Part Number: XZM2ACR45S-9 3.2x2.8mm PLCC2 SMD LED Package Schematics Features ● Ideal for indication light on hand held products ● Long life and robust package ● Variety of lens types and color choices available ● Standard Package: 2000pcs/ Reel ● MSL (Moisture Sensitivity Level): 3 ● RoHS compliant Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. Absolute Maximum Ratings (TA=25°C) M2ACR (AlGaInP) Unit Operating Characteristics (TA=25°C) M2ACR (AlGaInP) Unit Reverse Voltage VR 5 V Forward Current IF 50 mA Forward Voltage (Typ.) (IF=20mA) VF 2.2 V VF 2.8 V Forward Current (Peak) 1/10 Duty Cycle 0.1ms Pulse Width iFS 150 mA Forward Voltage (Max.) (IF=20mA) Power Dissipation PD 140 mW Reverse Current (Max.) (VR=5V) IR 10 uA Operating Temperature TA -40 ~ +85 λP 640* nm Tstg -40 ~ +85 Wavelength of Peak Emission CIE127-2007*(Typ.) (IF=20mA) Wavelength of Dominant Emission CIE127-2007*(Typ.) (IF=20mA) λD 625* nm Spectral Line Full Width At Half-Maximum (Typ.) (IF=20mA) △λ 25 nm C 27 pF Storage Temperature °C Capacitance (Typ.) (VF=0V, f=1MHz) Part Number XZM2ACR45S-9 Emitting Color Red Emitting Material AlGaInP Lens-color Water Clear Luminous Intensity CIE127-2007* (IF=20mA) mcd min. typ. 1000 300* 1590 500* Wavelength CIE127-2007* nm λP Viewing Angle 2θ 1/2 640* 120° *Luminous intensity value and wavelength are in accordance with CIE127-2007 standards. Oct 30,2012 XDSB4883 V3-X Layout: Maggie L. P. 1/5 Part Number: XZM2ACR45S-9 3.2x2.8mm PLCC2 SMD LED Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Oct 30,2012 XDSB4883 V3-X Layout: Maggie L. P. 2/5 Part Number: XZM2ACR45S-9 3.2x2.8mm PLCC2 SMD LED M2ACR LED is recommended for reflow soldering and soldering profile is shown below. Oct 30,2012 XDSB4883 V3-X Layout: Maggie L. P. 3/5 Part Number: XZM2ACR45S-9 3.2x2.8mm PLCC2 SMD LED The device has a single mounting surface. The device must be mounted according to the specifications. Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Reel Dimension Tape Specification (Units : mm) Remarks: If special sorting is required (e.g. binning based on forward voltage, Luminous intensity / luminous flux, or wavelength), the typical accuracy of the sorting process is as follows: 1. Wavelength: +/-1nm 2. Luminous intensity / luminous flux: +/-15% 3. Forward Voltage: +/-0.1V Note: Accuracy may depend on the sorting parameters. Oct 30,2012 XDSB4883 V3-X Layout: Maggie L. P. 4/5 Part Number: XZM2ACR45S-9 3.2x2.8mm PLCC2 SMD LED PACKING & LABEL SPECIFICATIONS Oct 30,2012 XDSB4883 V3-X Layout: Maggie L. P. 5/5