load TSD detection TSD recovery VOUT (5V/div.) VOUT (5V/div.) IIN (0.5A/div.) TSD recovery VIN=5V RLIM=20kΩ CL=100µF IIN (0.5A/div.) TIME (20ms/div.) Figure 43. Over Current Response Disenable From Short Circuit (BD2242G) TIME (20ms/div.) Figure 42. Over Current Response Enable Into Short Circuit (BD2242G) VIN (5V/div.) VIN (5V/div.) VIN=VEN V/OC (5V/div.) VIN=VEN V/OC (5V/div.) UVLO detection UVLO recovery VOUT (5V/div.) VOUT (5V/div.) IIN (50mA/div.) IIN (50mA/div.) V/OC=3.3V RLIM=20kΩ RL=100Ω TIME (1s/div.) Figure 44. UVLO Response Increasing VIN (BD2242G) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 V/OC=3.3V RLIM=20kΩ RL=100Ω TIME (1s/div.) Figure 45. UVLO Response Decreasing VIN (BD2242G) 15/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Typical Wave Forms - continued V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VIN=5V RLIM=20kΩ CL=100µF VIN=5V RLIM=20kΩ CL=100µF IIN (1A/div.) IIN (1A/div.) TIME (2ms/div.) Figure 46. Over Current Response 1Ω Load Connected At Enable TIME (5µs/div.) Figure 47. Over Current Response 1Ω Load Connected At Enable V/OC (5V/div.) V/OC (5V/div.) VOUT (5V/div.) VOUT (5V/div.) VIN=5V RLIM=20kΩ CL=100µF VIN=5V RLIM=20kΩ CL=100µF IIN (1A/div.) IIN (1A/div.) TIME (5µs/div.) Figure 49. Over Current Response 0Ω Load Connected At Enable TIME (2ms/div.) Figure 48. Over Current Response 0Ω Load Connected At Enable www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Application Circuit Example 5V (Typ) 10kΩ to 100kΩ CIN Controller IN OUT GND ILIM + RLIM EN CL - /OC Figure 50. Application Circuit Example Application Information Ringing may cause bad influences on IC operations. In order to avoid this case, connect a bypass capacitor across IN terminal and GND terminal of IC. 1µF or higher is recommended. When excessive current flows due to output short-circuit or so, ringing occurs because of inductance between power source line to IC may exert a bad influence upon IC. In order to decrease voltage fluctuations from power source line to IC, connect a low ESR capacitor in parallel with CIN. 10µF to 100µF or higher is effective. Pull up /OC output via resistance value of 10kΩ to 100kΩ. Set up a value for CL which satisfies the application. This system connection diagram does not guarantee operation as the intended application. When using the circuit with changes to the external circuit values, make sure to leave an adequate margin for external components including static and transitional characteristics as well as the design tolerance of the IC. Functional Description 1. Switch Operation IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal is also used as power source input to internal control circuit. When the switch is turned on from EN control input, the IN terminal and OUT terminal are connected by a 89mΩ(Typ) switch. In ON status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of the IN terminal, current flows from OUT terminal to IN terminal. Since a parasitic diode between the drain and the source of switch MOSFET is canceled, current flow from OUT to IN is prevented during off state. 2. Thermal Shutdown Circuit (TSD) If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature were beyond 120℃(Typ) in the condition of over-current detection, thermal shutdown circuit operates and makes power switch turn off and outputs fault flag (/OC). Then, when the junction temperature decreases lower than 110℃(Typ), power switch is turned on and fault flag (/OC) is cancelled. Also, regardless of over-current condition, if the junction temperature were beyond 160℃(Typ), thermal shutdown circuit makes power switch turn off and outputs fault flag (/OC).When junction temperature decreases lower than 140℃(Typ), power switch is turned on and fault flag (/OC) is cancelled. Unless the fact of the increasing chips temperature is removed or the output of power switch is turned off, this operation repeats. Fault flag (/OC) is output without delay time at thermal shutdown. The thermal shutdown circuit operates when the switch is on (EN signal is active). 3. Over-Current Detection (OCD) The over current detection circuit (OCD) limits current and outputs error flag (/OC) when current flowing in each switch MOSFET exceeds a specified value. There are three cases when the OCD is activated. The OCD operates when the switch is on (EN signal is active). (1). When the switch is turned on while the output is in short-circuit status, the switch gets in current limit status immediately. (See figure 42) (2). When the output short-circuits or when high current load is connected while the switch is on, very large current flows until the over current limit circuit reacts. When this happens, the over-current limit circuit is activated and the current limitation is carried out. (See figure 48) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G (3). When the output current increases gradually, current limitation does not work until the output current exceeds the over current detection value. When it exceeds the detection value, current limitation is carried out. (See Figure 41) 4. Under-Voltage Lockout (UVLO) UVLO circuit prevents the switch from turning on until the IN exceeds 2.55V(Typ). If the IN drops below 2.5V(Typ) while the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 50mV(Typ). Under-voltage lockout circuit works when the switch is on (EN signal is active). (see Figure 44,45) 5. Fault Flag (/OC) Output Fault flag output is an N-MOS open drain output. At detection of over-current or thermal shutdown, output is low-level. Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current at switch on, hot plug from being informed to outside, but if charge up time for output capacitance is longer than delay time, fault flag output asserts low level. When output current is close to Current Limit Threshold value, fault flag output (/OC) might be low level before turning to over-current condition because it is affected by current swinging or noise. If fault flag output is unused, /OC pin should be connected to open or ground line. Over-Current Detection Over-Current Load Removed VOUT ITH Limit current IOUT T/OC V/OC Figure 51. Over-Current Detection VEN VOUT Over-current detection Thermal Shutdown IOUT V/OC Thermal Shutdown recover /OC delay time Figure 52. Over-Current Detection, Thermal Shutdown Timing (BD2222G, BD2242G) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G VEN Over-current detection VOUT Thermal Shutdown IOUT Thermal Shutdown recover V/OC /OC delay time Figure 53. Over-Current Detection, Thermal Shutdown Timing (BD2243G) 6. Adjustable Current Limit Threshold BD2222/42/43G is able to change over-current detection value from 200mA to 1.7A by connecting resistance (RLIM) between ILIM pin and GND pin. The resistance value from 11.97KΩ to 106.3kΩ is recommended for RLIM. The relational expression and the table for resistance value and over-current detection value are described below. Allocate RLIM close to IC as possible. Be careful not to be affected by parasitic resistance of board pattern because over-current detection value is depended on the resistance value between ILIM pin and GND pin. ILIM pin cannot be used as open and short to GND pin. The RLIM resistance tolerance directly affects the current limit threshold accuracy. Recommended to use low tolerance resistance. Over Current Threshold Equation, Ith(Typ)[mA] = 19364 × RLIM[kΩ] -0.98 Ith(Min)[mA] = Ith(Typ)[mA] × 0.98 - 96 Ith(Max)[mA] = Ith(Typ)[mA] × 1.02 + 96 2000 Current Limit Threshold : Ith [mA] 1800 Typ. Min. Max. 1600 1400 1200 1000 800 600 400 200 0 0 20 40 60 80 100 120 Current Limit Resistor : R LIM [kΩ] Figure 54. Ith vs. RLIM graph www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G RLIM (kΩ) 106.30 70.28 52.40 41.73 34.65 29.60 25.83 22.91 20.57 18.67 17.08 15.74 14.59 13.60 12.73 11.97 MIN 100 198 296 394 492 590 688 786 884 982 1080 1178 1276 1374 1472 1570 Current Limit Threshold (mA) TYP 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 MAX 300 402 504 606 708 810 912 1014 1116 1218 1320 1422 1524 1626 1728 1830 Table 1. Ith Tolerance vs. RLIM 7. Output Discharge Function (BD2242G and BD2243G) When the switch is turned off from disable control input or UVLO function, the 60Ω(Typ.) discharge circuit between OUT and GND turns on. By turning on this switch, electric charge at capacitive load is discharged. But when the voltage of IN declines extremely, then the OUT pin becomes Hi-Z without UVLO function. Power Dissipation (SSOP6 package) 700 POWER DISSIPATION : Pd [mW] 600 500 400 300 200 100 0 0 25 50 75 85 100 AMBIENT TEMPERATURE : Ta [℃] 125 150 * 70mm x 70mm x 1.6mm Glass Epoxy Board Figure 55. Power Dissipation Curve (Pd-Ta Curve) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G I/O Equivalence Circuit Symbol Pin No. EN 3 /OC 4 ILIM 5 Equivalent Circuit EN /OC ILIM OUT 6 BD2222G OUT OUT BD2242G BD2243G www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6 OUT 21/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 56. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Ordering Information B D 2 2 x x Part Number BD2222 BD2242 BD2243 G - G Package G: SSOP6 T R G: Halogen free package Packaging and forming specification TR: Embossed tape and reel Marking Diagram SSOP6 (TOP VIEW) 1 2 Part Number Marking 1PIN MARK LOT Number Part Number Part Number Marking BD2222G BN BD2242G AY BD2243G AZ www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Physical Dimension, Tape and Reel Information Package Name SSOP6 <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ∗ Order quantity needs to be multiple of the minimum quantity. 25/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 BD2222G Datasheet BD2242G BD2243G Revision History Date Revision Changes 12.OCT.2012 0000 Draft 27.FEB.2013 0001 Over Current Threshold Limits 7.MAR.2013 001 23.APR.2013 002 12.FEB.2014 003 9.JUN.2014 004 Authentic Release Add Typical Wave Forms for over current response Change I/O Equivalence Circuit (EN) Applied new style and improved understandability. Improved Symbol name. Improved in Operational Notes. Add Output Discharge Function in Functional Description Add BD2222G www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/26 TSZ02201-0E3E0H300280-1-2 9.JUN.2014 Rev.004 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001